EP3632135A2 - Mikromechanischer schallwandler - Google Patents
Mikromechanischer schallwandlerInfo
- Publication number
- EP3632135A2 EP3632135A2 EP18729366.7A EP18729366A EP3632135A2 EP 3632135 A2 EP3632135 A2 EP 3632135A2 EP 18729366 A EP18729366 A EP 18729366A EP 3632135 A2 EP3632135 A2 EP 3632135A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- transducer
- bending
- micromechanical
- micromechanical sound
- sound transducer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
- H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
- H04R7/04—Plane diaphragms
- H04R7/06—Plane diaphragms comprising a plurality of sections or layers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
- H04R7/04—Plane diaphragms
- H04R7/06—Plane diaphragms comprising a plurality of sections or layers
- H04R7/10—Plane diaphragms comprising a plurality of sections or layers comprising superposed layers in contact
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/26—Damping by means acting directly on free portion of diaphragm or cone
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/02—Loudspeakers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2440/00—Bending wave transducers covered by H04R, not provided for in its groups
- H04R2440/01—Acoustic transducers using travelling bending waves to generate or detect sound
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
- H04R2499/10—General applications
- H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
Definitions
- Embodiments of the present invention relate to a micromechanical transducer with at least one bending actuator (generally bending transducer) and miniaturized gap as well as to a miniaturized transducer with a cascaded bending transducer. Additional embodiments relate to corresponding production methods.
- MEMS Due to high-precision manufacturing processes and energy-efficient drive principles, MEMS have the potential to overcome these disadvantages and enable a new generation of transducers.
- a fundamental problem so far has been the low sound pressure levels of MEMS transducers.
- the primary reason for this is the difficulty of producing sufficiently high strokes with the smallest possible dimensions.
- a membrane is required, which has a negative effect on the Intelauslenkung due to their additional spring stiffness.
- the latter can be minimized by using very soft and three-dimensionally shaped membranes (eg with Toms), which, however, can not currently be produced using MEMS technology and, accordingly, complex and costly hybrid integration.
- piezoelectric materials such as PZT, AIN or ZnO were applied directly to silicon-based acoustic transducer membranes, which, however, due to their low elasticity do not allow sufficiently large deflections.
- Digital MEMS sound transducers based on arrays with electrostatically driven membranes, which however can only generate sufficiently high sound pressure at high frequencies, are described in [Gla13, US7089069, US20100316242A1]. Therefore, there is a need for a better approach.
- Object of the present invention is to provide a micromechanical transducer, which represents an improved compromise of sound pressure, frequency response and manufacturing costs.
- Embodiments of the present invention provide a micromechanical transducer (eg built in a substrate) with a first bending transducer or bending actuator and a second bending transducer or bending actuator.
- the first bending actuator has a free end and, for example, at least one or two free sides and is configured to be excited, for example, by an audio signal for vertical oscillation and to emit sound.
- the second bending actuator also has a free end and is disposed opposite to the first bending actuator such that the first and second bending actuators are suspended in a common plane.
- the arrangement is configured such that a gap (eg, in the micrometer range) is formed between the first and second bending actuators, separating the two bending actuators.
- the second bending actuator is always excited in phase with the first bending actuator to oscillate, which causes the conse- The result is that the gap remains essentially constant over the entire deflection of the bending actuators.
- Embodiments for this aspect of the invention is based on the finding that by using a plurality of mutually separated bending transducers or actuators, which are separated from each other with a minimum (separation) gap, with identical deflection of the two transducers or actuators from the Level can be achieved that the gap between the two actuators remains almost constantly small (in the micrometer range), so that there are always high viscosity losses in the gap, which in effect prevent an acoustic short circuit between the rear volume and the front volume (of the Biegeaktuators) .
- the present concept allows a significant increase in performance.
- a micromechanical sound transducer with a first bending transducer or bending actuator (designed to be capable of vertical vibration) and a diaphragm element extending vertically (ie out of the plane of the substrate and thus also out of the plane of extent of the bending transducer) to the first bending transducer or bending actuator is produced created.
- the shutter member is separated by a gap from the free end of the first bending actuator.
- this aspect is that it can be achieved by the diaphragm element over the entire range of motion of the transducer or actuator (due to the vibration) that the distance between the diaphragm element and the free end of the actuator remains approximately constant.
- This will have the same effect Achieved as above, namely that due to the high viscous losses at the free end (and possibly also the free sides) or in the gap an acoustic short circuit can be prevented.
- One exemplary embodiment relates to a production method of such an actuator with diaphragm element.
- This method comprises the steps of: patterning a layer to form the first bending actuator, and forming or depositing the vertical aperture element so that it extends beyond the layer of the first bending actuator.
- vertical is to be understood as perpendicular (perpendicular to the substrate plane) or generally angled with respect to the substrate (angular range 75 ° -105 °).
- the first and the second bending actuators are similar bending actuators. These may be, for example, flat, rectangular, trapezoidal or polygonal bending actuators. According to a further embodiment, these bending actuators may each have a triangular shape or a circular segment shape. The triangular or circular segment shape is frequently used in micro-mechanical transducers which comprise more than two bending actuators. In this respect, according to another embodiment, the micromechanical transducer comprises one or more further bending actuators, such as. B. three or four bending actuators.
- either the simultaneous or in-phase control of the two bending actuators or the provision of the diaphragm element makes it possible, starting from a gap which (at rest) is less than 10% or even less than 5%; 2.5%, 1%, 0.1% or 0.01% of the area of the first bending actuator, the gap remains small over the entire range of motion, that is, even at deflection maximum 15% or even only 10% (or 1 % or 0, 1% or 0.01%) of the area of the first bending actuator.
- the height of the diaphragm element is dimensioned such that it is at least 30% or 50% or preferably 90% or even 100% or more of the maximum deflection of the first bending actuator in linear operation (ie linear mechano). elastic range) or the maximum elastic deflection of the first bending transducer (generally 5-100%). Alternatively, the height depending on the gap width (at least 0.5 times, 1 times, 3 times or 5 times the gap width) or depending on the thickness of the bending transducer (at least 0.1 times, 0.5 times, 1 time, 3 times or 5 times) times thickness).
- an aperture element may be arranged opposite to the free end, but also, for example, on the non-clamped sides around the bending actuator. This is particularly useful when the bending actuator is a cantilevered bending actuator.
- the aperture member may have a varying geometry in its cross-section (e.g., a geometry curved / tilted toward the actuator) such that the slot has a substantially constant cross-section along the actuator movement.
- the shutter may form a mechanical stop to prevent mechanical overloading.
- a micromechanical sound transducer which comprises a controller which controls the second bending actuator in such a way that it is excited to oscillate in phase with the first bending actuator.
- a sensor which detects the oscillation and / or the position of the first and / or the second bending actuator, in order to allow the control that the two bending actuators are driven in phase .
- this principle can be used to determine the actual position of the sound-generating element with the help of well-integrated sensors. This is a great advantage and allows a much more accurate and reliable detection. This forms the basis for a controlled excitation (closed-loop), with which external influences, aging effects and nonlinearities can be electronically compensated.
- the bending actuators can also have a so-called “cascading”, that is to say that the first and / or the second bending actuator each comprise at least a first and a second bending element. These elements are connected in series.
- connection between the two bending elements can be formed, for example, by a flexible element
- the micromechanical sound transducer can have an additional frame which is provided, for example, in the region of the transition between the first and the second bending element
- a micromechanical sound transducer is provided with at least one, preferably two bending actuators, wherein each bending actuator comprises a first and a second bending element, which are connected in series.
- each bending actuator comprises a first and a second bending element, which are connected in series.
- Such bending actuators may according to a further embodiment instead of a separating gap also have a flexible connection.
- Embodiments of this aspect of the invention is based on the finding that the in-series switching of a plurality of bending elements of a bending actuator makes it possible to achieve that different bending actuators are responsible for different frequency ranges.
- the internal bending actuator may be designed for a high-frequency range, while the far-outer frequency range is operated for the low frequency.
- the concept described allows cascading with several individually controllable actuator stages.
- the frequency-separated control in combination with the piezoelectric drives can achieve significant increases in energy efficiency.
- the good mode decoupling also offers advantages in the reproduction quality. Further advantages are z. B. the realization of particularly space-saving multi-way Schaliwandmin.
- Another embodiment relates to a method for producing a micromechanical transducer with cascaded bending actuators.
- the method comprises the steps of providing a first layer that forms the first (and second) bending actuators with the first and second flexures, respectively, and connecting the first and second flexures.
- actuators in one another and / or to make them of different sizes, e.g. to cover different frequency ranges.
- FIG. 1 a is a schematic representation of a micromechanical transducer with two bending actuators according to a basic embodiment
- 1 b is a schematic representation of a micromechanical sound transducer with a bending actuator and a vertical diaphragm element according to another basic embodiment
- Fig. 1 c is a schematic representation of a bending actuator with an arbitrary adjacent structure to illustrate the improvement of the concepts of Figures 1 a and 1 b over the prior art.
- 3a-d are schematic plan views of Biegeaktuatorkonfigurationen according to embodiments; 4 is a schematic diagram illustrating a simulated sound pressure level for different embodiments;
- FIG. 5 is a schematic representation of a micromechanical transducer with two bending actuators, each comprising a cascade, according to embodiments;
- Figures 6a-c are schematic plan views of biaxial actuator configurations with cascading according to embodiments.
- FIG. 7 is a schematic diagram illustrating a simulated sound pressure level with a cascaded bend actuator configuration
- FIG. 8a, b show schematic views or partial views of a plan view of a cascaded bending actuator configuration according to a further embodiment
- Fig. 9 is a schematic diagram illustrating an FE-simulated one
- 10a-c are schematic plan views of bending actuators arranged laterally
- FIG. 12 shows a schematic representation of an array having a multiplicity of micromechanical sound transducers according to one exemplary embodiment
- FIG. 13a-i show schematic representations of different implementations of the diaphragm structures explained in FIG. 1b, according to exemplary embodiments;
- 14a-c are schematic representations of micromechanical sound transducers with a lid according to additional embodiments; 15a-h show schematic representations of plan views of micromechanical sound transducers according to embodiments; and
- Fig. 16 is a schematic representation of a two-side clamped micromechanical sound transducer according to embodiments.
- FIG. 1 a shows a sound transducer 1 with a first bending actuator 10 and a second bending actuator 12. Both are arranged or clamped in a plane E1, as can be seen from the clamping 10e and 12e.
- the clamping can be realized by the bending actuators 10 and 12 are etched out of a common substrate (not shown), so that the bending actuators 10 and 12 are connected on one side to the substrate and under the actuators 10 and 12, a (common) cavity (not shown) is formed.
- the bending actuators 10 and 12 shown here can be biased, for example, so that the illustration either represents a rest state or also shows a deflected snapshot (in this case, the dormant line represents the rest state).
- the two actuators 10 and 12 are arranged horizontally next to each other, so that the actuators 10 and 12 or at least the restraints 10e and 12e lie in a common plane E1.
- This statement preferably refers to the idle state, wherein in the pre-stressed case, the plane E1 mainly refers to the common clamping regions 10e and 12e.
- the two actuators 10 and 12 are arranged opposite one another, so that between them a gap 14 of, for example, 5 ⁇ , 25 ⁇ or 50 ⁇ (generally in the range between 1 ⁇ and 90 ⁇ , preferably less than 50 ⁇ or less than 20 ⁇ ).
- This gap 14, which separates the two cantilever bending actuators 12 and 14, may be referred to as a decoupling gap.
- the decoupling gap 14 varies only minimally over the entire deflection range of the actuators 10 and 12, for example by a factor of 1, 1, 5 or 4 (generally in the range 0.5-5), ie variation of less than + 500%, + 300%, +100 % or + 75% or less + 50% of the gap width (at rest), so as to be able to dispense with an additional seal, as will be explained below.
- the actuators 10 and 12 are preferably driven piezoelectrically. Each of these actuators 10 and 12 may, for example, have a layer structure and, in addition to the piezoelectric active layers, have one or more passive functional layers. Alternatively, electrostatic, thermal or magnetic drive principles are possible.
- the actuators 10 and 12 If a voltage is applied to the actuators 12, then this deforms or in the piezoelectric case, the piezoelectric material of the actuators 10 and 12 and causes a bending of the actuators 10 and 12 out of the plane. This routing results in a displacement of air. In a cyclic control signal is then so the respective actuator 10 and 12 is excited to vibrate to emit a sound signal (or record in the case of a microphone).
- the actuators 10 and 12 or the corresponding drive signal is designed so that adjacent actuator edges or the free end of the actuators 10 and 12 experience a nearly identical deflection from the plane E1.
- the free ends are identified by the reference numerals 10f and 12f. As the actuators 10 and 12 and the free ends 10f and 12f move parallel to each other, they are in phase. In this respect, the deflection of the actuators 10 and 12 is referred to as in-phase.
- FIG. 1 b shows a further variant of how an actuator of a micromechanical sound transducer without sealing can obtain a good sound pressure behavior.
- the embodiment of FIG. 1 b shows the transducer V comprising the actuator 10, which is firmly clamped at the point 10 e.
- the bending actuator 10 may be etched out of a substrate (not shown) such that a cavity (not shown) is formed below it.
- the free end 10f can be made to oscillate over a region B.
- a vertically arranged aperture element 22 is provided. see.
- This diaphragm element is preferably at least as large or larger than the movement region B of the free end 10f.
- the diaphragm elements 22 preferably extended on the front and / or rear side of the actuator, ie viewed from the plane E1 (substrate plane) in a lower plane and a higher plane (eg perpendicular to the substrate). Between the diaphragm element 22 and the free end 10f, a gap 14 'is provided comparable to the gap 14 of FIG. 1a.
- the diaphragm element 22 makes it possible to keep the width of the provided decoupling gaps 14 'approximately equal even in the deflected state (see FIG. Thus, with this configuration, there are no significant openings due to the deflection with the adjacent edges, as shown for example in FIG. 1 c.
- Fig. 1 c shows an actuator 10, which is also clamped at the point 10 e. Opposite an arbitrarily adjacent structure 23 is provided without vertical expansion and without movement. As a result of a deflection of the actuator 10, an opening is established in the region of the free end 10f of the actuator. Depending on the deflection, these opening cross-sections 14o may be significantly larger than the decoupling slots (see Figures 1 a and 1 b) or, in general, a coupling slot in the idle state see between front and back, resulting in an acoustic short circuit.
- the side surface of the diaphragm element 22 or the diaphragm element 22 can be adapted to the movement of the actuator 10 in the deflection region B.
- a concave shape would be conceivable.
- Both the structure 1 of FIG. 1 a and the structure V of FIG. 1 b make it possible to prevent the acoustic short circuit by providing means which keep the decoupling gap 14 or 14 'approximately constant over the entire range of motion.
- a piezoelectric material may be used.
- Fig. 2 shows in the representations ac three different cross sections of possible actuator elements.
- a unimorph structure is shown.
- a passive layer 10p, 12p a piezoelectric layer 10pe or 12pe is applied.
- Fig. 2b shows a bimorph structure.
- two piezoelectric layers 10pe_1 or 12pe_1 and 10pe_2 or 12 pe_2 and a passive intermediate layer 10p or 12p are provided.
- FIG. 2c shows a piezoelectric layer stack with two piezoelectric layers 10pe_1 or 12pe_1 and 10pe_2 and 12 pe_2.
- All piezoactuators shown in FIGS. 2a to 2c thus have in common that they consist of at least two layers, namely a piezoelectric layer 10pe or 12pe and a further layer, such as. B. a passive layer 10p, 12p or another piezoelectric layer 10pe_2, 12pe_2 is formed.
- the piezoelectric layers 10pe, 12pe, 10pe_1, 12pe_1, 10pe_2, 12 pe_2 can be designed as multilayer systems with additional separating layers (cf., the layers 10p, 12p) and / or themselves be formed from any number of sublayers (see dashed lines).
- the contacting takes place, for example, by flat or interdigital electrodes.
- a thermal drive can be used, which may have a multi-layer structure analogous to the piezoelectric actuators.
- the structure of a thermal drive then corresponds to the structure as explained with reference to FIGS. 2a-c for piezoelectric layers, wherein thermally active layers are used instead of piezoelectric layers.
- FIG. 3a shows an actuator arrangement with four actuators 10 ', 11', 12 'and 13'.
- Each of these actuators 10 'to 13' is triangular and clamped on one side along the hypotenuse.
- the triangles are right triangles, so that the rectangular tips of the actuators 10 'to 13' all coincide in one point.
- the feedback gaps 14 each extend between the catheters.
- the individual actuators 10 'to 13' can also be further subdivided, as indicated by the dashed lines.
- the clamping is no longer along the hypotenuse, but along one of the catheters, while the decoupling gaps then extend along the hypotenuse and along the other catheters.
- the triangular configuration makes it possible for the adjacent free ends (separated by the respective gaps 14) to have as much deflection as possible.
- Fig. 3b shows in principle the top view of the embodiment of Fig. 1a, wherein here just indicated that both the actuator 10 and the actuator 12, z. B. along the symmetry axes (see dashed line) can be subdivided.
- FIG. 3 c shows a further embodiment in which the entire sound transducer is arranged in a circular segment, and has a total of four 90 ° segments as actuators 10 "to 13", which in turn are separated from one another by the separation strip 14.
- the individual actuators 10 "to 13" can in turn be further subdivided, as indicated by the dashed lines.
- the separating gaps 14 preferably extend along the symmetry lines. In the exemplary embodiments with more than two actuators, this therefore means that, according to a preferred embodiment, the separating gaps meet in the center of gravity of the total area of the sound transducer.
- Fig. 3d shows (in plan view) another version of a micromechanical transducer with four (here rectangular or square) actuators 10 "', 1 1"', 12 “'and 13”', in the form of four quadrants of a rectangle or square are arranged.
- the four actuators 10 "'to 13"' are separated from each other by two intersecting separation string 14.
- Each of the actuators 10 "'to 13"' is over corner, ie clamped on two sides on the outer edge.
- it is shown what influence the gap width has. 4 shows the resulting sound pressure level SPL over a frequency range of 500 Hz to 20 kHz for four different gap widths (5 [im, 10 ⁇ , 25 pm and 50 ⁇ ).
- the reduction of the sound pressure level SPL (acoustic short circuit) for gap width of less than 10 ⁇ negligible and the structure behaves acoustically as a closed membrane.
- the influence of the gap width decreases significantly in the higher frequency range (eg above 6000 Hz).
- the present systems are characterized by a significantly higher efficiency due to the decoupling of the individual actuators. The latter manifests itself in very high deflections and sound pressure levels.
- FIG. 5 shows a structure of a micromechanical sound transducer 1 "with two actuators 10 * and 12 * .
- the two actuators 10 * and 12 * each comprise an inner stage and an outer stage, that is to say that the actuator 10 * a first actuator element 10a * (outer stage) and a second actuator element 10i * (inner stage) .
- the actuator 12 * comprises the actuator element 12a * as well as the actuator element 121 *.
- the outer steps 10a * and 12a * are always clamped, namely over the areas 10e * and 12e *.
- the opposite end of the actuators 10a * and 12a * is referred to as the free end.
- the inner stages 101 * and 12i * are coupled by means of optional connecting elements 17.
- the coupling takes place in such a way that the coupling is again designed, for example, via one end of the inner actuator elements 10i * or 12i *, namely such that the opposite ends of the inner actuators 10i * and 12t * serve as free ends.
- this means that the actuator 10 * or 12 * is constructed in such a way that the inner stage 10i * (or 12i *) is connected in series with respect to the outer stage 10a * (12a *).
- a decoupling gap 14 * is formed between the free ends of the elements 101 * and 12i *.
- the actuators 10 * and 12 * are separated from each other only over a decoupling gap 14 which is a few micrometers wide and are preferably designed so that adjacent structural edges (free edges of the inner elements 10e * and 12e *) in operation as equal as possible deflection (synchronous or in-phase) from the plane E1 (in which the actuators 10 * and 12 * or the clamping region 10e * and 12e * are arranged) learn.
- a connection of the inner elements 10i * and 12i * in the region of the gap shown, for example by means of a flexible material would be possible.
- the individual cascaded stages may rest on a frame 19.
- the frame 19 is arranged such that the clamped ends of the inner steps 10i * and 12i * rest on the same frame 19.
- the frame 19 is preferably arranged such that it lies in the region of the connection points (see connecting elements 17). The frame makes it possible to suppress parasitic vibration modes as well as unwanted mechanical deformations.
- a micromechanical transducer with only one actuator (eg, the actuator 10 *) is created, which has the first stage 10a * and the second stage 10l * in a corresponding series arrangement.
- This actuator for example, swing freely relative to a fixed end, so that a gap is formed therebetween or be flexibly connected to a fixed end.
- a diaphragm as it is explained for example in Fig. 1 b, conceivable.
- FIGS. 6a to 6c three exemplary transducers in the schematic plan view are explained, in which the configurations from FIGS. 3a to 3c are extended by just the cascading (two-stage cascading configurations).
- 6a shows a micromechanical sound transducer with four actuators 10 * 'to 13 *', wherein each of the actuators 10 * 'to 13 *' has two actuator elements 10a * 'and 10i *' to 13i * 'and 13a *', respectively.
- the inner elements 10i * 'to 13i *' each have a triangular shape (with respect to the surface), while the outer elements 10a * 'to 13a *' have a trapezoidal shape (relative to the surface).
- the smaller leg of the trapezoidal actuator 10a * 'to 13a *' is connected to the hypotenuse leg of the triangular actuator 10i * 'to 131 *' via connecting elements 17.
- the optional connecting elements preferably arranged at the corners of the trapezoid or the triangle.
- Fig. 6b shows in a plan view substantially the electromechanical Schailwandler of Fig. 5 with the inner actuators 10i * and 12i * and the outer actuators 10a * and 12a * .
- 10i * , 10a *, 12i * and 12a * connecting elements 17 are provided at the corners of the rectangular inner and outer elements.
- FIG. 6c shows, starting from the micromechanical sound transducer in the form of a circle segment, the cascaded actuators 10 * "to 13 *", wherein each actuator has an inner actuator element and an outer actuator element.
- the inner actuator elements 10i * "to 13i *” are designed as circular segment-shaped elements, while the outer elements 10a * "to 13a *” are designed as circular disc segments.
- the connection is again via connecting elements 17th
- the actuators 10 * 'to 13 *' or 10 * to 12 * or 10 * "to 13 * " are separated from one another by separation gaps 14.
- separation gaps 15 between the inner actuators can also be provided, which are just bridged by the connecting elements 17.
- the outer stages for example, 10a * and 12a * in Fig. 6b
- the connecting elements can be designed as mechanical spring elements or joints.
- the actuators can also be subdivided further, so that any number of actuators per actuator element 10 * or 12 * are created (see dashed line).
- the actuators of the outer stage deflect the inner stage out of the plane, the actuators of the inner stage exerting a further deflection.
- the result is a deflected structure, which behaves acoustically like a closed membrane due to the high viscous losses in the decoupling slots.
- the cascaded forest may also have three or more stages.
- the different stages can be selectively controlled with identical or different drive signals. In the case of various drive signals, the stages can be operated in different frequency ranges and z. B. form a multi-way transducer with very little space.
- FIGS. 6a to 6c can be combined as desired in accordance with additional exemplary embodiments.
- the variants explained in FIGS. 6a to 6c can be combined as desired in accordance with additional exemplary embodiments.
- the four inner actuator elements 10a * 'to 13a *' of FIG. 6a instead of the four inner actuator elements 10a * 'to 13a *' of FIG. 6a, only two inner actuator elements 10l * and 12i *, as shown in FIG. 6b, are provided.
- an inner actuator element for. B. also in combination with a diaphragm (see embodiment of Fig. 1 b) is provided.
- the outer stage is particularly the low frequency range (maximum shock pressure at about 1500 Hz) while the inner stage is the higher frequency range (maximum sound pressure at about 10,000 Hz).
- a MEMS sound transducer with a chip size of 1 ⁇ 1 cm was used and measured at a distance of 10 cm.
- FIG. 8 illustrates the concept of cascading using the example of a concrete two-stage design.
- Fig. 8a the plan view is shown, wherein in Fig. 8b is a detail enlargement of the connecting portion is shown.
- the two-piece design has external actuators 10a * 'and internal actuators 101 *'.
- the design shown here in Fig. 8a is comparable to the design of Fig. 8a.
- the decoupling slots 14 are known by solid lines. borrowed.
- respective decoupling slots 14 are provided between the individual stages.
- FIG. 9 shows a deflection profile, obtained by means of FEM simulation, of the example design from FIGS. 8a and 8b in a three-dimensional cross-section. As illustrated by the deflection values illustrated by hatching, despite the decoupling slots, an almost continuous deflection profile is formed, which is interrupted only by the narrow decoupling slots 14.
- Fig. 10a is comparable to the configuration of Fig. 1b, wherein the diaphragm member 22 provided with respect to the cantilevered actuator 10 (see Fig. 10e) is provided not only in the region of the free end 10f, but also beyond still along the sides of the actuator, so along the entire decoupling slot 14 'extends.
- the laterally arranged diaphragm elements are identified by the reference numeral 22s.
- Fig. 10b is based on a Schallwandlerkonfiguration with two opposing actuators 10 and 12, as z. B. is shown in Fig. 3b. These are once again actuators clamped on one side (see clamping 10e or 12e). Along the lateral decoupling slots 14 extends in this embodiment, a vertically arranged aperture element 22s.
- FIG. 10 c shows a further variant in which four actuators 10 "", 11 “", 12 “” and 13 “” extend from a central area 16.
- the four actuators 10 "" to 13 “” are each designed trapezoidal and are clamped on one side over their short side opposite the surface 16.
- the four actuators 10 "" to 13 “” are separated by four diagonally arranged separation gaps 14 (which extend as an extension of the diagonal of the surface 16) so that the long side of the actuators 10 "" to 13 “” can swing freely.
- a (circumferential) vertically formed aperture element 22s is provided along the long side of the trapezoidal actuators 10 "" to 13 "”.
- Fig. 12 shows a micromechanical sound transducer in array form.
- the micromechanical transducer shown here has eight sound transducers 1, as explained for example in relation to FIG. 1a. These eight sound transducers 1 are arranged in two rows and four columns. As a result, a large-scale expansion and thus a high sound pressure can be achieved. Assuming that each actuator of the transducers 1 and a base area 5 x 5 mm, so this so to speak, 200 mm 2 "membrane surface" realized.
- the transducer shown so scalable, so that also transducer sizes of eg 1 cm in length or more (generally in the range of 1 mm to 50 cm) can be achieved.
- FIG. 12 by way of example, the micromechanical sound transducer 1 of Fig. 1 a has been explained, it should be noted at this point that any other sound transducer, as explained above, such. B. the sound transducer 1 'from Fig. 1 b or the cascaded sound transducer of FIG. 5 can be used. Also, other shapes and arrangements are conceivable.
- the individual actuators explained above can be provided with sensors.
- the sensors allow the actual deflection of the actuators to be determined. These sensors are typically connected to the control of the actuators, so that the control signal for the individual actuators is readjusted by a feedback loop such that the individual actuators oscillate in phase.
- the sensor system may also have the sense to detect non-linearities and to distort the signal during the control in such a way that non-linearities can be compensated or reduced. Background: Since the actuators simultaneously form the sound-generating element, aging effects and non-linearities can be directly measured during operation and, if necessary, electronically compensated. This represents a great advantage over conventional membrane-based systems in which either no sensor technology is present or only the behavior at the drives, but not at the sound generating membrane element can be detected.
- the position detection is preferably carried out via the piezoelectric effect.
- one or more regions of the piezoelectric layer on the actuators can be provided with separate sensor electrodes, via which an approximately proportional to the deflection voltage or charge signal can be tapped.
- a plurality of piezoelectric layers can be realized, wherein at least one layer is partially used for the position detection. It is also possible a combination of different piezoelectric materials, which are arranged either one above the other or next to each other (eg PZT for actuators, AIN for sensors).
- piezoelectric sensor elements it is also possible to integrate thin-film strain gauges or additional electrodes for capacitive position detection. If the actuator structures are made of silicon, piezoresistive silicon resistors can also be integrated directly.
- Such transducers can be operated, for example, with a first eigenmode of 10 Hz to 300 kHz.
- the excitation frequency is chosen, for example, static up to 300 kHz.
- the described actuator structures are suitable for fields of application in which, with the smallest possible component volumes ( ⁇ 10 cm 3 ), sound is to be generated in a frequency range between 10 Hz and 300 kHz. This applies in the first place to miniaturized sound transducers for wearables, smartphones, tablets, laptops, headphones, hearing aids, but also ultrasound transducers. On the whole, other applications are also considered in which fluids are displaced (eg fluid-mechanical and aerodynamic drive and guidance structures, inkjets).
- Embodiments provide a miniaturized device for displacing gases and liquids with at least one deflectable bending actuator, characterized in that the device contains narrow opening slots with such a large flow resistance, so that the device in the acoustic and ultrasonic frequency range (20 Hz to 300 kHz) behaves like a closed membrane in terms of flow.
- the device may comprise the following features: Decoupling slots in the actuator materials, the total length of which make up at most 5% of the total actuator area and have an average length-to-width ratio of more than 10.
- the device is designed such that formed in the deflected state openings account for less than 10% of the total actuator area, so that even without a closed membrane, a high fluid separation between the front and back is achieved.
- the device may comprise two or more opposing actuators separated from each other.
- the actuators can be driven piezoelectrically, electrostatically, thermally, electromagnetically or by means of a combination of several principles.
- the device is formed with two or more actuator stages coupled via connecting elements.
- the device has two or more actuator stages, which are controlled with separate signals and thus form a two-way or multi-way transducer.
- each actuator element 10a *, 12a *, 10i * and 12i * is an active, individually controllable element. This can be actuated, for example piezoelectric or with another principle explained here.
- the device has a frame structure for stiffening and mode decoupling.
- the actuators have been explained in particular as unilaterally clamped actuators. At this point it should be noted that two-sided clamping (see Fig. 3d) or generally multi-sided clamping would be conceivable.
- exemplary embodiments provide a device with flow orifices for reducing the opening cross sections between the front and the rear in the deflected state.
- the device may comprise sensor elements for position detection and control.
- the device for sound or ultrasound generation in air gaseous medium and that is, therefore, be formed in the range of 20 Hz to 300 kHz. Further areas of application are the generation and control of air flow, z. B. for cooling.
- FIG. 11 a possible manufacturing method of the above sound transducers will be explained.
- the embodiment shown here from FIGS. 11 ad permits the production of the exemplary embodiment, as for example in Fig. 1 b is shown. By slight modification, however, with the method shown here, the embodiments of the other figures, in particular from Fig. 1 a detectable.
- a passive layer 50 p is applied to a substrate 48, before a piezoelectric layer 50 p with two electrodes 50 e is then provided.
- the substrate 48 may be an SOI wafer (Silicon on Insulator) comprising a Sl substrate.
- SOI wafer Silicon on Insulator
- the electrodes 50e, the PZT 50pe and the insulation layer 50p are then patterned. This results, for example, in the trenches 50g in the piezoelectric layer 50pe.
- the structuring can be done by wet or dry etching.
- either the step of structuring the trench 50g is carried out so that it has only minimal dimensions in order to produce the product of FIG. 1a or have larger dimensions, so that the one shown here Intermediate product is developed in the direction of the product from 1b.
- a small trench 50g is applied and then the step shown in FIG. 11c is skipped so that, as shown in FIG. 11d, the rear side can be opened by a one-stage or multistage etching process to release the moving structures.
- the substrate is removed below the passivation layer 50p, in particular in the region aligned with the structuring piezoelectric actuators 50pe. This results in the cavity 48c.
- FIG. 1c illustrates the application of the vertically extending diaphragm elements 57. These are introduced here into the trenches 50g of the piezoelectric layer 50pe.
- the lateral position of the trenches 57 may be selected to be aligned with areas of the patterned passivation layer 50p such that, for example, the vertical aperture element 75 is the wall of a Grabens extended in the passive layer 50p.
- the application of the diaphragm elements 57 can be carried out, for example, by electrodeposition and preferably in such a way that the diaphragm elements 57 protrude from the layer of the piezoelectric elements 50p.
- the single or multi-stage etching of the rear side of the substrate 48 takes place in order to produce the cavity 48 c.
- discrete regions of the substrate 48 may be left standing to form the frame 48f within the cavity 48c. This frame corresponds to the frame 19 explained, for example, in FIG. 5.
- aspects have been described in the context of a device, it will be understood that these aspects also constitute a description of the corresponding method, so that a block or a component of a device is also to be understood as a corresponding method step or as a feature of a method step , Similarly, aspects described in connection with or as a method step also represent a description of a corresponding block or detail or feature of a corresponding device.
- Fig. 13a shows a schematic cross section of a diaphragm structure. It can be seen here that the diaphragm structure 22 * consists of several segments 22a *, 22b * and 22c *.
- the segment 22a * extends out of the substrate from the substrate plane (plane of the reference point 10e) in which the bending actuator 10 is in a rest position, for example, while the segment 22b * lies in the same plane of the reference point 10e.
- the segment 22c * lies in the substrate or extends from the substrate surface into the substrate. All illustrated segments 22a *, 22b *, 22c * may according to embodiments have different geometries, ie longitudinal and transverse dimensions as well as variable cross sections.
- the individual segments 22a * , 22b * and 22c * also have different materials or material characteristics.
- the segment 22c * and 22b * may be formed by the substrate itself while the segment 22a * is grown.
- middle position in the above and following embodiments does not necessarily have to correspond to the rest position, but may also be arbitrarily shifted up or down (electrically or mechanically biased).
- FIG. 13b shows a further embodiment of the diaphragm structure, here the diaphragm structure 22 ** .
- the background to this is that the side of the diaphragm structure 22 **, which is directly opposite the actuator 10, extends approximately along the movement path (circular path around the fixed point 10e).
- the diaphragm 22 ** may be tapered either upwards and / or downwards.
- the asymmetric structure shown here is thus only an example, so that naturally also the lower segment of the diaphragm structure 22 ** can be bevelled in an analogous manner in order to achieve a symmetrical structure.
- This embodiment of the diaphragm structure 22 ** with the bevelled inside has the advantage that a gap widening is reduced or increased for larger amplitudes. can be pensiert.
- a bevel can from manufacturing point of view z. B. be realized by adjusting the paint profile or the etching process.
- FIG. 13c shows a further development of the diaphragm structure 22 ** from FIG. 13b, namely the diaphragm structure 22 ** * .
- the diaphragm structure 22 * ** has a curved / rounded inside. This rounding extends along the arcuate trajectory of the actuator 10 and the free end 10f of the actuator 10. Although here the rounded inner side is shown only on the side extending out of the substrate, this rounded inside course on the aperture structure side in the Substrate level present.
- the diaphragm expansion 22 *** with the rounded inner side reduces or compensates for the gap widening at high amplitudes. A rounding can be made from a production point of view z. B.
- FIG. 13 d shows a further diaphragm structure, namely the diaphragm structure 22 * * * *.
- the cross section at the end of the diaphragm structure 22 **** has a broadening or an overhang which serves as a mechanical stop for the actuator 10 or the free end 10f of the actuator. This stop advantageously allows mechanical overload protection.
- 13e shows a further diaphragm structure 22 *****, in which the diaphragm structure 22 ***** is constructed asymmetrically.
- the background to this is that there are actuators 10 which are primarily deflected on one side so that a vertical extension of the diaphragm 22 ***** extends in one direction, here in the direction out of the substrate plane.
- the deflection of the actuator 10 or the extension of the diaphragm structure 22 ** * ** upwards (out of the substrate plane) is shown here, this can of course also be reversed according to exemplary embodiments, ie, so that both elements in the Extending substrate in.
- the displacement of the rest position of the actuator can be realized by an electrical offset in the drive signal or a mechanical projection (eg, layer stress in actuator layers).
- Fig. 13f shows an example of a diaphragm structure 22 * * * *** with a small extension.
- the diaphragm structure 22 **** * * can then be realized so flat, if the deflection of the actuator (10) is low.
- the height extent of the aperture is 22 ****** in the area of the actuator thickness.
- 13g shows an example of a diaphragm structure 22***** which on the one hand consists of a substrate region 23s and the actual diaphragm element 22*****.
- the upper panel structure 22***** can z. B. as an electrodeposited metal or as a polymer (SU8, BGB, .7) or be made of glass or silicon.
- the lower diaphragm structure 23s consists primarily of the substrate (eg silicon or glass) itself and can be provided with additional layers according to further embodiments.
- FIG. 13h shows a further diaphragm structure without an additionally applied element.
- the bending actuator 10 in particular vibrates into the substrate plane, so that it is possible to dispense with a diaphragm element which protrudes from the substrate plane.
- the diaphragm element consists of the substrate element 23s, which forms the lower diaphragm structure.
- the rest position of the actuator 10 can be moved downwards by means of mechanical pretension or an electrical offset, so that the diaphragm element 23s formed here is sufficient. In operation, the actuator can only be deflected downwards, so that no panel is needed up and then the manufacturing cost is reduced.
- FIG. 13i shows another diaphragm structure 22 *** * ****, which consists essentially of a thin layer applied to the substrate element 23s.
- the layer thickness of the diaphragm element 22****** can be in the range of Aktuatordicke.
- the substrate 23s can (but does not have to) additionally act as a diaphragm structure and terminate flush with the diaphragm structure 22****** or also have an offset.
- the micromechanical sound transducer is extended by a further substrate 220a, 220b and 220c (cover).
- the further substrate 220a, 220b, 220c forms the diaphragm structure.
- FIG. 14 a shows a substrate 220 a designed as a cover, which is placed on a substrate 23s above a cavity 23k of the bending actuator 10, so that the bending actuator 10 is defined within the cover 220a or within the space defined by the cover interior. raum 220a and the cavity 23 can swing.
- the lid 220 a is disposed on the side opposite to the free end such that the inner side wall of the lid 220 a is separated from the end 10 e by the gap 140.
- the lid 220a since the lid 220a is completely closed, the bending actuator 10 emits the sound through the cavity 23k.
- Figure 14a illustrates a cross-section through the substrate 220a, with the further substrate extending, for example, in a circular or angular fashion around the bending actuator 10 to provide a volume or coverage generally therefor.
- the cover 220a can be produced, for example, by a second structured substrate (that is, a substrate having a cavity) (see reference numeral 221k). This second substrate is then applied to the substrate with the bending actuator 10, so that the cavity 221 k is at least partially aligned with the cavity 23 (in the region of the gap 140).
- FIG. 1b shows a further embodiment with a modified cover 220b, wherein the remainder of the construction is based on the same actuator 10 and the substrate 23s.
- the lid 220b differs from the lid 220a in that it has optional sound openings 222o and 222s, respectively.
- the sound opening 222o or the plurality of sound openings 222o are applied to the main surface of the lid 220b, while the opening 222s is provided laterally. It should be noted at this point that, according to embodiments, it is also sufficient that an opening, either the opening 222o or the opening 222s, is provided. Through these openings 222o and 222s, the trapped air volume in the cavity 221 k can be ventilated.
- the openings can serve the sound outlet or allow pressure equalization.
- FIG. 14 c shows a further sound transducer with a cover 220 c, which has an opening 222 o.
- the bending actuator is provided on another substrate 230s, which has a lateral opening 232s.
- the substrate 230s is applied to another substrate 233s and a lid 233s, respectively, so that the cavity 230k is completed.
- This further substrate 233s may also have optional sound openings 233o.
- a closed volume or volume ventilated via at least one of the optional openings 232s, 233o, 222o is formed.
- the volume is essentially formed by the cavities 221 k and 230 k and opened via at least one or more openings.
- the openings can be used for sound emission or allow pressure equalization.
- a plurality of openings may cooperate and form one or more lattice structures that protect the actuator 10 from mechanical impact and dust.
- the actuator is provided with the reference numeral 100 or 100_1 to 100_4, while the diaphragm is provided with the reference numeral 225. Between the actuator and diaphragm always extends a coupling slot, which is provided with the reference numeral 140.
- actuator geometry can be combined with one another as desired (eg, Fig. 15f with rounded or triangular actuators).
- FIG. 15 a shows a plan view of a rounded actuator 100
- FIG. 15 b shows a plan view of a triangular actuator 100.
- Identical or different actuators 100 can be combined with one another as desired, as illustrated for example with reference to FIGS. 15c, 15d and 15e.
- FIG. 15c here shows triangular actuators 100_1 to 100_4, which in total describe a quadrilateral area, the four actuators 100_1 to 100_4 being separated from one another by a diaphragm structure 225 arranged in the shape of a cross. Between actuators 100_1 to 100_4 and the diaphragm structure 225, the slot 145 is again provided. Alternatively, arrangements with 3, 5, 6 ... actuators would be conceivable. It should also be noted that the total area does not necessarily have to be quadrangular, but can also be polygonal.
- Fig. 15d shows two opposing square actuators 100_5 and 100_6, which describe a quadrilateral. The square actuators form 100_5 and 100_6 each have three free corners, which are bounded by the H-shaped aperture 225 with associated slot 140.
- Fig. 15e shows four circular segment-shaped actuators 100_7 to 100_10, which are similar to Fig. 15c by a cross-shaped aperture 225 with slot 140 separated from each other.
- the hypotenuse of each triangular-shaped actuator 100_1 to 100_4 is clamped, while in the exemplary embodiment of FIG. 15e, in each case, the circular segmental arcs 100_7 to 100_10 are firmly clamped.
- arrangements with 3, 5, 6 ... actuators would be conceivable.
- the total area does not necessarily have to be quadrangular, but can also be polygonal.
- Fig. 15f combines e.g. three differently shaped, but each quadrangular actuators 100_1 to 100_ 3, which are each clamped on one of the four sides, wherein three of the four sides form free ends. Between the free ends, a labyrinth-shaped aperture 225 is provided which, using the slots 140, separates the actuators 100_11 to 100_13. All actuators 100_11 to 100_13 have e.g. different size (area) and can be designed for different frequency ranges.
- FIG. 15g shows two actuators 100_14 and 100_15, wherein the first 100_14 is a quadrangular small actuator.
- the further, larger actuator 100_15 is also quadrangular, but has a recess 100_15a for the other actuator 100_14.
- the recess 100_15a is arranged so that both actuators are clamped on the same side.
- a slot 140 provided between the second actuators 100_14 and 100_15, these actuators 100_14 and 100_15 can be decoupled in their movement.
- the larger actuator 100_15 can be used, for example, for the low-frequency range, while the inner actuator 100_14 can be used for the high-frequency range.
- Fig. 15h shows a similar structure of the actuators 100_14 and 100_15, wherein in addition to the separation by means of the slot 40 of the two actuators 100_ 4 and 100_15 also another aperture 225 is provided.
- Both embodiments (FIG. 15g and 15h) have in common that at least along the free ends of the large actuator 100_15 with the recess 100_15a, in which the small actuator 10CM4 is arranged, the aperture 225 together with slot 140 are arranged.
- Such an inner nesting or provision of larger and smaller actuators makes it generally possible to cover different frequency ranges with different actuators.
- FIG. 16 shows a schematic plan view of a double-sided or multi-sided clamped (see regions 10e1 and 10e2) bending actuator 10 * * which has at least one free side 10f * * (here 2).
- this free side 10f ** can be acoustically separated by an opposing diaphragm 22 ** (here 2, according to the variants explained) with a gap 14 ** lying therebetween.
- a sound transducer for the emission of sound should be created, which is why always was spoken of a bending actuator.
- the principle is also reversible, so that a microphone is formed by the transducer according to an embodiment in which the bending transducer (see Biegeaktuator) is formed, for example by air, to (eg vertical) vibration to be excited, in response thereto output electric signal (in general to detect the acoustic waves from the environment).
- a device which comprises both loudspeaker and microphone based on concepts explained above.
- the two components can be formed on the same substrate, which is advantageous from a manufacturing point of view.
- Glacer et al. Reversible acoustical transducers in MEMS technology, Proc. DTIP
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- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
- Micromachines (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Circuit For Audible Band Transducer (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
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Abstract
Description
Claims
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EP23189034.4A EP4247006A3 (de) | 2017-05-26 | 2018-05-28 | Mikromechanischer schallwandler |
EP23189032.8A EP4247005A3 (de) | 2017-05-26 | 2018-05-28 | Mikromechanischer schallwandler |
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DE102017208911.3A DE102017208911A1 (de) | 2017-05-26 | 2017-05-26 | Mikromechanischer Schallwandler |
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EP (3) | EP3632135B1 (de) |
JP (2) | JP7303121B2 (de) |
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DE102021201784A1 (de) | 2021-02-25 | 2022-08-25 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | MEMS-Schallwandler-Array |
DE102023203237A1 (de) | 2023-04-06 | 2024-10-10 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Mems-schallwandler |
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---|---|---|---|---|
DE102019201744B4 (de) | 2018-12-04 | 2020-06-18 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Mems-schallwandler |
EP3675522A1 (de) * | 2018-12-28 | 2020-07-01 | Sonion Nederland B.V. | Miniaturlautsprecher ohne wesentliche akustische leckage |
JP2020136800A (ja) * | 2019-02-15 | 2020-08-31 | 新日本無線株式会社 | 圧電素子 |
DE102019116080A1 (de) * | 2019-06-13 | 2020-12-17 | USound GmbH | MEMS-Schallwandler mit einer aus Polymer ausgebildeten Membran |
JP7522541B2 (ja) * | 2019-07-12 | 2024-07-25 | 日清紡マイクロデバイス株式会社 | 圧電素子 |
US11042346B2 (en) * | 2019-07-30 | 2021-06-22 | International Business Machines Corporation | Artificial cochlea |
DE102019218769A1 (de) * | 2019-12-03 | 2020-11-19 | Robert Bosch Gmbh | Mikromechanisches Bauteil für eine Aktor- und/oder Sensorvorrichtung |
JP7433870B2 (ja) | 2019-12-04 | 2024-02-20 | エルジー ディスプレイ カンパニー リミテッド | 表示装置及び情報処理装置 |
US11202138B2 (en) * | 2020-03-05 | 2021-12-14 | Facebook Technologies, Llc | Miniature high performance MEMS piezoelectric transducer for in-ear applications |
CN111328005B (zh) * | 2020-03-10 | 2021-09-10 | 瑞声声学科技(深圳)有限公司 | 压电式mems麦克风 |
WO2021220566A1 (ja) * | 2020-04-30 | 2021-11-04 | 株式会社村田製作所 | 圧電デバイス |
US11399228B2 (en) * | 2020-07-11 | 2022-07-26 | xMEMS Labs, Inc. | Acoustic transducer, wearable sound device and manufacturing method of acoustic transducer |
US11884535B2 (en) * | 2020-07-11 | 2024-01-30 | xMEMS Labs, Inc. | Device, package structure and manufacturing method of device |
US11972749B2 (en) * | 2020-07-11 | 2024-04-30 | xMEMS Labs, Inc. | Wearable sound device |
US12088988B2 (en) * | 2020-07-11 | 2024-09-10 | xMEMS Labs, Inc. | Venting device and venting method thereof |
US11323797B2 (en) * | 2020-07-11 | 2022-05-03 | xMEMS Labs, Inc. | Acoustic transducer, wearable sound device and manufacturing method of acoustic transducer |
US12028673B2 (en) | 2020-07-11 | 2024-07-02 | xMEMS Labs, Inc. | Driving circuit and wearable sound device thereof |
US12022253B2 (en) * | 2020-07-11 | 2024-06-25 | xMEMS Labs, Inc. | Venting device |
CN213342677U (zh) * | 2020-09-27 | 2021-06-01 | 瑞声科技(南京)有限公司 | 一种压电式麦克风 |
IT202000024469A1 (it) * | 2020-10-16 | 2022-04-16 | St Microelectronics Srl | Trasduttore ultrasonico microlavorato piezoelettrico |
US20240128928A1 (en) * | 2021-01-14 | 2024-04-18 | xMEMS Labs, Inc. | Demodulation Signal Generator for Air Pulse Generator |
US12075213B2 (en) * | 2021-01-14 | 2024-08-27 | xMEMS Labs, Inc. | Air-pulse generating device |
US20230292058A1 (en) * | 2021-01-14 | 2023-09-14 | xMEMS Labs, Inc. | Air-Pulse Generating Device Producing Asymmetric Air Pulses |
US20230300539A1 (en) * | 2021-01-14 | 2023-09-21 | xMEMS Labs, Inc. | Air-Pulse Generating Device with Efficient Propagation |
US11943585B2 (en) * | 2021-01-14 | 2024-03-26 | xMEMS Labs, Inc. | Air-pulse generating device with common mode and differential mode movement |
JP7452476B2 (ja) | 2021-03-10 | 2024-03-19 | 株式会社デンソー | 圧電素子、圧電装置、および圧電素子の製造方法 |
DE102021202573B3 (de) | 2021-03-16 | 2022-07-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Mems-schallwandler mit ausnehmungen und auskragungen |
DE102021203360A1 (de) | 2021-04-01 | 2022-10-06 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Mems-schallwandler |
US20240022859A1 (en) * | 2021-05-11 | 2024-01-18 | xMEMS Labs, Inc. | Package structure, apparatus and forming methods thereof |
US11711653B2 (en) | 2021-05-11 | 2023-07-25 | xMEMS Labs, Inc. | Sound producing cell and manufacturing method thereof |
US20220408195A1 (en) * | 2021-06-17 | 2022-12-22 | Skyworks Solutions, Inc. | Acoustic devices with residual stress compensation |
CN113365196B (zh) * | 2021-07-05 | 2023-06-02 | 瑞声开泰科技(武汉)有限公司 | Mems扬声器及mems扬声器制造方法 |
CN113852897A (zh) * | 2021-08-02 | 2021-12-28 | 天津大学 | 压电mems扬声器及其设计方法、电子设备 |
WO2023010247A1 (zh) * | 2021-08-02 | 2023-02-09 | 天津大学 | 压电mems扬声器及其设计方法、电子设备 |
DE102021130035A1 (de) * | 2021-11-17 | 2023-05-17 | USound GmbH | MEMS-Schallwandler mit einer gekrümmten Kontur eines Kragarmelements |
CN114339552A (zh) * | 2021-12-31 | 2022-04-12 | 瑞声开泰科技(武汉)有限公司 | 一种发声装置 |
CN114513729B (zh) * | 2022-01-07 | 2023-07-07 | 华为技术有限公司 | 电子设备及声学换能器 |
US20230270010A1 (en) * | 2022-02-18 | 2023-08-24 | Apple Inc. | Piezoelectric mems valve for an electronic device |
DE102022203173A1 (de) | 2022-03-31 | 2023-10-05 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | MEMS-Schallwandler |
IT202200007043A1 (it) * | 2022-04-08 | 2023-10-08 | St Microelectronics Srl | Trasduttore elettroacustico microelettromeccanico a membrana |
EP4376442A3 (de) * | 2022-04-08 | 2024-08-14 | STMicroelectronics S.r.l. | Mikroelektromechanischer membran-elektroakustikwandler |
EP4283609A1 (de) * | 2022-05-28 | 2023-11-29 | xMEMS Labs, Inc. | Luftpulserzeugungsvorrichtung |
DE102022210125A1 (de) | 2022-09-26 | 2024-03-28 | Robert Bosch Gesellschaft mit beschränkter Haftung | Mikromechanische Schallwandlervorrichtung und entsprechendes Schallwandlungsverfahren |
US12063470B1 (en) | 2023-02-10 | 2024-08-13 | xMEMS Labs, Inc. | Acoustic package structure and covering structure |
DE102023203467A1 (de) | 2023-04-17 | 2024-10-17 | Robert Bosch Gesellschaft mit beschränkter Haftung | Mikroelektromechanische Aktuatorstruktur, Bauelement |
CN117729500B (zh) * | 2024-02-08 | 2024-04-30 | 成都纤声科技有限公司 | 一种声学压电结构、声学传感器和电子设备 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6496351B2 (en) | 1999-12-15 | 2002-12-17 | Jds Uniphase Inc. | MEMS device members having portions that contact a substrate and associated methods of operating |
WO2003017717A2 (en) | 2001-08-17 | 2003-02-27 | Carnegie Mellon University | Method and apparatus for reconstruction of soundwaves from digital signals |
US7003125B2 (en) | 2001-09-12 | 2006-02-21 | Seung-Hwan Yi | Micromachined piezoelectric microspeaker and fabricating method thereof |
WO2004018980A2 (en) | 2002-08-20 | 2004-03-04 | The Regents Of The University Of California | Optical waveguide vibration sensor for use in hearing aid |
JP4715236B2 (ja) * | 2005-03-01 | 2011-07-06 | 株式会社デンソー | 超音波センサ装置 |
WO2007029878A1 (en) * | 2005-09-09 | 2007-03-15 | Yamaha Corporation | Capacitor microphone |
EP3525483B1 (de) | 2007-11-21 | 2021-06-02 | Audio Pixels Ltd. | Verbesserte lautsprechervorrichtung |
JP5707323B2 (ja) | 2008-06-30 | 2015-04-30 | ザ・リージェンツ・オブ・ザ・ユニバーシティ・オブ・ミシガンThe Regents Of The University Of Michigan | 圧電型memsマイクロフォン |
KR101562339B1 (ko) | 2008-09-25 | 2015-10-22 | 삼성전자 주식회사 | 압전형 마이크로 스피커 및 그 제조 방법 |
EP2254353B1 (de) * | 2009-05-19 | 2017-07-05 | Sivantos Pte. Ltd. | Hörvorrichtung mit einem Schallwandler und Verfahren zum Herstellen eines Schallwandlers |
KR101561663B1 (ko) | 2009-08-31 | 2015-10-21 | 삼성전자주식회사 | 피스톤 다이어프램을 가진 압전형 마이크로 스피커 및 그 제조 방법 |
FR2955443B1 (fr) | 2010-01-19 | 2012-03-23 | Univ Maine | Structure de haut-parleur electrodynamique a technologie mems |
DE102010009453A1 (de) | 2010-02-26 | 2011-09-01 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Schallwandler zum Einsetzen in ein Ohr |
CN101841756A (zh) | 2010-03-29 | 2010-09-22 | 瑞声声学科技(深圳)有限公司 | 振膜及应用该振膜的硅电容麦克风 |
EP2669648A4 (de) * | 2011-01-28 | 2017-03-01 | The University of Tokyo | Differenzdrucksensor |
CN103460721B (zh) | 2011-03-31 | 2017-05-24 | 韦斯伯技术公司 | 具有间隙控制几何形状的声换能器以及声换能器制造方法 |
FR2990320B1 (fr) | 2012-05-07 | 2014-06-06 | Commissariat Energie Atomique | Haut-parleur digital a performance amelioree |
DE102012107457B4 (de) * | 2012-08-14 | 2017-05-24 | Tdk Corporation | MEMS-Bauelement mit Membran und Verfahren zur Herstellung |
JP6021110B2 (ja) | 2012-12-28 | 2016-11-02 | 国立大学法人 東京大学 | 感圧型センサ |
US9092585B2 (en) | 2013-01-22 | 2015-07-28 | The Procter & Gamble Company | Computer based models for absorbent articles |
US9212045B1 (en) | 2014-07-31 | 2015-12-15 | Infineon Technologies Ag | Micro mechanical structure and method for fabricating the same |
DE102015210919A1 (de) | 2015-06-15 | 2016-12-15 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | MEMS-Wandler zum Interagieren mit einem Volumenstrom eines Fluids und Verfahren zum Herstellen desselben |
DE102015213771A1 (de) * | 2015-07-22 | 2017-01-26 | Robert Bosch Gmbh | MEMS-Bauelement mit schalldruckempfindlichem Membranelement |
KR101725728B1 (ko) * | 2016-05-30 | 2017-04-13 | 김중배 | 모션 피드백 기능을 갖는 차동 스피커 장치 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102021201784A1 (de) | 2021-02-25 | 2022-08-25 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | MEMS-Schallwandler-Array |
WO2022180161A1 (de) | 2021-02-25 | 2022-09-01 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Mems-schallwandler-array |
DE102023203237A1 (de) | 2023-04-06 | 2024-10-10 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Mems-schallwandler |
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EP4247006A3 (de) | 2023-12-27 |
DE102017208911A1 (de) | 2018-11-29 |
US11350217B2 (en) | 2022-05-31 |
JP2020522178A (ja) | 2020-07-27 |
CN116668926A (zh) | 2023-08-29 |
JP2023029908A (ja) | 2023-03-07 |
EP3632135B1 (de) | 2023-08-02 |
WO2018215669A3 (de) | 2019-01-24 |
CN111034223A (zh) | 2020-04-17 |
US20200100033A1 (en) | 2020-03-26 |
EP4247005A3 (de) | 2023-12-06 |
JP7303121B2 (ja) | 2023-07-04 |
WO2018215669A2 (de) | 2018-11-29 |
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EP4247006A2 (de) | 2023-09-20 |
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