Classifications

• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
  • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
  • C23C14/223—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating specially adapted for coating particles
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K1/00—Soldering, e.g. brazing, or unsoldering
  • B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
• • C—CHEMISTRY; METALLURGY
  • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
  • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
  • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
• • C—CHEMISTRY; METALLURGY
  • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
  • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
  • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
  • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
  • C04B41/81—Coating or impregnation
  • C04B41/85—Coating or impregnation with inorganic materials
  • C04B41/87—Ceramics
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
  • C23C14/02—Pretreatment of the material to be coated
  • C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
  • C23C14/025—Metallic sublayers
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
  • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
  • C23C14/0676—Oxynitrides
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
  • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
  • C23C14/14—Metallic material, boron or silicon
  • C23C14/18—Metallic material, boron or silicon on other inorganic substrates
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
  • C23C14/58—After-treatment
  • C23C14/5806—Thermal treatment
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
  • C23C14/58—After-treatment
  • C23C14/5873—Removal of material
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23B—TURNING; BORING
  • B23B2226/00—Materials of tools or workpieces not comprising a metal
  • B23B2226/31—Diamond
  • B23B2226/315—Diamond polycrystalline [PCD]
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23B—TURNING; BORING
  • B23B27/00—Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
  • B23B27/14—Cutting tools of which the bits or tips or cutting inserts are of special material
  • B23B27/148—Composition of the cutting inserts
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
  • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material

Definitions

• the present invention relates to a method for coating solid diamond materials according to the preamble of claim 1.
• the invention further relates to a method for producing a machine component with a
• machine component is also understood to mean, in particular, a cutting tool and a tool for machining which are well-known to those skilled in the art
• Embodiments may be present.
• Tools in particular those for machining, with a tool head, a tool shank and with a clamping portion for receiving in a tool holder are known in a variety of forms from the prior art.
• Such tools have in their cutting area on functional area topologies, which are adapted to the specific requirements of the materials to be processed.
• the tools mentioned are those which are designed, for example, as drilling, milling, countersinking, turning, threading, contouring or reaming tools. These may have as a functional area cutting body and / or guide rails, wherein the functional body soldered to a support or z. B. may be formed as a change or indexable insert. In addition, it is usually possible to solder on an indexable insert carrier. Typically, such tool heads have functional areas which provide the tool with high wear resistance in the machining of highly abrasive materials such as Al-Si alloys or rock.
• tool heads are provided with a functional layer comprising a superhard material such as cubic boron nitride (CBN) or polycrystalline diamonds (PCD).
• CBN cubic boron nitride
• PCD polycrystalline diamonds
• Shaped bodies of polycrystalline diamonds and sintering aids to solid
• Such solid PCDs are commercially available and can be soldered to a hard metal substrate, for example, with certain solders in an active soldering process under inert gas or vacuum.
• Diamond crystal surface and solder analyzes on real diamond cemented carbide solder joints have shown that the presence of cemented carbide can adversely affect Ti migration to the diamond surface.
• Vacuum brazing is one of the most promising joining methods for making diamond tools, although one must consider the fact that
• Diamonds at elevated temperatures in air from about 500 ° C and in vacuum from about 1300 ° C begin to decompose why it is crucial to provide a joining method in which these critical temperatures are not exceeded.
• Tillmann et al. The covalent bonding of diamond with its bound electrons is the biggest obstacle to a metallurgical interaction between solder alloy and diamond.
• the prior art by Tillmann et al. Proposes that this obstacle be overcome by using a brazing alloy containing active elements that react chemically directly with the diamond.
• Tillmann et al. to use titanium or other unspecified "refractory metals" for this purpose.
• Tillmann et al. a carbidic reaction which results in the formation of a TiC reaction layer which serves as the key to a wetting reaction, since carbide reaction products also have metallic bonds in the sense of an electron gas.
• carbide reaction products also have metallic bonds in the sense of an electron gas.
• Non-oxide ceramics do not necessarily require diamonds for thermodynamic reasons to have such reactive active metals to promote an interfacial reaction. Tillmann et al. experiment with a Kupferbasislot and a
• US Pat. No. 5,626,909 discloses polycrystalline diamond tool sets that can be soldered to a substrate after coating with an adhesive layer and a protective layer of air.
• the bonding layer is formed by coating (by CVD or PVD) a metal layer of, for example, tungsten or titanium and heat treating to produce a corresponding metal carbide at the interface with the tool insert, ie, the diamonds.
• the protective layer applied in a further step consists of a metal such as silver, copper, gold, palladium, platinum, nickel and their alloys and alloys of nickel with chromium.
• coated abrasive particles can be further processed in air with simple solders.
• Diamond materials can be produced, which can be safely and resiliently soldered under ambient air in a metallic surface or against another diamond surface or glued.
• a coated solid PCD according to claim 15 and a machine component according to figure 18 also solves the problem.
• the present invention describes a
• Dampfabscheide Kunststoffe Kunststoffe Kunststoffe Kunststoffe Kunststoffe Kunststoffe Kunststoffe Kunststoffe Kunststoffe Kunststoffemers are at least partially coated, the Coating is carried out with at least one carbide-forming chemical element which is selected from the group consisting of: B, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W; wherein a subset of the diamond carbon present in the surface of the carbide-forming chemical element which is selected from the group consisting of: B, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W; wherein a subset of the diamond carbon present in the surface of the group consisting of: B, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W; wherein a subset of the diamond carbon present in the surface of the group consisting of: B, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W; wherein a subset of the diamond carbon present in the surface of the
• Diamond materials is converted into elemental carbides which form an elemental carbide layer; wherein the chemical element is present in a molar ratio to the element carbides formed in a stoichiometric excess, so that the surface of the
• Element carbide / element mixture layer forms, with a transition layer on the resulting element layer or
• Element carbide / element blend layer is deposited; and in that the transition layer comprises at least one layer which is selected from the group consisting of: boridic layers, nitridic layers, oxidic layers and mixed layers thereof, carbonitridic layers, oxinitridic layers and / or carboxynitridic layers.
• part of the diamond carbon transforms into the corresponding one
• This elemental carbide layer is firmly bonded to the PCD layer.
• an element layer containing the coating element (or elements) is formed on the elemental carbide layer.
• Both layers - the element carbide layer on the one hand and the element layer on the other hand - have metallic bonding properties, resulting in a strong adhesion of the element layer on the carbide layer.
• the Due to their metallic properties, the element layer or the elemental carbide layer / element mixture layer is also readily wettable with a metallic solder, so that stable solder connections to the substrate can be formed.
• a transition layer comprising at least one layer selected from the group consisting of boridic layers, nitridic layers, oxide layers and mixed layers thereof, carbonitridic layers, oxinitridic layers and / or carboxynitridic layers.
• Diamond materials can be used from monocrystalline diamonds or polycrystalline diamonds.
• solid PCDs sintered diamond particles of polycrystalline diamonds
• solid PCDs containing sintering aids selected from the group consisting of: Al, Mg, Fe, Co, Ni, and mixtures thereof. These metals can also contribute to the formation of a solder wettable carbide-containing diamond / solder interface.
• the sintered diamond particles have an average particle size of 0.5 ⁇ to 100 ⁇ .
• Transition layer on the resulting element layer or element carbide / mixed element layer to deposit
• Such a transition layer may be of the elemental type (B, C, N, O) and deposited on the resulting elemental layer or elemental carbide / element mixture layer, wherein boridic layers, nitridic layers, oxide layers and mixed layers thereof, in particular carbonitridic layers, oxinitridic layer and / or a carboxy-nitridic layers.
• E (E1, E2, E3 .... Exy) x (BCNO) y
• E is an element selected from the group consisting of: Mg, B, Al, Si, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W; wherein x in the range of 0-2 and y in the range of 0.5 to 2, wherein for x and y, each independently a range of preferably 0.5 to 1, 1 is preferred.
• Such transition layers can protect the solid PCDs from thermal and chemical influences during the soldering process.
• PVD physical vapor deposition
• Noble gas atmosphere is preferably used an argon atmosphere.
• the PVD method is used in a temperature range from 400 ° C. to 600 ° C., in particular 450 ° C., at a bias Tension of 0 to minus 1000 v and a pressure of 100 mPa to 10,000 mPa for a period of 1 min to 20 min, in particular 5 min performed.
• an annealing step is carried out at 200 ° C. to 600 ° C. for a time between 1 minute and 60 minutes.
• the transition layer can also preferably by means of PVD on the
• Elementcarbid stands in a temperature range of 400 ° C to 600 ° C, in particular 450 ° C, at a bias voltage of 0 to minus 1000V and a pressure of 100 mPa to 10,000 mPa for a period of 0.1 h to 3 h to be applied.
• the transition layer is wettable under air atmosphere with a solder, if necessary with the use of fluxes, and the solid PCDs constructed in this way can thus be soldered without problems into a machine component, in particular a tool.
• multiple solid PCDs can be soldered together to get a larger solid PCD.
• a machine component with at least one functional area of a coated solid-PCD and a metallic support body wherein the solid-PKD is fixed by means of a solder joint on at least one surface of the metallic support body, being used as solder brazing silver or nickel-based or other, well-known to those skilled, suitable brazing alloys are used; and the solder joint between coated solid PCD and carrier body is produced at a maximum of 700 ° C under atmospheric pressure under normal pressure.
• Such machine components can be tools, in particular
• the soldering of the Solid-PKD body is to be made possible - without a protective gas atmosphere - and thus under air atmosphere by means of a bonding layer.
• the test body geometry was a square plate.
• the Solid-PKD grades used are polycrystalline diamond material which, in addition to other metals, also contains cobalt.
• the solid-PCD test bodies were tempered with several carbide-forming metals or elements, in the example of titanium and zirconium, and treated at a temperature of about 600 ° C. and a stress bias of about -150 V in a PVD coating system.
• the formation of metal carbides - TiC and ZrC in this example - was demonstrated by X-ray diffractometry.
• the thickness of the carbide layer was about 0.01 ⁇ , measured by means
• Oxygen and nitrogen are deposited by PVD on the elemental carbide layer.
• the conditions for applying the transition layer were a temperature gradient of 400 ° C to 600 ° C, which was passed through at a rate of 10 ° C / min and then kept at 600 ° C.
• the PVD process was carried out with a bias voltage of about minus 600V and a pressure of about 2000 mPa for a duration of 2 h.
• Such coated solid PCDs were then soldered by means of a solder alloy - in the example case - made of Ag-Cu-Zn-Mn-Ni under a room air atmosphere at about 700 ° C on a hard metal plate and carried out a shear test. Following the shear test, another scanning electron microscopic examination was performed
• the diamond surface itself was also free of damage.

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• Chemical & Material Sciences (AREA)
• Engineering & Computer Science (AREA)
• Materials Engineering (AREA)
• Organic Chemistry (AREA)
• Mechanical Engineering (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Metallurgy (AREA)
• Inorganic Chemistry (AREA)
• Ceramic Engineering (AREA)
• Structural Engineering (AREA)
• Physics & Mathematics (AREA)
• Thermal Sciences (AREA)
• Cutting Tools, Boring Holders, And Turrets (AREA)
• Chemical Vapour Deposition (AREA)
• Drilling Tools (AREA)
• Physical Vapour Deposition (AREA)
• Crystals, And After-Treatments Of Crystals (AREA)
• Polishing Bodies And Polishing Tools (AREA)

Applications Claiming Priority (2)

Publications (1)

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• 2017
  • 2017-01-31 DE DE102017201487.3A patent/DE102017201487A1/de not_active Ceased
• 2018
  • 2018-01-30 EP EP18702669.5A patent/EP3577249A1/de active Pending
  • 2018-01-30 CN CN201880009622.7A patent/CN110249070A/zh active Pending
  • 2018-01-30 WO PCT/EP2018/052283 patent/WO2018141748A1/de unknown
  • 2018-01-30 KR KR1020197023261A patent/KR102532558B1/ko active IP Right Grant
  • 2018-01-30 JP JP2019541247A patent/JP7143307B2/ja active Active
• 2019
  • 2019-07-26 US US16/523,571 patent/US20200023442A1/en not_active Abandoned

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