EP3546822B1 - Micromirror-comprising light module for a motor vehicle headlight - Google Patents

Micromirror-comprising light module for a motor vehicle headlight Download PDF

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Publication number
EP3546822B1
EP3546822B1 EP19161297.7A EP19161297A EP3546822B1 EP 3546822 B1 EP3546822 B1 EP 3546822B1 EP 19161297 A EP19161297 A EP 19161297A EP 3546822 B1 EP3546822 B1 EP 3546822B1
Authority
EP
European Patent Office
Prior art keywords
light module
micromirrors
light
dust
casing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP19161297.7A
Other languages
German (de)
French (fr)
Other versions
EP3546822A1 (en
Inventor
Anton Jost
Ralf Chor
Uwe BREITENBACH
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marelli Automotive Lighting Reutlingen Germany GmbH
Original Assignee
Automotive Lighting Reutlingen GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Automotive Lighting Reutlingen GmbH filed Critical Automotive Lighting Reutlingen GmbH
Publication of EP3546822A1 publication Critical patent/EP3546822A1/en
Application granted granted Critical
Publication of EP3546822B1 publication Critical patent/EP3546822B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/20—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by refractors, transparent cover plates, light guides or filters
    • F21S41/25—Projection lenses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/20—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by refractors, transparent cover plates, light guides or filters
    • F21S41/29—Attachment thereof
    • F21S41/295—Attachment thereof specially adapted to projection lenses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
    • F21S41/32—Optical layout thereof
    • F21S41/36—Combinations of two or more separate reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
    • F21S41/32—Optical layout thereof
    • F21S41/36—Combinations of two or more separate reflectors
    • F21S41/365—Combinations of two or more separate reflectors successively reflecting the light
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/60—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution
    • F21S41/67—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution by acting on reflectors
    • F21S41/675—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution by acting on reflectors by moving reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/10—Protection of lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2102/00—Exterior vehicle lighting devices for illuminating purposes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2107/00—Use or application of lighting devices on or in particular types of vehicles
    • F21W2107/10—Use or application of lighting devices on or in particular types of vehicles for land vehicles

Definitions

  • the present invention relates to a light module for a motor vehicle headlight according to the preamble of claim 1.
  • a light module is from DE 198 22 142 C2 known and has a light source, primary optics, an array of micromirrors whose mirror position is controllable and secondary optics, which has at least one secondary optics lens.
  • the light source, the primary optics, the array of micromirrors and the secondary optics are arranged relative to one another such that light emanating from the light source and directed by the primary optics onto the array of micromirrors can be reflected by the array of micromirrors onto the refractive secondary optics .
  • the unpre-released EP 3 382 268 A1 shows a vehicle headlight with an arrangement of micro-mirrors in a predominantly tight housing and with a pressure compensation valve, which in the simplest case by a simple opening can be replaced.
  • the US 2015/0092435 A1 shows a headlight in which the light source and primary optics are arranged in a different compartment of an interior than an arrangement of micromirrors and secondary optics.
  • the pamphlets U.S. 2015/0211703 A1 , US 2017/0067613 A1 and U.S. 2017/0160542 A1 show headlights each with an array of micromirrors, in which headlights only the array of micromirrors are protected from dust.
  • the array of micromirrors is part of a DMD chip (digital mirror device).
  • DMD chips can have a large number (greater than a million) of micromirrors.
  • Each individual micromirror is only 8 x 8 micrometers in size, for example.
  • a position of each individual micromirror can be switched between two positions. In one position it reflects the incident light onto the secondary optics, and in the other position it reflects the light onto an absorber, for example.
  • the secondary optics images the arrangement of the micromirrors in the area in front of the light module, which in the case of a motor vehicle headlight lies on the road, for example.
  • Micromirrors that reflect light onto the secondary optics appear as bright pixels in the light distribution resulting from the image, while the micromirrors that reflect light onto the absorber appear as dark pixels in the light distribution.
  • the shape of the light distribution can be controlled with a fineness specified by the number of pixels and thus by the number of micromirrors, which, for example, enables camera-controlled light distributions in which areas that would dazzle other road users can be specifically darkened and other areas , such as traffic signs or pedestrians, are specifically illuminated so that they can be recognized by the driver.
  • the object of the invention consists in specifying a light module of the type mentioned in the introduction, the light distribution of which does not have the disadvantageous dark spots and blurred images.
  • the light module according to the invention is characterized in that the light module has a dust-tight interior and that the light source, the primary optics and the arrangement of micromirrors are arranged in the dust-tight interior.
  • the invention is thus based on the finding that the locally undesirably dark areas and blurred images of individual micromirrors are produced by dust particles that are located in the light beam path, in particular between the arrangement of the micromirrors and the secondary optics.
  • the size of dust particles is between 0.1 microns and 100 microns.
  • a typical construction volume of a light module is 0.2 mx 0.2 mx 0.1 m. It has been shown that smaller particles, for example 0.5 micron particles, lead to light losses due to blurred images and that particles that are larger than about 10 microns must be kept completely out of the beam path.
  • the dust-free interior preferably corresponds to protection class IP6K2.
  • the components of the light modules involved in the dust-tight sealing of the interior are preferably assembled in a clean room.
  • the dust-tight interior is enclosed by a front part of the housing, a central support element, a DMD chip, a first printed circuit board, the secondary optics lens and a dust-tight pressure equalization membrane.
  • the front part of the housing prefferably has a housing window in a part of the front part of the housing which faces the first printed circuit board, which window is covered by the first printed circuit board in a dust-tight manner.
  • This configuration allows electrical contacting of the first printed circuit board, which, apart from its surface area covering the housing window, is located completely in the dust-tight interior, without the printed circuit board or a cable harness having to be guided through a sealing surface (i.e. through a surface in which a seal is located).
  • the front part of the housing has a light exit opening which is covered in a dust-tight manner by the secondary optics lens.
  • the dust-proof interior must inevitably have a transparent window through which the light can escape from the interior. Utilizing the secondary optics lens for this function eliminates the need for an additional window, which avoids light loss and reduces complexity and component count.
  • a further preferred embodiment is characterized in that the front part of the housing has a pressure equalization opening which is covered by the dust-tight pressure equalization membrane, the pressure equalization membrane being gas-permeable.
  • the central carrier element has a carrier element window, the opening of which is covered by a DMD chip carrying the arrangement of the micromirrors. This feature allows the front side carrying the micromirrors to be arranged in the dust-tight exterior, while the electrical contact can be made by a second printed circuit board lying completely outside the interior.
  • the DMD chip is arranged on a rear side of the central carrier element that faces away from the interior space, with the arrangement of micromirrors being arranged in front of the opening of the carrier element window. This uses the DMD chip itself for sealing, reducing the complexity of the assembly.
  • the central support element has an interior-side flange area that runs along a closed spatial curve
  • the front housing part has a housing flange area whose shape is a negative of the shape of the flange area of the central support element, see above that when the front part of the housing and the central support element are joined together, the two flange areas touch one another over the entire length of the spatial curve of the flange area or touch a seal lying between them over the entire surface.
  • a seal on a interior-side edge of the housing window over the entire length of the edge of the housing window.
  • the front part of the housing is made of plastic and that the seals and sealing lips formed on the flange areas of the front part of the housing are made of sealing material.
  • FIG. 1 a section through an embodiment of a light module 10 of a motor vehicle headlight according to the invention.
  • the light module has a light source 12 , primary optics 14 , a DMD chip 16 and secondary optics 18 .
  • the light source 12 is a semiconductor light source which is arranged on a first printed circuit board 20 and which emits light 22 in the direction of the primary optics 14 .
  • the primary optics 14 has a light-refracting part 14.1 and a reflector 14.2.
  • the refractive part 14.1 is illuminated by the light source 12 and directs the light 22 onto the reflector 14.2.
  • the reflector 14.2 deflects the light 22 incident on it from the light-refracting part 14.1 onto a reflecting surface of a front side 16.1 of the DMD chip 16, the reflecting surface being composed of a multiplicity of micromirrors consists. It is essential that the primary optics direct the light from the light source onto the DMD chip. How and with which optical elements this happens in detail is not essential for the invention.
  • a pivoting position of the micromirrors can be switched individually for each micromirror or at least for a subset of the micromirrors between a first pivoting position and a second pivoting position.
  • Each micromirror that is in the first pivoting position deflects the light incident on it from the primary optics 14 onto the secondary optics 18 .
  • Each micromirror that is in the second swivel position deflects the light 22 incident on it from the primary optics 14 in such a way that this light 22.1 does not fall on the secondary optics 18.
  • This light 22.1 is directed onto an absorber 24, for example, and is absorbed there, so that it cannot produce any disruptive light effects.
  • the secondary optics 18 directs the light 22 incident on it from the DMD chip 16 into the area in front of the light module 10. When the light module is used as intended, the road ahead of the motor vehicle is illuminated with this light 22.
  • the secondary optics 18 has a secondary optics lens 18.1 made of transparent plastic or glass.
  • the secondary optics 18 can also have several lenses, for example an arrangement of an achromat and an imaging lens.
  • the path of the light 22 from the light source 12 to its exit from the secondary optics 18 through the secondary optics 18 lies completely in a dust-tight sealed interior 26.
  • This interior 26 is defined by a front housing part 28, a central support element 30 , the DMD chip 16, the first printed circuit board 20, the secondary optics 18 and a dust-proof pressure equalization membrane 32.
  • the central carrier element 30 has a front side 30.1 facing the interior space 26 and a rear side 30.2.
  • the central carrier element 30 has a first partial area 30.3 on the light source and primary optics side and a second partial area 30.4 on the DMD chip side. These two sections 30.3 and 30.4 are spatially separated from one another, but are cohesively connected and together form the one-piece central support element 30.
  • the two sections 30.3 and 30.4 enclose an angle that is greater than 90° but less than 180°.
  • the central carrier element 30 is preferably made of metal and also serves as a heat sink, which absorbs the heat released in the light source 12 and emits it to the surroundings of the light module 10 .
  • the first printed circuit board 20 is firmly connected to the front side 30.1 of the central support element 30 in its first section 30.3.
  • the connection is, for example, a screw connection and/or an adhesive connection.
  • a front side 20.1 of the first printed circuit board 20 carries the light source 12 implemented as a semiconductor light source and the primary optics 14.
  • a rear side 20.2 of the first printed circuit board 20 faces the front side 30.1 of the central support element 30.
  • the central carrier element 30 protrudes beyond the first circuit board 20 in directions pointing transversely to the front side 20.1 and to the rear side 20.2 of the first circuit board 20. These directions are also referred to as lateral directions 34 below.
  • An example of a lateral direction 34 is in FIG figure 1 specified. Other lateral directions are perpendicular to the plane of the drawing.
  • the side protruding edge of the The front side 30.1 of the central support element 30 forms part of an interior-side flange area 30.5 of the central support element 30.
  • the second partial area 30.4 of the central carrier element 30 has a carrier element window 35.
  • FIG. A window edge area surrounding the carrier element window 35 forms a window flange area 36 on the rear side 30.2 of the central carrier element 30.
  • the DMD chip 16 is arranged on the rear side 30.2 of the central carrier element 30 in its second partial area 30.4 in such a way that it forms the carrier element window 35 covers.
  • the DMD chip 16 has two broad sides in the form of a front side 16.1 and a back side, the front side and back sides being separated from one another by lateral narrow sides 16.3 lying between them.
  • the front side 16.1 of the DMD chip 16 has a central chip area in which the micromirrors 16.4 are arranged, and it has a flange area 16.5 which runs around the central chip area in a closed curve and in which no micromirrors 16.4 are arranged.
  • the number of micromirrors is about 1.3 million, arranged in a matrix with 1152 columns and 1152 rows.
  • Such DMD chips digital mirror device
  • Texas Instruments are manufactured and marketed, for example, by Texas Instruments.
  • figure 1 and figure 2 show in combination with one another that the DMD chip 16 is arranged overall in such a way that the two flange areas 36 and 16.5 face one another.
  • a DMD chip seal 38 in the form of a flat seal, which is held by the flange areas 36 and 16.5 with a contact force pressing these flange areas together and which surrounds the carrier element window 35 in a closed curve.
  • figure 2 also shows that the DMD chip 16 is arranged and held in a socket 40.1 of a second printed circuit board 40.
  • FIG. The mechanical mounting of the DMD chip 16 in the base 40.1 takes place via the lateral narrow sides 16.3 and possibly also via parts of the rear side of the DMD chip 16, and the electrical contacting also takes place via the lateral narrow sides 16.3 and/or via the rear side of the DMD chip 16.
  • the second printed circuit board 40 is firmly connected to the second partial area 30.4 of the central carrier element 30.
  • the connection is preferably made as an adhesive connection. In the figure 1 this is represented by the contact of the second printed circuit board 40 by screw bosses 30.6 of the central support element.
  • the second printed circuit board 40 does not exert the contact pressure acting perpendicular to the surface of the second printed circuit board 40 and the front side 16.1 of the DMD chip 16.
  • the second printed circuit board 40 holds the DMD chip 16 with its socket in directions pointing tangentially to the front side 16.1 of the DMD chip 16 and the second printed circuit board 40.
  • the second circuit board 40 lies entirely outside of the sealed interior 26.
  • a central area of the backside of the DMD chip 16 serves as an interface for dissipating heat from the DMD chip 16 and therefore has no electrical connections.
  • figure 3 shows schematically a plan view of the second Printed circuit board 40 with a printed circuit board window 42.
  • the opening of the printed circuit board window 42 is opposite the central area of the rear side of the DMD chip 16, which has no electrical connections.
  • figure 4 shows an oblique view of the back 30.2 of a central support element 30 before the assembly of the DMD chip 16.
  • the central support element 30 has on its back 30.2 a support element window 35 in a closed curve surrounding the outer flange area, figure 4 is covered by the DMD chip seal 38.
  • the contours of the DMD chip seal 38 correspond to the contours of the outer flange area and the carrier element window 35.
  • figure 4 also shows screw bosses 30.6, with the help of which the DMD chip 16 is pressed onto the DMD chip seal 38 by additional components. This ensures the sealing function, and the DMD chip 16 is additionally fixed in its end position.
  • figure 1 shows how the contact pressure force acting perpendicularly to the front side 16.1 and the back side of the DMD chip 16 is generated by an elastic element 44 and with a punch 46 through the in figure 3 circuit board window 42 shown is applied to the central part of the rear side of the DMD chip 16.
  • the elastic element 44 has a proximal area 44.1 and two distal ends 44.2.
  • the distal ends 44.2 are rigidly connected to the central support element 30, in particular to its second section 30.4.
  • the proximal area 44.1 is non-positively and/or positively connected to a first end 46.1 of the plunger 46.
  • a second end 46.2 of the stamp 46 is prestressed against the back of the DMD chip 16 on.
  • the pretension corresponds to a restoring force of the elastic element 44 which is generated by elastic deformation of the elastic element 44 when the light module 10 is assembled.
  • the screw bosses 30.6 are preferably used in addition to fastening the distal ends 44.2 of the elastic element 44 to the central support element 30.
  • the DMD chip 16 is held tangentially to its broad sides by the base 40.1 and thus by the second printed circuit board 42. In the direction perpendicular to the broad sides of the DMD chip 16, the DMD chip 16 is clamped between the spring-loaded plunger 46 and the outer flange area, which on the rear side 30.2 of the central support element 30 surrounds the support element window 35 in a closed curve.
  • the contact pressure force generated by the elastic element 44 is also exerted on the DMD chip seal 38 , which thus contributes to the dust-tight sealing of the interior 26 .
  • figure 5 shows a schematic plan view of the front side 30.1 of the central support element 30 with the first printed circuit board 20, support element window 35 and an interior-side flange area 30.5 of the central support element 30, which has the shape of a closed curve.
  • the curve is at the in the figure 1 illustrated embodiment, in which the two sections 30.3 and 30.4 form an angle with one another that is greater than 90° and less than 180°, not in one plane. Depending on the design, the curve can also run in one plane. In any case, the curve forms a curve that runs in space and is therefore a spatial curve.
  • a flat gasket or a flange reinforcement 50 can rest on the first printed circuit board 20, which, when assembled with the front housing part 28, runs around the housing window 48 of the front housing part.
  • FIG 6 shows that to the central support element 30 from figure 5 complementary housing front part 28.
  • an interior 26 of the light module 10 facing the inside of the housing front part 28 with the housing flange area 28.1 is visible.
  • the front housing part 28 has a housing flange area 28.1, the shape of which is a negative of the shape of the flange area 30.5 of the central support element 30, so that both flange areas 28.1, 30.5 when the front housing part 28 and the central support element 30 are joined together along the entire length of the spatial Flatly touch the curve of the flange area 30.5 or flatly touch a seal lying between them.
  • a seal 52 rests on the housing flange area 28.1 over its entire length.
  • a seal 54 rests along the length of the rim of the housing window 48 on the rim.
  • the seals 52 and 54 are preferably sealing lips made of sealing material which is molded onto the front part 28 of the housing, which is preferably made of plastic.
  • the sealing material is, for example, a plastically deformable plastic, for example silicone. Silicone has the advantage that it can be heated out before assembly, which avoids subsequent impairment of optical surfaces of the light module 10 by deposits of evaporated sealing material.
  • the gasket 52 is compressed between the flange areas 28.1 and 30.5 and the gasket 54 is compressed between the flange reinforcement 50 or the first circuit board 20 on one side and the edge of the housing window 48 on the other side compressed.
  • the projection module 10 preferably has screw connections with which the flange areas 30.5 and 28.1 are pressed onto one another. In the assembled state, the housing front part 28 and the central support element 30 surround the interior space 26.
  • FIG. 1 shows, at least the rear side 20.2 of the first printed circuit board 20, which faces the front side 30.1 of the central support element 30 on the interior side, is located in the inner space 26.
  • the front housing part 28 has a housing window 48 in a part of the front housing part 20 which faces the first printed circuit board 20 .
  • the housing window enables an electrical connection of the electrical components arranged in the dust-tight, sealed interior 26 of the light module 10, in particular the light source 12, to a cable harness 29 routed from the outside.
  • the edge of the housing window 48 forms a housing window flange on its side facing the first printed circuit board 20, which flange touches the first printed circuit board 20 over its entire length or which touches a seal 54 surrounding the opening of the window at least over its entire length in turn touches the first printed circuit board 20 over its entire length.
  • the first printed circuit board 20 thus covers the housing window 48 in a dust-tight manner.
  • the shape of the front part of the housing corresponds to the position of the first printed circuit board 20 on the central support element 30 coordinated in such a way that there is already contact between the first circuit board 20 and the housing window flange, or between the first circuit board 20, the seal 54 and the housing window flange, even if there is still a small contact between the housing flange area 28.1 and the interior-side flange area 30.5 of the central support element 30 distance exists.
  • the housing front part 28 is further assembled and fastened to the central support element 30, this results in a sealing contact pressure force between the housing window flange and the first circuit board 20, or between the housing window flange, the seal 54 and the first circuit board.
  • the seals 52 and 54 are therefore in mutually offset sealing planes.
  • the narrow side of the first circuit board 20 running around the broad sides of the first circuit board 20 lies within the interior space 26 over its entire length. The electrical contacting therefore does not have to run in a sealing plane, which improves the reliability of the seal.
  • the housing front part 28 has a light exit opening 56 .
  • the edge of the front part of the housing surrounding the clear width of the light exit opening 56 is designed as an inner sealing area 58 of the front part of the housing 28 .
  • the inner sealing area 58 is also covered with sealing material.
  • figure 7 12 shows a fastening piece 60 which is used to hold a secondary optics lens in the front part 28 of the housing.
  • the fastening piece 60 has an outer sealing area 62, the shape of which is a negative of the inner sealing area 58 of the front part 28 of the housing.
  • An opening 64 in the attachment piece 60 and this opening 64 encircling Edge have a shape that corresponds to the shape of an edge region of the secondary optics lens to the extent that the fastening piece 60 positively receives the secondary optics lens in the opening 64 .
  • An inner edge of the attachment piece 60, which surrounds the opening 64 of the attachment piece, is designed as an inner sealing area 65. In a preferred embodiment, the inner sealing area 65 is also covered with sealing material.
  • FIG 8 shows the housing front part 28 with its inner sealing area 58 from the front.
  • the fastening piece 60 is inserted from the front and thus counter to the light exit direction into the light exit opening 56 of the front housing part 28 and is fastened to the front housing part 28 .
  • the fastening takes place, for example, with screw connections.
  • a further opening 68 in the front part 28 of the housing is covered by a pressure equalization membrane 70 which is dust-proof but permeable to gas and water vapor and which enables pressure equalization between the sealed interior space 26 and the environment of the light module 10 .
  • figure 9 shows the attachment piece 60 with the inserted secondary optics lens 18.1 and front part 28 of the housing.
  • the secondary optics lens 18.1 covers the remaining opening 64 of the attachment piece 60, and the connection between the attachment piece and 60 and the secondary optics lens 18.1 is sealed with sealing material from the inner sealing area 65 of the attachment piece 60.
  • the fastening piece 60 fixes the position of the secondary optics lens 18.1 in one direction of an optical axis of the secondary optics 18 in a form-fitting manner by means of a collar projecting radially into the opening 64 (compare 7 ).
  • a lens holder grips a front edge of the secondary optics lens 18.1 by means of a form fit and fixes the position of the secondary optics lens 18.1 in the other direction of the optical axis in a form-fitting manner, thereby exerting a contact pressure directed towards the interior 26 on the secondary optics lens 18.1 and thus also on the sealing material lying between the secondary optics lens 18.1 and the inner sealing area 65 of the fastening piece 60.
  • the lens holder is preferably attached to the central support element 30 . This can be done, for example, by screw connections.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Projection Apparatus (AREA)

Description

Die vorliegende Erfindung betrifft ein Lichtmodul für einen Kraftfahrzeugscheinwerfer nach dem Oberbegriff des Anspruchs 1. Ein solches Lichtmodul ist aus der DE 198 22 142 C2 bekannt und weist eine Lichtquelle, eine Primäroptik, eine Anordnung von Mikrospiegeln, deren Spiegelstellung steuerbar ist und eine Sekundäroptik auf, die wenigstens eine Sekundäroptiklinse aufweist. Die Lichtquelle, die Primäroptik, die Anordnung von Mikrospiegeln und die Sekundäroptik sind relativ zueinander so angeordnet, dass Licht, das von der Lichtquelle ausgeht und von der Primäroptik auf die Anordnung von Mikrospiegeln gerichtet wird, von der Anordnung von Mikrospiegeln auf die lichtbrechende Sekundäroptik reflektierbar ist. Die nicht vorveröffentlichte EP 3 382 268 A1 zeigt einen Fahrzeugscheinwerfer mit einer Anordnung von Mikrospiegeln in einem überwiegend dichten Gehäuse und mit einem Druckausgleichventil, das im einfachsten Fall durch eine einfache Öffnung ersetzt sein kann. Die US 2015/0092435 A1 zeigt einen Scheinwerfer, bei dem Lichtquelle und Primäroptik in einem anderen Kompartiment eines Innenraums angeordnet sind als eine Anordnung von Mikrospiegeln und eine Sekundäroptik. Die Druckschriften US 2015/0211703 A1 , US 2017/0067613 A1 und US 2017/0160542 A1 zeigen Scheinwerfer mit jeweils einer Anordnung von Mikrospiegeln, bei welchen Scheinwerfern jeweils nur die Anordnung von Mikrospiegeln vor Staub geschützt sind.The present invention relates to a light module for a motor vehicle headlight according to the preamble of claim 1. Such a light module is from DE 198 22 142 C2 known and has a light source, primary optics, an array of micromirrors whose mirror position is controllable and secondary optics, which has at least one secondary optics lens. The light source, the primary optics, the array of micromirrors and the secondary optics are arranged relative to one another such that light emanating from the light source and directed by the primary optics onto the array of micromirrors can be reflected by the array of micromirrors onto the refractive secondary optics . The unpre-released EP 3 382 268 A1 shows a vehicle headlight with an arrangement of micro-mirrors in a predominantly tight housing and with a pressure compensation valve, which in the simplest case by a simple opening can be replaced. the US 2015/0092435 A1 shows a headlight in which the light source and primary optics are arranged in a different compartment of an interior than an arrangement of micromirrors and secondary optics. The pamphlets U.S. 2015/0211703 A1 , US 2017/0067613 A1 and U.S. 2017/0160542 A1 show headlights each with an array of micromirrors, in which headlights only the array of micromirrors are protected from dust.

Die Anordnung von Mikrospiegeln ist Bestandteil eines DMD-Chips (digital mirror device). Solche DMD-Chips können eine große Zahl (größer als eine Million) von Mikrospiegeln aufweisen. Jeder einzelne Mikrospiegel ist dabei zum Beispiel nur 8 x 8 Mikrometer groß. Eine Stellung jedes einzelnen Mikrospiegels ist zwischen zwei Stellungen umschaltbar. In einer Stellung reflektiert er das einfallende Licht auf die Sekundäroptik, und in der anderen Stellung reflektiert er das Licht zum Beispiel auf einen Absorber. Die Sekundäroptik bildet die Anordnung der Mikrospiegel in das Vorfeld des Lichtmoduls, das bei einem Kraftfahrzeugscheinwerfer zum Beispiel auf der Fahrbahn liegt, ab. Mikrospiegel, die Licht auf die Sekundäroptik spiegeln, erscheinen in der aus der Abbildung resultierenden Lichtverteilung als helle Pixel, während die Mikrospiegel, die Licht auf den Absorber spiegeln, in der Lichtverteilung als dunkle Pixel erscheinen. Im Ergebnis ist damit die Form der Lichtverteilung mit einer durch die Zahl der Pixel und damit durch die Zahl der Mikrospiegel vorgegebenen Feinheit steuerbar, was zum Beispiel kameragesteuerte Lichtverteilungen ermöglicht, bei denen Bereiche, die andere Verkehrsteilnehmer blenden würden, gezielt abgedunkelt werden können und andere Bereiche, zum Beispiel Verkehrsschilder oder Fußgänger, gezielt beleuchtet werden, damit sie vom Fahrer erkannt werden.The array of micromirrors is part of a DMD chip (digital mirror device). Such DMD chips can have a large number (greater than a million) of micromirrors. Each individual micromirror is only 8 x 8 micrometers in size, for example. A position of each individual micromirror can be switched between two positions. In one position it reflects the incident light onto the secondary optics, and in the other position it reflects the light onto an absorber, for example. The secondary optics images the arrangement of the micromirrors in the area in front of the light module, which in the case of a motor vehicle headlight lies on the road, for example. Micromirrors that reflect light onto the secondary optics appear as bright pixels in the light distribution resulting from the image, while the micromirrors that reflect light onto the absorber appear as dark pixels in the light distribution. As a result, the shape of the light distribution can be controlled with a fineness specified by the number of pixels and thus by the number of micromirrors, which, for example, enables camera-controlled light distributions in which areas that would dazzle other road users can be specifically darkened and other areas , such as traffic signs or pedestrians, are specifically illuminated so that they can be recognized by the driver.

Es hat sich gezeigt, dass mit bekannten Lichtmodulen erzeugte Lichtverteilungen lokal dunkle Stellen oder unscharfe Abbildungen einzelner Mikrospiegel aufweisen.It has been shown that light distributions generated with known light modules have locally dark spots or blurred images of individual micromirrors.

Die Aufgabe der Erfindung besteht in der Angabe eines Lichtmoduls der eingangs genannten Art, dessen Lichtverteilungen die nachteiligen dunklen Stellen und unscharfen Abbildungen nicht aufweisen.The object of the invention consists in specifying a light module of the type mentioned in the introduction, the light distribution of which does not have the disadvantageous dark spots and blurred images.

Diese Aufgabe wird mit den Merkmalen des Anspruchs 1 gelöst. Das erfindungsgemäße Lichtmodul zeichnet sich dadurch aus, dass das Lichtmodul einen staubdichten Innenraum aufweist und dass die Lichtquelle, die Primäroptik und die Anordnung von Mikrospiegeln in dem staubdichten Innenraum angeordnet sind.This object is achieved with the features of claim 1. The light module according to the invention is characterized in that the light module has a dust-tight interior and that the light source, the primary optics and the arrangement of micromirrors are arranged in the dust-tight interior.

Damit basiert die Erfindung auf der Erkenntnis, dass die lokal unerwünscht dunklen stellen und unscharfen Abbildungen einzelner Mikrospiegel durch Staubpartikel erzeugt werden, die sich im Strahlengang des Lichtes insbesondere zwischen der Anordnung der Mikrospiegel und der Sekundäroptik befinden. Die Größe von Staubpartikeln liegt zwischen 0,1 Mikrometern und 100 Mikrometern. Ein typisches Bauvolumen eines Lichtmoduls liegt bei 0,2 m x 0,2 m x 0,1 m. Es hat sich gezeigt, dass kleinere Partikel, zum Beispiel 0,5 Mikrometer große Partikel, zu Lichteinbußen durch unscharfe Abbildungen führen und dass Partikel, die größer als etwa 10 Mikrometer sind vollständig aus dem Strahlengang heraus gehalten werden müssen. Die Staubfreiheit des Innenraums entspricht bevorzugt der Schutzklasse IP6K2. Die Montage der an der staubdichten Abdichtung des Innenraums beteiligten Bauteile der Lichtmodule erfolgt bevorzugt in einem Reinraum.The invention is thus based on the finding that the locally undesirably dark areas and blurred images of individual micromirrors are produced by dust particles that are located in the light beam path, in particular between the arrangement of the micromirrors and the secondary optics. The size of dust particles is between 0.1 microns and 100 microns. A typical construction volume of a light module is 0.2 mx 0.2 mx 0.1 m. It has been shown that smaller particles, for example 0.5 micron particles, lead to light losses due to blurred images and that particles that are larger than about 10 microns must be kept completely out of the beam path. The dust-free interior preferably corresponds to protection class IP6K2. The components of the light modules involved in the dust-tight sealing of the interior are preferably assembled in a clean room.

Erfindungsgemäß wird der staubdichte Innenraum durch ein Gehäusevorderteil, ein zentrales Trägerelement, einen DMD-Chip, eine erste Leiterplatte, die Sekundäroptiklinse und durch eine staubdichte Druckausgleichsmembrane umschlossen.According to the invention, the dust-tight interior is enclosed by a front part of the housing, a central support element, a DMD chip, a first printed circuit board, the secondary optics lens and a dust-tight pressure equalization membrane.

Damit werden ohnehin vorhandene Bauteile für die Abdichtung verwendet.This means that existing components are used for the seal anyway.

Bevorzugt ist auch, dass das Gehäusevorderteil in einem Teil des Gehäusevorderteils, welcher der ersten Leiterplatte zugewandt ist, ein Gehäusefenster aufweist, das von der ersten Leiterplatte staubdicht abgedeckt wird. Diese Ausgestaltung erlaubt eine elektrische Kontaktierung der ersten Leiterplatte, die bis auf ihren das Gehäusefenster abdeckenden Oberflächenbereich vollständig im staubdichten Innenraum liegt, ohne dass die Leiterplatte oder ein Kabelbaum durch eine Dichtungsfläche (d.h. durch eine Fläche, in der eine Dichtung liegt) hindurchgeführt werden muss.It is also preferable for the front part of the housing to have a housing window in a part of the front part of the housing which faces the first printed circuit board, which window is covered by the first printed circuit board in a dust-tight manner. This configuration allows electrical contacting of the first printed circuit board, which, apart from its surface area covering the housing window, is located completely in the dust-tight interior, without the printed circuit board or a cable harness having to be guided through a sealing surface (i.e. through a surface in which a seal is located).

Weiter ist bevorzugt, dass das Gehäusevorderteil eine Lichtaustrittsöffnung aufweist, die durch die Sekundäroptiklinse staubdicht abgedeckt wird. Der staubdichte Innenraum muss zwangsläufig ein transparentes Fenster aufweisen, durch welches das Licht aus dem Innenraum austreten kann. Die Nutzung der Sekundäroptiklinse für diese Funktion macht eine Verwendung eines zusätzlichen Fensters unnötig, was Lichtverluste vermeidet und eine Komplexität und Bauteilezahl reduziert.It is also preferred that the front part of the housing has a light exit opening which is covered in a dust-tight manner by the secondary optics lens. The dust-proof interior must inevitably have a transparent window through which the light can escape from the interior. Utilizing the secondary optics lens for this function eliminates the need for an additional window, which avoids light loss and reduces complexity and component count.

Eine weitere bevorzugte Ausgestaltung zeichnet sich dadurch aus, dass das Gehäusevorderteil eine Druckausgleichsöffnung aufweist, die durch die staubdichte Druckausgleichsmembran abgedeckt wird, wobei die Druckausgleichsmembran gasdurchlässig ist. Diese Ausgestaltung erlaubt einen Druckausgleich trotz des aufgrund der staubdichten Abdichtung erschwerten Teilchenaustausches zwischen Innenraum und dessen Umgebung.A further preferred embodiment is characterized in that the front part of the housing has a pressure equalization opening which is covered by the dust-tight pressure equalization membrane, the pressure equalization membrane being gas-permeable. This design allows one Pressure equalization despite the difficult exchange of particles between the interior and its surroundings due to the dust-tight seal.

Bevorzugt ist auch, dass das zentrale Trägerelement ein Trägerelementfenster aufweist, dessen Öffnung von einem die Anordnung der Mikrospiegel tragenden DMD-Chip abgedeckt wird. Dieses Merkmal erlaubt eine Anordnung der die Mikrospiegel tragenden Vorderseite im staubdichten Außenraum, während die elektrische Kontaktierung durch eine vollständig außerhalb des Innenraums liegend zweite Leiterplatte erfolgen kann.It is also preferred that the central carrier element has a carrier element window, the opening of which is covered by a DMD chip carrying the arrangement of the micromirrors. This feature allows the front side carrying the micromirrors to be arranged in the dust-tight exterior, while the electrical contact can be made by a second printed circuit board lying completely outside the interior.

Weiter ist bevorzugt, dass der DMD-Chip auf einer dem Innenraum abgewandten Rückseite des zentralen Trägerelements angeordnet ist, wobei die Anordnung von Mikrospiegeln vor der Öffnung des Trägerelementfensters angeordnet ist. Damit wird der DMD-Chip selbst zur Abdichtung verwendet, was die Komplexität des Aufbaus reduziert.It is also preferred that the DMD chip is arranged on a rear side of the central carrier element that faces away from the interior space, with the arrangement of micromirrors being arranged in front of the opening of the carrier element window. This uses the DMD chip itself for sealing, reducing the complexity of the assembly.

Eine weitere bevorzugte Ausgestaltung zeichnet sich dadurch aus, dass das zentrale Trägerelement einen innenraumseitigen Flanschbereich aufweist, der entlang einer geschlossenen räumlichen Kurve verläuft, und dass das Gehäusevorderteil einen Gehäuse-Flanschbereich aufweist, dessen Form ein Negativ der Form des Flanschbereichs des zentralen Trägerelements ist, so dass sich beide Flanschbereiche bei einem Zusammenfügen des Gehäusevorderteils und des zentralen Trägerelements entlang der gesamten Länge der räumlichen Kurve des Flanschbereichs flächig berühren oder eine zwischen ihnen liegende Dichtung jeweils flächig berühren.Another preferred embodiment is characterized in that the central support element has an interior-side flange area that runs along a closed spatial curve, and that the front housing part has a housing flange area whose shape is a negative of the shape of the flange area of the central support element, see above that when the front part of the housing and the central support element are joined together, the two flange areas touch one another over the entire length of the spatial curve of the flange area or touch a seal lying between them over the entire surface.

Bevorzugt ist auch, dass eine Dichtung auf einem innenraumseitigen Rand des Gehäusefensters über die gesamte Länge des Randes des Gehäusefensters liegt.It is also preferred that a seal on a interior-side edge of the housing window over the entire length of the edge of the housing window.

Weiter ist bevorzugt, dass das Gehäusevorderteil aus Kunststoff besteht und dass die Dichtungen und an Flanschbereiche des Gehäusevorderteils angeformte Dichtlippen aus Dichtungsmaterial sind.It is also preferred that the front part of the housing is made of plastic and that the seals and sealing lips formed on the flange areas of the front part of the housing are made of sealing material.

Weitere Vorteile ergeben sich aus der nachfolgenden Beschreibung, den Zeichnungen und den Unteransprüchen. Es versteht sich, dass die vorstehend genannten und die nachstehend noch zu erläuternden Merkmale nicht nur in der jeweils angegebenen Kombination, sondern auch in anderen Kombinationen oder in Alleinstellung verwendbar sind, ohne den Rahmen der vorliegenden Erfindung zu verlassen.Further advantages result from the following description, the drawings and the dependent claims. It goes without saying that the features mentioned above and those still to be explained below can be used not only in the combination specified in each case, but also in other combinations or on their own, without departing from the scope of the present invention.

Ausführungsbeispiele der Erfindung sind in den Zeichnungen dargestellt und werden in der nachfolgenden Beschreibung näher erläutert.Embodiments of the invention are shown in the drawings and are explained in more detail in the following description.

Dabei zeigen, jeweils in schematischer Form:

Figur 1
ein Ausführungsbeispiel eines erfindungsgemäßen Lichtmoduls in einem zu einer optischen Achse des Lichtmoduls parallelen Schnitt;
Figur 2
einen DMD-Chip;
Figur 3
eine zweite Leiterplatte mit einem Leiterplattenfenster;
Figur 4
eine Schrägansicht der Rückseite eines zentralen Trägerelements vor der Montage des DMD-Chips;
Figur 5
eine Draufsicht auf die Vorderseite eines zentralen Trägerelements mit erster Leiterplatte, Trägerelementfenster und einem innenraumseitigen Flanschbereich des zentralen Trägerelements;
Figur 6
Figur 6 zeigt ein zu dem zentralen Trägerelement aus Figur 5 komplementäres Gehäusevorderteil;
Figur 7
ein Befestigungsstück, das zur Halterung einer Sekundäroptiklinse in dem Gehäusevorderteil dient;
Figur 8
das Gehäusevorderteil mit einem inneren Dichtbereich von vorn; und
Figur 9
das Befestigungsstück mit eingesetzter Sekundäroptiklinse.
Show, each in schematic form:
figure 1
an embodiment of a light module according to the invention in a section parallel to an optical axis of the light module;
figure 2
a DMD chip;
figure 3
a second circuit board with a circuit board window;
figure 4
an oblique view of the back of a central support element before mounting the DMD chip;
figure 5
a top view of the front of one central support element with a first printed circuit board, support element window and an interior-side flange area of the central support element;
figure 6
figure 6 shows a to the central support element figure 5 complementary case front;
figure 7
a mounting piece for mounting a secondary optics lens in the front housing;
figure 8
the housing front part with an inner sealing area from the front; and
figure 9
the attachment piece with the secondary optics lens inserted.

Dabei bezeichnen gleiche Bezugszeichen in verschiedenen Figuren jeweils gleiche oder zumindest ihrer Funktion nach vergleichbare Elemente.The same reference symbols in different figures denote the same elements or elements that are at least comparable in terms of their function.

Im Einzelnen zeigt die Figur 1 einen Schnitt durch ein Ausführungsbeispiel eines erfindungsgemäßen Lichtmoduls 10 eines Kraftfahrzeugscheinwerfers. Das Lichtmodul weist eine Lichtquelle 12, eine Primäroptik 14, einen DMD-Chip 16 und eine Sekundäroptik 18 auf. Die Lichtquelle 12 ist eine Halbleiterlichtquelle, die auf einer ersten Leiterplatte 20 angeordnet ist und die Licht 22 in Richtung zu der Primäroptik 14 abstrahlt. Die Primäroptik 14 weist einen lichtbrechenden Teil 14.1 und einen Reflektor 14.2 auf. Der lichtbrechende Teil 14.1 wird von der Lichtquelle 12 beleuchtet und richtet das Licht 22 auf den Reflektor 14.2. Der Reflektor 14.2 lenkt das auf ihn vom lichtbrechenden Teil 14.1 her einfallende Licht 22 auf eine spiegelnde Fläche einer Vorderseite 16.1 des DMD-Chips 16, wobei die spiegelnde Fläche aus einer Vielzahl von Mikrospiegeln besteht. Wesentlich ist dabei, dass die Primäroptik das Licht der Lichtquelle auf den DMD-Chip richtet. Wie und mit welchen optischen Elementen dies im Einzelnen geschieht, ist für die Erfindung nicht wesentlich.In detail, the figure 1 a section through an embodiment of a light module 10 of a motor vehicle headlight according to the invention. The light module has a light source 12 , primary optics 14 , a DMD chip 16 and secondary optics 18 . The light source 12 is a semiconductor light source which is arranged on a first printed circuit board 20 and which emits light 22 in the direction of the primary optics 14 . The primary optics 14 has a light-refracting part 14.1 and a reflector 14.2. The refractive part 14.1 is illuminated by the light source 12 and directs the light 22 onto the reflector 14.2. The reflector 14.2 deflects the light 22 incident on it from the light-refracting part 14.1 onto a reflecting surface of a front side 16.1 of the DMD chip 16, the reflecting surface being composed of a multiplicity of micromirrors consists. It is essential that the primary optics direct the light from the light source onto the DMD chip. How and with which optical elements this happens in detail is not essential for the invention.

Eine Schwenkstellung der Mikrospiegel ist individuell für jeden Mikrospiegel oder zumindest für eine Teilmenge der Mikrospiegel zwischen einer ersten Schwenkstellung und einer zweiten Schwenkstellung umschaltbar. Jeder Mikrospiegel, der sich in der ersten Schwenkstellung befindet, lenkt das auf ihn von der Primäroptik 14 her einfallende Licht auf die Sekundäroptik 18 um. Jeder Mikrospiegel, der sich in der zweiten Schwenkstellung befindet, lenkt das auf ihn von der Primäroptik 14 her einfallende Licht 22 so ab, dass dieses Licht 22.1 nicht auf die Sekundäroptik 18 fällt. Dieses Licht 22.1 wird zum Beispiel auf einen Absorber 24 gelenkt und dort absorbiert, so dass es keine störenden Lichteffekte erzeugen kann.A pivoting position of the micromirrors can be switched individually for each micromirror or at least for a subset of the micromirrors between a first pivoting position and a second pivoting position. Each micromirror that is in the first pivoting position deflects the light incident on it from the primary optics 14 onto the secondary optics 18 . Each micromirror that is in the second swivel position deflects the light 22 incident on it from the primary optics 14 in such a way that this light 22.1 does not fall on the secondary optics 18. This light 22.1 is directed onto an absorber 24, for example, and is absorbed there, so that it cannot produce any disruptive light effects.

Die Sekundäroptik 18 richtet das auf sie von dem DMD-Chip 16 her einfallende Licht 22 in das Vorfeld des Lichtmoduls 10. Bei einer bestimmungsgemäßen Verwendung des Lichtmoduls wird mit diesem Licht 22 die vor dem Kraftfahrzeug liegende Fahrbahn ausgeleuchtet. Die Sekundäroptik 18 weist eine Sekundäroptiklinse 18.1 aus transparentem Kunststoff oder Glas auf. Die Sekundäroptik 18 kann auch mehrere Linsen aufweisen, zum Beispiel eine Anordnung aus einem Achromaten und einer abbildenden Linse.The secondary optics 18 directs the light 22 incident on it from the DMD chip 16 into the area in front of the light module 10. When the light module is used as intended, the road ahead of the motor vehicle is illuminated with this light 22. The secondary optics 18 has a secondary optics lens 18.1 made of transparent plastic or glass. The secondary optics 18 can also have several lenses, for example an arrangement of an achromat and an imaging lens.

Bei dem erfindungsgemäßen Lichtmodul 10 liegt der Weg des Lichtes 22 von der Lichtquelle 12 bis zu seinem durch die Sekundäroptik 18 hindurch erfolgenden Austritt aus der Sekundäroptik 18 vollständig in einem staubdicht abgedichteten Innenraum 26. Dieser Innenraum 26 wird durch ein Gehäusevorderteil 28, ein zentrales Trägerelement 30, den DMD-Chip 16, die erste Leiterplatte 20, die Sekundäroptik 18 und eine staubdichte Druckausgleichsmembrane 32 begrenzt.In the light module 10 according to the invention, the path of the light 22 from the light source 12 to its exit from the secondary optics 18 through the secondary optics 18 lies completely in a dust-tight sealed interior 26. This interior 26 is defined by a front housing part 28, a central support element 30 , the DMD chip 16, the first printed circuit board 20, the secondary optics 18 and a dust-proof pressure equalization membrane 32.

Das zentrale Trägerelement 30 weist eine dem Innenraum 26 zugewandte Vorderseite 30.1 und eine Rückseite 30.2 auf. Das zentrale Trägerelement 30 weist einen Lichtquellen- und Primäroptik-seitigen ersten Teilbereich 30.3 und einen DMD-Chip-seitigen zweiten Teilbereich 30.4 auf. Diese beiden Teilbereiche 30.3 und 30.4 sind räumlich voneinander getrennt, hängen aber stoffschlüssig zusammen und bilden zusammen das einstückige zentrale Trägerelement 30. Die beiden Teilbereiche 30.3 und 30.4 schließen einen Winkel ein, der größer als 90°, aber kleiner als 180° ist. Das zentrale Trägerelement 30 besteht bevorzugt aus Metall und dient auch als Kühlkörper, der die in der Lichtquelle 12 frei werdende Wärme aufnimmt und an die Umgebung des Lichtmoduls 10 abgibt.The central carrier element 30 has a front side 30.1 facing the interior space 26 and a rear side 30.2. The central carrier element 30 has a first partial area 30.3 on the light source and primary optics side and a second partial area 30.4 on the DMD chip side. These two sections 30.3 and 30.4 are spatially separated from one another, but are cohesively connected and together form the one-piece central support element 30. The two sections 30.3 and 30.4 enclose an angle that is greater than 90° but less than 180°. The central carrier element 30 is preferably made of metal and also serves as a heat sink, which absorbs the heat released in the light source 12 and emits it to the surroundings of the light module 10 .

Die erste Leiterplatte 20 ist fest mit der Vorderseite 30.1 des zentralen Trägerelements 30 in dessen erstem Teilbereich 30.3 verbunden. Die Verbindung ist zum Beispiel eine Schraub- und/oder Klebeverbindung. Eine Vorderseite 20.1 der ersten Leiterplatte 20 trägt die als Halbleiterlichtquelle verwirklichte Lichtquelle 12 und die Primäroptik 14. Eine Rückseite 20.2 der ersten Leiterplatte 20 ist der Vorderseite 30.1 des zentralen Trägerelements 30 zugewandt. In quer zur Vorderseite 20.1 und zur Rückseite 20.2 der ersten Leiterplatte 20 weisenden Richtungen ragt das zentrale Trägerelement 30 über die erste Leiterplatte 20 hinaus. Diese Richtungen werden im Folgenden auch als seitliche Richtungen 34 bezeichnet. Ein Beispiel einer seitlichen Richtung 34 ist in der Figur 1 angegeben. Andere seitliche Richtungen stehen senkrecht auf der Zeichnungsebene. Der seitlich überstehende Rand der Vorderseite 30.1 des zentralen Trägerelements 30 bildet einen Teil eines innenraumseitigen Flanschbereiches 30.5 des zentralen Trägerelements 30.The first printed circuit board 20 is firmly connected to the front side 30.1 of the central support element 30 in its first section 30.3. The connection is, for example, a screw connection and/or an adhesive connection. A front side 20.1 of the first printed circuit board 20 carries the light source 12 implemented as a semiconductor light source and the primary optics 14. A rear side 20.2 of the first printed circuit board 20 faces the front side 30.1 of the central support element 30. The central carrier element 30 protrudes beyond the first circuit board 20 in directions pointing transversely to the front side 20.1 and to the rear side 20.2 of the first circuit board 20. These directions are also referred to as lateral directions 34 below. An example of a lateral direction 34 is in FIG figure 1 specified. Other lateral directions are perpendicular to the plane of the drawing. The side protruding edge of the The front side 30.1 of the central support element 30 forms part of an interior-side flange area 30.5 of the central support element 30.

Der zweite Teilbereich 30.4 des zentralen Trägerelements 30 weist ein Trägerelementfenster 35 auf. Ein das Trägerelementfenster 35 umlaufender Fenster-Randbereich bildet auf der Rückseite 30.2 des zentralen Trägerelements 30 einen Fenster-Flanschbereich 36. Der DMD-Chip 16 ist auf der Rückseite 30.2 des zentralen Trägerelements 30 in dessen zweiten Teilbereich 30.4 so angeordnet, dass er das Trägerelementfenster 35 abdeckt.The second partial area 30.4 of the central carrier element 30 has a carrier element window 35. FIG. A window edge area surrounding the carrier element window 35 forms a window flange area 36 on the rear side 30.2 of the central carrier element 30. The DMD chip 16 is arranged on the rear side 30.2 of the central carrier element 30 in its second partial area 30.4 in such a way that it forms the carrier element window 35 covers.

Wie Figur 2 zeigt, weist der DMD-Chip 16 zwei Breitseiten in Form einer Vorderseite 16.1 und einer Rückseite auf, wobei Vorderseite und Rückseiten durch zwischen ihnen liegende seitliche Schmalseiten 16.3 voneinander getrennt sind. Dabei ist seine die Mikrospiegel 16.4 tragende Vorderseite 16.1 dem Trägerelementfenster 35 und damit dem Innenraum 26 zugewandt. Die Vorderseite 16.1 des DMD-Chips 16 weist einen zentralen Chip-Bereich auf, in dem die Mikrospiegel 16.4 angeordnet sind, und er weist einen den zentralen Chip-Bereich in einer geschlossenen Kurve umlaufenden Flanschbereich 16.5 auf, in dem keine Mikrospiegel 16.4 angeordnet sind. Die Zahl der Mikrospiegel beträgt zum Beispiel ca. 1,3 Millionen, die in einer Matrix mit 1152 Spalten und 1152 Reihen angeordnet sind. Derartige DMD-Chips (digital mirror device) werden zum Beispiel von der Firma Texas Instruments hergestellt und vertrieben.As figure 2 shows, the DMD chip 16 has two broad sides in the form of a front side 16.1 and a back side, the front side and back sides being separated from one another by lateral narrow sides 16.3 lying between them. Its front side 16.1, which carries the micromirrors 16.4, faces the carrier element window 35 and thus the interior space 26. The front side 16.1 of the DMD chip 16 has a central chip area in which the micromirrors 16.4 are arranged, and it has a flange area 16.5 which runs around the central chip area in a closed curve and in which no micromirrors 16.4 are arranged. For example, the number of micromirrors is about 1.3 million, arranged in a matrix with 1152 columns and 1152 rows. Such DMD chips (digital mirror device) are manufactured and marketed, for example, by Texas Instruments.

Figur 1 und Figur 2 zeigen in Kombination miteinander, dass der DMD-Chip 16 insgesamt so angeordnet ist, dass die beiden Flanschbereiche 36 und 16.5 einander gegenüberliegen. Zwischen den beiden Flanschbereichen 36 und 16.5 liegt eine DMD-Chip-Dichtung 38 in Form einer Flachdichtung, die von den Flanschbereichen 36 und 16.5 mit einer diese Flanschbereiche aufeinander pressenden Anpresskraft gehalten wird und die das Trägerelementfenster 35 in einer geschlossenen Kurve umläuft. figure 1 and figure 2 show in combination with one another that the DMD chip 16 is arranged overall in such a way that the two flange areas 36 and 16.5 face one another. Between the two flange areas 36 16.5 and 16.5 is a DMD chip seal 38 in the form of a flat seal, which is held by the flange areas 36 and 16.5 with a contact force pressing these flange areas together and which surrounds the carrier element window 35 in a closed curve.

Figur 2 zeigt auch, dass der DMD-Chip 16 in einem Sockel 40.1 einer zweiten Leiterplatte 40 angeordnet ist und gehalten wird. Dabei erfolgt die mechanische Halterung des DMD-Chips 16 in dem Sockel 40.1 über die seitlichen Schmalseiten 16.3 und ggf. zusätzlich über Teile der Rückseite des DMD-Chips 16, und die elektrische Kontaktierung erfolgt ebenfalls über die seitlichen Schmalseiten 16.3 und/oder über die Rückseite des DMD-Chips 16. figure 2 also shows that the DMD chip 16 is arranged and held in a socket 40.1 of a second printed circuit board 40. FIG. The mechanical mounting of the DMD chip 16 in the base 40.1 takes place via the lateral narrow sides 16.3 and possibly also via parts of the rear side of the DMD chip 16, and the electrical contacting also takes place via the lateral narrow sides 16.3 and/or via the rear side of the DMD chip 16.

Die zweite Leiterplatte 40 ist fest mit dem zweiten Teilbereich 30.4 des zentralen Trägerelements 30 verbunden. Die Verbindung erfolgt bevorzugt als Klebeverbindung. In der Figur 1 wird dies durch die Berührung der zweiten Leiterplatte 40 durch Schraubdome 30.6 des zentralen Trägerelements repräsentiert. Dabei übt die zweite Leiterplatte 40 aber nicht die senkrecht zur Fläche der zweiten Leiterplatte 40 und der Vorderseite 16.1 des DMD-Chips 16 wirkende Anpresskraft aus. Die zweite Leiterplatte 40 hält den DMD-Chip 16 mit ihrem Sockel jedoch in tangential zur Vorderseite 16.1 des DMD-Chips 16 und der zweiten Leiterplatte 40 weisenden Richtungen fest. Die zweite Leiterplatte 40 liegt vollständig außerhalb des abgedichteten Innenraums 26. Ein zentraler Bereich der Rückseite des DMD-Chips 16 dient als Schnittstelle zur Ableitung von Wärme aus dem DMD-Chip 16 und weist daher keine elektrischen Anschlüsse auf.The second printed circuit board 40 is firmly connected to the second partial area 30.4 of the central carrier element 30. The connection is preferably made as an adhesive connection. In the figure 1 this is represented by the contact of the second printed circuit board 40 by screw bosses 30.6 of the central support element. However, the second printed circuit board 40 does not exert the contact pressure acting perpendicular to the surface of the second printed circuit board 40 and the front side 16.1 of the DMD chip 16. However, the second printed circuit board 40 holds the DMD chip 16 with its socket in directions pointing tangentially to the front side 16.1 of the DMD chip 16 and the second printed circuit board 40. The second circuit board 40 lies entirely outside of the sealed interior 26. A central area of the backside of the DMD chip 16 serves as an interface for dissipating heat from the DMD chip 16 and therefore has no electrical connections.

Figur 3 zeigt schematisch eine Draufsicht auf die zweite Leiterplatte 40 mit einem Leiterplattenfenster 42. Die Öffnung des Leiterplattenfensters 42 liegt im fertig montierten Zustand dem keine elektrischen Anschlüsse aufweisenden zentralen Bereich der Rückseite des DMD-Chips 16 gegenüber. figure 3 shows schematically a plan view of the second Printed circuit board 40 with a printed circuit board window 42. In the fully assembled state, the opening of the printed circuit board window 42 is opposite the central area of the rear side of the DMD chip 16, which has no electrical connections.

Figur 4 zeigt eine Schrägansicht der Rückseite 30.2 eines zentralen Trägerelements 30 vor der Montage des DMD-Chips 16. Das zentrale Trägerelement 30 weist auf seiner Rückseite 30.2 einen das Trägerelementfenster 35 in einer geschlossenen Kurve umlaufenden äußeren Flanschbereich auf, der in der Figur 4 durch die DMD-Chip-Dichtung 38 abgedeckt wird. Die Konturen der DMD-Chip-Dichtung 38 entsprechen den Konturen des äußeren Flanschbereichs und des Trägerelementfensters 35. Figur 4 zeigt auch Schraubdome 30.6, mit deren Hilfe der DMD-Chip 16 durch zusätzliche Bauteile auf die DMD-Chip-Dichtung 38 gepresst wird. Dadurch wird die Dichtfunktion sichergestellt, und der DMD-Chip 16 wird zusätzlich in seiner Endlage fixiert. figure 4 shows an oblique view of the back 30.2 of a central support element 30 before the assembly of the DMD chip 16. The central support element 30 has on its back 30.2 a support element window 35 in a closed curve surrounding the outer flange area, figure 4 is covered by the DMD chip seal 38. The contours of the DMD chip seal 38 correspond to the contours of the outer flange area and the carrier element window 35. figure 4 also shows screw bosses 30.6, with the help of which the DMD chip 16 is pressed onto the DMD chip seal 38 by additional components. This ensures the sealing function, and the DMD chip 16 is additionally fixed in its end position.

Figur 1 zeigt, wie die senkrecht zu der Vorderseite 16.1 und der Rückseite des DMD-Chips 16 wirkende Anpresskraft von einem elastischen Element 44 erzeugt und mit einem Stempel 46 durch das in Figur 3 dargestellte Leiterplattenfenster 42 hindurch auf den zentralen Teil der Rückseite des DMD-Chips 16 ausgeübt wird. figure 1 shows how the contact pressure force acting perpendicularly to the front side 16.1 and the back side of the DMD chip 16 is generated by an elastic element 44 and with a punch 46 through the in figure 3 circuit board window 42 shown is applied to the central part of the rear side of the DMD chip 16.

Das elastische Element 44 weist in Bezug auf den Stempel 46 einen proximalen Bereich 44.1 und zwei distale Enden 44.2 auf. Die distalen Enden 44.2 sind starr mit dem zentralen Trägerelement 30, insbesondere mit dessen zweitem Teilbereich 30.4 verbunden. Der proximale Bereich 44.1 ist kraft-und/oder formschlüssig mit einem ersten Ende 46.1 des Stempels 46 verbunden. Ein zweites Ende 46.2 des Stempels 46 liegt unter Vorspannung an der Rückseite des DMD-Chips 16 an. Die Vorspannung entspricht dabei einer Rückstellkraft des elastischen Elements 44, die durch elastische Verformung des elastischen Elements 44 bei dem Zusammenbau des Lichtmoduls 10 erzeugt wird.In relation to the plunger 46, the elastic element 44 has a proximal area 44.1 and two distal ends 44.2. The distal ends 44.2 are rigidly connected to the central support element 30, in particular to its second section 30.4. The proximal area 44.1 is non-positively and/or positively connected to a first end 46.1 of the plunger 46. A second end 46.2 of the stamp 46 is prestressed against the back of the DMD chip 16 on. In this case, the pretension corresponds to a restoring force of the elastic element 44 which is generated by elastic deformation of the elastic element 44 when the light module 10 is assembled.

Die Schraubdome 30.6 werden bevorzugt zusätzlich zur Befestigung der distalen Enden 44.2 des elastischen Elements 44 an dem zentralen Trägerelement 30 verwendet. Insgesamt wird der DMD Chip 16 tangential zu seinen Breitseiten durch den Sockel 40.1 und damit durch die zweite Leiterplatte 42 gehalten. In der zu den Breitseiten des DMD-Chips 16 senkrechten Richtungen wird der DMD-Chip 16 zwischen dem federbelasteten Stempel 46 und dem äußeren Flanschbereich klemmend gehalten, der auf der Rückseite 30.2 des zentralen Trägerelements 30 das Trägerelementfenster 35 in einer geschlossenen Kurve umläuft. Dabei wird die vom elastischen Element 44 erzeugte Anpresskraft gleichzeitig auch auf die DMD-Chip-Dichtung 38 ausgeübt, was damit zu der staubdichten Abdichtung des Innenraums 26 beiträgt.The screw bosses 30.6 are preferably used in addition to fastening the distal ends 44.2 of the elastic element 44 to the central support element 30. Overall, the DMD chip 16 is held tangentially to its broad sides by the base 40.1 and thus by the second printed circuit board 42. In the direction perpendicular to the broad sides of the DMD chip 16, the DMD chip 16 is clamped between the spring-loaded plunger 46 and the outer flange area, which on the rear side 30.2 of the central support element 30 surrounds the support element window 35 in a closed curve. At the same time, the contact pressure force generated by the elastic element 44 is also exerted on the DMD chip seal 38 , which thus contributes to the dust-tight sealing of the interior 26 .

Figur 5 zeigt schematisch eine Draufsicht auf die Vorderseite 30.1 des zentralen Trägerelements 30 mit erster Leiterplatte 20, Trägerelementfenster 35 und einem innenraumseitigen Flanschbereich 30.5 des zentralen Trägerelements 30, der die Form einer geschlossenen Kurve besitzt. Die Kurve liegt bei dem in der Figur 1 dargestellten Ausführungsbeispiel, bei dem die beiden Teilbereiche 30.3 und 30.4 einen Winkel miteinander einschließen, der größer als 90° und kleiner als 180° ist, nicht in einer Ebene. Die Kurve kann, je nach Ausgestaltung, aber auch in einer Ebene verlaufen. In jedem Fall bildet die Kurve eine im Raum verlaufende und damit räumliche Kurve. Auf der ersten Leiterplatte 20 kann eine Flachdichtung oder eine Flanschverstärkung 50 aufliegen, die im mit dem Gehäusevorderteil 28 zusammengebauten Zustand um das Gehäusefenster 48 des Gehäusevorderteils herum läuft. figure 5 shows a schematic plan view of the front side 30.1 of the central support element 30 with the first printed circuit board 20, support element window 35 and an interior-side flange area 30.5 of the central support element 30, which has the shape of a closed curve. The curve is at the in the figure 1 illustrated embodiment, in which the two sections 30.3 and 30.4 form an angle with one another that is greater than 90° and less than 180°, not in one plane. Depending on the design, the curve can also run in one plane. In any case, the curve forms a curve that runs in space and is therefore a spatial curve. A flat gasket or a flange reinforcement 50 can rest on the first printed circuit board 20, which, when assembled with the front housing part 28, runs around the housing window 48 of the front housing part.

Figur 6 zeigt das zu dem zentralen Trägerelement 30 aus Figur 5 komplementäre Gehäusevorderteil 28. Dabei ist insbesondere eine dem Innenraum 26 des Lichtmoduls 10 zugewandte Innenseite des Gehäusevorderteils 28 mit dem Gehäuse-Flanschbereich 28.1 sichtbar. Das Gehäusevorderteil 28 weist einen Gehäuse-Flanschbereich 28.1 auf, dessen Form ein Negativ der Form des Flanschbereichs 30.5 des zentralen Trägerelements 30 ist, so dass sich beide Flanschbereiche 28.1, 30.5 beim Zusammenfügen des Gehäusevorderteils 28 und des zentralen Trägerelements 30 entlang der gesamten Länge der räumlichen Kurve des Flanschbereichs 30.5 flächig berühren oder eine zwischen ihnen liegende Dichtung jeweils flächig berühren. Auf dem Gehäuse-Flanschbereich 28.1 liegt über dessen gesamter Länge eine Dichtung 52 auf. Über die Länge des Randes des Gehäusefensters 48 liegt auf dem Rand eine Dichtung 54 auf. figure 6 shows that to the central support element 30 from figure 5 complementary housing front part 28. In particular, an interior 26 of the light module 10 facing the inside of the housing front part 28 with the housing flange area 28.1 is visible. The front housing part 28 has a housing flange area 28.1, the shape of which is a negative of the shape of the flange area 30.5 of the central support element 30, so that both flange areas 28.1, 30.5 when the front housing part 28 and the central support element 30 are joined together along the entire length of the spatial Flatly touch the curve of the flange area 30.5 or flatly touch a seal lying between them. A seal 52 rests on the housing flange area 28.1 over its entire length. A seal 54 rests along the length of the rim of the housing window 48 on the rim.

Die Dichtungen 52 und 54 sind bevorzugt Dichtlippen aus Dichtungsmaterial, das an das bevorzugt aus Kunststoff bestehende Gehäusevorderteil 28 angeformt ist. Das Dichtungsmaterial ist beispielsweise ein plastisch verformbarer Kunststoff, beispielsweise Silikon. Silikon hat den Vorteil, dass es vor dem Zusammenbau ausgeheizt werden kann, was spätere Beeinträchtigungen optischer Flächen des Lichtmoduls 10 durch Niederschläge von verdampftem Dichtungsmaterial vermeidet. Beim Zusammenbau des Lichtmoduls 10 wird die Dichtung 52 zwischen den Flanschbereichen 28.1 und 30.5 zusammengepresst, und die Dichtung 54 wird zwischen der Flanschverstärkung 50 oder der ersten Leiterplatte 20 auf der eines Seite und dem Rand des Gehäusefensters 48 auf der anderen Seite zusammengepresst.The seals 52 and 54 are preferably sealing lips made of sealing material which is molded onto the front part 28 of the housing, which is preferably made of plastic. The sealing material is, for example, a plastically deformable plastic, for example silicone. Silicone has the advantage that it can be heated out before assembly, which avoids subsequent impairment of optical surfaces of the light module 10 by deposits of evaporated sealing material. During assembly of the light module 10, the gasket 52 is compressed between the flange areas 28.1 and 30.5 and the gasket 54 is compressed between the flange reinforcement 50 or the first circuit board 20 on one side and the edge of the housing window 48 on the other side compressed.

Das Projektionsmodul 10 weist bevorzugt Schraubverbindungen auf, mit denen die Flanschbereiche 30.5 und 28.1 aufeinander gepresst werden. Im zusammengefügten Zustand umgeben das Gehäusevorderteil 28 und das zentrale Trägerelement 30 den Innenraum 26.The projection module 10 preferably has screw connections with which the flange areas 30.5 and 28.1 are pressed onto one another. In the assembled state, the housing front part 28 and the central support element 30 surround the interior space 26.

Wie Figur 1 zeigt, liegt dabei zumindest die Rückseite 20.2 der ersten Leiterplatte 20, die der innenraumseitigen Vorderseite 30.1 des zentralen Trägerelements 30 zugewandt ist, in dem Innenraum 26. Eine die Lichtquelle 12 und die Primäroptik 14 tragende Vorderseite 20.1 der ersten Leiterplatte 20 ist dem Gehäusevorderteil 28 zugewandt. Das Gehäusevorderteil 28 weist in einem Teil des Gehäusevorderteils 20, welcher der ersten Leiterplatte 20 zugewandt ist, ein Gehäusefenster 48 auf. Das Gehäusefenster ermöglicht eine elektrische Verbindung der in dem staubdicht abgedichteten Innenraum 26 des Lichtmoduls 10 angeordneten elektrischen Komponenten, insbesondere der Lichtquelle 12, mit einem von außen herangeführten Kabelbaum 29.As figure 1 shows, at least the rear side 20.2 of the first printed circuit board 20, which faces the front side 30.1 of the central support element 30 on the interior side, is located in the inner space 26. A front side 20.1 of the first printed circuit board 20, which carries the light source 12 and the primary optics 14, faces the front part 28 of the housing . The front housing part 28 has a housing window 48 in a part of the front housing part 20 which faces the first printed circuit board 20 . The housing window enables an electrical connection of the electrical components arranged in the dust-tight, sealed interior 26 of the light module 10, in particular the light source 12, to a cable harness 29 routed from the outside.

Der Rand des Gehäusefensters 48 bildet dabei auf seiner der ersten Leiterplatte 20 zugewandten Seite einen Gehäusefensterflansch, der die erste Leiterplatte 20 über seine ganze Länge hinweg flächig berührt oder der zumindest über seine ganze Länge hinweg eine die Öffnung des Fensters umlaufende Dichtung 54 flächig berührt, die ihrerseits über ihre ganze Länge hinweg die erste Leiterplatte 20 flächig berührt. Damit deckt die erste Leiterplatte 20 das Gehäusefenster 48 staubdicht ab.The edge of the housing window 48 forms a housing window flange on its side facing the first printed circuit board 20, which flange touches the first printed circuit board 20 over its entire length or which touches a seal 54 surrounding the opening of the window at least over its entire length in turn touches the first printed circuit board 20 over its entire length. The first printed circuit board 20 thus covers the housing window 48 in a dust-tight manner.

Die Form des Gehäusevorderteils ist dabei mit der Lage der ersten Leiterplatte 20 auf dem zentralen Trägerelement 30 so abgestimmt, dass einen Berührung zwischen der ersten Leiterplatte 20 und dem Gehäusefensterflansch, beziehungsweise zwischen der ersten Leiterplatte 20, der Dichtung 54 und dem Gehäusefensterflansch bereits erfolgt, wenn zwischen dem Gehäuse-Flanschbereich 28.1 und dem innenraumseiteigen Flanschbereich 30.5 des zentralen Trägerelements 30 noch ein kleiner Abstand besteht. Beim weiteren Zusammenfügen und Befestigen des Gehäusevorderteils 28 an dem zentralen Trägerelement 30 ergibt sich damit eine abdichtend wirkende Anpresskraft zwischen dem Gehäusefensterflansch und der ersten Leiterplatte 20, beziehungsweise zwischen dem Gehäusefensterflansch, der Dichtung 54 und der ersten Leiterplatte. Die Dichtungen 52 und 54 liegen also in zueinander versetzten Dichtebenen. Die um die Breitseiten der ersten Leiterplatte 20 herum verlaufende Schmalseite der ersten Leiterplatte 20 liegt in ihrer ganzen Länge innerhalb des Innenraums 26. Die elektrische Kontaktierung muss dadurch nicht in einer Dichtebene verlaufen, was die Zuverlässigkeit der Abdichtung verbessert.The shape of the front part of the housing corresponds to the position of the first printed circuit board 20 on the central support element 30 coordinated in such a way that there is already contact between the first circuit board 20 and the housing window flange, or between the first circuit board 20, the seal 54 and the housing window flange, even if there is still a small contact between the housing flange area 28.1 and the interior-side flange area 30.5 of the central support element 30 distance exists. When the housing front part 28 is further assembled and fastened to the central support element 30, this results in a sealing contact pressure force between the housing window flange and the first circuit board 20, or between the housing window flange, the seal 54 and the first circuit board. The seals 52 and 54 are therefore in mutually offset sealing planes. The narrow side of the first circuit board 20 running around the broad sides of the first circuit board 20 lies within the interior space 26 over its entire length. The electrical contacting therefore does not have to run in a sealing plane, which improves the reliability of the seal.

Wie Figur 6 zeigt, weist das Gehäusevorderteil 28 eine Lichtaustrittsöffnung 56 auf. Der die lichte Weite der Lichtaustrittsöffnung 56 umlaufende Rand des Gehäusevorderteils ist als ein innerer Dichtbereich 58 des Gehäusevorderteils 28 ausgestaltet. In einer bevorzugten Ausgestaltung ist der innere Dichtbereich 58 ebenfalls mit Dichtungsmaterial belegt.As figure 6 shows, the housing front part 28 has a light exit opening 56 . The edge of the front part of the housing surrounding the clear width of the light exit opening 56 is designed as an inner sealing area 58 of the front part of the housing 28 . In a preferred embodiment, the inner sealing area 58 is also covered with sealing material.

Figur 7 zeigt ein Befestigungsstück 60, das zur Halterung einer Sekundäroptiklinse in dem Gehäusevorderteil 28 dient. Das Befestigungsstück 60 besitzt einen äußeren Dichtbereich 62, dessen Form ein Negativ des inneren Dichtbereichs 58 des Gehäusevorderteils 28 ist. Eine Öffnung 64 im Befestigungsstück 60 und der diese Öffnung 64 umlaufende Rand besitzen eine Form, die soweit der Form eines Randbereichs der Sekundäroptiklinse entspricht, dass das Befestigungsstück 60 die Sekundäroptiklinse in der Öffnung 64 formschlüssig aufnimmt. Ein innerer Rand des Befestigungsstücks 60, der die Öffnung 64 des Befestigungsstücks umläuft, ist als innerer Dichtbereich 65 ausgestaltet. In einer bevorzugten Ausgestaltung ist der innere Dichtbereich 65 ebenfalls mit Dichtungsmaterial belegt. figure 7 12 shows a fastening piece 60 which is used to hold a secondary optics lens in the front part 28 of the housing. The fastening piece 60 has an outer sealing area 62, the shape of which is a negative of the inner sealing area 58 of the front part 28 of the housing. An opening 64 in the attachment piece 60 and this opening 64 encircling Edge have a shape that corresponds to the shape of an edge region of the secondary optics lens to the extent that the fastening piece 60 positively receives the secondary optics lens in the opening 64 . An inner edge of the attachment piece 60, which surrounds the opening 64 of the attachment piece, is designed as an inner sealing area 65. In a preferred embodiment, the inner sealing area 65 is also covered with sealing material.

Figur 8 zeigt das Gehäusevorderteil 28 mit seinem inneren Dichtbereich 58 von vorn. Das Befestigungsstück 60 wird beim Zusammenbau von vorn und damit entgegen der Lichtaustrittsrichtung in die Lichtaustrittsöffnung 56 des Gehäusevorderteils 28 eingesetzt und an dem Gehäusevorderteil 28 befestigt. Die Befestigung erfolgt zum Beispiel mit Schraubverbindungen. Eine weitere Öffnung 68 im Gehäusevorderteil 28 wird durch eine staubdichte, aber gasdurchlässige und für Wasserdampf durchlässige Druckausgleichsmembran 70 abgedeckt, die einen Druckausgleich zwischen dem abgedichteten Innenraum 26 und der Umgebung des Lichtmoduls 10 ermöglicht. figure 8 shows the housing front part 28 with its inner sealing area 58 from the front. During assembly, the fastening piece 60 is inserted from the front and thus counter to the light exit direction into the light exit opening 56 of the front housing part 28 and is fastened to the front housing part 28 . The fastening takes place, for example, with screw connections. A further opening 68 in the front part 28 of the housing is covered by a pressure equalization membrane 70 which is dust-proof but permeable to gas and water vapor and which enables pressure equalization between the sealed interior space 26 and the environment of the light module 10 .

Figur 9 zeigt das Befestigungsstück 60 mit eingesetzter Sekundäroptiklinse 18.1 und Gehäusevorderteil 28. Die Sekundäroptiklinse 18.1 deckt die verbleibende Öffnung 64 des Befestigungsstücks 60 ab, und die Verbindung aus Befestigungsstück und 60 und Sekundäroptiklinse 18.1 wird mit Dichtungsmaterial des inneren Dichtbereichs 65 des Befestigungsstücks 60 abgedichtet. figure 9 shows the attachment piece 60 with the inserted secondary optics lens 18.1 and front part 28 of the housing. The secondary optics lens 18.1 covers the remaining opening 64 of the attachment piece 60, and the connection between the attachment piece and 60 and the secondary optics lens 18.1 is sealed with sealing material from the inner sealing area 65 of the attachment piece 60.

Das Befestigungsstück 60 legt die Position der Sekundäroptiklinse 18.1 in der einen Richtung einer optischen Achse der Sekundäroptik 18 durch einen in die Öffnung 64 radial hineinragenden Kragen formschlüssig fest (vergleiche Fig. 7).The fastening piece 60 fixes the position of the secondary optics lens 18.1 in one direction of an optical axis of the secondary optics 18 in a form-fitting manner by means of a collar projecting radially into the opening 64 (compare 7 ).

Ein in den Figuren nicht dargestellter Linsenhalter erfasst einen vorderen Rand der Sekundäroptiklinse 18.1 durch Formschluss und legt die Position der Sekundäroptiklinse 18.1 in der anderen Richtung der optischen Achse formschlüssig fest und übt dabei eine zum Innenraum 26 gerichtete Anpresskraft auf die Sekundäroptiklinse 18.1 und damit auch auf das zwischen der Sekundäroptiklinse 18.1 und dem inneren Dichtbereich 65 des Befestigungsstücks 60 liegende Dichtungsmaterial aus. Der Linsenhalter wird bevorzugt am zentralen Trägerelement 30 befestigt. Dies kann zum Beispiel durch Schraubverbindungen erfolgen.A lens holder, not shown in the figures, grips a front edge of the secondary optics lens 18.1 by means of a form fit and fixes the position of the secondary optics lens 18.1 in the other direction of the optical axis in a form-fitting manner, thereby exerting a contact pressure directed towards the interior 26 on the secondary optics lens 18.1 and thus also on the sealing material lying between the secondary optics lens 18.1 and the inner sealing area 65 of the fastening piece 60. The lens holder is preferably attached to the central support element 30 . This can be done, for example, by screw connections.

Claims (9)

  1. Light module (10) for a motor vehicle headlight, with a light source (12), a primary lens unit (14), an arrangement of micromirrors (16.4), the mirror positioning of which can be adjusted, and with a secondary lens unit (18) comprising at least one secondary optic lens (18.1), whereby the light source (12), primary lens unit (14), arrangement of micromirrors (16.4), and secondary lens unit (18) are arranged relative to one another such that light (22) emitted by the light source (12) and directed by the primary lens unit (14) to the arrangement of micromirrors (16.4) can be reflected by the arrangement of micromirrors (16.4) onto the refractive secondary lens unit (18), characterised in that
    the light module (10) comprises a dust-proof interior (26),
    the light source (12), primary lens unit (14), and arrangement of micromirrors are located in the dust-proof interior (26), and
    the dust-proof interior (26) is enclosed by an anterior casing (28), a central bearing element (30), a DMD chip (16), an initial conductor plate (20), the secondary lens (18.1), and a dust-proof pressure regulation membrane (32) .
  2. Light module (10) as per claim 1, characterised in that the anterior casing (28) comprises, in a part of the anterior casing (28) facing the first conductor plate (20), a casing window (48) covered by the first conductor plate (20) in a dust-proof manner.
  3. Light module (10) as per one of the claims 1 and 2, characterised in that the anterior casing (28) comprises a light outlet opening (56) covered by the secondary lens (18.1) in a dust-proof manner.
  4. Light module (10) as per one of the claims 1 through 3, characterised in that the anterior casing (28) comprises a pressure regulation opening (31) covered by the dust-proof pressure regulation membrane (32), whereby the pressure regulation membrane (32) is gas-permeable.
  5. Light module (10) as per one of the claims 1 through 4, characterised in that the central bearing element (30) comprises a bearing element window (35), the opening of which is covered by a DMD chip (16) bearing the arrangement of micromirrors (16.4).
  6. Light module (10) as per claim 5, characterised in that the DMD chip (16) is arranged on a back side (30.2) of the central bearing element (30) facing away from the interior (26), whereby the arrangement of micromirrors (16.4) is located before the opening of the bearing element window (35).
  7. Light module (10) as per one of the claims 1 through 6, characterised in that the central bearing element (30) comprises an interior flange area (30.5) running along a closed spatial curve, and that the anterior casing (28) comprises a casing flange area (28.1), the shape of which is a negative of that of the flange area (30.5) of the central bearing element (30), such that both flange areas (28.1, 30.5) make extensive contact with each other along the entire length of the spatial curve of the flange area (30.5) or make extensive contact with a seal (52) between them when the anterior casing (28) and the central bearing element (30) are interconnected.
  8. Light module (10) as per one of the claims 1 through 7, characterised in that a seal (54) on an interior rim of the casing window (48) exceeds the full length of the rim of the casing window (48).
  9. Light module (10) as per claims 7 and 8, characterised in that the anterior casing (28) is made from plastic, and the seals (52, 54) on flange areas of the anterior casing (28) are moulded sealing lips made from a sealing material.
EP19161297.7A 2018-03-29 2019-03-07 Micromirror-comprising light module for a motor vehicle headlight Active EP3546822B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102018107678.9A DE102018107678A1 (en) 2018-03-29 2018-03-29 Micro-mirror having light module for a motor vehicle headlight

Publications (2)

Publication Number Publication Date
EP3546822A1 EP3546822A1 (en) 2019-10-02
EP3546822B1 true EP3546822B1 (en) 2022-05-04

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EP19161297.7A Active EP3546822B1 (en) 2018-03-29 2019-03-07 Micromirror-comprising light module for a motor vehicle headlight

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EP (1) EP3546822B1 (en)
CN (1) CN110319418B (en)
DE (1) DE102018107678A1 (en)

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CN115066581A (en) * 2020-02-07 2022-09-16 株式会社小糸制作所 Lamp unit
DE102022100705A1 (en) * 2022-01-13 2023-07-13 Docter Optics Se motor vehicle

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DE19822142C2 (en) 1998-05-16 2000-08-17 Bosch Gmbh Robert Method and device for generating a light beam striking the road in front of a motor vehicle
CN1570692A (en) * 2003-07-22 2005-01-26 吕兴增 Projection display device
DE102007012703A1 (en) * 2006-12-22 2008-06-26 Robert Bosch Gmbh Pressure compensation element for a housing and motor vehicle electrical component with such a pressure compensation element
KR101220063B1 (en) * 2010-11-19 2013-01-08 주식회사 에스엘라이팅 Intelligent head lamp assembly of vehicle
JP6254810B2 (en) * 2013-10-02 2017-12-27 株式会社小糸製作所 Vehicle headlamp
JP6259672B2 (en) * 2014-01-24 2018-01-10 株式会社小糸製作所 Vehicle lighting
JP6472983B2 (en) * 2014-11-11 2019-02-20 株式会社小糸製作所 Vehicle lighting
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Also Published As

Publication number Publication date
CN110319418B (en) 2023-03-24
CN110319418A (en) 2019-10-11
EP3546822A1 (en) 2019-10-02
DE102018107678A1 (en) 2019-10-02

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