EP3536129A4 - Transparente leuchtdiodenfolie - Google Patents

Transparente leuchtdiodenfolie Download PDF

Info

Publication number
EP3536129A4
EP3536129A4 EP17867186.3A EP17867186A EP3536129A4 EP 3536129 A4 EP3536129 A4 EP 3536129A4 EP 17867186 A EP17867186 A EP 17867186A EP 3536129 A4 EP3536129 A4 EP 3536129A4
Authority
EP
European Patent Office
Prior art keywords
emitting diode
transparent light
diode film
film
transparent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP17867186.3A
Other languages
English (en)
French (fr)
Other versions
EP3536129A1 (de
EP3536129B1 (de
Inventor
Daewoon HONG
Sangtae Park
Jeongsik CHOI
Dongjin Yoon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Electronics Inc
Original Assignee
LG Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020160144455A external-priority patent/KR102646656B1/ko
Priority claimed from KR1020160144453A external-priority patent/KR102646662B1/ko
Application filed by LG Electronics Inc filed Critical LG Electronics Inc
Publication of EP3536129A1 publication Critical patent/EP3536129A1/de
Publication of EP3536129A4 publication Critical patent/EP3536129A4/de
Application granted granted Critical
Publication of EP3536129B1 publication Critical patent/EP3536129B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
EP17867186.3A 2016-11-01 2017-10-13 Transparente leuchtdiodenfolie Active EP3536129B1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020160144455A KR102646656B1 (ko) 2016-11-01 2016-11-01 투명 발광다이오드 필름
KR1020160144453A KR102646662B1 (ko) 2016-11-01 2016-11-01 투명 발광다이오드 필름
PCT/KR2017/011323 WO2018084446A1 (en) 2016-11-01 2017-10-13 Transparent light-emitting diode film

Publications (3)

Publication Number Publication Date
EP3536129A1 EP3536129A1 (de) 2019-09-11
EP3536129A4 true EP3536129A4 (de) 2020-07-01
EP3536129B1 EP3536129B1 (de) 2021-07-07

Family

ID=62021830

Family Applications (1)

Application Number Title Priority Date Filing Date
EP17867186.3A Active EP3536129B1 (de) 2016-11-01 2017-10-13 Transparente leuchtdiodenfolie

Country Status (4)

Country Link
US (1) US10290786B2 (de)
EP (1) EP3536129B1 (de)
CN (1) CN109892013B (de)
WO (1) WO2018084446A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9348174B2 (en) 2013-03-14 2016-05-24 Manufacturing Resources International, Inc. Rigid LCD assembly
US10649273B2 (en) 2014-10-08 2020-05-12 Manufacturing Resources International, Inc. LED assembly for transparent liquid crystal display and static graphic
US10261362B2 (en) 2015-09-01 2019-04-16 Manufacturing Resources International, Inc. Optical sheet tensioner
KR20210017519A (ko) * 2019-08-08 2021-02-17 삼성전자주식회사 디스플레이 모듈, 디스플레이 패널, 및 디스플레이 장치

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070105250A1 (en) * 2004-03-29 2007-05-10 Articulated Technologies, Llc Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
US20080223509A1 (en) * 2005-11-22 2008-09-18 Gi Heon Kim Adhesive film and method of fabricating flexible display using the same
US20110058372A1 (en) * 2010-08-27 2011-03-10 Quarkstar, Llc Solid State Bidirectional Light Sheet for General Illumination
EP2571067A2 (de) * 2011-09-14 2013-03-20 Nitto Denko Corporation Verkapselungsfolie, Herstellungsverfahren davon, LED-Vorrichtung und Herstellungsverfahren davon
US20140264396A1 (en) * 2013-03-15 2014-09-18 Nthdegree Technologies Worldwide Inc. Ultra-thin printed led layer removed from substrate

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010018260A1 (de) * 2010-01-29 2011-08-04 OSRAM Opto Semiconductors GmbH, 93055 Beleuchtungsvorrichtung
JP5533183B2 (ja) * 2010-04-20 2014-06-25 日亜化学工業株式会社 Ｌｅｄ光源装置及びその製造方法
EP2583306A4 (de) * 2010-06-17 2014-09-17 Achrolux Inc Lichtemittierende struktur und verfahren zu ihrer herstellung
JP5925511B2 (ja) * 2011-02-11 2016-05-25 株式会社半導体エネルギー研究所 発光ユニット、発光装置、照明装置
CN102646740B (zh) * 2011-02-18 2015-06-10 3M创新有限公司 胶带及由其制成的太阳能组件和制品
KR102008901B1 (ko) * 2011-12-06 2019-08-09 엘지디스플레이 주식회사 액정표시장치
KR101542411B1 (ko) 2013-04-17 2015-08-12 엘지전자 주식회사 이동단말기
TWI594661B (zh) * 2013-04-19 2017-08-01 隆達電子股份有限公司 發光二極體顯示器及其製造方法
KR20140137732A (ko) 2013-05-23 2014-12-03 주식회사 모린스 형상 처리를 위한 터치 패널용 필름 및 그 제조 방법
JP6483613B2 (ja) * 2013-09-12 2019-03-13 創光科学株式会社 紫外線発光装置
JP6583764B2 (ja) 2014-09-12 2019-10-02 パナソニックＩｐマネジメント株式会社 発光装置、及び照明装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070105250A1 (en) * 2004-03-29 2007-05-10 Articulated Technologies, Llc Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
US20080223509A1 (en) * 2005-11-22 2008-09-18 Gi Heon Kim Adhesive film and method of fabricating flexible display using the same
US20110058372A1 (en) * 2010-08-27 2011-03-10 Quarkstar, Llc Solid State Bidirectional Light Sheet for General Illumination
EP2571067A2 (de) * 2011-09-14 2013-03-20 Nitto Denko Corporation Verkapselungsfolie, Herstellungsverfahren davon, LED-Vorrichtung und Herstellungsverfahren davon
US20140264396A1 (en) * 2013-03-15 2014-09-18 Nthdegree Technologies Worldwide Inc. Ultra-thin printed led layer removed from substrate

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2018084446A1 *

Also Published As

Publication number Publication date
CN109892013A (zh) 2019-06-14
WO2018084446A1 (en) 2018-05-11
US10290786B2 (en) 2019-05-14
US20180123009A1 (en) 2018-05-03
CN109892013B (zh) 2021-04-09
EP3536129A1 (de) 2019-09-11
EP3536129B1 (de) 2021-07-07

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