EP3522682B1 - Circuit, dispositif d'éclairage et phares de véhicule automobile - Google Patents

Circuit, dispositif d'éclairage et phares de véhicule automobile Download PDF

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Publication number
EP3522682B1
EP3522682B1 EP18155280.3A EP18155280A EP3522682B1 EP 3522682 B1 EP3522682 B1 EP 3522682B1 EP 18155280 A EP18155280 A EP 18155280A EP 3522682 B1 EP3522682 B1 EP 3522682B1
Authority
EP
European Patent Office
Prior art keywords
circuit arrangement
heat sink
control unit
current control
micro
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP18155280.3A
Other languages
German (de)
English (en)
Other versions
EP3522682A1 (fr
Inventor
Thomas MITTERLEHNER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZKW Group GmbH
Original Assignee
ZKW Group GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZKW Group GmbH filed Critical ZKW Group GmbH
Priority to EP18155280.3A priority Critical patent/EP3522682B1/fr
Priority to PCT/EP2019/050607 priority patent/WO2019154581A1/fr
Priority to US16/967,569 priority patent/US11262045B2/en
Priority to CN201980011860.6A priority patent/CN111656861B/zh
Priority to KR1020207024452A priority patent/KR102421603B1/ko
Priority to JP2020562832A priority patent/JP6942272B2/ja
Publication of EP3522682A1 publication Critical patent/EP3522682A1/fr
Application granted granted Critical
Publication of EP3522682B1 publication Critical patent/EP3522682B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
    • H05B3/845—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields specially adapted for reflecting surfaces, e.g. bathroom - or rearview mirrors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
    • F21S41/32—Optical layout thereof
    • F21S41/36—Combinations of two or more separate reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/60—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution
    • F21S41/67—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution by acting on reflectors
    • F21S41/675—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution by acting on reflectors by moving reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/10—Protection of lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/60—Heating of lighting devices, e.g. for demisting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227—Applications
    • H05B1/023—Industrial applications
    • H05B1/0236—Industrial applications for vehicles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/0019—Circuit arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
    • H05B3/86—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields the heating conductors being embedded in the transparent or reflecting material

Definitions

  • the invention relates to a circuit arrangement comprising a printed circuit board, at least one micromirror component connected to the printed circuit board for modulating a light beam of a light source directed onto the micromirror component, and a heat sink thermally connected to the at least one micromirror component, and a current control unit, the micromirror component being a means of the current control unit Controllable heating element is assigned, which is thermally connected to the micromirror component.
  • the term "modulation” is understood to mean a method in which light can be deflected by targeted control of the micromirror component, with e.g. by projecting a light beam onto a roadway via a downstream imaging optical system in one state of a micromirror of the micromirror component and in another state the light beam is already absorbed beforehand. By intermittently changing the states, the light distribution and the intensity can be varied.
  • the invention relates to a lighting device with a circuit arrangement according to the invention and a vehicle headlight with a lighting device according to the invention.
  • DMD is an acronym used for "Digital Micromirror Device", thus for a micromirror array or micromirror matrix.
  • Such a micromirror array has very small dimensions, typically on the order of 10 mm.
  • micromirror actuators are arranged in a matrix, each individual mirror element being tiltable by a certain angle, for example 20 °, for example by means of electromagnetic or piezoelectric actuators.
  • the end positions of a micromirror are referred to in this description as the ON state or the OFF state, where the ON state means that light from the micromirror reaches the street via the imaging optics, whereas in the OFF state it is directed, for example, to an absorber .
  • a headlamp based on a micromirror array is for example in the DE 195 30 008 A1 described.
  • Micromirror components generally have a temperature working range which can leave the permissible operating temperature range in normal operation without additional measures in vehicle headlight applications, in which case malfunction or consequential damage would occur.
  • a temperature working range which can leave the permissible operating temperature range in normal operation without additional measures in vehicle headlight applications, in which case malfunction or consequential damage would occur.
  • it is provided to connect micromirror components with heat sinks. This can ensure that, in the case of high ambient temperatures, the heat loss generated at a micromirror component does not lead to an impermissibly high component temperature.
  • the micromirror component At temperatures that are lower than e.g. 0 ° C, the provision of the heat sink, on the other hand, could have a negative effect, since the intended operating temperature of a micromirror component also has a lower temperature limit, which could be lower at ambient temperatures of 0 ° C and less, since this would result in an approximation to the undesirably low ambient temperature in this case.
  • the micromirror component In order to prevent the temperature falling below the permissible operating temperature in the case of low ambient temperatures, the micromirror component therefore has a heating element which is thermally connected to the component or is preferably integrated into the component. Since the heat sink counteracts the heating of the micromirror component, considerable power is required to heat the micromirror component.
  • the power loss at the current control unit may reach values similar to the power of the DMD heating element (PHEATER). Heating outputs of up to 40W, for example, are required to sufficiently heat the micromirror component. Losses of 40 W, for example, can therefore occur at the current control unit.
  • This object is achieved with a circuit arrangement of the type mentioned at the outset, in which, according to the invention, the current control unit for controlling the heating element is electrically connected to the latter, the current control unit also being connected to the micromirror component via a thermal connection to the heat sink for the transmission of heat loss occurring at the current control unit is.
  • the light source is preferably one or more LED light sources.
  • the heating element can be designed, for example, as a heating winding.
  • the micromirror component can be, for example, a DMD chip (digital mirror device), the micromirror component preferably being designed and controllable in such a way that a large number of mirrors are individually switched on and switched off state can be controlled in order to generate the desired light distribution pattern which is projected onto the road via the projection optics.
  • the micromirror component can also be referred to as a beam deflection unit.
  • a DMD chip can e.g. be designed as a DLP-based light module, such modules being available, for example, from the company "Texas Instruments”.
  • the printed circuit board has an opening through which a heat-conducting element extends from the micromirror component to the heat sink for heat transfer.
  • the heat-conducting element is thermally connected to the micromirror component and the heat sink.
  • the heat-conducting element is integrated in the heat sink or is formed in one piece with it.
  • heat-conducting paste or heat-conducting adhesive is preferably arranged to optimize the heat transfer.
  • the printed circuit board can be, for example, a double-sided FR4 printed circuit board. Such plates are inexpensive to manufacture, but have poor thermal conductivity.
  • the circuit arrangement further comprises a support frame that can be connected to a vehicle headlight housing, the circuit board being arranged between the heat sink and the support frame.
  • the support frame has positioning means for fixing the position of the micromirror component in relation to the support frame.
  • the heating element is integrated in the micromirror component. In this way, thermal energy of the heating element can be transmitted to the micromirrors particularly efficiently.
  • the current control unit is arranged on the side of the circuit board facing the heat sink.
  • the heat sink can contact the current control unit directly, for example via its outer housing.
  • this arrangement can be particularly advantageous.
  • the current control unit is arranged on the side of the circuit board facing away from the heat sink.
  • circuit boards that can be populated on one side can be used, for example.
  • the current control unit is thermally connected to the heat sink via at least one heat-conducting means extending through the printed circuit board, in particular heat-conducting vias. As a result, the current control unit can be efficiently thermally contacted with the micromirror component.
  • a via is understood to mean a so-called “vertical interconnected access”, that is to say a connection extending through the printed circuit board.
  • This arrangement has the particular advantage that the cooling of the current control unit or the heat transfer to the heat sink typically takes place particularly efficiently via the underside of the current control unit, since this is equipped with corresponding metallic contacts and is connected to the printed circuit board, which is located inside the current control unit extend and thus efficiently conduct heat to the bottom.
  • the heat sink is connected to the support frame in such a way that the circuit board can be fixed in its position in relation to the support frame by the heat sink, as a result of which the micromirror component is in position with respect to a vehicle headlight housing connected to the support frame and therein recorded components can be fixed.
  • the heat sink is connected to the support frame by means of a screw connection, the heat sink being displaceable along the screw connection and spring elements being provided by means of which the heat sink in the direction of the Support frame is pressed.
  • the current control unit is a linearly regulated current control unit, in particular a linear current source.
  • these current control units are linearly regulated and inexpensive to produce.
  • Linearly controlled current control units have a higher power loss than clocked control units, which, however, can be used advantageously in the sense of the present invention, so that the cost saving potential of the cheap linear current control units can be fully exploited.
  • Linear constant current sources include, for example, constant current sources with J-FET, constant current sources with bipolar transistors, constant current sources Operational amplifier (OPV) and transistor, current mirror as a constant current source, or constant current sources with linear regulators in question.
  • all electronic components of the circuit arrangement are SMD components (ie surface mounted devices).
  • At least one base for receiving the at least one micromirror component is provided on the printed circuit board. In this way, it is fundamentally possible to install or, for example, replace the micromirror component at any time during vehicle headlight assembly.
  • the current control unit is arranged at a maximum distance of 3 cm from the micromirror component.
  • the invention also relates to a lighting device comprising a circuit arrangement according to the invention, a light source, and at least one imaging optics for imaging the light emitted by the lighting element towards a predeterminable light distribution, the light source, the micromirror component and the imaging optics being arranged such that the light source emitted light can be deflected via the micromirror component towards the imaging optics.
  • the invention relates to a vehicle headlight, in particular motor vehicle headlights, comprising a lighting device according to one of the preceding claims.
  • the invention relates to a vehicle comprising a vehicle headlight according to the invention, in particular motor vehicle headlights.
  • FIG. 1 shows a schematic representation of a circuit arrangement 1 'according to the prior art.
  • the circuit arrangement 1 ' comprises therein a circuit board 2', at least one micromirror component 3 'connected to the circuit board 2' for deflecting a light beam directed onto the micromirror component 3 ', and a current control unit 5'.
  • the micromirror component 3 ' has an integrated heating element 3a' which can be controlled by means of the current control unit 5 '.
  • the current control unit 5 ' is arranged on the printed circuit board 2', no structural elements being provided for the thermal connection to the micromirror component 3 '. The heat loss at the current control unit 5 'thus remains unused.
  • FIG. 1 shows a schematic representation of a first embodiment of a circuit arrangement 1 according to the invention
  • Fig. 1 The circuit arrangement 1 according to the invention comprises a printed circuit board 2 and at least one micromirror component 3 connected to the printed circuit board 2 for modulating a light beam directed onto the micromirror component 3.
  • the circuit arrangement 1 comprises a heat sink 4 thermally connected to the at least one micromirror component 3 and a current control unit 5.
  • the micromirror component 3 has an integrated heating element 3a which can be controlled by the current control unit 5.
  • the circuit arrangement 1 is electrically connected to the heating element 3a
  • Current control unit 5 is thermally connected to the micromirror component 3 via a thermal connection to the heat sink 4 for the transmission of heat loss generated by the current control unit 5.
  • the circuit board 2 in the present exemplary embodiment has an opening 2a through which a heat-conducting element 4a extends from the micromirror component 3 to the heat sink 4 for heat transfer.
  • the heat-conducting element 4a is formed in one piece with the heat sink 4.
  • heat conducting material 10 eg heat conducting paste
  • this heat-conducting material 10 (for example gap filler material from Bergquist GF1500) is specially designed for conduction over larger distances (in the millimeter range), the material being arranged in the region between the printed circuit board 2 and the current control unit 5.
  • This material can also be arranged between the micromirror component 3 and the heat-conducting element 4a.
  • conventional thermal paste or thermal adhesive can be provided.
  • the circuit arrangement 1 further comprises a support frame 6 which can be connected to a vehicle headlight housing (not shown in the figures), the circuit board 2 being arranged between the heat sink and the support frame 6.
  • the support frame 6 comprises positioning means 6a designed as projections for fixing the position of the micromirror component 3 with respect to the support frame 6.
  • the electronic components of the circuit arrangement 1 are arranged both on the side of the printed circuit board 2 facing the support frame 6 and on the opposite side, the current control unit 5 being thermally connected to the heat sink 4 via at least one heat-conducting means 2b extending through the printed circuit board 2, in particular heat-conducting vias is.
  • the heat sink 4 is connected to the support frame 6 in such a way that the circuit board 2 can be fixed in its position in relation to the support frame 6 by the heat sink 4.
  • this is achieved in that the heat sink 4 is connected to the support frame 6 by means of a screw connection 7, the heat sink 4 being displaceable along the screw connection 7 and spring elements 8 being provided, by means of which the heat sink 4 is pressed in the direction of the support frame 6 .
  • a base 9 is arranged on the printed circuit board 2 and is provided for receiving the micromirror component 3 and via which the micromirror component 3 is electrically connected to the printed circuit board 2.
  • the distance (measured from the center points of the elements in the direction of the plane spanned by the printed circuit board 2) between the micromirror component 3 and the current control unit is maximal Is 3 cm.
  • the invention also relates to a lighting device, not shown in the figures, comprising a circuit arrangement 1 according to the invention, a light source, and at least one imaging optics (the light source and the imaging optics are not shown in the figures) for imaging the light emitted by the lighting element towards one Predeterminable light distribution, the light source and the micromirror component being arranged such that light emitted by the light source can be directed via the micromirror component to the imaging optics, in particular a projection device (lens).
  • the invention relates to a vehicle headlight, in particular a motor vehicle headlight, comprising a lighting device according to the invention and a vehicle, comprising a vehicle headlight according to the invention, in particular a motor vehicle headlight.
  • Figure 3 shows a schematic representation of a second embodiment of a circuit arrangement 1 according to the invention.
  • the current control unit 5 is arranged on the underside of the printed circuit board 2, the heat sink 4 making direct contact with the current control unit 5 by means of heat conducting material on its housing.
  • FIG. 4 shows an equivalent circuit diagram of an electrical circuit consisting of the heating element 3a of a microprojection element 3 and a current control unit 5.
  • the equivalent circuit shows a voltage source Uo, via which the current control unit 5 and the heating element 3a are supplied.
  • the voltage Uo is divided into the voltages U DMD and U SR , the ratio of these voltages depending on the nature of the heating element, the ambient temperature, and the properties of the controller 5 and its operating state is specified.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Lighting Device Outwards From Vehicle And Optical Signal (AREA)

Claims (15)

  1. Circuit (1) comprenant
    - une carte de circuit imprimé (2),
    - au moins un composant à micro-miroir (3) connecté à la carte de circuit imprimé (2) pour moduler un faisceau lumineux d'une source de lumière dirigée sur le composant à micro-miroir (3),
    - un dissipateur de chaleur (4) relié thermiquement à au moins un composant à micro-miroir (3), et
    - une unité de contrôle du courant (5),
    le composant à micro-miroir (3) étant associé à un élément chauffant (3a) qui peut être commandé au moyen de l'unité de commande de courant (5) et qui est thermiquement relié au composant à micro-miroir (3),
    caractérisé en ce que
    l'unité de commande de courant (5) pour l'entraînement de l'élément chauffant (3a) est reliée électriquement à ce dernier, l'unité de commande de courant (5) étant également reliée au composant à micro-miroir (3) par une liaison thermique avec le dissipateur de chaleur (4) pour transmettre les pertes de chaleur se produisant à l'unité de commande de courant (5).
  2. Circuit (1) selon la revendication 1, dans lequel la carte de circuit (2) présente une ouverture (2a) à travers laquelle un élément conducteur de chaleur (4a) s'étend du composant à micro-miroir (3) au dissipateur de chaleur (4) pour le transfert de chaleur.
  3. Circuit (1) selon la revendication 1 ou 2, l'arrangement de circuit (1) comprenant en outre un cadre de support (6) pouvant être connecté à un boîtier de phare de véhicule, la carte de circuit imprimé (2) étant disposée entre le dissipateur de chaleur (4) et le cadre de support (6), de préférence le cadre de support (6) ayant des moyens de positionnement (6a) pour déterminer la position du composant à micro-miroir (3) par rapport au cadre de support (6).
  4. Circuit selon l'une des revendications 1 à 3, dans lequel l'élément chauffant (3a) est intégré dans le composant à micro-miroir (3).
  5. Circuit (1) selon l'une des revendications précédentes, dans lequel l'unité de commande de courant (5) est disposée sur le côté de la carte de circuit imprimé (3) opposé au dissipateur de chaleur (4).
  6. Circuit (1) selon l'une des revendications 1 à 4, l'unité de contrôle du courant (5) étant disposée sur le côté de la carte de circuit imprimé (3) opposé au dissipateur de chaleur (4).
  7. Circuit (1) selon la revendication 6, dans lequel l'unité de régulation du courant (5) est reliée thermiquement au dissipateur de chaleur (4) par au moins un moyen conducteur de chaleur (2b) s'étendant à travers la carte de circuit imprimé (2), en particulier au moins un passage conducteur de chaleur.
  8. Circuit (1) selon l'une des revendications 3 à 7, dans lequel le dissipateur de chaleur (4) est relié au cadre de support (6) de telle sorte que la carte de circuit imprimé (2) peut être fixée dans sa position par rapport au cadre de support (6) par le dissipateur de chaleur (4).
  9. Circuit (1) selon la revendication 8, dans lequel le dissipateur de chaleur (4) est relié au cadre porteur (6) au moyen d'un raccord à vis (7), dans lequel le dissipateur de chaleur (4) est déplaçable le long du raccord à vis et des éléments à ressort (8) sont prévus, au moyen desquels le dissipateur de chaleur (4) est pressé en direction du cadre porteur (6).
  10. Circuit (1) selon l'une des revendications précédentes, dans lequel l'unité de commande de courant (5) est une unité de commande de courant à commande linéaire.
  11. Circuit (1) selon l'une des revendications précédentes, dans lequel tous les composants électroniques (3, 5) du circuit (1) sont des composants CMS.
  12. Circuit (1) selon l'une des revendications précédentes, dans lequel au moins une prise (9) pour recevoir le au moins un composant à micro-miroir (3) est prévue sur la carte de circuit imprimé (2).
  13. Circuit (1) selon l'une des revendications précédentes, dans lequel l'unité de régulation du courant (5) est disposée à une distance (d) de 3 cm au maximum du composant à micro-miroir (3).
  14. Dispositif d'éclairage, comprenant un circuit (1) selon l'une des revendications précédentes, une source de lumière et au moins une optique de reproduction pour reproduire la lumière émise par l'élément d'éclairage selon une répartition lumineuse pouvant être prédéterminée, la source de lumière, le composant à micro-miroir (3) et l'optique de reproduction étant disposés de telle sorte que la lumière émise par la source de lumière puisse être déviée vers l'optique de reproduction par l'intermédiaire du composant à micro-miroir (3).
  15. Phare de véhicule, en particulier phare de véhicule automobile, comprenant un dispositif d'éclairage selon la revendication 14.
EP18155280.3A 2018-02-06 2018-02-06 Circuit, dispositif d'éclairage et phares de véhicule automobile Active EP3522682B1 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
EP18155280.3A EP3522682B1 (fr) 2018-02-06 2018-02-06 Circuit, dispositif d'éclairage et phares de véhicule automobile
PCT/EP2019/050607 WO2019154581A1 (fr) 2018-02-06 2019-01-11 Agencement de circuit, dispositif d'éclairage ainsi que phare pour véhicule
US16/967,569 US11262045B2 (en) 2018-02-06 2019-01-11 Circuit assembly, lighting device, and vehicle headlight
CN201980011860.6A CN111656861B (zh) 2018-02-06 2019-01-11 线路装置、照明装置以及车辆探照灯
KR1020207024452A KR102421603B1 (ko) 2018-02-06 2019-01-11 회로 어셈블리, 조명 장치, 그리고 차량 헤드램프
JP2020562832A JP6942272B2 (ja) 2018-02-06 2019-01-11 回路装置、照明装置及び車両投光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP18155280.3A EP3522682B1 (fr) 2018-02-06 2018-02-06 Circuit, dispositif d'éclairage et phares de véhicule automobile

Publications (2)

Publication Number Publication Date
EP3522682A1 EP3522682A1 (fr) 2019-08-07
EP3522682B1 true EP3522682B1 (fr) 2020-07-29

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EP18155280.3A Active EP3522682B1 (fr) 2018-02-06 2018-02-06 Circuit, dispositif d'éclairage et phares de véhicule automobile

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Country Link
US (1) US11262045B2 (fr)
EP (1) EP3522682B1 (fr)
JP (1) JP6942272B2 (fr)
KR (1) KR102421603B1 (fr)
CN (1) CN111656861B (fr)
WO (1) WO2019154581A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11543095B2 (en) * 2018-04-06 2023-01-03 Koito Manufacturing Co., Ltd. Vehicle lamp with particular attachment of spatial light modulator to heat sink

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WO2019154581A1 (fr) 2019-08-15
US20210018157A1 (en) 2021-01-21
KR102421603B1 (ko) 2022-07-15
EP3522682A1 (fr) 2019-08-07
JP2021512480A (ja) 2021-05-13
CN111656861B (zh) 2022-07-08
JP6942272B2 (ja) 2021-09-29
CN111656861A (zh) 2020-09-11
KR20200115571A (ko) 2020-10-07
US11262045B2 (en) 2022-03-01

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