EP3522682B1 - Circuit arrangement, lighting device and vehicle headlight - Google Patents

Circuit arrangement, lighting device and vehicle headlight Download PDF

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Publication number
EP3522682B1
EP3522682B1 EP18155280.3A EP18155280A EP3522682B1 EP 3522682 B1 EP3522682 B1 EP 3522682B1 EP 18155280 A EP18155280 A EP 18155280A EP 3522682 B1 EP3522682 B1 EP 3522682B1
Authority
EP
European Patent Office
Prior art keywords
circuit arrangement
heat sink
control unit
current control
micro
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP18155280.3A
Other languages
German (de)
French (fr)
Other versions
EP3522682A1 (en
Inventor
Thomas MITTERLEHNER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZKW Group GmbH
Original Assignee
ZKW Group GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZKW Group GmbH filed Critical ZKW Group GmbH
Priority to EP18155280.3A priority Critical patent/EP3522682B1/en
Priority to CN201980011860.6A priority patent/CN111656861B/en
Priority to PCT/EP2019/050607 priority patent/WO2019154581A1/en
Priority to KR1020207024452A priority patent/KR102421603B1/en
Priority to US16/967,569 priority patent/US11262045B2/en
Priority to JP2020562832A priority patent/JP6942272B2/en
Publication of EP3522682A1 publication Critical patent/EP3522682A1/en
Application granted granted Critical
Publication of EP3522682B1 publication Critical patent/EP3522682B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
    • H05B3/845—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields specially adapted for reflecting surfaces, e.g. bathroom - or rearview mirrors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
    • F21S41/32—Optical layout thereof
    • F21S41/36—Combinations of two or more separate reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/60—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution
    • F21S41/67—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution by acting on reflectors
    • F21S41/675—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution by acting on reflectors by moving reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/10—Protection of lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/60—Heating of lighting devices, e.g. for demisting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227—Applications
    • H05B1/023—Industrial applications
    • H05B1/0236—Industrial applications for vehicles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/0019—Circuit arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
    • H05B3/86—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields the heating conductors being embedded in the transparent or reflecting material

Definitions

  • the invention relates to a circuit arrangement comprising a printed circuit board, at least one micromirror component connected to the printed circuit board for modulating a light beam of a light source directed onto the micromirror component, and a heat sink thermally connected to the at least one micromirror component, and a current control unit, the micromirror component being a means of the current control unit Controllable heating element is assigned, which is thermally connected to the micromirror component.
  • the term "modulation” is understood to mean a method in which light can be deflected by targeted control of the micromirror component, with e.g. by projecting a light beam onto a roadway via a downstream imaging optical system in one state of a micromirror of the micromirror component and in another state the light beam is already absorbed beforehand. By intermittently changing the states, the light distribution and the intensity can be varied.
  • the invention relates to a lighting device with a circuit arrangement according to the invention and a vehicle headlight with a lighting device according to the invention.
  • DMD is an acronym used for "Digital Micromirror Device", thus for a micromirror array or micromirror matrix.
  • Such a micromirror array has very small dimensions, typically on the order of 10 mm.
  • micromirror actuators are arranged in a matrix, each individual mirror element being tiltable by a certain angle, for example 20 °, for example by means of electromagnetic or piezoelectric actuators.
  • the end positions of a micromirror are referred to in this description as the ON state or the OFF state, where the ON state means that light from the micromirror reaches the street via the imaging optics, whereas in the OFF state it is directed, for example, to an absorber .
  • a headlamp based on a micromirror array is for example in the DE 195 30 008 A1 described.
  • Micromirror components generally have a temperature working range which can leave the permissible operating temperature range in normal operation without additional measures in vehicle headlight applications, in which case malfunction or consequential damage would occur.
  • a temperature working range which can leave the permissible operating temperature range in normal operation without additional measures in vehicle headlight applications, in which case malfunction or consequential damage would occur.
  • it is provided to connect micromirror components with heat sinks. This can ensure that, in the case of high ambient temperatures, the heat loss generated at a micromirror component does not lead to an impermissibly high component temperature.
  • the micromirror component At temperatures that are lower than e.g. 0 ° C, the provision of the heat sink, on the other hand, could have a negative effect, since the intended operating temperature of a micromirror component also has a lower temperature limit, which could be lower at ambient temperatures of 0 ° C and less, since this would result in an approximation to the undesirably low ambient temperature in this case.
  • the micromirror component In order to prevent the temperature falling below the permissible operating temperature in the case of low ambient temperatures, the micromirror component therefore has a heating element which is thermally connected to the component or is preferably integrated into the component. Since the heat sink counteracts the heating of the micromirror component, considerable power is required to heat the micromirror component.
  • the power loss at the current control unit may reach values similar to the power of the DMD heating element (PHEATER). Heating outputs of up to 40W, for example, are required to sufficiently heat the micromirror component. Losses of 40 W, for example, can therefore occur at the current control unit.
  • This object is achieved with a circuit arrangement of the type mentioned at the outset, in which, according to the invention, the current control unit for controlling the heating element is electrically connected to the latter, the current control unit also being connected to the micromirror component via a thermal connection to the heat sink for the transmission of heat loss occurring at the current control unit is.
  • the light source is preferably one or more LED light sources.
  • the heating element can be designed, for example, as a heating winding.
  • the micromirror component can be, for example, a DMD chip (digital mirror device), the micromirror component preferably being designed and controllable in such a way that a large number of mirrors are individually switched on and switched off state can be controlled in order to generate the desired light distribution pattern which is projected onto the road via the projection optics.
  • the micromirror component can also be referred to as a beam deflection unit.
  • a DMD chip can e.g. be designed as a DLP-based light module, such modules being available, for example, from the company "Texas Instruments”.
  • the printed circuit board has an opening through which a heat-conducting element extends from the micromirror component to the heat sink for heat transfer.
  • the heat-conducting element is thermally connected to the micromirror component and the heat sink.
  • the heat-conducting element is integrated in the heat sink or is formed in one piece with it.
  • heat-conducting paste or heat-conducting adhesive is preferably arranged to optimize the heat transfer.
  • the printed circuit board can be, for example, a double-sided FR4 printed circuit board. Such plates are inexpensive to manufacture, but have poor thermal conductivity.
  • the circuit arrangement further comprises a support frame that can be connected to a vehicle headlight housing, the circuit board being arranged between the heat sink and the support frame.
  • the support frame has positioning means for fixing the position of the micromirror component in relation to the support frame.
  • the heating element is integrated in the micromirror component. In this way, thermal energy of the heating element can be transmitted to the micromirrors particularly efficiently.
  • the current control unit is arranged on the side of the circuit board facing the heat sink.
  • the heat sink can contact the current control unit directly, for example via its outer housing.
  • this arrangement can be particularly advantageous.
  • the current control unit is arranged on the side of the circuit board facing away from the heat sink.
  • circuit boards that can be populated on one side can be used, for example.
  • the current control unit is thermally connected to the heat sink via at least one heat-conducting means extending through the printed circuit board, in particular heat-conducting vias. As a result, the current control unit can be efficiently thermally contacted with the micromirror component.
  • a via is understood to mean a so-called “vertical interconnected access”, that is to say a connection extending through the printed circuit board.
  • This arrangement has the particular advantage that the cooling of the current control unit or the heat transfer to the heat sink typically takes place particularly efficiently via the underside of the current control unit, since this is equipped with corresponding metallic contacts and is connected to the printed circuit board, which is located inside the current control unit extend and thus efficiently conduct heat to the bottom.
  • the heat sink is connected to the support frame in such a way that the circuit board can be fixed in its position in relation to the support frame by the heat sink, as a result of which the micromirror component is in position with respect to a vehicle headlight housing connected to the support frame and therein recorded components can be fixed.
  • the heat sink is connected to the support frame by means of a screw connection, the heat sink being displaceable along the screw connection and spring elements being provided by means of which the heat sink in the direction of the Support frame is pressed.
  • the current control unit is a linearly regulated current control unit, in particular a linear current source.
  • these current control units are linearly regulated and inexpensive to produce.
  • Linearly controlled current control units have a higher power loss than clocked control units, which, however, can be used advantageously in the sense of the present invention, so that the cost saving potential of the cheap linear current control units can be fully exploited.
  • Linear constant current sources include, for example, constant current sources with J-FET, constant current sources with bipolar transistors, constant current sources Operational amplifier (OPV) and transistor, current mirror as a constant current source, or constant current sources with linear regulators in question.
  • all electronic components of the circuit arrangement are SMD components (ie surface mounted devices).
  • At least one base for receiving the at least one micromirror component is provided on the printed circuit board. In this way, it is fundamentally possible to install or, for example, replace the micromirror component at any time during vehicle headlight assembly.
  • the current control unit is arranged at a maximum distance of 3 cm from the micromirror component.
  • the invention also relates to a lighting device comprising a circuit arrangement according to the invention, a light source, and at least one imaging optics for imaging the light emitted by the lighting element towards a predeterminable light distribution, the light source, the micromirror component and the imaging optics being arranged such that the light source emitted light can be deflected via the micromirror component towards the imaging optics.
  • the invention relates to a vehicle headlight, in particular motor vehicle headlights, comprising a lighting device according to one of the preceding claims.
  • the invention relates to a vehicle comprising a vehicle headlight according to the invention, in particular motor vehicle headlights.
  • FIG. 1 shows a schematic representation of a circuit arrangement 1 'according to the prior art.
  • the circuit arrangement 1 ' comprises therein a circuit board 2', at least one micromirror component 3 'connected to the circuit board 2' for deflecting a light beam directed onto the micromirror component 3 ', and a current control unit 5'.
  • the micromirror component 3 ' has an integrated heating element 3a' which can be controlled by means of the current control unit 5 '.
  • the current control unit 5 ' is arranged on the printed circuit board 2', no structural elements being provided for the thermal connection to the micromirror component 3 '. The heat loss at the current control unit 5 'thus remains unused.
  • FIG. 1 shows a schematic representation of a first embodiment of a circuit arrangement 1 according to the invention
  • Fig. 1 The circuit arrangement 1 according to the invention comprises a printed circuit board 2 and at least one micromirror component 3 connected to the printed circuit board 2 for modulating a light beam directed onto the micromirror component 3.
  • the circuit arrangement 1 comprises a heat sink 4 thermally connected to the at least one micromirror component 3 and a current control unit 5.
  • the micromirror component 3 has an integrated heating element 3a which can be controlled by the current control unit 5.
  • the circuit arrangement 1 is electrically connected to the heating element 3a
  • Current control unit 5 is thermally connected to the micromirror component 3 via a thermal connection to the heat sink 4 for the transmission of heat loss generated by the current control unit 5.
  • the circuit board 2 in the present exemplary embodiment has an opening 2a through which a heat-conducting element 4a extends from the micromirror component 3 to the heat sink 4 for heat transfer.
  • the heat-conducting element 4a is formed in one piece with the heat sink 4.
  • heat conducting material 10 eg heat conducting paste
  • this heat-conducting material 10 (for example gap filler material from Bergquist GF1500) is specially designed for conduction over larger distances (in the millimeter range), the material being arranged in the region between the printed circuit board 2 and the current control unit 5.
  • This material can also be arranged between the micromirror component 3 and the heat-conducting element 4a.
  • conventional thermal paste or thermal adhesive can be provided.
  • the circuit arrangement 1 further comprises a support frame 6 which can be connected to a vehicle headlight housing (not shown in the figures), the circuit board 2 being arranged between the heat sink and the support frame 6.
  • the support frame 6 comprises positioning means 6a designed as projections for fixing the position of the micromirror component 3 with respect to the support frame 6.
  • the electronic components of the circuit arrangement 1 are arranged both on the side of the printed circuit board 2 facing the support frame 6 and on the opposite side, the current control unit 5 being thermally connected to the heat sink 4 via at least one heat-conducting means 2b extending through the printed circuit board 2, in particular heat-conducting vias is.
  • the heat sink 4 is connected to the support frame 6 in such a way that the circuit board 2 can be fixed in its position in relation to the support frame 6 by the heat sink 4.
  • this is achieved in that the heat sink 4 is connected to the support frame 6 by means of a screw connection 7, the heat sink 4 being displaceable along the screw connection 7 and spring elements 8 being provided, by means of which the heat sink 4 is pressed in the direction of the support frame 6 .
  • a base 9 is arranged on the printed circuit board 2 and is provided for receiving the micromirror component 3 and via which the micromirror component 3 is electrically connected to the printed circuit board 2.
  • the distance (measured from the center points of the elements in the direction of the plane spanned by the printed circuit board 2) between the micromirror component 3 and the current control unit is maximal Is 3 cm.
  • the invention also relates to a lighting device, not shown in the figures, comprising a circuit arrangement 1 according to the invention, a light source, and at least one imaging optics (the light source and the imaging optics are not shown in the figures) for imaging the light emitted by the lighting element towards one Predeterminable light distribution, the light source and the micromirror component being arranged such that light emitted by the light source can be directed via the micromirror component to the imaging optics, in particular a projection device (lens).
  • the invention relates to a vehicle headlight, in particular a motor vehicle headlight, comprising a lighting device according to the invention and a vehicle, comprising a vehicle headlight according to the invention, in particular a motor vehicle headlight.
  • Figure 3 shows a schematic representation of a second embodiment of a circuit arrangement 1 according to the invention.
  • the current control unit 5 is arranged on the underside of the printed circuit board 2, the heat sink 4 making direct contact with the current control unit 5 by means of heat conducting material on its housing.
  • FIG. 4 shows an equivalent circuit diagram of an electrical circuit consisting of the heating element 3a of a microprojection element 3 and a current control unit 5.
  • the equivalent circuit shows a voltage source Uo, via which the current control unit 5 and the heating element 3a are supplied.
  • the voltage Uo is divided into the voltages U DMD and U SR , the ratio of these voltages depending on the nature of the heating element, the ambient temperature, and the properties of the controller 5 and its operating state is specified.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Lighting Device Outwards From Vehicle And Optical Signal (AREA)

Description

Die Erfindung betrifft eine Schaltungsanordnung, umfassend eine Leiterplatte, zumindest ein mit der Leiterplatte verbundenes Mikrospiegelbauelement zur Modulation eines auf das Mikrospiegelbauelement gerichteten Lichtstrahls einer Lichtquelle, und einen mit dem zumindest einen Mikrospiegelbauelement thermisch verbundenen Kühlkörper, sowie eine Stromregeleinheit, wobei dem Mikrospiegelbauelement ein mittels der Stromregeleinheit steuerbares Heizelement zugeordnet ist, das mit dem Mikrospiegelbauteil thermisch verbunden ist.The invention relates to a circuit arrangement comprising a printed circuit board, at least one micromirror component connected to the printed circuit board for modulating a light beam of a light source directed onto the micromirror component, and a heat sink thermally connected to the at least one micromirror component, and a current control unit, the micromirror component being a means of the current control unit Controllable heating element is assigned, which is thermally connected to the micromirror component.

Unter dem Ausdruck "Modulation" wird in diesem Zusammenhang ein Verfahren verstanden, bei dem Licht durch gezielte Ansteuerung des Mikrospiegelbauelements abgelenkt werden kann, wobei z.B. durch in einem Zustand eines Mikrospiegels des Mikrospiegelbauelements ein Lichtstrahl über eine nachgelagerte Abbildungsoptik auf eine Fahrbahn projiziert wird und in einem anderen Zustand der Lichtstrahl bereits zuvor absorbiert wird. Durch intermittierenden Wechsel der Zustände kann dadurch die Lichtverteilung als auch die Intensität variiert werden.In this context, the term "modulation" is understood to mean a method in which light can be deflected by targeted control of the micromirror component, with e.g. by projecting a light beam onto a roadway via a downstream imaging optical system in one state of a micromirror of the micromirror component and in another state the light beam is already absorbed beforehand. By intermittently changing the states, the light distribution and the intensity can be varied.

Ferner betrifft die Erfindung eine Leuchtvorrichtung mit einer erfindungsgemäßen Schaltungsanordnung sowie einen Fahrzeugscheinwerfer mit einer erfindungsgemäßen Leuchtvorrichtung.Furthermore, the invention relates to a lighting device with a circuit arrangement according to the invention and a vehicle headlight with a lighting device according to the invention.

Es ist bekannt geworden, als Lichtbearbeitungselemente für Scheinwerfersysteme Bildgeber zu verwenden, die eine große Anzahl ansteuerbarer Pixelfelder aufweisen. So zeigt die DE102013215374A1 Lösungen, bei welchen das Licht einer Lichtquelle über einen sogenannten "Taper", einem konischen Lichtleitelement, zu einem LCD-Bildgeber, zu einem LCoS-Chip oder zu einer Mikrospiegelanordnung ("DMD") gelenkt wird, um dann über eine Projektionsoptik auf die Fahrbahn projiziert zu werden. Das Dokument WO 2017/132713 A1 betrifft eine Beleuchtungseinheit für ein Kraftfahrzeug umfassend ein Lichtmodul und ein Spiegelmodul. Dokument EP 3 168 526 A1 betrifft einen Scheinwerfer umfassend ein mikromechanisches Spiegelsystem.It has become known to use imaging devices which have a large number of controllable pixel fields as light processing elements for headlight systems. So it shows DE102013215374A1 Solutions in which the light from a light source is directed via a so-called "taper", a conical light-guiding element, to an LCD imager, to an LCoS chip or to a micromirror arrangement ("DMD"), and then onto the road via projection optics to be projected. The document WO 2017/132713 A1 relates to a lighting unit for a motor vehicle comprising a light module and a mirror module. document EP 3 168 526 A1 relates to a headlamp comprising a micromechanical mirror system.

DMD ist ein Akronym, das für "Digital Micromirror Device" gebraucht wird, somit für ein Mikrospiegel-Array oder Mikrospiegel-Matrix. Solch ein Mikrospiegel-Array besitzt sehr kleine Abmessungen, typischerweise in der Größenordnung von 10 mm.DMD is an acronym used for "Digital Micromirror Device", thus for a micromirror array or micromirror matrix. Such a micromirror array has very small dimensions, typically on the order of 10 mm.

Bei einem DMD sind Mikrospiegelaktoren matrixartig angeordnet, wobei jedes einzelne Spiegelelement um einen bestimmten Winkel, beispielsweise 20°, verkippbar ist, beispielsweise durch elektromagnetische oder piezoelektrische Aktoren. Die Endlagen eines Mikrospiegels wird in dieser Beschreibung als EIN-Zustand bzw. AUS-Zustand bezeichnet, wobei EIN-Zustand bedeutet, dass Licht von dem Mikrospiegel über die Abbildungsoptik auf die Straße gelangt, wogegen es im AUS-Zustand beispielsweise auf einen Absorber gelenkt wird. Ein Scheinwerfer auf Basis eines Mikrospiegel-Arrays ist beispielsweise in der DE 195 30 008 A1 beschrieben.In a DMD, micromirror actuators are arranged in a matrix, each individual mirror element being tiltable by a certain angle, for example 20 °, for example by means of electromagnetic or piezoelectric actuators. The end positions of a micromirror are referred to in this description as the ON state or the OFF state, where the ON state means that light from the micromirror reaches the street via the imaging optics, whereas in the OFF state it is directed, for example, to an absorber . A headlamp based on a micromirror array is for example in the DE 195 30 008 A1 described.

Mikrospiegelbauelemente weisen im Allgemeinen einen Temperaturarbeitsbereich auf, der ohne zusätzliche Maßnahmen bei Fahrzeugscheinwerferanwendungen im Normalbetrieb den zulässigen Betriebstemperaturbereich verlassen kann, wobei in diesem Fall Fehlfunktion oder Folgeschäden auftreten würden. Um den Arbeitsbereich auf den zulässigen Betriebstemperaturbereich einzuschränken, ist in Fahrzeugscheinwerferanwendungen, die anwendungsgemäß einer hohen Schwankungsbreite der Umgebungstemperaturen ausgesetzt sein können, vorgesehen, Mikrospiegelbauelemente mit Kühlkörpern zu verbinden. Dadurch kann sichergestellt werden, dass im Falle hoher Umgebungstemperaturen die an einem Mikrospiegelbauelement anfallende Verlustwärme zu keiner unzulässig hohen Bauteiltemperatur führt.Micromirror components generally have a temperature working range which can leave the permissible operating temperature range in normal operation without additional measures in vehicle headlight applications, in which case malfunction or consequential damage would occur. In order to restrict the working range to the permissible operating temperature range, in vehicle headlight applications which, depending on the application, may be exposed to a wide fluctuation range of the ambient temperatures, it is provided to connect micromirror components with heat sinks. This can ensure that, in the case of high ambient temperatures, the heat loss generated at a micromirror component does not lead to an impermissibly high component temperature.

Bei Temperaturen, die niedriger als z.B. 0°C sind, könnte sich das Vorsehen des Kühlkörpers hingegen negativ auswirken, da die vorgesehene Betriebstemperatur eines Mikrospiegelbauelements ebenso eine Temperaturuntergrenze aufweist, die bei Umgebungstemperaturen von 0°C und weniger unterschritten werden könnte, da damit eine Angleichung an die in diesem Fall unerwünscht niedrige Umgebungstemperatur erwirkt wird. Um ein Unterschreiten der zulässigen Betriebstemperatur im Falle niedriger Umgebungstemperaturen zu verhindern, weist das Mikrospiegelbauelement daher ein Heizelement auf, das mit dem Bauteil thermisch verbunden oder vorzugsweise in das Bauteil integriert ist. Da der Kühlkörper der Beheizung des Mikrospiegelbauelements entgegenwirkt, ist beträchtliche Leistung zur Erwärmung des Mikrospiegelbauelements erforderlich. Hinzu kommt, dass der Wicklungswiderstand von typischen integrierten Heizelementen, insbesondere in DMD-Chips, sehr stark temperaturabhängig ist, weshalb eine Stromregelungseinheit zur Ansteuerung des Heizelements bzw. zur Steuerung der Heizleistung vorgesehen ist. An dieser Stromregelungseinheit fallen gemäß dem Produkts aus Spannungsabfall USR und Strom IHeater (siehe Figur 4) Verluste an, die sehr stark von der Temperatur des Heizelements abhängen.At temperatures that are lower than e.g. 0 ° C, the provision of the heat sink, on the other hand, could have a negative effect, since the intended operating temperature of a micromirror component also has a lower temperature limit, which could be lower at ambient temperatures of 0 ° C and less, since this would result in an approximation to the undesirably low ambient temperature in this case. In order to prevent the temperature falling below the permissible operating temperature in the case of low ambient temperatures, the micromirror component therefore has a heating element which is thermally connected to the component or is preferably integrated into the component. Since the heat sink counteracts the heating of the micromirror component, considerable power is required to heat the micromirror component. In addition comes that the winding resistance of typical integrated heating elements, especially in DMD chips, is very strongly temperature-dependent, which is why a current control unit is provided to control the heating element or to control the heating power. According to the product of voltage drop U SR and current I heater (see Figure 4 ) Losses, which depend very much on the temperature of the heating element.

Die Verlustleistung an der Stromreglungseinheit kann unter Umständen ähnliche Werte wie die Leistung des DMD Heizelement (PHEATER) erreichen. Dabei sind Heizleistungen bis zu einer Höhe von beispielsweise 40W erforderlich, um das Mikrospiegelbauelement ausreichend zu erwärmen. An der Stromregelungseinheit können daher Verluste in Höhe von beispielsweise 40 W anfallen.The power loss at the current control unit may reach values similar to the power of the DMD heating element (PHEATER). Heating outputs of up to 40W, for example, are required to sufficiently heat the micromirror component. Losses of 40 W, for example, can therefore occur at the current control unit.

Eine Aufgabe der Erfindung besteht daher darin, die Verlustleistung der Schaltungsanordnung zu reduzieren und den Betrieb des Mikrospiegelbauelements zu optimieren. Diese Aufgabe wird mit einer Schaltungsanordnung der eingangs genannten Art gelöst, bei der erfindungsgemäß die Stromregeleinheit zur Ansteuerung des Heizelements mit diesem elektrisch verbunden ist, wobei die Stromregeleinheit zudem über eine thermische Verbindung mit dem Kühlkörper zur Übertragung von an der Stromregeleinheit anfallender Verlustwärme mit dem Mikrospiegelbauelement verbunden ist. Dadurch ist es möglich, die in der Stromregeleinheit anfallende Verlustleistung zur Beheizung des Mikrospiegelbauelements zu nutzen, wodurch die in dem Heizelement des Mikrospiegelbauelements umzusetzende Heizleistung reduziert werden kann. Die Effizienz des Gesamtsystems steigt dadurch, da in Summe weniger Energie erforderlich ist, um das Mikrospiegelbauelement in einen zulässigen Temperaturbereich zu bringen. Diese Verbesserung der Effizienz ermöglicht es zudem, Leiterbahnen und die Leiterbahnen versorgende Kabelstränge - insbesondere Flex-Verbindungen - entsprechend dünner zu dimensionieren. Bei der Lichtquelle handelt es sich bevorzugt um eine oder mehrere LED-Lichtquellen.It is therefore an object of the invention to reduce the power loss of the circuit arrangement and to optimize the operation of the micromirror component. This object is achieved with a circuit arrangement of the type mentioned at the outset, in which, according to the invention, the current control unit for controlling the heating element is electrically connected to the latter, the current control unit also being connected to the micromirror component via a thermal connection to the heat sink for the transmission of heat loss occurring at the current control unit is. This makes it possible to use the power loss that arises in the current control unit for heating the micromirror component, as a result of which the heating power to be implemented in the heating element of the micromirror component can be reduced. This increases the efficiency of the overall system, since less energy is required to bring the micromirror component into a permissible temperature range. This improvement in efficiency also makes it possible to dimension conductor tracks and the cable runs supplying the conductor tracks, in particular flex connections, correspondingly thinner. The light source is preferably one or more LED light sources.

Das Heizelement kann beispielsweise als Heizwicklung ausgebildet sein. Bei dem Mikrospiegelbauelement kann es sich beispielsweise um einen DMD-Chip (digital mirror device) handeln, wobei das Mikrospiegelbauelement vorzugsweise dergestalt ausgebildet und ansteuerbar ist, dass eine Vielzahl von Spiegeln individuell in einen eingeschalteten und ausgeschalteten Zustand ansteuerbar sind, um somit das gewünschte Lichtverteilungsmuster zu erzeugen, welches über die Projektionsoptik auf die Fahrbahn projiziert wird.The heating element can be designed, for example, as a heating winding. The micromirror component can be, for example, a DMD chip (digital mirror device), the micromirror component preferably being designed and controllable in such a way that a large number of mirrors are individually switched on and switched off state can be controlled in order to generate the desired light distribution pattern which is projected onto the road via the projection optics.

Das Mikrospiegelbauelement kann auch als Strahlablenkeinheit bezeichnet werden. Ein DMD-Chip kann z.B. als DLP basiertes Lichtmodul ausgebildet sein, wobei solche Module beispielsweise von dem Unternehmen "Texas Instruments" erhältlich sind.The micromirror component can also be referred to as a beam deflection unit. A DMD chip can e.g. be designed as a DLP-based light module, such modules being available, for example, from the company "Texas Instruments".

Vorzugsweise kann vorgesehen sein, dass die Leiterplatte eine Öffnung aufweist, durch die sich ein Wärmeleitelement von dem Mikrospiegelbauelement hin zu dem Kühlkörper zur Wärmeübertragung erstreckt. Das Wärmeleitelement ist mit dem Mikrospiegelbauelement und dem Kühlkörper thermisch verbunden. Insbesondere kann vorgesehen sein, dass das Wärmeleitelement in den Kühlkörper integriert ist bzw. mit diesem einstückig ausgebildet ist. Zwischen dem Wärmeleitelement und dem Mikrospiegelbauelement ist zur Optimierung des Wärmeüberganges vorzugweise Wärmeleitpaste oder Wärmeleitkleber angeordnet. Bei der Leiterplatte kann es sich beispielsweise um eine doppelseitig bestückte FR4 Leiterplatte handeln. Solche Platten sind kostengünstig herstellbar, weisen allerdings eine schlechte thermische Leitfähigkeit auf.It can preferably be provided that the printed circuit board has an opening through which a heat-conducting element extends from the micromirror component to the heat sink for heat transfer. The heat-conducting element is thermally connected to the micromirror component and the heat sink. In particular, it can be provided that the heat-conducting element is integrated in the heat sink or is formed in one piece with it. Between the heat-conducting element and the micromirror component, heat-conducting paste or heat-conducting adhesive is preferably arranged to optimize the heat transfer. The printed circuit board can be, for example, a double-sided FR4 printed circuit board. Such plates are inexpensive to manufacture, but have poor thermal conductivity.

Zur Befestigung und Referenz des Mikrospiegelbauelements innerhalb eines Fahrzeugscheinwerfers kann z.B. vorgesehen sein, dass die Schaltungsanordnung ferner einen mit einem Fahrzeugscheinwerfergehäuse verbindbaren Tragrahmen umfasst, wobei die Leiterplatte zwischen dem Kühlkörper und dem Tragrahmen angeordnet ist. Insbesondere kann vorgesehen, dass der Tragrahmen Positionierungsmittel zur Festlegung der Position des Mikrospiegelbauelements in Bezug auf den Tragrahmen aufweist.For fastening and reference of the micromirror component within a vehicle headlight, e.g. it should be provided that the circuit arrangement further comprises a support frame that can be connected to a vehicle headlight housing, the circuit board being arranged between the heat sink and the support frame. In particular, it can be provided that the support frame has positioning means for fixing the position of the micromirror component in relation to the support frame.

Insbesondere kann vorgesehen sein, dass das Heizelement in das Mikrospiegelbauteil integriert ist. Auf diese Weise kann thermische Energie des Heizelements besonders effizient auf die Mikrospiegel übertragen werden.In particular, it can be provided that the heating element is integrated in the micromirror component. In this way, thermal energy of the heating element can be transmitted to the micromirrors particularly efficiently.

Beispielsweise kann vorgesehen, dass die Stromregeleinheit an der von dem Kühlkörper zugewandten Seite der Leiterplatte angeordnet ist. In diesem Fall kann der Kühlkörper die Stromregeleinheit direkt - z.B. über dessen Außengehäuse - kontaktieren. Abhängig von der Wärmeleitfähigkeit des Außengehäuses kann diese Anordnung besonders vorteilhaft sein. Alternativ dazu kann vorgesehen sein, dass die Stromregeleinheit an der dem Kühlkörper abgewandten Seite der Leiterplatte angeordnet ist. Dadurch können beispielsweise einseitig bestückbare Leiterplatten eingesetzt werden. Zudem kann vorgesehen sein, dass, dass die Stromregeleinheit über zumindest ein durch die Leiterplatte erstreckendes Wärmeleitmittel, insbesondere wärmeleitende Vias, mit dem Kühlkörper thermisch verbunden ist. Dadurch kann die Stromregeleinheit effizient thermisch mit dem Mikrospiegelbauelement kontaktiert werden. Unter einem Via wird ein sog. "vertical interconnected access" verstanden, also eine durch die Leiterplatte erstreckende Verbindung. Diese Anordnung hat den besonderen Vorteil, dass die Kühlung der Stromregeleinheit bzw. die Wärmeübertragung auf den Kühlkörper typischerweise besonders effizient über die Unterseite der Stromregeleinheit erfolgt, da diese mit entsprechenden metallischen Kontakten ausgestattet und mit der Leiterplatte verbunden ist, die sich in das Innere der Stromregeleinheit erstrecken und damit Wärme effizient zur Unterseite leiten.For example, it can be provided that the current control unit is arranged on the side of the circuit board facing the heat sink. In this case, the heat sink can contact the current control unit directly, for example via its outer housing. Depending on the thermal conductivity of the outer housing, this arrangement can be particularly advantageous. Alternatively, it can be provided that the current control unit is arranged on the side of the circuit board facing away from the heat sink. As a result, circuit boards that can be populated on one side can be used, for example. In addition, it can be provided that the current control unit is thermally connected to the heat sink via at least one heat-conducting means extending through the printed circuit board, in particular heat-conducting vias. As a result, the current control unit can be efficiently thermally contacted with the micromirror component. A via is understood to mean a so-called "vertical interconnected access", that is to say a connection extending through the printed circuit board. This arrangement has the particular advantage that the cooling of the current control unit or the heat transfer to the heat sink typically takes place particularly efficiently via the underside of the current control unit, since this is equipped with corresponding metallic contacts and is connected to the printed circuit board, which is located inside the current control unit extend and thus efficiently conduct heat to the bottom.

Dabei kann insbesondere vorgesehen sein, dass der Kühlkörper mit dem Tragrahmen dergestalt verbunden ist, dass die Leiterplatte durch den Kühlkörper in ihrer Position in Bezug auf den Tragrahmen fixierbar ist, wodurch das Mikrospiegelbauteil in seiner Position in Bezug auf einen mit dem Tragrahmen verbunden Fahrzeugscheinwerfergehäuse und darin aufgenommener Komponenten fixiert werden kann. Um den Einbau und die Endpositionierung der Schaltungsanordnung innerhalb eines Fahrzeugscheinwerfers zu erleichtern, kann vorgesehen sein, dass der Kühlkörper mit dem Tragrahmen mittels einer Schraubverbindung verbunden ist, wobei der Kühlkörper entlang der Schraubverbindung verschiebbar ist und Federelemente vorgesehen sind, mittels derer der Kühlkörper in Richtung des Tragrahmens gedrückt wird.In particular, it can be provided that the heat sink is connected to the support frame in such a way that the circuit board can be fixed in its position in relation to the support frame by the heat sink, as a result of which the micromirror component is in position with respect to a vehicle headlight housing connected to the support frame and therein recorded components can be fixed. In order to facilitate the installation and the final positioning of the circuit arrangement within a vehicle headlight, it can be provided that the heat sink is connected to the support frame by means of a screw connection, the heat sink being displaceable along the screw connection and spring elements being provided by means of which the heat sink in the direction of the Support frame is pressed.

Insbesondere kann vorgesehen sein, dass die Stromregeleinheit eine linear geregelte Stromregeleinheit, insbesondere eine Linearstromquelle ist. Im Gegensatz zu getakteten Stromregeleinheiten sind diese Stromregeleinheiten linear geregelt und kostengünstig herstellbar. Linear geregelte Stromregeleinheiten weisen eine im Vergleich zu getakteten Regeleinheiten höhere Verlustleistung auf, die allerdings im Sinne der vorliegenden Erfindung vorteilhaft genutzt werden kann, sodass das Kosteneinsparungspotential der günstigen linearen Stromregeleinheiten vollständig ausgeschöpft werden kann. Als lineare Konstantstromquellen kommen z.B. Konstantstromquellen mit J-FET, Konstantstromquellen mit bipolaren Transistoren, Konstantstromquellen mit Operationsverstärker (OPV) und Transistor, Stromspiegel als Konstantstromquelle, oder Konstantstromquellen mit Linearreglern in Frage.In particular, it can be provided that the current control unit is a linearly regulated current control unit, in particular a linear current source. In contrast to clocked current control units, these current control units are linearly regulated and inexpensive to produce. Linearly controlled current control units have a higher power loss than clocked control units, which, however, can be used advantageously in the sense of the present invention, so that the cost saving potential of the cheap linear current control units can be fully exploited. Linear constant current sources include, for example, constant current sources with J-FET, constant current sources with bipolar transistors, constant current sources Operational amplifier (OPV) and transistor, current mirror as a constant current source, or constant current sources with linear regulators in question.

Insbesondere kann vorgesehen sein, dass sämtliche elektronischen Bauteile der Schaltungsanordnung SMD-Bauteile (also surface mounted devices) sind.In particular, it can be provided that all electronic components of the circuit arrangement are SMD components (ie surface mounted devices).

Zudem kann vorgesehen sein, dass an der Leiterplatte zumindest ein Sockel zur Aufnahme des zumindest einen Mikrospiegelbauelements vorgesehen ist. Auf diese Weise ist es grundsätzlich möglich, das Mikrospiegelbauelement zu einem beliebigen Zeitpunkt einer Fahrzeugscheinwerfermontage einzubauen oder beispielsweise auszutauschen.In addition, it can be provided that at least one base for receiving the at least one micromirror component is provided on the printed circuit board. In this way, it is fundamentally possible to install or, for example, replace the micromirror component at any time during vehicle headlight assembly.

Zudem kann vorgesehen sein, dass die Stromregeleinheit in einem Abstand von maximal 3 cm zu dem Mikrospiegelbauelement angeordnet ist.In addition, it can be provided that the current control unit is arranged at a maximum distance of 3 cm from the micromirror component.

Die Erfindung betrifft zudem eine Leuchtvorrichtung, umfassend eine erfindungsgemäße Schaltungsanordnung, eine Lichtquelle, sowie zumindest eine Abbildungsoptik zur Abbildung des von dem Leuchtelement abgestrahlten Licht hin zu einer vorgebbaren Lichtverteilung, wobei die Lichtquelle, das Mikrospiegelbauelement und die Abbildungsoptik dergestalt angeordnet ist, dass durch die Lichtquelle abgestrahltes Licht über das Mikrospiegelbauelement hin zu der Abbildungsoptik ablenkbar ist.The invention also relates to a lighting device comprising a circuit arrangement according to the invention, a light source, and at least one imaging optics for imaging the light emitted by the lighting element towards a predeterminable light distribution, the light source, the micromirror component and the imaging optics being arranged such that the light source emitted light can be deflected via the micromirror component towards the imaging optics.

Weiters betrifft die Erfindung einen Fahrzeugscheinwerfer, insbesondere Kraftfahrzeugscheinwerfer, umfassend eine Leuchtvorrichtung nach einem der vorhergehenden Ansprüche.Furthermore, the invention relates to a vehicle headlight, in particular motor vehicle headlights, comprising a lighting device according to one of the preceding claims.

Zudem betrifft die Erfindung ein Fahrzeug, umfassend einen erfindungsgemäßen Fahrzeugscheinwerfer, insbesondere Kraftfahrzeugscheinwerfer.In addition, the invention relates to a vehicle comprising a vehicle headlight according to the invention, in particular motor vehicle headlights.

Die Erfindung ist im Folgenden anhand beispielhafter und nicht einschränkender Ausführungsformen näher erläutert, die in den Figuren veranschaulicht sind. Darin zeigt

  • Figur 1 eine schematische Darstellung einer Schaltungsanordnung gemäß dem Stand der Technik,
  • Figur 2 eine schematische Darstellung einer ersten Ausführungsform einer erfindungsgemäßen Schaltungsanordnung,
  • Figur 3 eine schematische Darstellung einer zweiten Ausführungsform einer erfindungsgemäßen Schaltungsanordnung, und
  • Figur 4 ein Ersatzschaltbild einer elektrischen Schaltung bestehend aus einem Heizelement eines Mikroprojektionselements und einer Stromregeleinheit.
The invention is explained in more detail below on the basis of exemplary and non-restrictive embodiments which are illustrated in the figures. In it shows
  • Figure 1 1 shows a schematic representation of a circuit arrangement according to the prior art,
  • Figure 2 1 shows a schematic representation of a first embodiment of a circuit arrangement according to the invention,
  • Figure 3 a schematic representation of a second embodiment of a circuit arrangement according to the invention, and
  • Figure 4 an equivalent circuit diagram of an electrical circuit consisting of a heating element of a microprojection element and a current control unit.

In den folgenden Figuren bezeichnen - sofern nicht anders angegeben - gleiche Bezugszeichen gleiche Merkmale.Unless otherwise stated, the same reference symbols in the following figures denote the same features.

Figur 1 zeigt eine schematische Darstellung einer Schaltungsanordnung 1' gemäß dem Stand der Technik. Die Schaltungsanordnung 1' umfasst darin eine Leiterplatte 2', zumindest ein mit der Leiterplatte 2' verbundenes Mikrospiegelbauelement 3' zur Ablenkung eines auf das Mikrospiegelbauelement 3' gerichteten Lichtstrahls, sowie eine Stromregeleinheit 5' auf. Das Mikrospiegelbauelement 3' weist ein mittels der Stromregeleinheit 5' steuerbares integriertes Heizelement 3a' auf. Die Stromregeleinheit 5' ist an der Leiterplatte 2' angeordnet, wobei keine strukturelle Elemente zur thermischen Verbindung mit dem Mikrospiegelbauelement 3' vorgesehen sind. Die Verlustwärme an der Stromregeleinheit 5' bleibt damit ungenutzt. Figure 1 shows a schematic representation of a circuit arrangement 1 'according to the prior art. The circuit arrangement 1 'comprises therein a circuit board 2', at least one micromirror component 3 'connected to the circuit board 2' for deflecting a light beam directed onto the micromirror component 3 ', and a current control unit 5'. The micromirror component 3 'has an integrated heating element 3a' which can be controlled by means of the current control unit 5 '. The current control unit 5 'is arranged on the printed circuit board 2', no structural elements being provided for the thermal connection to the micromirror component 3 '. The heat loss at the current control unit 5 'thus remains unused.

Figur 2 zeigt eine schematische Darstellung einer ersten Ausführungsform einer erfindungsgemäßen Schaltungsanordnung 1. Analog zu Fig. 1 umfasst die erfindungsgemäße Schaltungsanordnung 1 eine Leiterplatte 2 und zumindest ein mit der Leiterplatte 2 verbundenes Mikrospiegelbauelement 3 zur Modulation eines auf das Mikrospiegelbauelement 3 gerichteten Lichtstrahls. Zudem umfasst die Schaltungsanordnung 1 einen mit dem zumindest einen Mikrospiegelbauelement 3 thermisch verbundenen Kühlkörper 4 sowie eine Stromregeleinheit 5. Das Mikrospiegelbauelement 3 weist ein mittels der Stromregeleinheit 5 steuerbares integriertes Heizelement 3a auf. Figure 2 shows a schematic representation of a first embodiment of a circuit arrangement 1 according to the invention Fig. 1 The circuit arrangement 1 according to the invention comprises a printed circuit board 2 and at least one micromirror component 3 connected to the printed circuit board 2 for modulating a light beam directed onto the micromirror component 3. In addition, the circuit arrangement 1 comprises a heat sink 4 thermally connected to the at least one micromirror component 3 and a current control unit 5. The micromirror component 3 has an integrated heating element 3a which can be controlled by the current control unit 5.

Im Gegensatz zur Schaltungsanordnung 1' gemäß dem Stand der Technik ist bei der Schaltungsanordnung 1 erfindungsgemäß die mit dem Heizelement 3a elektrisch verbundene Stromregeleinheit 5 über eine thermische Verbindung mit dem Kühlkörper 4 zur Übertragung von an der Stromregeleinheit 5 anfallender Verlustwärme mit dem Mikrospiegelbauelement 3 thermisch verbunden. Zu diesem Zweck weist die Leiterplatte 2 im vorliegenden Ausführungsbeispiel eine Öffnung 2a auf, durch die sich ein Wärmeleitelement 4a von dem Mikrospiegelbauelement 3 hin zu dem Kühlkörper 4 zur Wärmeübertragung erstreckt. Das Wärmeleitelement 4a ist im vorliegenden Ausführungsbeispiel einstückig mit dem Kühlkörper 4 ausgebildet. Zwischen dem Kühlkörper 4 und der Leiterplatte 2 kann zur Verbesserung des Wärmeüberganges Wärmeleitmaterial 10 (z.B. Wärmeleitpaste) angeordnet sein. Insbesondere kann vorgesehen sein, dass dieses wärmeleitende Material 10 (z.B. Gapfiller-Material der Firma Bergquist GF1500) speziell zur Leitung über größere Abstände (im Millimeterbereich) ausgelegt ist, wobei das Material im Bereich zwischen der Leiterplatte 2 und der Stromregeleinheit 5 angeordnet ist. Zwischen dem Mikrospiegelbauteil 3 und dem Wärmeleitelement 4a kann dieses Material ebenso angeordnet sein. Alternativ dazu kann herkömmliche Wärmeleitpaste oder Wärmeleitkleber vorgesehen sein.In contrast to the circuit arrangement 1 'according to the prior art, the circuit arrangement 1 according to the invention is electrically connected to the heating element 3a Current control unit 5 is thermally connected to the micromirror component 3 via a thermal connection to the heat sink 4 for the transmission of heat loss generated by the current control unit 5. For this purpose, the circuit board 2 in the present exemplary embodiment has an opening 2a through which a heat-conducting element 4a extends from the micromirror component 3 to the heat sink 4 for heat transfer. In the present exemplary embodiment, the heat-conducting element 4a is formed in one piece with the heat sink 4. Between the heat sink 4 and the printed circuit board 2, heat conducting material 10 (eg heat conducting paste) can be arranged to improve the heat transfer. In particular, it can be provided that this heat-conducting material 10 (for example gap filler material from Bergquist GF1500) is specially designed for conduction over larger distances (in the millimeter range), the material being arranged in the region between the printed circuit board 2 and the current control unit 5. This material can also be arranged between the micromirror component 3 and the heat-conducting element 4a. Alternatively, conventional thermal paste or thermal adhesive can be provided.

Die Schaltungsanordnung 1 umfasst ferner einen mit einem Fahrzeugscheinwerfergehäuse (in den Figuren nicht dargestellt) verbindbaren Tragrahmen 6, wobei die Leiterplatte 2 zwischen dem Kühlkörper und dem Tragrahmen 6 angeordnet ist. Der Tragrahmen 6 umfasst als Vorsprünge ausgebildete Positionierungsmittel 6a zur Festlegung der Position des Mikrospiegelbauelements 3 in Bezug auf den Tragrahmen 6.The circuit arrangement 1 further comprises a support frame 6 which can be connected to a vehicle headlight housing (not shown in the figures), the circuit board 2 being arranged between the heat sink and the support frame 6. The support frame 6 comprises positioning means 6a designed as projections for fixing the position of the micromirror component 3 with respect to the support frame 6.

Die elektronischen Bauelemente der Schaltungsanordnung 1 sind sowohl an der dem Tragrahmen 6 zugewandten Seite der Leiterplatte 2 als auch an der abgewandten Seite angeordnet, wobei die Stromregeleinheit 5 über zumindest ein durch Leiterplatte 2 erstreckendes Wärmeleitmittel 2b, insbesondere wärmeleitende Vias, mit dem Kühlkörper 4 thermisch verbunden ist.The electronic components of the circuit arrangement 1 are arranged both on the side of the printed circuit board 2 facing the support frame 6 and on the opposite side, the current control unit 5 being thermally connected to the heat sink 4 via at least one heat-conducting means 2b extending through the printed circuit board 2, in particular heat-conducting vias is.

Der Kühlkörper 4 ist mit dem Tragrahmen 6 dergestalt verbunden, dass die Leiterplatte 2 durch den Kühlkörper 4 in seiner Position in Bezug auf den Tragrahmen 6 fixierbar ist. Dies wird im vorliegenden Ausführungsbeispiel erreicht, indem der Kühlkörper 4 mit dem Tragrahmen 6 mittels einer Schraubverbindung 7 verbunden ist, wobei der Kühlkörper 4 entlang der Schraubverbindung 7 verschiebbar ist und Federelemente 8 vorgesehen sind, mittels derer der Kühlkörper 4 in Richtung des Tragrahmens 6 gedrückt wird.The heat sink 4 is connected to the support frame 6 in such a way that the circuit board 2 can be fixed in its position in relation to the support frame 6 by the heat sink 4. In the present exemplary embodiment, this is achieved in that the heat sink 4 is connected to the support frame 6 by means of a screw connection 7, the heat sink 4 being displaceable along the screw connection 7 and spring elements 8 being provided, by means of which the heat sink 4 is pressed in the direction of the support frame 6 .

An der Leiterplatte 2 ist ein Sockel 9 angeordnet, der zur Aufnahme des Mikrospiegelbauelements 3 vorgesehen ist und über den das Mikrospiegelbauelement 3 mit der Leiterplatte 2 elektrisch verbunden ist.A base 9 is arranged on the printed circuit board 2 and is provided for receiving the micromirror component 3 and via which the micromirror component 3 is electrically connected to the printed circuit board 2.

Um die an der Stromregeleinheit 5 anfallende Verlustwärme möglichst vollständig und rasch an das Mikrospiegelbauelement 3 weiterzuleiten, kann vorgesehen sein, dass der Abstand (gemessen von den Mittelpunkten der Elemente in Richtung der durch die Leiterplatte 2 aufgespannten Ebene) zwischen dem Mikrospiegelbauelement 3 und der Stromregeleinheit maximal 3 cm beträgt.In order to transmit the heat loss at the current control unit 5 as completely and quickly as possible to the micromirror component 3, it can be provided that the distance (measured from the center points of the elements in the direction of the plane spanned by the printed circuit board 2) between the micromirror component 3 and the current control unit is maximal Is 3 cm.

Die Erfindung betrifft zudem eine in den Figuren nicht näher dargestellte Leuchtvorrichtung, umfassend eine erfindungsgemäße Schaltungsanordnung 1, eine Lichtquelle, sowie zumindest eine Abbildungsoptik (die Lichtquelle und die Abbildungsoptik sind in den Figuren nicht dargestellt) zur Abbildung des von dem Leuchtelement abgestrahlten Licht hin zu einer vorgebbaren Lichtverteilung, wobei die Lichtquelle und das Mikrospiegelbauelement dergestalt angeordnet ist, dass durch die Lichtquelle abgestrahltes Licht über das Mikrospiegelbauelement hin zu der Abbildungsoptik, insbesondere einer Projektionsvorrichtung (Linse) lenkbar ist. Außerdem betrifft die Erfindung einen Fahrzeugscheinwerfer, insbesondere Kraftfahrzeugscheinwerfer, umfassend eine erfindungsgemäße Leuchtvorrichtung sowie ein Fahrzeug, umfassend einen erfindungsgemäßen Fahrzeugscheinwerfer, insbesondere einen Kraftfahrzeugscheinwerfer.The invention also relates to a lighting device, not shown in the figures, comprising a circuit arrangement 1 according to the invention, a light source, and at least one imaging optics (the light source and the imaging optics are not shown in the figures) for imaging the light emitted by the lighting element towards one Predeterminable light distribution, the light source and the micromirror component being arranged such that light emitted by the light source can be directed via the micromirror component to the imaging optics, in particular a projection device (lens). In addition, the invention relates to a vehicle headlight, in particular a motor vehicle headlight, comprising a lighting device according to the invention and a vehicle, comprising a vehicle headlight according to the invention, in particular a motor vehicle headlight.

Figur 3 zeigt eine schematische Darstellung einer zweiten Ausführungsform einer erfindungsgemäßen Schaltungsanordnung 1. Im Gegensatz zur ersten Ausführungsform ist darin die Stromregeleinheit 5 an der Unterseite der Leiterplatte 2 angeordnet, wobei der Kühlkörper 4 die Stromregeleinheit 5 mittels Wärmeleitmaterial direkt an seinem Gehäuse kontaktiert. Figure 3 shows a schematic representation of a second embodiment of a circuit arrangement 1 according to the invention. In contrast to the first embodiment, the current control unit 5 is arranged on the underside of the printed circuit board 2, the heat sink 4 making direct contact with the current control unit 5 by means of heat conducting material on its housing.

Figur 4 zeigt ein Ersatzschaltbild einer elektrischen Schaltung bestehend aus dem Heizelement 3a eines Mikroprojektionselements 3 und einer Stromregeleinheit 5. Die Ersatzschaltung zeigt eine Spannungsquelle Uo, über die die Stromregeleinheit 5 sowie das Heizelement 3a versorgt wird. Die Spannung Uo teilt sich in die Spannungen UDMD und USR auf, wobei das Verhältnis dieser Spannungen in Abhängigkeit von der Beschaffenheit des Heizelements, der Umgebungstemperatur, sowie der Eigenschaften des Reglers 5 und dessen Betriebszustand vorgegeben ist. Wie bereits eingangs erwähnt, kann die Verlustleistung an dem Regler 5 durchaus gleiche Werte wie die Wärmeleistung der Heizwicklung annehmen. In diesem Fall gilt daher USR = UDMD, wobei die Verlustleistung PSR = IHeater ∗ USR beträgt und PDMD = IHeater ∗ UDMD beträgt. Indem erfindungsgemäß die an der Stromregeleinheit 5 anfallende Verlustleistung PSR zur Erwärmung des Mikrospiegelbauelements 3 genutzt wird, kann die Heizleistung PDMD und damit der Gesamtenergiebedarf zur Heizung des Mikrospiegelbauelements 3 reduziert werden. Figure 4 shows an equivalent circuit diagram of an electrical circuit consisting of the heating element 3a of a microprojection element 3 and a current control unit 5. The equivalent circuit shows a voltage source Uo, via which the current control unit 5 and the heating element 3a are supplied. The voltage Uo is divided into the voltages U DMD and U SR , the ratio of these voltages depending on the nature of the heating element, the ambient temperature, and the properties of the controller 5 and its operating state is specified. As already mentioned at the beginning, the power loss at the controller 5 can assume the same values as the thermal output of the heating winding. In this case, therefore, U SR = U DMD applies, the power loss being P SR = I Heater ∗ U SR and P DMD = I Heater ∗ U DMD . By using the power loss P SR occurring at the current control unit 5 to heat the micromirror component 3, the heating power P DMD and thus the total energy requirement for heating the micromirror component 3 can be reduced.

Claims (15)

  1. Circuit arrangement (1) comprising
    - a printed circuit board (2),
    - at least one micro-mirror component (3) connected to the printed circuit board (2) for modulating a light beam of a light source directed onto the micro-mirror component (3),
    - a heat sink (4) thermally connected to the at least one micro mirror component (3), and
    - a current control unit (5),
    the micro-mirror component (3) being assigned a heating element (3a) which can be controlled by means of the current control unit (5) and is thermally connected to the micro-mirror component (3),
    characterised in that
    the current control unit (5) for driving the heating element (3a) is electrically connected to the latter, the current control unit (5) also being connected to the micro-mirror component (3) via a thermal connection to the heat sink (4) for transmitting heat loss occurring at the current control unit (5).
  2. Circuit arrangement (1) according to claim 1, wherein the circuit board (2) has an opening (2a) through which a heat conducting element (4a) extends from the micro-mirror component (3) to the heat sink (4) for heat transfer.
  3. Circuit arrangement (1) according to claim 1 or 2, the circuit arrangement (1) further comprising a support frame (6) connectable to a vehicle headlamp housing, the circuit board (2) being arranged between the heat sink (4) and the support frame (6), preferably the support frame (6) having positioning means (6a) for determining the position of the micro-mirror component (3) with respect to the support frame (6).
  4. Circuit arrangement according to one of claims 1 to 3, wherein the heating element (3a) is integrated into the micro-mirror component (3).
  5. Circuit arrangement (1) according to one of the preceding claims, wherein the current control unit (5) is arranged on the side of the circuit board (3) facing away from the heat sink (4).
  6. Circuit arrangement (1) according to one of the claims 1 to 4, the current control unit (5) being arranged on the side of the printed circuit board (3) facing away from the heat sink (4).
  7. Circuit arrangement (1) according to claim 6, wherein the current regulating unit (5) is thermally connected to the heat sink (4) via at least one heat conducting means (2b) extending through the printed circuit board (2), in particular at least one heat conducting via.
  8. Circuit arrangement (1) according to one of claims 3 to 7, wherein the heat sink (4) is connected to the support frame (6) in such a way that the printed circuit board (2) can be fixed in its position with respect to the support frame (6) by the heat sink (4).
  9. Circuit arrangement (1) according to claim 8, wherein the heat sink (4) is connected to the supporting frame (6) by means of a screw connection (7), wherein the heat sink (4) is displaceable along the screw connection and spring elements (8) are provided by means of which the heat sink (4) is pressed in the direction of the supporting frame (6).
  10. Circuit arrangement (1) according to one of the preceding claims, wherein the current control unit (5) is a linearly controlled current control unit.
  11. Circuit arrangement (1) according to one of the preceding claims, wherein all electronic components (3, 5) of the circuit arrangement (1) are SMD components.
  12. Circuit arrangement (1) according to one of the preceding claims, wherein at least one socket (9) for receiving the at least one micro-mirror component (3) is provided on the circuit board (2).
  13. Circuit arrangement (1) according to one of the preceding claims, wherein the current regulating unit (5) is arranged at a distance (d) of at most 3 cm from the micro-mirror component (3).
  14. Lighting device, comprising a circuit arrangement (1) according to one of the preceding claims, a light source, and at least one imaging optic for imaging the light emitted by the lighting element to a predeterminable light distribution, wherein the light source, the micro-mirror component (3) and the imaging optic are arranged in such a way that light emitted by the light source can be deflected via the micro-mirror component (3) to the imaging optic.
  15. Vehicle headlight, in particular motor vehicle headlight, comprising a lighting device according to claim 14.
EP18155280.3A 2018-02-06 2018-02-06 Circuit arrangement, lighting device and vehicle headlight Active EP3522682B1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
EP18155280.3A EP3522682B1 (en) 2018-02-06 2018-02-06 Circuit arrangement, lighting device and vehicle headlight
CN201980011860.6A CN111656861B (en) 2018-02-06 2019-01-11 Line device, lighting device, and vehicle searchlight
PCT/EP2019/050607 WO2019154581A1 (en) 2018-02-06 2019-01-11 Circuit assembly, lighting device, and vehicle headlight
KR1020207024452A KR102421603B1 (en) 2018-02-06 2019-01-11 Circuit assemblies, lighting devices, and vehicle headlamps
US16/967,569 US11262045B2 (en) 2018-02-06 2019-01-11 Circuit assembly, lighting device, and vehicle headlight
JP2020562832A JP6942272B2 (en) 2018-02-06 2019-01-11 Circuit equipment, lighting equipment and vehicle floodlights

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP18155280.3A EP3522682B1 (en) 2018-02-06 2018-02-06 Circuit arrangement, lighting device and vehicle headlight

Publications (2)

Publication Number Publication Date
EP3522682A1 EP3522682A1 (en) 2019-08-07
EP3522682B1 true EP3522682B1 (en) 2020-07-29

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Application Number Title Priority Date Filing Date
EP18155280.3A Active EP3522682B1 (en) 2018-02-06 2018-02-06 Circuit arrangement, lighting device and vehicle headlight

Country Status (6)

Country Link
US (1) US11262045B2 (en)
EP (1) EP3522682B1 (en)
JP (1) JP6942272B2 (en)
KR (1) KR102421603B1 (en)
CN (1) CN111656861B (en)
WO (1) WO2019154581A1 (en)

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DE112019001810T5 (en) * 2018-04-06 2020-12-31 Koito Manufacturing Co., Ltd. Vehicle light, room light modulation unit and light unit

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US11262045B2 (en) 2022-03-01
JP6942272B2 (en) 2021-09-29
KR20200115571A (en) 2020-10-07
WO2019154581A1 (en) 2019-08-15
CN111656861B (en) 2022-07-08
JP2021512480A (en) 2021-05-13
EP3522682A1 (en) 2019-08-07
CN111656861A (en) 2020-09-11
KR102421603B1 (en) 2022-07-15
US20210018157A1 (en) 2021-01-21

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