EP3515154B1 - Dispositif de cuisson - Google Patents

Dispositif de cuisson Download PDF

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Publication number
EP3515154B1
EP3515154B1 EP19155518.4A EP19155518A EP3515154B1 EP 3515154 B1 EP3515154 B1 EP 3515154B1 EP 19155518 A EP19155518 A EP 19155518A EP 3515154 B1 EP3515154 B1 EP 3515154B1
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EP
European Patent Office
Prior art keywords
sensor
sensor unit
designed
filter
cooking
Prior art date
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Application number
EP19155518.4A
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German (de)
English (en)
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EP3515154A1 (fr
Inventor
Dominic Beier
Volker Backherms
Michael Voss
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Miele und Cie KG
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Miele und Cie KG
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Publication of EP3515154A1 publication Critical patent/EP3515154A1/fr
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
    • H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24C—DOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
    • F24C7/00—Stoves or ranges heated by electric energy
    • F24C7/08—Arrangement or mounting of control or safety devices
    • F24C7/082—Arrangement or mounting of control or safety devices on ranges, e.g. control panels, illumination
    • F24C7/083—Arrangement or mounting of control or safety devices on ranges, e.g. control panels, illumination on tops, hot plates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/02—Induction heating
    • H05B6/10—Induction heating apparatus, other than furnaces, for specific applications
    • H05B6/12—Cooking devices
    • H05B6/1209—Cooking devices induction cooking plates or the like and devices to be used in combination with them
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2213/00—Aspects relating both to resistive heating and to induction heating, covered by H05B3/00 and H05B6/00
    • H05B2213/04—Heating plates with overheat protection means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2213/00—Aspects relating both to resistive heating and to induction heating, covered by H05B3/00 and H05B6/00
    • H05B2213/07—Heating plates with temperature control means

Definitions

  • the present invention relates to a cooking device which is provided in particular for the preparation of dishes.
  • the cooking device comprises at least one hob with at least one hotplate and at least one heating device provided for heating at least one cooking area
  • Cooking devices which offer automatic functions have become known in the prior art.
  • a prerequisite for such an automatic operation of a cooking device is sometimes the acquisition of various parameters which are characteristic of the cooking process, such as, for. B. the temperature of the food container and in particular the bottom of the pot.
  • the automatic function and in particular the heating power of the cooking device are then controlled as a function of the detected parameters.
  • the heat source must be controlled so that, for. B. an undesired overheating of the food is avoided.
  • the reliability or the accuracy of the recorded parameters is therefore crucial for the functionality of the automatic function.
  • Devices are known in the prior art for determining temperatures during cooking and cooking processes, for example, which determine the temperature on the underside of a food container without contact. So z. B.
  • the WO 2008/148 529 A1 a heat sensor in front of a hob plate, which detects the radiated heat radiation and uses this to determine the temperature of the food container or the pan base.
  • a disadvantage of such a temperature determination is that generally expensive electronic components such as, for example, several heat sensors have to be used in order to achieve the required accuracy.
  • JP 2008 041471 A JP2009 301878 A and EP 1 865 754 A2 disclose other cooking facilities according to the prior art.
  • the cooking device comprises at least one hob with at least one hotplate and at least one heating device provided for heating at least one cooking area.
  • At least one safety device is provided, to which at least one safety sensor unit is assigned.
  • the safety sensor unit is for Detection of at least one characteristic variable for temperatures.
  • at least one control device is provided.
  • At least one sensor device is provided for detecting at least one characteristic variable for at least one temperature of the cooking area.
  • the control device is at least partially designed and set up to control the heating device as a function of the size detected by the sensor device.
  • At least one first sensor unit and at least one further sensor unit are assigned to the sensor device.
  • the first sensor unit is designed and set up for contactless detection of thermal radiation.
  • the safety sensor unit is assigned to the sensor device as the further sensor unit.
  • the cooking device according to the invention has many advantages since it enables simple, relatively inexpensive construction and reliable operation.
  • the invention makes use of the fact that safety sensor units are installed regularly, for example in order to be able to carry out an emergency shutdown in the event of damage.
  • the control system switches off a cooking device if such a safety sensor unit, for. B. determined an impermissibly high temperature.
  • Such a safety sensor unit is used according to the invention to also supply sensor signals for the sensor device. This enables a simple control and plausibility function to be implemented, since such a safety sensor unit is regularly present. Effort can be saved without losing functionality.
  • the hob preferably has at least one support device which is suitable and designed for positioning at least one food container.
  • the carrier device preferably comprises or is designed as a glass ceramic plate.
  • the sensor device is preferably arranged at least partially below the carrier device in the installed position of the hob.
  • the sensor device is preferably provided in the vicinity and / or in a central region of the heating device.
  • the sensor device can be at least partially and in particular essentially completely surrounded by the heating device in at least one plane parallel to the orientation of the carrier device.
  • the first sensor unit can comprise a thermopile and preferably a thermopile or be designed as such. It is also possible that the first sensor unit comprises at least one thermocouple or is designed as such.
  • the further sensor unit is particularly intended to detect a temperature on the underside of the carrier device.
  • the further sensor unit is preferably arranged in a thermally conductive manner on the underside of the carrier device.
  • the further sensor unit can be designed as a temperature-sensitive resistor or as a thermocouple or other temperature-sensitive element.
  • the further sensor unit can comprise a thermistor, in particular a PTC thermistor (PTC) and / or thermistor (NTC), or be designed as such. Such has a variable resistance that can be reproduced by changing the temperature.
  • PTC PTC thermistor
  • NTC thermistor
  • At least one other sensor unit can be provided which is designed and suitable for contactless detection of thermal radiation.
  • At least one of the sensor units is preferably suitable and designed to control at least one of the other sensor units.
  • At least one sensor unit can be suitable and designed to trigger a security state.
  • the cooking device is preferably switched off or put into a safety or emergency operation.
  • the safety sensor used and / or designed as an additional sensor unit is used in particular as the sensor unit.
  • the sensor device preferably has at least one filter device.
  • the filter device is in particular designed and suitable for reflecting and / or transmitting electromagnetic radiation as a function of the wavelength and / or the polarization and / or the angle of incidence.
  • the filter device particularly preferably acts differently on different optical sensor units that may be present.
  • the heating device preferably comprises at least one induction device.
  • the induction device can comprise one, several or a plurality of induction coils.
  • the sensor device in particular comprises at least one magnetic shielding device.
  • the magnetic shielding device is used in particular for shielding electromagnetic interactions and is designed and suitable in particular for shielding from the electromagnetic field of the induction device.
  • At least one sealing device in particular for thermal insulation, is preferably provided.
  • at least part of the sealing device is arranged at least partially between the carrier device and at least part of the sensor device and / or the magnetic shielding device.
  • the sealing device preferably consists of a low heat-conducting material.
  • the sealing device also serves in particular to seal off dust and also to keep out unwanted radiation.
  • the sensor device can have at least one optical screen device.
  • the optical shielding device is in particular at least partially surrounded by the magnetic shielding device.
  • the sensor device comprises at least one thermal compensation device, the thermal compensation device in particular having at least one coupling device which is suitable and designed to connect at least one sensor unit to the thermal compensation device at least partially in a thermally conductive manner.
  • the sensor device preferably has at least one radiation source which emits at least one signal, in particular at least also in the wavelength range of the infrared light and / or the visible light.
  • the senor device preferably has at least one holding device.
  • at least two units can be accommodated in a defined arrangement by the holding device.
  • the units are preferably taken from a group of units, which group comprises sensor units, magnetic shielding devices, optical shielding devices, insulation devices, radiation sources and thermal compensation devices and the like.
  • the invention provides a very advantageous cooking device. It is possible to supplement the sensor device, which is designed as a so-called optical module, with a temperature sensor (for example NTC), which is arranged in particular on the underside of the carrier device, which is preferably designed as a glass ceramic.
  • a temperature sensor for example NTC
  • the temperature sensor preferably rests on the underside of the carrier device, which is preferably designed as a glass ceramic, it being possible for the temperature sensor to be glued on, for example, or to be pressed or clamped on by suitable means.
  • a redundant measurement of the bottom temperature of the glass ceramic of the carrier device possible. This additional signal can also be used to calculate the floor temperature of the cookware or cooking vessel.
  • Such a temperature sensor as a sensor unit can be provided for safety reasons and can now be used accordingly in normal operation.
  • thermopile Preferably only one thermopile is used as the sensor unit.
  • a temperature sensor such as. B. uses an NTC.
  • NTC The z. B.
  • existing temperature sensors are now used not only for safety purposes, but also to control automatic functions, for example.
  • the sensor unit which is designed in particular as a thermopile and works without contact, serves to record the temperature of the base of the cookware and first detects it Amount of radiation.
  • the radiation emitted by a surface depends on the emission coefficient and the temperature of the surface. If measurements are taken from below in cooking devices with glass ceramic hobs, the glass ceramic emits heat radiation on the one hand, and on the other hand the bottom of a food container or cookware positioned on it emits heat radiation.
  • the emission coefficient of the glass ceramic can be determined beforehand or separately and can be assumed to be known.
  • the emission coefficient of the bottom of a food container or cookware positioned thereon depends on the food container and its current condition. By determining the reflectivity of the food container, determining the temperature of the glass ceramic and by evaluating the detected amount of radiation, the temperature of the bottom of the food container can be derived.
  • the Figure 1 shows a cooking device 1 according to the invention, which is designed here as part of a cooking appliance 100.
  • the cooking device 1 or the cooking device 100 can be designed both as a built-in device and as an independent cooking device 1 or a standalone cooking device 100.
  • the cooking device 1 here comprises a cooktop 11 with four hotplates 21.
  • Each of the hotplates 21 here has at least one heatable cooking area 31 for cooking dishes.
  • a heating device 2, or one for each hotplate 21, is provided in total.
  • the heating devices 2 are designed as induction heating sources and each have an induction device 12 for this purpose. It is also possible, however, that a cooking area 31 is not assigned to a specific hotplate 21, but rather represents an arbitrary location on the hob 11.
  • the cooking area 31 can have a plurality of induction devices 12 and in particular a plurality of induction coils and can be designed as part of a so-called full-surface induction unit.
  • a pot can simply be placed on the hob 11 at any point, only the corresponding induction coils in the area of the pot being activated or active during the cooking operation.
  • heating devices 2 e.g. Gas, infrared or resistance heating sources.
  • the cooking device 1 can be operated here via the operating devices 105 of the cooking device 100.
  • the cooking device 1 can also be designed as a self-sufficient cooking device 1 with its own operating and control device. Operation via a touch-sensitive surface or a touchscreen or remotely via a computer, smartphone or the like is also possible.
  • the cooking appliance 100 is designed here as a cooker with a cooking space 103 which can be closed by a cooking space door 104.
  • the cooking chamber 104 can be heated by various heating sources, such as a forced-air heating source. Additional heat sources such as an upper heat radiator and a lower heat radiator as well as a microwave heat source or a steam source and the like can be provided.
  • the cooking device 1 has a sensor device 3, not shown here, which is suitable for detecting at least one physical variable characterizing at least one state of the cooking area 31.
  • the sensor device 3 can detect a variable by means of which the temperature of a pot which is placed in the cooking area 31 can be determined.
  • a sensor device 3 can be assigned to each cooking area 31 and / or each hotplate 21.
  • the sensor device 3 is operatively connected to a control device 106.
  • the control device 106 is designed to control the heating devices 2 as a function of the parameters detected by the sensor device 3.
  • the cooking device 1 is preferably designed for automatic cooking operation and has various automatic functions.
  • the automatic function allows a soup to be boiled up briefly and then kept warm without a user having to supervise the cooking process or set a heating level.
  • he places the pot with the soup on a hotplate 21 and selects the corresponding automatic function via the operating device 105, here, for. B. a boiling followed by keeping warm at 60 ° C or 70 ° C or the like.
  • the temperature of the pan bottom is determined by means of the sensor device 3 during the cooking process.
  • the control device 106 adjusts the heating output of the heating device 2 accordingly.
  • the temperature of the pan base is continuously monitored, so that when the desired temperature is reached or when the soup is boiled, the heating output is reduced.
  • the automatic function also makes it possible to carry out a longer cooking process at one or more different desired temperatures, e.g. B. to let milk rice slowly brew.
  • a cooking device 1 is shown in a highly schematic manner in a sectional side view.
  • the cooking device 1 here has a carrier device 5 designed as a glass ceramic plate 15.
  • the glass ceramic plate 15 can in particular be designed as a ceramic hob or the like or comprise at least one of these. Other types of carrier devices 5 are also possible.
  • On the glass ceramic plate 15 there is a cookware or food container 200, for example a pot or a pan, in which food or food can be cooked.
  • a sensor device 3 is provided which detects heat radiation in a detection area 83 here.
  • the detection area 83 is provided in the installed position of the cooking device 1 above the sensor device 3 and extends upwards through the glass ceramic plate 15 to the food container 200 and beyond, if no food container 200 is placed there is.
  • An induction device 12 for heating the cooking area 31 is attached below the glass ceramic plate 15.
  • the induction device 12 is here ring-shaped and has a recess in the middle in which the sensor device 3 is attached.
  • Such an arrangement of the sensor device 3 has the advantage that even if a cooking product container 200 is not centered on the hotplate 21, it is still in the detection area 83 of the sensor device.
  • the sensor device 3 can also not be arranged centrally in the induction device. If an induction device has, for example, a two-circuit induction coil, at least one sensor device 3 can be arranged in an intermediate space provided between the two induction coils of the induction device.
  • the Figure 3 shows a schematic cooking device 1 in a sectional side view.
  • the cooking device 1 has a glass ceramic plate 15, below which the induction device 12 and the sensor device 3 are attached.
  • the sensor device 3 has a first sensor unit 13 and another sensor unit 23. Both sensor units 13, 23 are suitable for contactless detection of heat radiation and are designed as a thermopile or thermopile.
  • the sensor units 13, 23 are each equipped with a filter device 43, 53 and are provided for detecting heat radiation emanating from the cooking area 31.
  • the heat radiation emanates, for example, from the bottom of a food container 200, penetrates the glass ceramic plate 15 and reaches the sensor units 13, 23.
  • the sensor device 3 is advantageously mounted directly below the glass ceramic plate 15 in order to maximize the proportion of the heat radiation emanating from the cooking area 31 without major losses to be able to record.
  • the sensor units 13, 23 are thus provided just below the glass ceramic plate 15.
  • a magnetic shielding device 4 which here consists of a ferrite body 14.
  • the ferrite body 14 is here essentially designed as a hollow cylinder and surrounds the sensor units 13, 23 in a ring-like manner.
  • the magnetic shielding device 4 shields the sensor device 3 against electromagnetic interactions and in particular against the electromagnetic field of the induction device 12. Without such a shield, the magnetic field which the induction device 12 generates during operation could also heat up parts of the sensor device 3 in an undesirable manner and thus lead to unreliable temperature detection and poorer measurement accuracy.
  • the magnetic shielding device 4 thus significantly improves the accuracy and reproducibility of the temperature detection.
  • the magnetic shielding device 4 can also consist at least in part of at least one at least partially magnetic material and an at least partially electrically non-conductive material.
  • the magnetic material and the electrically non-conductive Material can be arranged alternately and in layers. Other materials or materials are also possible which at least partially have magnetic properties and also have electrically insulating properties or at least low electrical conductivity.
  • the sensor device 3 has at least one optical screen device 7, which is provided to shield radiation influences and in particular thermal radiation, which act on the sensor units 13, 23 from outside the detection area 83.
  • the optical screen device 7 is designed here as a tube or a cylinder 17, the cylinder 17 being hollow and surrounding the sensor units 13, 23 approximately in a ring.
  • the cylinder 17 is made of stainless steel here. This has the advantage that the cylinder 17 has a reflective surface which reflects a large proportion of the large amount of thermal radiation or absorbs as little thermal radiation as possible.
  • the high reflectivity of the surface on the outside of the cylinder 17 is particularly advantageous for shielding against heat radiation.
  • the high reflectivity of the surface on the inside of the cylinder 17 is also advantageous in order to direct heat radiation from (and in particular only from) the detection area 83 to the sensor units 13, 23.
  • the optical screen device 7 can also be configured as a wall which at least partially and preferably surrounds the sensor device 13, 23 in a ring-like manner.
  • the cross section can be round, polygonal, oval or rounded. An embodiment as a cone is also possible.
  • an insulation device 8 is provided for thermal insulation, which is arranged between the optical shielding device 7 and the magnetic shielding device 4.
  • the insulation device 8 here consists of an air layer 18 which is located between the ferrite body 14 and the cylinder 17. There is preferably no exchange with the ambient air in order to avoid convection. An exchange with the ambient air is also possible.
  • the insulation device 8 counteracts in particular heat conduction from the ferrite body 14 to the cylinder 17.
  • the cylinder 17, as already mentioned above, is equipped with a reflective surface in order to counteract heat transfer from the ferrite body 14 to the cylinder 17 by heat radiation.
  • the insulation device 8 has in particular a thickness between approximately 0.5 mm and 5 mm and preferably a thickness of 0.8 mm to 2 mm and particularly preferably a thickness of approximately 1 mm.
  • the insulation device 8 can also at least one medium with a correspondingly low heat conduction, such as. B. comprise a foam material and / or a polystyrene plastic or other suitable insulating material.
  • the sensor units 13, 23 are arranged here in a thermally conductive manner on a thermal compensation device 9 and in particular are coupled in a thermally conductive manner to the thermal compensation device 9.
  • the thermal compensation device 9 has two coupling devices 29, which are designed here as depressions in which the sensor units 13, 23 are embedded with a precise fit. This ensures that the sensor units 13, 23 are at a common and relatively constant temperature level.
  • the thermal compensation device 9 ensures a homogeneous temperature of the sensor unit 13, 23 when it heats up during operation of the cooking device 1. An unequal intrinsic temperature can lead to artifacts during the detection, in particular in the case of sensor units 13, 23 designed as thermopiles.
  • a spacing between the cylinder 17 and the thermal compensation device 9 is provided.
  • the copper plate 19 can also be provided as the bottom 27 of the cylinder 17.
  • the thermal compensation device 9 is designed here as a solid copper plate 19.
  • another material with a correspondingly high thermal capacity and / or high thermal conductivity is also possible at least in part.
  • the sensor device 3 here has a radiation source 63 which can be used to determine the reflection properties of the measuring system or the emissivity of a food container 200.
  • the radiation source 63 is designed here as a lamp 111, which emits a signal in the wavelength range of the infrared light and of the visible light.
  • the radiation source 63 can also be designed as a diode or the like.
  • the lamp 111 is also used here to signal the operating state of the cooking device 1.
  • an area of the thermal compensation device 9 or the copper plate 19 is designed as a reflector 39.
  • the copper plate 19 has a concave depression in which the lamp 111 is arranged.
  • the copper plate 19 is also coated with a gold-containing coating in order to increase the reflectivity.
  • the gold-containing layer has the advantage that it also protects the thermal compensation device 9 against corrosion.
  • the thermal compensation device 9 is attached to a holding device 10 designed as a plastic holder.
  • the holding device 10 has a not shown here Connecting device 20, by means of which the holding device 10 can be locked on a support device 30.
  • the support device 30 is designed here as a circuit card 50.
  • other components can also be provided, such as. B electronic components, control and computing devices and / or fastening or assembly elements.
  • a sealing device 6 is provided between the glass ceramic plate 15 and the induction device 12, which is designed here as a micanite layer 16.
  • the micanite layer 16 is used for thermal insulation so that the induction device 12 is not heated by the heat of the cooking area 31.
  • a micanite layer 16 is also provided here for thermal insulation between the ferrite body 14 and the glass ceramic plate 15. This has the advantage that the heat transfer from the hot glass ceramic plate 15 to the ferrite body 14 is severely restricted. As a result, the ferrite body 14 hardly emits any heat which could be transferred to the insulation device 8 or the optical shielding device.
  • the micanite layer 16 thus counteracts undesired heat transfer to the sensor device 3, which increases the reliability of the measurements.
  • the micro layer 16 seals the sensor device 3 dust-tight against the remaining areas of the cooking device 1.
  • the micanite layer 16 has in particular a thickness between approximately 0.2 mm and 4 mm, preferably from 0.2 mm to 1.5 mm and particularly preferably a thickness from 0.3 mm to 0.8 mm.
  • the cooking device 1 has a cover device 41 on the underside, which is designed here as an aluminum plate and covers the induction device 12.
  • the covering device 41 is connected to a housing 60 of the sensor device 3 via a screw connection 122.
  • the sensor device 3 is arranged elastically within the housing 60 relative to the glass ceramic plate 15.
  • a damping device 102 is provided, which here has a spring device 112.
  • the spring device 112 is connected to the inside of the housing 60 at a lower end and to the printed circuit board 50 at an upper end.
  • the spring device 112 presses the circuit board 50 with the ferrite body 14 and the micanite layer 16 mounted thereon upward against the glass ceramic plate 15.
  • Such an elastic arrangement is particularly advantageous since the sensor device 3 should be arranged as close as possible to the glass ceramic plate 15 for measurement reasons .
  • This directly adjacent arrangement of the sensor device 3 on the glass ceramic plate 15 could result in damage to the glass ceramic plate 15 in the event of impacts or impacts.
  • the elastic mounting of the sensor device 3 relative to the carrier device 5 dampens impacts or impacts on the glass ceramic plate 15 and thus reliably prevents such damage.
  • the first sensor unit 13 detects heat radiation emanating from the pot bottom as mixed radiation together with the heat radiation which is emitted by the glass ceramic plate 15.
  • the proportion of the radiation power emanating from the glass ceramic plate 15 is calculated from the mixed radiation power.
  • the other sensor unit 23 is provided to detect only the heat radiation from the glass ceramic plate 15.
  • the other sensor unit 23 has a filter device 53 which essentially only transmits radiation with a wavelength greater than 5 ⁇ m to the sensor unit 23. The reason for this is that radiation with a wavelength greater than 5 ⁇ m is not or barely transmitted through the glass ceramic plate 15.
  • the other sensor unit 23 thus essentially detects the heat radiation emitted by the glass ceramic plate 15. With the knowledge of the proportion of heat radiation which is emitted by the glass ceramic plate 15, the proportion of the heat radiation which emanates from the base of the pot can be determined in a manner known per se.
  • the first sensor unit 13 is equipped with a filter device 43 which is very transparent to radiation in this wavelength range, while the filter device 43 essentially reflects radiation from other wavelength ranges.
  • the filter devices 43, 53 are each designed as an interference filter 433 and in particular as a bandpass filter or as a longpass filter.
  • the radiation can be detected in the wavelength range between 3 ⁇ m and 5 ⁇ m and in particular in the range from 3.1 ⁇ m to 4.2 ⁇ m, the respective sensor unit and filter device then being designed or adapted accordingly.
  • the determination of a temperature from a specific radiation power is a known method. It is crucial that the emissivity of the body from which the temperature is to be determined is known. In the present case, the emissivity of the pot base must be known or determined for a reliable temperature determination.
  • the sensor device 3 has the advantage here that it is used for determination the emissivity of a food container 200 is formed. This is particularly advantageous, since any cookware can thus be used and not just a specific food container, the emissivity of which must be known beforehand.
  • the lamp 111 In order to determine the emissivity of the base of the pot, the lamp 111 emits a signal, in particular a light signal, which has a proportion of heat radiation in the wavelength range of the infrared light.
  • the radiation power or the thermal radiation of the lamp 111 reaches the pot bottom through the glass ceramic plate 15 and is partially reflected and partially absorbed there.
  • the radiation reflected from the pot bottom passes through the glass ceramic plate 15 back to the sensor device 3, where it is detected by the first sensor unit 13. Simultaneously with the signal radiation reflected from the pot bottom and transmitted from the glass ceramic plate 15, the own heat radiation from the pot bottom and the heat radiation from the glass ceramic plate 15 also reach the first sensor unit 13.
  • the lamp 111 is then switched off and only the heat radiation from the pot bottom and the glass ceramic plate 15 is detected .
  • the proportion of the reflected signal radiation from which the emissivity of the base of the pot can be determined then results in principle as the difference from the total radiation previously recorded when the lamp 111 is switched on, minus the heat radiation from the base of the pot and the glass ceramic plate when the lamp 111 is switched off.
  • At least one reference value with regard to reflected radiation and associated emissivity is stored in a memory unit which interacts with the sensor device and is not shown in the figures, the memory unit being able to be arranged, for example, on the printed circuit board 50.
  • the respective actual emissivity of the pot base can then be determined based on a comparison of the reflected signal radiation with the at least one reference value.
  • the proportion of the signal radiation absorbed by the base of the pot is determined. This results from the radiation power emitted by the lamp 111 minus the signal radiation reflected from the base of the pot according to methods known per se.
  • the radiation power of the lamp 111 is either fixed and thus known or is determined, for example, by a measurement with the other sensor unit 23.
  • the other sensor unit 23 detects a wavelength range of the signal radiation which is almost completely reflected by the glass ceramic plate 15.
  • the emitted radiation power can thus be determined in a very suitable approximation, taking into account, inter alia, a wavelength dependence of the radiation line or the spectrum of the lamp 111.
  • the degree of absorption of the bottom of the pot can be determined in a known manner. Since the absorption capacity of a body corresponds in principle to the emission capacity of a body, the degree of absorption of the bottom of the pot can be used the desired emissivity can be derived. With the knowledge of the degree of emissivity and the proportion of heat radiation emanating from the bottom of the pot, the temperature of the bottom of the pot can be determined very reliably.
  • the emissivity is preferably continuously redetermined at the shortest possible intervals. This has the advantage that a later change in the emissivity does not lead to a falsified measurement result. A change in the emissivity can occur, for example, if the cookware base has different emissivities and is moved on the hotplate 21. Different degrees of emissivity can be observed very frequently on cookware bases, as e.g. B. even slight contamination, corrosion or even different coatings or varnishes can have a major influence on the emissivity.
  • the lamp 111 is also used here to signal the operating state of the cooking device 1.
  • the signal from the lamp 111 also includes visible light, which is perceptible through the glass ceramic plate 15.
  • lamp 111 indicates to a user that an automatic function is operating.
  • Such an automatic function can e.g. B. be a cooking operation in which the heating device 2 is automatically controlled depending on the determined pot temperature. This is particularly advantageous since the lighting of the lamp 111 does not confuse the user.
  • the user knows that the lighting up represents an operating display and belongs to the normal appearance of the cooking device 1. He can therefore be sure that the flashing of the lamp 111 is not a malfunction and that the cooking device 1 may no longer function properly.
  • the lamp 111 can also light up for a certain duration and at certain intervals. It is possible e.g. B. also that different operating states can be output via different flashing frequencies. Different signals via different on / off sequences are also possible.
  • a sensor device 3 with a radiation source 63 is advantageously provided for each hotplate 21 or each (possible) cooking area 31, which is suitable for indicating at least one operating state.
  • At least one computing unit can be provided for the necessary calculations for determining the temperature and for evaluating the detected quantities.
  • the computing unit can be at least partially provided on the circuit board 50.
  • the control device 106 can also be designed accordingly, or at least a separate computing unit is provided.
  • the Figure 4 shows a development in which a safety sensor 73 is attached below the glass ceramic plate 15.
  • the safety sensor 73 is designed here as a temperature-sensitive resistor, such as a thermistor, in particular an NTC sensor, and thermally conductively connected to the glass ceramic plate 15.
  • the safety sensor 73 is provided here in order to be able to detect a temperature of the cooking area 31 and in particular the glass ceramic plate 15. If the temperature exceeds a certain value, there is a risk of overheating and the heating devices 2 are switched off.
  • the safety sensor 73 is operatively connected to a safety device, not shown here, which can trigger a safety state as a function of the detected temperature.
  • a security state has z. B. the shutdown of the heating devices 2 and the cooking device 1 result.
  • the safety sensor 73 is assigned here as a further sensor unit 33 to the sensor device 3.
  • the values detected by the safety sensor 73 are also taken into account for the determination of the temperature by the sensor device 3.
  • the values of the safety sensor 73 are used in particular when determining the temperature of the glass ceramic plate 15. So z. B. the temperature, which was determined by means of the other sensor unit 23 via the detected thermal radiation, can be compared with the temperature determined by the safety sensor 73. This comparison can serve on the one hand to control the function of the sensor device 3, but on the other hand can also be used for tuning or adjusting the sensor device 3.
  • a sensor device 3 is also shown, in which a safety sensor 73 is assigned to the sensor device 3 as a further sensor unit 33.
  • a safety sensor 73 is assigned to the sensor device 3 as a further sensor unit 33.
  • the task of the other sensor unit 23 is taken over here by the safety sensor 73.
  • the safety sensor 73 serves to determine the temperature of the glass ceramic plate 15. For example, the knowledge of this temperature from the heat radiation, which the first sensor unit 13 detects, can be used to determine the proportion of a pan base.
  • Such an embodiment has the advantage that the other sensor unit 23 and an associated filter device 53 can be saved.
  • the other sensor unit 23 can be referred to as a second sensor unit.
  • the further sensor unit 33 can be referred to as a third sensor unit. According to the design Fig. 5 only the first sensor unit and the third sensor unit are provided.
  • FIG Figure 6 Another embodiment of a cooking device 1 is shown in FIG Figure 6 shown.
  • a common sealing device 6 for the induction device 12 and the ferrite body 14 of the sensor device 3 is provided here.
  • the sealing device 6 is designed as a micanite layer 16 which has a recess in the detection area 83 of the sensor device 3.
  • the Figure 7 shows a schematic, magnetic shielding device 4, which is designed as a hollow, cylindrical ferrite body 14.
  • a configuration is special advantageous because the ferrite body 14 surrounds the areas and parts to be protected in a ring.
  • the wall of the ferrite body 14 preferably has a thickness of approximately 1 mm to 10 mm and in particular 2 mm to 5 mm and particularly preferably 2.5 mm to 4 mm and in particular 3 mm or more.
  • an optical screen device 7 is shown schematically, which is designed here as a cylinder 17.
  • the cylinder here has three locking devices 80 which are suitable for connection to a holding device 10.
  • a thermal compensation device 9 is in the Figure 9 shown.
  • the thermal compensation device 9 is designed as a copper plate 19.
  • the copper plate preferably has a thickness of 0.5 mm to 4 mm or even 10 mm or more and particularly preferably from 0.8 mm to 2 mm and in particular of 1 mm or more.
  • the copper plate 19 here has two coupling devices 29.
  • the coupling device 29 is suitable and provided for receiving a sensor unit 13, 23 in a thermally conductive manner.
  • the copper plate 19 has a reflector device 39 which can reflect and in particular bundle the radiation from a radiation source 63.
  • Figure 10 shows a holding device 10 which is designed as a plastic holder.
  • the holding device 10 preferably has a thickness between 0.3 mm and 3 mm or even 6 mm and particularly preferably a thickness of 1 mm or more.
  • the holding device 10 comprises, for example, three connecting devices, of which only two connecting devices 20 are visible in the figure, by means of which the holding device 10 z. B. can be connected to a support device 30.
  • the holding device 10 has three receiving devices 40, which are designed here as webs.
  • the receiving devices 40 are suitable for receiving the optical shielding device 7 and arranging it at a defined distance from the magnetic shielding device 4.
  • Receiving openings 70 are provided for making contacts.
  • the holding device 10 can also have further receiving devices 40, not shown here, which, for. B.
  • Such receiving devices 40 are provided in particular for the defined arrangement of a magnetic shielding device 4, an optical shielding device 7, a thermal compensating device 9, an insulation device 8 and / or a support device 30.
  • a sensor unit 13 for the contactless detection of thermal radiation.
  • the sensor unit 13 is designed as a thermopile or thermopile.
  • the sensor unit 13 has contacts in order to connect it to a circuit board 50 or circuit board, for example.
  • the area in which the thermal radiation is detected is located in an upper area of the sensor unit 13.
  • a filter device 43 is arranged here in this area.
  • Figure 12a shows a sensor unit 13 designed as a thermopile with a filter device 43 in a sectional, schematic side view.
  • the filter device 43 is arranged here on the area in which the thermal radiation hits the sensor unit 13 and is detected.
  • the filter device 43 is here attached to the sensor unit 13 in a thermally conductive manner with an adhesive connecting means 430.
  • the connecting means 430 here is an adhesive with a thermal conductivity of at least 1 W m -1 K -1 (W / (mK)) and preferably of 0.5 W m -1 K -1 (W / (mK)).
  • a thermal conductivity of more than 4 W m -1 K -1 (W / (mK)) is also possible and preferred.
  • heat can be dissipated from the filter device 43 to the sensor unit 43.
  • the dissipation of the heat prevents the sensor unit 13 from detecting the inherent heat of the filter device 43, which would lead to a falsified measurement result.
  • the heat from the filter device 43 can also be passed on to the thermal compensation device 9 or the copper plate 19 via the sensor unit 13.
  • Such indirect dissipation of the heat from the filter device 43 via the sensor unit 13 to the copper plate 19 is also particularly favorable, since the copper plate 19 has a high heat capacity.
  • the adhesive can be, for example, a thermally curing, one-component, solvent-free, silver-filled epoxy conductive adhesive.
  • a very favorable thermal conductivity is achieved due to the proportion of silver or silver-containing compounds.
  • a proportion of other metals or metal compounds with a corresponding thermal conductivity is also possible.
  • Such an adhesive ensures a thermally conductive connection which is permanent and stable even at the temperatures to be expected in a cooking device 1.
  • the filter device 43 is designed as an interference filter 433 and here has four filter layers 432 with a different refractive index and with dielectric properties. Filter layers 432 with higher and lower refractive indices are alternately stacked and connected one above the other.
  • the filter layers 432 are in particular very thin, preferably a few nanometers to 25 nm.
  • a filter base 431 made of a silicon-containing material with a thickness of more than 0.2 mm is provided as the carrier layer for the filter layers 432.
  • the filter device 43 is designed and suitable for transmitting a wavelength range in the infrared spectrum and for essentially reflecting radiation outside this range.
  • Figure 12b shows a further embodiment of a sensor unit 13 with a filter device 43, the filter device 43 here being only partially glued to the sensor device 13.
  • the area in which the thermal radiation hits and is sensed by the sensor unit 13 is surrounded here by an elevated edge area.
  • the connecting means 430 was only applied in an edge area. This has the advantage that the heat radiation to be detected does not have to pass through the connecting means 430 before it strikes the sensor unit 13.
  • a sensor device 3 is shown in a top view. For better clarity and distinctive character, some parts or areas are hatched. It can be clearly seen that the sensor device 3 has a concentric structure based on the onion skin principle. Inside is a thermal compensation device 9 or a copper plate 19, on which two sensor units 13, 23 and a radiation source 63 designed as a lamp 111 are arranged. So that no undesired heat radiation falls on the sensor units 13, 23 from the side, the sensor units 13, 23 are surrounded by an optical screen device 7 or a cylinder 17.
  • the cylinder 17 is arranged at a distance from the copper plate 19, so that, as far as possible, no heat transfer can take place between the cylinder 17 and copper plate 19.
  • the cylinder 17 is arranged surrounded by a magnetic shielding device 4 or a ferrite body 14.
  • the ferrite body 14 represents the outermost layer of the sensor device 3 and shields it from electromagnetic interactions.
  • the sensor device 3 is preferably provided as close as possible below a carrier device 5, there is a sealing device 6 or a micanite layer 16 on the ferrite body 14, which considerably reduces heat transfer from the carrier device 5 to the ferrite body 14.
  • An insulation device 8 is formed between the ferrite body 14 and the cylinder 17.
  • the insulation device 8 is an air layer 18 here.
  • the air layer 18 counteracts heat transfer from the ferrite body 14 to the cylinder 17.
  • the sensor units 13, 23 in the interior of the sensor device 3 are thus very effective against interference, such as. B. a magnetic field of an induction device 12, heat radiation from outside the detection area 83 and heating by heat conduction, protected.
  • Such a, shell-like arrangement of the listed components significantly increases the reliability of the measurements carried out with the sensor device 3.
  • the Figure 14 shows a sensor device 3 in an exploded view.
  • the individual parts are shown here spatially separated from one another, as a result of which the arrangement of the individual parts within the sensor device 3 is clearly recognizable.
  • the concentric or onion-shell-like structure is also clearly visible here. In addition to improved measurement accuracy, such a structure also enables the sensor device 3 to be assembled in a particularly production-friendly and cost-effective manner.
  • the order of the individual parts or components can be designed differently. It is preferred that some components are already prefabricated. For example, a sensor unit 13, 23 can already be thermally conductively bonded to a filter device 43, 53.
  • the circuit board 50 can also be partially equipped with electronic components before assembly. Is preferred e.g. B. the radiation source 63 has already contacted the circuit board 50.
  • the holding device 10 designed as a plastic holder is first mounted on the support device 30 designed as a printed circuit board 50.
  • the holding device 10 has at least one connecting device 20, not shown here, which is connected to the circuit card 50 and z. B. can be locked.
  • a holding device 10 with three connecting devices 20 is in the Figure 10 shown.
  • the thermal compensation device 9 provided here as a copper plate 19 is inserted into the holding device 10.
  • the sensor units 13, 23 designed as thermopiles or thermopiles are passed through receiving openings 70 in the copper plate 19, the holding device 10 and the circuit card 50.
  • the mounting of the holding device 10, the copper plate 19 and the sensor units 13, 23 can also be carried out in any other order. So z. B. first the copper plate 19 is inserted into the holding device 10, then the sensor units 13, 23 are inserted and subsequently the holding device 10 is locked with the circuit card 50. The contacting of the sensor units 13, 23 with the circuit card 50 can also take place at any time during assembly.
  • the radiation source 63 in the form of a lamp 111 can also be contacted with the circuit board 50 at any time during the assembly. It is preferred to first contact the lamp 111 with the circuit card 50 and then to start with the mounting option described above.
  • the cylinder 17 has three latching devices 80, which are latched with the three receiving devices 40 of the holding device 10.
  • the magnetic shielding device 4, which is designed as a ferrite body 14, is then mounted on the holding device 10.
  • the holding device 10 preferably has a further receiving device 40, not shown here, which can be designed as a depression, elevation, web and / or annular groove or the like. In particular, this enables the ferrite body 14 to be accommodated at a defined distance from the optical screen device 7, the thermal compensation device 9 and / or an insulation device 8.
  • the sealing device 6 designed as a micanite layer 16 is subsequently attached to the magnetic shielding device 4.
  • Other suitable assembly sequences for the cylinder 17, the ferrite body 14 and the sealing device 6 can be provided.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Induction Heating Cooking Devices (AREA)
  • Electric Stoves And Ranges (AREA)
  • Radiation Pyrometers (AREA)

Claims (15)

  1. Dispositif de cuisson (1), comprenant au moins une plaque de cuisson (11) comportant au moins une plaque chauffante (12) et au moins un dispositif de chauffage (2) prévu pour chauffer au moins une zone de cuisson (31), lequel dispositif de chauffage comporte au moins un dispositif de sécurité (107) associé à au moins une unité de détection de sécurité (73),
    l'unité de détection de sécurité (73) étant conçue pour détecter au moins une grandeur caractéristique pour les températures, et comportant au moins un dispositif de commande (106) et au moins un dispositif de détection (3),
    le dispositif de détection (3) étant prévu pour la détection d'au moins une grandeur caractéristique pour les températures de la zone de cuisson (31), et
    le dispositif de commande (106) étant au moins partiellement conçu et adapté pour commander le dispositif de chauffage (2) en fonction de la grandeur détectée par le dispositif de détection (3),
    au moins une première unité de détection (13) et au moins une autre unité de détection (33) étant associées au dispositif de détection (3),
    une première unité de détection (13) étant conçue et adaptée pour la détection sans contact de rayonnement thermique et l'unité de détection de sécurité (73) est associée au dispositif de détection (3) en tant qu'autre unité de détection (33),
    caractérisé en ce que
    le dispositif de détection (3) comporte au moins un dispositif filtrant (43, 53) et, en outre, une autre unité de détection (23),
    le dispositif filtrant (43, 53) étant conçu et adapté pour réfléchir et/ou transmettre un rayonnement électromagnétique en fonction de la longueur d'onde et/ou de la polarisation et/ou l'angle d'incidence,
    la première unité de détection (13) et l'autre unité de détection (23) étant adaptées pour détecter sans contact le rayonnement thermique, et conçues comme une thermopile ou pile thermoélectrique, et
    les unités de détection (13, 23) étant chacune équipées d'un dispositif filtrant (43, 53) et étant prévues pour détecter le rayonnement thermique émanant de la zone de cuisson (31),
    les dispositifs filtrant (43, 53) agissant différemment sur les unités de détection (13, 23) optiques, le dispositif filtrant (43) étant fixé par conduction thermique à l'unité de détection (13) à l'aide d'un moyen de liaison adhésif (430), et le moyen de liaison (430) étant un adhésif dont la conductivité thermique est d'au moins 0,5 W m-1 K-1, la chaleur étant transmise du dispositif filtrant (43) au dispositif d'équilibrage thermique (9) par l'intermédiaire de l'unité de détection (13).
  2. Dispositif de cuisson (1) selon la revendication 1, caractérisé en ce que la plaque de cuisson comporte au moins un dispositif de support (5) qui est adapté et conçu pour le positionnement d'au moins un récipient de produit à cuire, et en ce que, en position de montage de la plaque de cuisson (11), le dispositif de détection (3) est disposé au moins partiellement en dessous du dispositif de support (5).
  3. Dispositif de cuisson (1) selon la revendication précédente, caractérisé en ce que la première unité de détection (13) comprend une thermopile ou est conçu en tant que telle.
  4. Dispositif de cuisson (1) selon l'une des revendications précédentes, caractérisé en ce que l'autre unité de détection (33) détecte une température sur le côté inférieur du dispositif de support (5), et est disposée par conduction thermique sur le côté inférieur du dispositif de support (5).
  5. Dispositif de cuisson (1) selon l'une des revendications précédentes, caractérisé en ce que l'autre unité de détection (33) comprend une thermistance ou est conçue en tant que telle.
  6. Dispositif de cuisson (1) selon l'une des revendications précédentes, caractérisé en ce qu'au moins une autre unité de détection (23) est prévue, laquelle est conçue et adaptée pour la détection sans contact de rayonnement thermique.
  7. Dispositif de cuisson (1) selon l'une des revendications précédentes, caractérisé en ce qu'au moins une unité de détection (13, 23, 33) est adaptée et conçue pour commander au moins une unité de détection (13, 23, 33).
  8. Dispositif de cuisson (1) selon l'une quelconque des revendications précédentes, caractérisé en ce qu'au moins une unité de détection (13, 23, 33) est adaptée et conçue pour déclencher un état de sécurité.
  9. Dispositif de cuisson (1) selon l'une des revendications précédentes, caractérisé en ce qu'au moins un dispositif d'induction (12) est prévu pour le dispositif de chauffage (2), et en ce que le dispositif de détection (3) comprend au moins un dispositif de blindage magnétique (4), le dispositif de blindage magnétique (4) étant conçu et adapté pour la protection contre les interactions électromagnétiques, et en particulier pour la protection contre le champ électromagnétique du dispositif d'induction (12).
  10. Dispositif de cuisson (1) selon l'une des deux revendications précédentes, caractérisé en ce qu'au moins un dispositif d'étanchéité (6) est prévu pour l'isolation thermique, au moins une partie du dispositif d'étanchéité (6) étant disposée au moins partiellement entre le dispositif de support (5) et au moins une partie du dispositif de détection (3) et/ou du dispositif de blindage magnétique (4).
  11. Dispositif de cuisson (1) selon l'une des trois revendications précédentes, caractérisé en ce que le dispositif de détection (3) comporte au moins un dispositif de blindage optique (7), le dispositif de blindage optique (7) étant au moins partiellement entouré par le dispositif de blindage magnétique (4).
  12. Dispositif de cuisson (1) selon la revendication précédente, caractérisé en ce que le dispositif de détection (3) comprend au moins un dispositif d'équilibrage thermique (9), le dispositif d'équilibrage thermique (9) comportant au moins un dispositif de couplage (29) adapté et conçu pour relier, au moins partiellement par conduction thermique, au moins une unité de détection (13, 23) au dispositif d'équilibrage thermique (9).
  13. Dispositif de cuisson (1) selon l'une des revendications précédentes, caractérisé en ce que le dispositif de détection (3) comporte au moins une source de rayonnement (63) qui émet un signal, notamment dans la plage de longueurs d'onde de la lumière infrarouge et/ou de la lumière visible.
  14. Dispositif de cuisson (1) selon l'une des revendications précédentes, caractérisé en ce que le dispositif de détection (3) comporte au moins un dispositif de retenue (10), au moins deux unités pouvant être reçues, par le dispositif de retenue (10), dans un agencement défini l'une par rapport à l'autre, et les unités étant choisies dans un groupe d'unités comprenant une unité de détection (13, 23) et/ou le dispositif de blindage magnétique (4) et/ou le dispositif de blindage optique (7) et/ou un dispositif d'isolation (8) et/ou la source de rayonnement (63) et/ou le dispositif d'équilibrage thermique (9), et
    en ce qu'il est conçu comme un filtre d'interférence (433) et comprend quatre couches filtrantes (432) ayant un indice de réfraction et des propriétés diélectriques différentes, les couches filtrantes (432) présentant des indices de réfraction supérieurs et inférieurs étant empilées alternativement l'une au-dessus de l'autre, et les couches filtrantes (432) étant reliées, lesquelles couches filtrantes (432) sont très minces et ont une épaisseur comprise entre quelques nanomètres et 25 nm.
  15. Dispositif de cuisson (1) selon l'une des revendications précédentes, caractérisé en ce que le dispositif filtrant (43) comporte une couche support comme base filtrante (431) pour les couches filtrantes (432), la base filtrante (431) étant constituée d'un matériau contenant du silicium d'une épaisseur supérieure à 0,2 mm, et le dispositif filtrant (43) étant conçu et adapté pour transmettre une plage de longueurs d'onde dans le spectre infrarouge et pour réfléchir essentiellement un rayonnement en dehors de cette plage.
EP19155518.4A 2013-03-04 2014-02-03 Dispositif de cuisson Active EP3515154B1 (fr)

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Application Number Priority Date Filing Date Title
DE102013102119.0A DE102013102119A1 (de) 2013-03-04 2013-03-04 Kocheinrichtung
EP14401016.2A EP2775792B1 (fr) 2013-03-04 2014-02-03 Appareil de cuisson

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EP14401016.2A Division EP2775792B1 (fr) 2013-03-04 2014-02-03 Appareil de cuisson

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DE102013108646A1 (de) 2013-08-09 2015-02-12 Miele & Cie. Kg Kocheinrichtung und Verfahren zum Betreiben einer Kocheinrichtung
DE102016120667A1 (de) * 2016-10-28 2018-05-03 Hans Heidolph GmbH Laborgerät, insbesondere Magnetrührer

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JP2004227976A (ja) * 2003-01-24 2004-08-12 Matsushita Electric Ind Co Ltd 誘導加熱調理器
JP4617676B2 (ja) * 2004-01-27 2011-01-26 パナソニック株式会社 誘導加熱調理器
JP4892872B2 (ja) * 2005-05-27 2012-03-07 パナソニック株式会社 誘導加熱調理器
JP4839682B2 (ja) * 2005-06-08 2011-12-21 パナソニック株式会社 誘導加熱調理器
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Also Published As

Publication number Publication date
EP2775792B1 (fr) 2019-07-10
ES2813082T3 (es) 2021-03-22
EP2775792A1 (fr) 2014-09-10
EP3515154A1 (fr) 2019-07-24
DE102013102119A1 (de) 2014-09-18

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