EP3494453B1 - Ensemble carte d'expansion - Google Patents

Ensemble carte d'expansion Download PDF

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Publication number
EP3494453B1
EP3494453B1 EP16918536.0A EP16918536A EP3494453B1 EP 3494453 B1 EP3494453 B1 EP 3494453B1 EP 16918536 A EP16918536 A EP 16918536A EP 3494453 B1 EP3494453 B1 EP 3494453B1
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EP
European Patent Office
Prior art keywords
card
low
full
profile
height
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP16918536.0A
Other languages
German (de)
English (en)
Other versions
EP3494453A4 (fr
EP3494453A1 (fr
Inventor
Andrew L Wiltzius
Robert J EBNER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
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Hewlett Packard Development Co LP
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Publication date
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Publication of EP3494453A1 publication Critical patent/EP3494453A1/fr
Publication of EP3494453A4 publication Critical patent/EP3494453A4/fr
Application granted granted Critical
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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/185—Mounting of expansion boards
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/186—Securing of expansion boards in correspondence to slots provided at the computer enclosure
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38—Information transfer, e.g. on bus
    • G06F13/40—Bus structure
    • G06F13/4063—Device-to-bus coupling
    • G06F13/409—Mechanical coupling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications

Definitions

  • Expansion cards can be fit into expansion slots or openings in most computer enclosures, and in some examples multiple expansion cards can be packed together in close proximity to one another within the enclosures.
  • Expansion cards generally comprise a printed circuit board (PCB) with a number of electronic components mounted to the board. During operation, the electronic components mounted to the board can generate a large amount of heat. To help ensure reliable operation of the electronic components on the expansion cards, heat generated by the cards can be transferred away from the cards.
  • PCB printed circuit board
  • US patent application US 2011/0235259A1 discloses an expansion card assembly including an expansion card and a heat shielding cover mounted to a chassis.
  • US patent application US2009/262497A1 discloses an apparatus comprising an expansion card in communication with an expansion card connector and secured to the frontend of a chassis.
  • US patent application US 2012/327589A1 discloses a computer that includes a computer case and an airflow guiding duct.
  • Computer enclosures also referred to as chassis, or cases
  • chassis come in various sizes including full-height enclosures and low-profile enclosures (sometimes referred to as small form factor enclosures).
  • Both full-height and low-profile computer enclosures can include expansion openings that enable upgrading the computer with additional components. Expansion openings are often found on the back side of a computer enclosure, and when they're not being used they can be closed off with a blank covering such as a thin piece of metal that can help prevent the entry of dust or other particles into the enclosure, improve air flow within the enclosure, and prevent electrical interference.
  • expansion cards can be installed in a computer, including sound cards, network cards, modem cards, interface cards, video cards (also referred to as graphics cards), and others. Expansion cards generally extend the features of a computer's motherboard and/or provide additional features not available on the motherboard.
  • An expansion card can be installed in a computer by inserting the card into an expansion card slot located on the motherboard, such as a PCI (peripheral component interconnect) slot, an AGP (accelerated graphics port), or a PCI Express slot.
  • An expansion card can include an I/O (input/output) bracket at one end that allows the card to be attached to the computer enclosure at one of the expansion openings.
  • the I/O bracket (alternately referred to as a mounting bracket) also includes appropriately formed openings to accommodate various I/O ports on the expansion card, such as plugs, connectors, and sockets, and to provide access to these I/O ports from outside the computer enclosure.
  • the number of expansion cards that can be added to a computer system can depend in part on the size of the computer enclosure and the form factor of the computer motherboard. For example, full-height computer enclosures often have more expansion openings than low-profile enclosures, due to the additional space available in the full-height enclosures.
  • the size of the computer enclosure can also affect the circulation of air inside the enclosure, which in turn, can impact the ability to keep the computer components cool. As the number of expansion cards increases, the power they consume and the heat they generate can become limiting factors.
  • Expansion cards generally incorporate numerous integrated circuits and other electronic components that generate heat within the computer enclosure during operation.
  • Video cards for example, comprise graphical processing units (GPU) and associated electronic components that can consume significant energy and create large amounts of heat when carrying out complex calculations and generating images to be output on a display device.
  • GPU graphical processing units
  • Expansion cards often include integrated cooling solutions that help prevent the integrated circuits and other components on the cards from exceeding their operating temperature limits. Examples of such cooling solutions include passive, open-air cooling solutions such as heat sinks, and active, forced-air cooling solutions such as fans or other types of blowers that can move air over the video card.
  • Cooling solutions on video cards can remove heat by actively forcing air over the cards and expelling the heated air from the computer enclosure, for example, through vents in the enclosure. In some examples, however, if there is inadequate venting throughout the computer enclosure, or, if the venting is located in areas of the enclosure that do not allow heated air to exit the enclosure sufficiently, then the heated air can recirculate within the computer enclosure and cause unwanted temperature increases in components throughout the enclosure. This issue is often encountered in circumstances where low- profile video cards are installed into full-height computer enclosures, as discussed in more detail below.
  • low-profile video cards that are designed for use in low-profile computer enclosures, can also be used in full-height computer enclosures.
  • Full-height computer enclosures are generally designed to accept full-height expansion cards on the order of 4.38 inches (11.12 centimeters) in height, while low-profile computer enclosures are designed to accept low-profile expansion cards on the order of 2.73 inches (6.93 centimeters) in height.
  • Manufacturers can enable the versatile use of a low-profile video card in both low-profile and full-height computer enclosures, for example, by providing two differently sized 1/0 brackets with which to attach the low-profile card to the two differently sized computer enclosures.
  • a computer system housed within a low-profile computer enclosure can include a low-profile video card installed within the low-profile enclosure using a smaller I/O bracket
  • a computer system housed within a full-height computer enclosure can include the low-profile video card installed within the full-height enclosure using a larger I/O bracket.
  • the vent holes in the full-height I/O bracket are of marginal value because they are located on the bracket above the plane of the video card, and they are not aligned with the heated airflow stream coming from the card cooler.
  • the result in most examples, therefore, is that the heated air from the video card cooler gets recirculated within the computer enclosure instead of being expelled from the enclosure.
  • examples of an expansion card assembly described herein provide a device and method for guiding heated air away from a low-profile expansion card and expelling the heated air from a full-height computer enclosure in which the low-profile card is installed.
  • the expansion card assembly includes a low-profile card cooler attached to the low-profile expansion card, and a full-height I/O bracket (i.e., mounting bracket) to mount the card and the card cooler to the full-height computer enclosure.
  • the device for guiding the heated air comprises a removable airflow guide that is attachable to the low-profile expansion card as part of the assembly when the assembly is to be installed in a full-height computer enclosure.
  • the airflow guide directs heated air forced by the card cooler over the low-profile expansion card out of the full-height computer enclosure through vent holes formed in the full-height I/O bracket.
  • the airflow guide is removable from the low-profile expansion card assembly when the assembly is to be installed in a low-profile computer enclosure.
  • an opening on one side of the airflow guide serves as an air intake positioned adjacent to an exhaust region of the card cooler to allow heated air from the card cooler to enter the airflow guide.
  • a passageway in the airflow guide directs the heated air out of an air output opening on a second side of the airflow guide.
  • the air output of the airflow guide is positioned adjacent to vent holes formed in a full-height I/O bracket. The vent holes in the I/O bracket allow the heated air flowing through the airflow guide to be expelled directly from the full-height computer enclosure into the atmosphere surrounding the outside of the enclosure.
  • an expansion card assembly includes a low-profile expansion card and a card cooler attachable to the card to force air over the card.
  • the assembly also includes an airflow guide attachable to the card to direct forced air from the card cooler out of a full-height computer enclosure in which the card can be installed.
  • a method of removing heat from a low-profile expansion card assembly includes securing a low-profile expansion card to a full-height mounting bracket, where the card comprises an attached card cooler.
  • the method includes securing the bracket to a full-height computer enclosure, where the bracket is to support the card and card cooler within the full-height computer enclosure.
  • the method also includes attaching an airflow guide to the bracket and the card to enable forced air from the card cooler to exit the full-height computer enclosure through the bracket.
  • an expansion card assembly includes a full-height mounting bracket comprising a plurality of I/O connection ports toward a first end, and vent openings toward a second end opposite the first end.
  • the assembly also includes a low-profile ,for example video , card attachable to the bracket and comprising a plurality of output connectors aligned with the plurality of I/O connection ports on the bracket.
  • an airflow guide is configured to be attached to the low-profile card and to the bracket toward the second end of the bracket such that an output opening of the airflow guide aligns with the vent openings.
  • FIG. 1 shows a perspective view of an example expansion card assembly 100 with a low-profile expansion card 102 that is suitable for installation into a full-height computer enclosure 104 (shown in FIG. 3 ).
  • FIG. 2 shows a perspective view of the example expansion card assembly 100 of FIG. 1 with some components of the assembly 100 blown up, or separated from one another, to help illustrate the flow of air through the assembly, as discussed in more detail below.
  • FIG. 3 shows a perspective block diagram view of an example of a full-height computer closure 104 into which an example expansion card assembly 100 can be installed.
  • an example expansion card assembly 100 can remove heat from a low-profile expansion card 102 by forcing air over the card 102 and guiding the heated air toward vent openings 106, where it is expelled from the full-height computer enclosure 104.
  • the expansion card assembly 100 includes the low-profile expansion card 102 attached to a low-profile card cooler 108.
  • the assembly 100 also includes a full-height I/O bracket 110 (i.e., mounting bracket 110) to which the low-profile expansion card 102 can be attached and then mounted to the full-height computer enclosure 104.
  • the low-profile expansion card 102 can include any of a variety of different types of expansion cards capable of installation into a computer including, for example, a sound card, a video card, a modem card, a network card, an interface card, and so on. As discussed herein, however, the low-profile expansion card 102 will be generally referred to as a low-profile video card 102. This is because video cards tend to generate more heat than other types of expansion cards, and they are therefore more likely than other types of expansion cards to incorporate an attached card cooler 108.
  • multiple expansion cards can be installed in slots on a motherboard within a computer enclosure.
  • multiple low-profile video cards 102, each with an attached card cooler 108 are installed on the motherboard 112 within the full-height computer enclosure 104.
  • the higher density of electronic components within the enclosure can make it particularly challenging to maintain a proper temperature throughout the enclosure and avoid causing the electronic components on the cards, motherboard, and other devices within the enclosure to exceed their operating temperature limits.
  • a low-profile video card 102 can be installed into a PCI (peripheral component interconnect) slot 114 on the motherboard 112.
  • the low-profile video card 102 might additionally or alternatively fit into other types of slots, such as AGP (accelerated graphics port) slots, or PCI Express slots.
  • AGP accelerated graphics port
  • PCI Express PCI Express slots
  • other components often connected within the computer enclosure 104 include a power supply 116, an auxiliary exhaust fan 118 to help remove heat from the enclosure, drives 120 for CDs and DVDS, hard drives 122, and interconnect and power cables 124.
  • the card cooler 108 attached to the low-profile video card 102 comprises a card cooling device that includes an active, forced-air cooling device capable of moving air over the video card 102.
  • an active forced-air cooling device comprises a fan 126 that can pull air into a chamber 128 of the card cooler 108.
  • the chamber 128 covers one side of the low-profile video card 102 (i.e., the component side) on which a majority of the electronic components (not shown) are located.
  • FIG. 2 arrows are shown using both dashed lines and full lines to help illustrate the flow of air through the expansion card assembly 100.
  • Arrows with dashed lines shown in FIG. 2 generally indicate the flow of air as it passes within or through components of the expansion card assembly 100
  • arrows with full lines i.e., non-dashed lines
  • air that has entered the assembly 100 through the fan 126 travels through the chamber 128 and over the component side of the low-profile video card 102. The heated air is then forced out of an exhaust region 130 of the card cooler 108.
  • the expansion card assembly 100 includes a removable airflow guide 132 that can be attached to any or all of the card cooler 108, the low-profile video card 102, and the full-height I/O mounting bracket 110.
  • the size and shape of the airflow guide 132 are generally designed to facilitate the alignment of airflow openings between the card cooler 108, the airflow guide 132, and the full-height I/O bracket 110.
  • the depth or length of the airflow guide 132 is long enough to encompass the length of the exhaust region 130 of the card cooler 108, but in some examples it may be longer or shorter than the exhaust region.
  • the width of the airflow guide 132 similarly, is approximately as wide as the card cooler 108 to enable the width of the airflow guide 132 to cover the width of the exhaust region 130.
  • the exhaust region 130 of the card cooler 108 aligns with an air intake 134 on the airflow guide 132. This alignment allows the heated air being forced out of the exhaust region 130 of the card cooler 108 to enter the removable airflow guide 132 through the air intake 134.
  • the height of the airflow guide 132 extending above the card cooler 108 is sufficient to enable the air output opening 138 of the airflow guide 132 to encompass the multiple vents 106 formed in the full-height I/O bracket 110.
  • the height may be greater or lower depending, for example, where the vents 106 are located in the bracket 110.
  • the height of the airflow guide 132 facilitates the passing of heated air through the air output opening 138 and out through the vents 106 formed in the full-height I/O bracket 110, and ultimately out of the full-height computer enclosure 104.
  • the shape of the airflow guide 132 facilitates the flow of air through the guide 132 between its intake 134 and output 138 along a passageway 136.
  • 1 and 2 is generally triangular, other shapes and contours are possible and contemplated to enable the passageway 136 in the airflow guide 132 to direct the heated air away from the low-profile video card 102 and through the air output opening 138 of the airflow guide 132.
  • the full-height I/O bracket 110 comprises a full-height mounting bracket that is designed to accommodate physical and functional connections between, and to, the low-profile video card 102, the card cooler 108, the removable airflow guide 132, and the full-height computer enclosure 104.
  • a variety of different connection mechanisms 140 can be used for connecting the components of the expansion card assembly 100 to one another and to the computer enclosure 104, including, for example, screws, tab connectors, crimp connectors, snap connectors, and so on.
  • the I/O bracket 110 can include multiple I/O connection ports 142 positioned toward one end of the bracket to enable cable connections to be made between the low-profile video card 102 and multiple display devices.
  • connection ports 142 align with output connectors 144 along one end of the low-profile video card 102.
  • connection ports 142 can comprise any of a variety of different types of connection ports such as HDMI, VGA, S-video, composite video, DVI, SDI, and so on.
  • the full-height I/O bracket 110 includes one or multiple vent openings 106 to allow heated air to be expelled from the full-height computer enclosure 104.
  • the vent openings 106 are not aligned with the low-profile video card 102 or the card cooler 108, but instead are positioned toward a second end of the bracket above the plane of the edge of the video card 102.
  • the positioning of the vent openings 106 in the full-height I/O bracket 110 causes the vents 106 to be aligned with the air output opening 138 of the removable airflow guide 132 when the bracket 110 and airflow guide 132 are connected.
  • Expelling heated air from the full-height computer enclosure 104 prevents heated air from being recirculated within the enclosure and repeatedly pulled back over the low-profile video card 102 by the card cooler 108. This process helps to avoid temperature increases within the enclosure that can lead to overheating of electronic components on the video card 102, the motherboard, the power supply, and other devices, that in turn can lead to improper functioning and/or damage to these components and devices.
  • FIGs. 4 and 5 show flow diagrams illustrating example methods 400 and 500, respectively, of removing heat from an expansion card assembly.
  • Method 500 is an extension of method 400 that incorporates additional details.
  • Methods 400 and 500 are associated with the examples discussed herein with regard to FIGs. 1 - 3 , and details of the operations shown in these methods can be found in the related discussion of such examples.
  • methods 400 and 500 may include more than one implementation, and different implementations of methods 400 and 500 may not employ every operation presented in the respective flow diagrams of FIGs. 4 and 5 .
  • method 500 is presented in a particular order within the flow diagrams, the order of their presentation is not intended to be a limitation as to the order in which the operations may actually be implemented, or as to whether all of the operations may be implemented.
  • one implementation of method 500 might be achieved through the performance of a number of initial operations, without performing one or more subsequent operations, while another implementation of method 500 might be achieved through the performance of all of the operations.
  • an example method 400 of removing heat from an expansion card assembly includes securing a low-profile expansion card to a full-height mounting bracket, as shown at block 402.
  • the low-profile expansion card comprises an attached card cooler.
  • the method includes securing the bracket to a full-height computer enclosure.
  • the bracket supports the card and the card cooler within the full-height computer enclosure.
  • the method includes attaching an airflow guide to the bracket and the card to enable forced air from the card cooler to exit the full-height computer enclosure through the bracket, as shown at block 406.
  • method 500 is an extension of method 400 that incorporates additional details. Accordingly, like method 400, method 500 includes securing a low-profile expansion card to a full-height mounting bracket, and securing the bracket to a full-height computer enclosure, as shown at blocks 502 and 504, respectively. As shown at block 506, the method 500 includes attaching an airflow guide to the bracket and the card to enable forced air from the card cooler to exit the full-height computer enclosure through the bracket.
  • attaching the airflow guide can include aligning an air intake of the airflow guide with an exhaust region of the card cooler, and aligning an air output of the airflow guide with a vent in the bracket.
  • the method 500 includes providing a fan in the card cooler to enable the card cooler to force air over the card and out of the full-height computer enclosure through the airflow guide.
  • the method 500 of removing heat from an expansion card assembly can include removing the card from the full-height mounting bracket it was previously attached to, and removing the airflow guide from the card and the bracket, as shown at blocks 510 and 512, respectively.
  • the low-profile expansion card can then be secured to a low-profile mounting bracket, and the low-profile mounting bracket can be secured within a low-profile computer enclosure, as shown at block 516.
  • the low-profile mounting bracket can support the low-profile expansion card and the card cooler within the low-profile computer enclosure.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Claims (7)

  1. Ensemble de carte d'extension (100) comprenant :
    une carte d'extension à profil bas (102) comprenant au moins un connecteur de sortie (144) et au moins un composant électronique, ladite carte d'extension à profil bas (102) ayant un côté composant, étant le côté sur lequel la majorité des composants électroniques de la carte d'extension à profil bas (102) se trouve ;
    un refroidisseur de carte (108) pouvant être fixé à la carte d'extension à profil bas (102) pour forcer de l'air sur la carte d'extension à profil bas (102) ;
    ledit refroidisseur de carte (108) comprenant une chambre (128) et un ventilateur (126) qui, lorsqu'il est actif, est configuré pour aspirer de l'air dans ladite chambre (128) du refroidisseur de carte (108), et la chambre (128) est configurée pour couvrir le côté composant de la carte d'extension à profil bas (102), et le refroidisseur de carte (108) est configuré de telle sorte que, lorsqu'il est couplé à la carte d'extension à profil bas (102), de l'air pénètre dans l'ensemble (100) à travers le ventilateur (126) lorsque le ventilateur (126) est actif et que l'air qui est entré dans la chambre (128) à travers le ventilateur actif (126) se déplace à travers la chambre (128) et que l'air, après avoir été chauffé par l'un ou plusieurs composants du côté des composants, expulsés d'une région d'échappement (130) de la chambre (128),
    caractérisé par :
    un support pleine hauteur (110) comprenant : dans une première partie de celui-ci, au moins un port de connexion (142) configuré pour être aligné avec ledit au moins un connecteur de sortie (144) et, dans une seconde partie de celui-ci différente de ladite première partie, au moins un évent (106) ;
    et,
    un guide de flux d'air amovible (132), comprenant une entrée d'air (134) et une ouverture de sortie d'air (138), ledit guide de flux d'air amovible (132) pouvant être fixé à la carte d'extension à profil bas (102) pour diriger l'air forcé provenant du refroidisseur de carte (108) hors d'un boîtier d'ordinateur pleine hauteur (104) lorsque ladite carte d'extension à profil bas (102) est disposée, à l'aide dudit support pleine hauteur (110), dans un emplacement compatible pleine hauteur dans ladite pleine hauteur boîtier d'ordinateur (104), ledit guide de flux d'air (132) étant configuré, de telle sorte que la région d'échappement (130) du refroidisseur de carte (108) peut s'aligner avec ladite entrée d'air (134) et de telle sorte que, par ledit alignement, l'air chauffé peut être forcé hors de la région d'échappement (130) du refroidisseur de carte (108) pour entrer dans le guide de flux d'air amovible (132) par l'intermédiaire de ladite entrée d'air (134), et dans ledit état aligné, ledit guide de flux d'air (132) est configuré pour s'étendre au-dessus du refroidisseur de carte (108) et est configuré pour permettre à l'ouverture de sortie d'air (138) d'englober l'au moins un évent (106) formé dans le support pleine hauteur (110) de telle sorte que ledit air chauffé sera expulsé de l'enceinte informatique pleine hauteur à travers ledit au moins un évent (106).
  2. Ensemble (100) selon la revendication 1, dans lequel en outre :
    ledit support pleine hauteur (110) est configuré pour être fixé à la carte d'extension à profil bas (102) afin de sécuriser la carte d'extension à profil bas (102) au boîtier d'ordinateur pleine hauteur (104).
  3. Ensemble (100) selon la revendication 2, dans lequel lors de la fixation du guide de flux d'air amovible (132) à la carte d'extension à profil bas (102), ladite entrée d'air (134) du guide de flux d'air amovible (132) est configurée pour être située de manière adjacente à ladite région d'échappement (130) du refroidisseur de carte (108) et ladite ouverture de sortie d'air (138) du guide de flux d'air amovible (132) est configurée pour être située de manière adjacente à l'au moins un évent (106) dans son support pleine hauteur (110).
  4. Ensemble (100) selon la revendication 1, dans lequel lors du retrait du guide de flux d'air amovible (132) et du retrait du support pleine hauteur (110) de la carte d'extension à profil bas (102), la carte d'extension à profil bas (102) auquel le refroidisseur de carte (108) est fixé, peut être inséré dans un boîtier d'ordinateur à profil bas en fixant ladite carte d'extension à profil bas (102) avec le refroidisseur fixé (108) à un support compatible avec un boîtier d'ordinateur à profil bas.
  5. Ensemble (100) selon la revendication 1, dans lequel la carte d'extension à profil bas (102) est sélectionnée dans le groupe constitué d'une carte vidéo, d'une carte réseau, d'une carte mémoire, d'une carte modem et d'une carte d'interconnexion.
  6. Procédé (400) d'élimination de chaleur d'un ensemble de carte d'extension comprenant :
    la sécurisation (402) d'une carte d'extension à profil bas (102) comprenant au moins un connecteur de sortie (144) et au moins un composant électronique, ladite carte d'extension à profil bas (102) ayant un côté composant, étant le côté sur lequel la majorité des composants électroniques de la carte d'extension à profil bas (102) est situé, sur un support de montage pleine hauteur (110) comprenant : dans une première partie de celui-ci, au moins un port de connexion (142) configuré pour être aligné avec ledit au moins un connecteur de sortie (144) et, dans une seconde partie de celui-ci différente de ladite première partie, au moins un évent (106),
    la carte d'extension à profil bas (102) comprenant un refroidisseur de carte fixé (108), ledit refroidisseur de carte (108) comprenant une chambre (128) et un ventilateur (126) qui, lorsqu'il est actif, est configuré pour aspirer de l'air dans ladite chambre (128) du refroidisseur de carte (108), et la chambre (128) étant configurée pour couvrir le côté composant de la carte d'extension à profil bas (102), et le refroidisseur de carte (108) est configuré de telle sorte que, lorsqu'il est couplé à la carte d'extension à profil bas (102), l'air pénètre dans l'ensemble (100) à travers le ventilateur (126) lorsque le ventilateur (126) est actif et l'air qui est entré dans la chambre (128) à travers le ventilateur actif (126) se déplace. à travers la chambre (128) et l'air est, après avoir été chauffé par le ou les composants du côté composant, forcé hors d'une région d'échappement (130) de la chambre (128) ;
    la sécurisation (404) du support pleine hauteur (110) à un boîtier d'ordinateur pleine hauteur (104), le support pleine hauteur (110) supportant la carte d'extension à profil bas (102) et le refroidisseur de carte (104) dans la partie pleine hauteur boîtier informatique (104) ; et,
    la fixation (406) d'un guide de flux d'air amovible (132) comprenant une entrée d'air (134) et une ouverture de sortie d'air (138), au support et à la carte, ledit guide de flux d'air amovible (132) étant configuré pour permettre à l'air forcé du refroidisseur de carte pour sortir du boîtier d'ordinateur pleine hauteur (104) à travers le support pleine hauteur (110), ledit guide d'écoulement d'air (132) étant configuré, de telle sorte que la région d'échappement (130) du refroidisseur de carte (108) peut s'aligner avec ladite entrée d'air (134) et de telle sorte que, par ledit alignement, l'air chauffé peut être forcé hors de la région d'échappement (130) du refroidisseur de carte (108) pour entrer dans le guide d'écoulement d'air amovible (132) par l'intermédiaire de ladite entrée d'air (134), et dans ladite état aligné, ledit guide de flux d'air (132) est configuré pour s'étendre au-dessus du refroidisseur de carte (108) et est configuré pour permettre à l'ouverture de sortie d'air (138) d'englober l'au moins un évent (106) formé dans le support pleine hauteur (110) de telle sorte que ledit air chauffé sera expulsé de l'enceinte informatique pleine hauteur à travers ledit au moins un évent (106).
  7. Procédé (400) selon la revendication 6, comprenant en outre :
    le retrait de la carte d'extension à profil bas (102) du support pleine hauteur (110) ;
    le retrait du guide de flux d'air amovible (132) de la carte d'extension à profil bas (102) et du support pleine hauteur (110) ;
    la sécurisation de la carte d'extension à profil bas (102) à un support de montage à profil bas ; et,
    la sécurisation du support de montage à profil bas à l'intérieur d'un boîtier d'ordinateur à profil bas, le support de montage à profil bas supportant la carte d'extension à profil bas (102) et le refroidisseur de carte (108) à l'intérieur du boîtier d'ordinateur à profil bas.
EP16918536.0A 2016-10-11 2016-10-11 Ensemble carte d'expansion Active EP3494453B1 (fr)

Applications Claiming Priority (1)

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PCT/US2016/056319 WO2018070990A1 (fr) 2016-10-11 2016-10-11 Ensemble carte d'expansion

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EP3494453A1 EP3494453A1 (fr) 2019-06-12
EP3494453A4 EP3494453A4 (fr) 2020-04-08
EP3494453B1 true EP3494453B1 (fr) 2022-10-05

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EP (1) EP3494453B1 (fr)
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WO (1) WO2018070990A1 (fr)

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Publication number Publication date
EP3494453A4 (fr) 2020-04-08
EP3494453A1 (fr) 2019-06-12
WO2018070990A1 (fr) 2018-04-19
CN109923495A (zh) 2019-06-21
US20190227605A1 (en) 2019-07-25
US10871808B2 (en) 2020-12-22

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