EP3491887A1 - Micro conducteur chauffant - Google Patents
Micro conducteur chauffantInfo
- Publication number
- EP3491887A1 EP3491887A1 EP17748448.2A EP17748448A EP3491887A1 EP 3491887 A1 EP3491887 A1 EP 3491887A1 EP 17748448 A EP17748448 A EP 17748448A EP 3491887 A1 EP3491887 A1 EP 3491887A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- heating conductor
- micro
- radiation source
- structures
- meander
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 title claims abstract description 165
- 238000010438 heat treatment Methods 0.000 title claims abstract description 131
- 230000005855 radiation Effects 0.000 claims abstract description 73
- 239000000463 material Substances 0.000 claims description 18
- 239000012528 membrane Substances 0.000 claims description 11
- 229910045601 alloy Inorganic materials 0.000 claims description 9
- 239000000956 alloy Substances 0.000 claims description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 4
- 229910052721 tungsten Inorganic materials 0.000 claims description 4
- 239000010937 tungsten Substances 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- 229910017052 cobalt Inorganic materials 0.000 claims description 2
- 239000010941 cobalt Substances 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- 229910052758 niobium Inorganic materials 0.000 claims description 2
- 239000010955 niobium Substances 0.000 claims description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 229910052702 rhenium Inorganic materials 0.000 claims description 2
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 claims description 2
- 229910000601 superalloy Inorganic materials 0.000 claims description 2
- 229910052715 tantalum Inorganic materials 0.000 claims description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 229910052720 vanadium Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- XACAZEWCMFHVBX-UHFFFAOYSA-N [C].[Mo] Chemical compound [C].[Mo] XACAZEWCMFHVBX-UHFFFAOYSA-N 0.000 claims 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims 1
- 239000007789 gas Substances 0.000 description 6
- 239000010409 thin film Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000001419 dependent effect Effects 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 238000004868 gas analysis Methods 0.000 description 3
- 230000012447 hatching Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000002329 infrared spectrum Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/16—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being mounted on an insulating base
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
- H05B2203/003—Heaters using a particular layout for the resistive material or resistive elements using serpentine layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
- H05B2203/007—Heaters using a particular layout for the resistive material or resistive elements using multiple electrically connected resistive elements or resistive zones
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/032—Heaters specially adapted for heating by radiation heating
Definitions
- the invention relates to a micro heating conductor, wherein the micro heating conductor consists of a meandering,
- the invention also relates to a micro heating conductor which is used as a radiation source, such as an infrared radiation source.
- a radiation source such as an infrared radiation source.
- Black body radiator emits the physically maximum possible amount of energy at each wavelength ⁇ .
- Black body radiator is known and in the ⁇ denotes the Stefan- Boltzmann constant. Real emitters are not blackbody emitters. Their emitted radiation power is lower than that of the
- Blackbody radiator same radiating area A and temperature T. This is because the real thermal radiator does not radiate at every wavelength ⁇ the maximum possible amount of energy.
- emissivity ⁇ Energy amount is called emissivity ⁇ , which lies in the range between zero and one.
- Black body radiator thus has the value one and is wavelength independent.
- the emitted radiation power of real radiators is further reduced compared to the black body radiator in that the radiating surface A is not homogeneously heated with the temperature T, since the heating element is usually heated at a colder point, e.g. attached to the housing, and this connection due to heat conduction
- a temperature distribution T (A) is formed on the surface A, with regions having a maximum and a minimum temperature forming on the radiating surface.
- the radiant power Prs of a real thermal radiator can thus be adapted with a Stefan-Boltzmann law
- the radiant power depends accordingly on the fourth
- the radiating element For high radiation power, therefore, the radiating element must have a high temperature and a high average emissivity as close to unity as possible. In addition, for a high
- thermal radiators operate according to the Joule principle heat, or also current heat, that is, when an electric current flows through a heating conductor, the electrical resistance of the heating conductor counteracts the current flow, whereby heat is generated. The resulting heat heats the heating element and is transferred from it
- Heat radiation and must therefore be designed that the power loss as a result of the heat dissipation to the housing or to the surrounding gas as low as possible.
- the heat dissipation to the surrounding the radiant heating element or the radiating heating element surrounding gas can be reduced by the housing of the
- Infrared radiation source with an inert gas such as argon
- Inert gases are characterized by a significantly lower thermal conductivity than that of air.
- the heat dissipation of a cantilevered heat conductor to the housing of the infrared radiation source can be reduced by increasing the thermal resistance of the heat conductor.
- the thermal resistance of a heat conductor depends on the material and its geometry. It is for typical heating conductor materials, such as e.g. metals,
- Infrared radiation source has a self-supporting heating conductor, which should ideally be as long and thin as possible in order to provide a high electrical resistance, high thermal resistance and a large radiating area.
- long self-supporting heating conductors have the disadvantage that under thermal load they expand more in absolute terms than short ones. They are thus mechanically less stable than short heating conductors.
- Thermal infrared radiation sources are mainly used in non-dispersive infrared (NDIR) gas analysis.
- NDIR gas analysis is an optical method for determining the concentration of gases. The infrared radiation of the thermal emitter radiographs the cuvette with the fluid to be measured and then strikes the sensitive surface of the detector. To the highest possible proportion of the emitted
- Heating conductor must therefore always be kept in the same position to the optics under operating temperature, so that the focus on the detector element is maintained. Another requirement for heat conductors is therefore the mechanical stability. Typical heating conductor materials, e.g.
- Metals expand under thermal load, which in conjunction with their attachment, e.g. on the housing of the infrared radiator, leads to deformations.
- the deformation is mainly dependent on the temperature, the material used and the Schuleitergeometrie.
- thermal infrared radiation sources Four different types are used for previous applications in gas analysis: filament lamps, resistance coils, globars and thin-film radiators.
- filament lamps In compact infrared spectroscopic devices, emitters with resistance coils and
- the glass is no longer sufficiently transparent to infrared radiation above 4.5 ⁇ wavelength, so that
- the radiating element is cantilevered and attached to some housing points, which hold the element in a fixed position and ensure electrical contact.
- radiators have the disadvantage that the radiating element has too low an electrical resistance due to its short length. Furthermore, the low thermal resistance coupled to the low electrical resistance results in much of the electrical power dissipating to the housing in the form of heat rather than being dissipated as desired thermal radiation.
- An advantage of this construction is the mechanical stability of the radiating element resulting from the small heating conductor length under temperature load. Furthermore, the radiation emitted on both sides can be utilized by a reflector integrated in the radiator housing.
- spiral heating conductors provide a sufficiently high electrical resistance and a homogeneous Temperature distribution over the entire radiating surface. Its thickness is in the range of a few microns. These heaters are self-supporting, so that the bottom and top of the radiating element with a
- the radiating element is not self-supporting
- the radiating element consisting of a thin membrane and a Schumetallmaschine on a Support frame to be attached to secure it in the housing of the radiation source can.
- This frame can not be used as a radiating surface and thus prevents optimal utilization of the available space as a radiating surface.
- Another disadvantage of thin-film radiators is the inhomogeneous heating
- Infrared radiation source with cantilever heating conductor which by a high electrical and thermal
- Resistance is energy efficient and is characterized by a long-term stable and high radiation power, which is ensured by a heat conductor, which deforms only slightly under thermal load and a large
- the object is achieved by a Mikroproofleiter in that the Mikroterrorismleiter at least two
- Heat conductor structure with an area normal to a second Schumacher Designebene a second Schuleiterer Design encloses an angle and at least two
- a heat conductor structure plane is understood to mean a plane in which the heat conductor structure lies, i. the plane is spanned by the heat conductor structure.
- FIG. 1 A schematic diagram is shown in FIG. A meandering protuberance, in relation to the present subject matter of the invention, will be considered part of one in one
- the materials are electrically connected, inasmuch as the compounds are electrically conductive.
- the material thickness of the heating element is understood, which is smaller by a multiple than that Dimensions of the heating conductor structure is. It is less than 5 ym.
- a temperature greater than 700 K can be achieved with the micro-heating conductor.
- Spectral range can be used.
- the radiating surface In order to achieve a high radiation power, in addition to a high temperature, the radiating surface must be as large as possible.
- the electrical resistance and the thermal resistance must be high so that
- the heat-conductor structure has a structure width of ⁇ 500 ⁇ m, preferably ⁇ 250 ⁇ m, more preferably ⁇ 125 ⁇ m. That the conductor pattern widths are larger by approximately two orders of magnitude than the thickness of the heating conductor material. Due to the meander-shaped heating conductor structures and the connection of the opposing meander protuberances, the mechanical stability under thermal stress can be significantly increased even at temperatures> 700 K.
- the meander protuberances are two
- Meander protuberances are designed such that the
- Protuberances are connected in an area or the
- connection can also be designed as an adhesive connection or a welded connection.
- the compound acts both mechanically, thermally and electrically, i. the mechanical connection ensures the mechanical stability of the micro heating element, the thermal connection is the basis for the homogeneous heating of the micro heating element, so that a homogeneous
- Infrared radiation can be achieved, the
- the meander protuberances are arc-shaped or n-shaped, where n is a natural number greater than two. If the shape of a meander protuberance is changed locally, its partial resistance increases or decreases, which results in a higher or lower one at this point
- Heat conductor cause Furthermore, it is also possible to influence and adjust the electrical resistance of the heating conductor structures and the mechanical stability of the micro heating conductor in a radiation source. Under a Partial resistance is the electrical or thermal
- N-sided means that the recesses, e.g. in a
- the surface normals of two adjacent heat conductor structures are designed to run parallel to one another. This means that the included angle is zero.
- the heating conductor structures are located in one plane, but the heating conductor structures do not overlap.
- the Mikroterrorismleiter is formed of a material. That is, the Schuetzleiterer Modellen are made of the same material and can either be combined to a Mikroterrorismleiter or the
- Micro-heating is due to a structuring of a material, e.g. a metal foil, made by
- Recesses are introduced into the material.
- the size of these recesses is advantageously less than 50 ym.
- Nickel-base alloy made of a nickel-base superalloy, of a Ni x Cri x alloy of 0 ⁇ x ⁇ 1, of tungsten, of molybdenum, of carbon, of platinum, of tantalum
- Vanadium made of a titanium-based alloy, rhenium, niobium, cobalt or an alloy of at least two of these materials.
- the enumeration is to be understood as or linking, wherein an alloy consists of at least two of these enumerated materials.
- Heat conductor structures is thus a homogeneous radiator with optimized mechanical stability feasible.
- the heat conductor structures are cantilevered. This has the advantage that both the front and the
- Thin-film radiators due to the direct connection of the heat sink (support frame) and heating metallization can be remedied by varying the shape of the recesses formed by the meandering protrusions.
- Decisive is the partial resistance of the individual meander sections.
- the Mikroterrorismleiter of at least two Schumacher Modellen is formed, which are formed so that the Mikroterrorismleiter forms a round or elliptical Schuleiter configuration in the Schuleiter Modellebene.
- a schematic diagram is shown in FIG. 8. This is particularly advantageous if the micro-heating conductor is installed in a round housing, because with this structural form the installation space can be optimally utilized and the
- the radiating surface is particularly large selectable.
- the Mikrotropicleiter of at least two Schuleiter Modellen is formed, which are formed so that the Mikroterrorismleiter forms a curved Bankleiter Structure.
- the Schuleiter Structure is then no longer in a plane but is curved, similar to a segment on a spherical surface.
- the curved surface acts as a kind of collimator with a focal point. This can be used to focus the radiated radiation and thus to increase the radiance.
- FIG. 1 shows a schematic sketch of a meander-shaped
- FIG. 4 Consisting of a microheater according to the invention
- Meander protuberances of the first heat conductor structure are not all connected to the meander protuberances of the second heat conductor structure;
- FIG. 5 Consisting of a microheater according to the invention
- FIG. 7 Consisting of a microheater according to the invention
- FIG. 8 Consisting of a microheater according to the invention
- Housing for use as an infrared ⁇ radiation source.
- Figure 1 shows the schematic representation of a
- a meander is a unidirectional and repeating pattern, with a meander protuberance 2 relating to the present invention as a part of this
- Pattern and adjacent protuberances 2 i. successive in the sequence of the pattern
- Figure 2 shows the combination of two meandering
- Fig. 2b shows a perspective view of two adjacent
- Heat conductor structure 10-2 connected.
- the advantage of both this connection and the tilt is a higher
- FIG. 3 shows the tilting of two adjacent ones
- FIG. 5 shows an embodiment of the micro-heating conductor 1 according to the invention, in which two heating-conductor structures 10-1, 10-2 are arranged in one plane, so that the
- Meander protuberances 2 of the first heat conductor structure 10-1 are in each case opposite
- FIG. 6 shows an embodiment of the invention
- Heat conductor structure 10-2 in the opposite direction as the meander protuberances 2 of the first Schuleiter Quilt 10-1 have connected.
- the meander protuberances 2 of the second heat conductor structure 10-2 are corresponding to the respectively opposite meander protuberances 2 of the third heat conductor structure 10-3, which in the opposite direction as the meander protuberances 2 of the second
- Heat conductor structure 10-2 point connected 6. Compared to Mikrofableiter of two meanders or
- FIG. 7 shows an embodiment of the micro-heating conductor 1 according to the invention, in which four heating-conductor structures 10-1, 10-2, 10-3, 10-4 are arranged in a plane, so that the surface normals 4 of the heating-conductor structure planes 3 run parallel to one another.
- the meander protuberances 2 of the first heat conductor structure 10-1 are in each case with the
- the meander protuberances 2 of the second heat conductor structure 10-2 are corresponding to the respectively opposite meander protuberances 2 of the third heat conductor structure 10-3, which in opposite direction than the Guranderausstülponne 2 of the second
- FIG. 8 shows a further embodiment of the micro-heating conductor 1 according to the invention. If the Mikrotropicleiter 1 installed in a housing 11, that is used as a radiation element in a radiation source, such as an infrared radiation source, then
- Radiation source housing 11 can be adjusted. As shown in Fig. 8, the Mikroschreibleiter 1 with the
- Heat conductor structures 10 may be round in a round design, so that by this arrangement of
- FIG. 9 shows another embodiment of the invention
- Mikrocrocellleiters invention 1 shown.
- a radiation source e.g. an infrared radiation source used
- Radiation source housing 11 can be adjusted.
- this round design can be formed even curved at the same time. This can be used, for example, to focus the radiation and increase the radiance.
- 9a) shows a plan view, b) a side view, and FIGS. 9c) and d) various perspective views of the curved micro-heating conductor 1 consisting of four heating conductor structures 10.
- FIG. 10 shows various shapes of the meandering structures 2 or protuberances.
- Fig. 9a) shows the shape of the
- Meander protuberances at n 3, ie the meanders have the Shape of triangles and in Fig. 9b) are the
- Meander structures 2 arcuately formed. It may also, depending on the heat profile to be formed, i. local adjustment of the current density and thus the warm-up different meandering structure forms 2 are combined.
- FIG. 11 shows the use of the invention
- Terminals 8 contacted in the housing 11, wherein the
Landscapes
- Resistance Heating (AREA)
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102016113747.2A DE102016113747A1 (de) | 2016-07-26 | 2016-07-26 | Mikroheizleiter |
PCT/EP2017/068942 WO2018019915A1 (fr) | 2016-07-26 | 2017-07-26 | Micro conducteur chauffant |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3491887A1 true EP3491887A1 (fr) | 2019-06-05 |
EP3491887B1 EP3491887B1 (fr) | 2019-11-06 |
Family
ID=59520888
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP17748448.2A Active EP3491887B1 (fr) | 2016-07-26 | 2017-07-26 | Micro conducteur chauffant |
Country Status (5)
Country | Link |
---|---|
US (1) | US10674567B2 (fr) |
EP (1) | EP3491887B1 (fr) |
CN (1) | CN109565907B (fr) |
DE (1) | DE102016113747A1 (fr) |
WO (1) | WO2018019915A1 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3855162A1 (fr) * | 2020-01-21 | 2021-07-28 | Omya International AG | Système d'imagerie lwir pour détecter une structure amorphe et/ou cristalline de sels de phosphate et/ou de sulfate sur la surface d'un substrat ou à l'intérieur d'un substrat et utilisation du système d'imagerie lwir |
DE102021205755B4 (de) | 2021-06-08 | 2023-01-19 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Vorrichtung zur Erzeugung elektromagnetischer Strahlung und Verfahren zu ihrer Herstellung |
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GB905867A (en) * | 1957-11-18 | 1962-09-12 | Eisler Paul | Manufacture of electrical heating and conducting devices |
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GB1020311A (en) * | 1961-01-20 | 1966-02-16 | Eisler Paul | Electrical heating film |
US3573430A (en) * | 1966-12-30 | 1971-04-06 | Paul Eisler | Surface heating device |
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DE3544499C1 (de) * | 1985-12-17 | 1987-08-20 | Bauerhin I G Elektro Tech | Heizleiterverbindung zwischen durch einen im Polsterkern vorgesehenen Abspanngraben getrennten,elektr,beheizten Sitz- bzw.Lehnenflaechen zur Sitzbeheizung von Fahrzeugen |
JP2535372B2 (ja) * | 1988-03-09 | 1996-09-18 | 日本碍子株式会社 | セラミック・ヒ―タ及び電気化学的素子並びに酸素分析装置 |
EP0355210A1 (fr) * | 1988-08-26 | 1990-02-28 | Koninklijke Philips Electronics N.V. | Elément chauffant |
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EP0635993B1 (fr) * | 1993-07-20 | 2000-05-17 | TDK Corporation | Elément chauffant céramique |
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US5939726A (en) | 1997-12-11 | 1999-08-17 | Cal-Sensors, Inc. | Infrared radiation source |
DE10052345A1 (de) * | 2000-10-21 | 2002-05-02 | Mayfield Ventures Ltd Croydon | Wetterfeste Bodenmatte mit elektrischer Beheizung |
US6541743B2 (en) * | 2001-02-14 | 2003-04-01 | Steve Chen | Electrical heater unit and heater |
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DE102004024044A1 (de) | 2004-05-07 | 2005-11-24 | E.G.O. Elektro-Gerätebau GmbH | Elektrischer Heizleiter aus Keramik und Verfahren zu seiner Herstellung sowie Heizeinrichtung |
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DE102007039219B4 (de) * | 2007-08-20 | 2010-04-22 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Spektral abstimmbares Lasermodul |
DE102009031890A1 (de) | 2009-07-06 | 2011-01-13 | Dbk David + Baader Gmbh | Heizvorrichtung |
ES2409116T3 (es) | 2010-09-23 | 2013-06-25 | Andreas Massold | Procedimiento para la medición de temperatura en un vehículo. |
DE102012202374A1 (de) | 2012-02-16 | 2013-08-22 | Webasto Ag | Fahrzeugheizung und Verfahren zur Herstellung einer Fahrzeugheizung |
DE102012103662B3 (de) | 2012-04-26 | 2013-04-18 | Technische Universität Dresden | Dünnschicht-Infrarotstrahlungsquelle und Verfahren zu deren Herstellung |
US9193466B2 (en) * | 2012-07-13 | 2015-11-24 | Mra Systems, Inc. | Aircraft ice protection system and method |
US9320086B2 (en) * | 2013-07-11 | 2016-04-19 | Minco Products, Inc. | Fail safe heater assembly |
US9730276B2 (en) * | 2013-11-19 | 2017-08-08 | Mhi Health Devices, Llc | Flat heating element comprising twists and bends and method thereby to relieve heating element stress |
CA2881549A1 (fr) * | 2014-02-12 | 2015-08-12 | Winners Products Engineering Canada Ltd. | Ensemble plaque thermique pour barbecue comportant une plaque thermique avec un element de repartition de chaleur coplanaire |
-
2016
- 2016-07-26 DE DE102016113747.2A patent/DE102016113747A1/de not_active Withdrawn
-
2017
- 2017-07-26 WO PCT/EP2017/068942 patent/WO2018019915A1/fr unknown
- 2017-07-26 EP EP17748448.2A patent/EP3491887B1/fr active Active
- 2017-07-26 US US16/319,427 patent/US10674567B2/en active Active
- 2017-07-26 CN CN201780046197.4A patent/CN109565907B/zh active Active
Also Published As
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US20190281665A1 (en) | 2019-09-12 |
CN109565907A (zh) | 2019-04-02 |
WO2018019915A1 (fr) | 2018-02-01 |
EP3491887B1 (fr) | 2019-11-06 |
DE102016113747A1 (de) | 2018-02-01 |
US10674567B2 (en) | 2020-06-02 |
CN109565907B (zh) | 2020-06-26 |
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