EP3482937A1 - Procédé de structuration d'une surface, plaque d'héliogravure ou outil d'estampage ainsi qu'utilisation - Google Patents

Procédé de structuration d'une surface, plaque d'héliogravure ou outil d'estampage ainsi qu'utilisation Download PDF

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Publication number
EP3482937A1
EP3482937A1 EP17200585.2A EP17200585A EP3482937A1 EP 3482937 A1 EP3482937 A1 EP 3482937A1 EP 17200585 A EP17200585 A EP 17200585A EP 3482937 A1 EP3482937 A1 EP 3482937A1
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EP
European Patent Office
Prior art keywords
stencil layer
stencil
layer
structuring
embossing tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP17200585.2A
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German (de)
English (en)
Inventor
Peter Kesper
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AKK GmbH
Original Assignee
AKK GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AKK GmbH filed Critical AKK GmbH
Priority to EP17200585.2A priority Critical patent/EP3482937A1/fr
Publication of EP3482937A1 publication Critical patent/EP3482937A1/fr
Withdrawn legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00—Forme preparation
    • B41C1/02—Engraving; Heads therefor
    • B41C1/025—Engraving; Heads therefor characterised by means for the liquid etching of substrates for the manufacturing of relief or intaglio printing forms, already provided with resist pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00—Printing plates or foils; Materials therefor
    • B41N1/003—Printing plates or foils; Materials therefor with ink abhesive means or abhesive forming means, such as abhesive siloxane or fluoro compounds, e.g. for dry lithographic printing

Definitions

  • the invention relates to a method for structuring a surface for a gravure mold or an embossing tool. Furthermore, the invention relates to a gravure mold or an embossing tool having a surface, wherein the surface has been structured at least partially with a method according to the invention and a use of laser radiation for structuring a surface for a gravure mold or an embossing tool.
  • the surfaces of gravure printing plates are structured with wells for receiving ink.
  • the ink is applied to the textured surface and into the wells of the gravure form. Excess ink is removed from the surface by means of a doctor, in particular a squeegee. This leaves the ink predominantly only in the wells.
  • a doctor in particular a squeegee. This leaves the ink predominantly only in the wells.
  • the printed image formed by the ink in the wells can be transferred directly to the material to be printed.
  • the wells can not be made arbitrarily large, otherwise ink is removed from the wells when scraping. Therefore, wider areas to be printed are formed by a plurality of wells with intermediate webs, the webs must be designed very fine for high print quality. Further, it may be necessary for the coloring to equip the wells with different depths, so that depending on the depth of more or less ink is absorbed by the respective wells. Finally, the surface of the gravure form is subject to wear by the printing process and, in particular, ink stripping.
  • the shape of the cups also affects the coloring when printing.
  • the ink taken up by the intaglio printing plate or the cups should be dispensed as completely as possible when printing onto the material to be printed, so that the printed image is completely dispensed and also no residues of the ink remain in the intaglio printing form.
  • embossing tools are patterned with depressions to provide an embossed image.
  • the depressions must have a certain resolution for the embossed image and also have a shape or a depth profile which allows embossing on different materials.
  • the recesses of embossing tools are usually complex shaped, i. the depressions have a profile or depth profile, which changes with the distance to the original surface, for example tapered, in order to ensure process-reliable embossing.
  • etching techniques can be used.
  • a nationwide stencil layer of a photosensitive material is first applied to the surface.
  • the stencil layer is selectively exposed, thus changing the solubility of the exposed areas of the stencil layer.
  • the subsequent detachment of partial regions of the stencil layer with a solvent causes the stencil layer to be structured.
  • An etching treatment of the surface is carried out with which the portions of the surface, which are not covered by the template, are selectively etched.
  • Corresponding etching techniques are often not suitable for high process speeds and are too inaccurate with regard to the required fine structuring of the surface.
  • the surface can be mechanically processed, wherein the wells or depressions are introduced by a mechanical engraving by means of a stylus.
  • An electromechanical engraving can be carried out, for example, on the basis of a template which is scanned simultaneously or also computer-based.
  • corresponding devices for electromechanical or laser engraving are often complex and expensive.
  • the surface of the gravure mold or embossing tool is usually chrome plated.
  • the chromium layer increases the hardness and life of the surface.
  • the chrome plating is complex and not environmentally friendly due to the associated safety requirements.
  • the EP 3 205 499 A1 discloses a method of patterning the surface of a gravure form wherein a stencil layer is selectively printed by dropping droplets. Subsequently, material is chemically applied or removed on the surface to create a structure.
  • the object of the invention is to propose a method for structuring a surface for a gravure printing die or an embossing tool, wherein structuring with high resolution and process speed is achieved and the form of structuring can be improved.
  • an apparatus for performing the method, a gravure form or a stamping tool and a use of laser radiation for structuring should be specified.
  • a method for structuring a surface for a gravure mold or embossing tool in which a stencil layer is applied to the surface, wherein the stencil layer comprises an electrically insulating stencil material, in the stencil layer of a Laser ablation is performed, wherein laser radiation, the template layer removed in regions and thereby recesses in the stencil layer is exposed, the surface is exposed in the region of the recesses, in which an electrochemical treatment of the surface is carried out, wherein material is applied to the surface, so that in the the recesses of the stencil layer are formed elevated areas on the surface.
  • the surface to be patterned may be a surface or a part of a surface of a blank for a gravure mold or an embossing tool.
  • the surface to be structured has, in particular, a material which is suitable for a printing or embossing process and for which it has, in particular, sufficient hardness, wear properties and / or chemical properties.
  • the surface may, for example, be a metallic surface and in particular comprise or consist of steel, nickel, copper, chromium and their compounds.
  • the stencil layer comprises an electrically insulating stencil material so that the regions in which the stencil layer remains on the surface after the laser ablation are not affected by the electrochemical treatment or substantially no material is applied in the corresponding regions.
  • the stencil layer consists of electrically insulating stencil material.
  • the stencil layer can completely or partially cover the surface.
  • the stencil layer is applied directly to the surface to be structured, ie after application, the stencil layer is in direct (direct) contact with the surface to be structured, in particular with a metallic surface. In particular, none further layers between the stencil layer and the surface to be structured provided.
  • the template layer is removed from the surface area by area via laser radiation.
  • the stencil layer is ablated in regions as far as the laser ablation so that the stencil layer is partially completely, i. is removed over the entire layer thickness of the stencil layer.
  • Recesses are provided in the stencil layer, wherein the surface to be structured is exposed in the region of the recesses. Under an exposure of the surface is to be understood in particular that the surface to be structured in the region of the recesses forms the outermost layer and is directly accessible for electrochemical treatment. With the recesses there are thus lasered, bare areas in the stencil layer, in which the surface to be structured is exposed, and wherein the structured stencil layer forms a pattern for applying material to the surface.
  • the surface is insignificantly or not influenced and / or removed by the laser ablation of the stencil layer.
  • the surface may be applied to the chemical treatment for application of material immediately after patterning the stencil layer without further steps being required to contour the stencil or other layers.
  • the electrochemical treatment of the surface of the gravure mold causes the application of material to the surface. Due to the electrically insulating properties of the structured stencil layer, in particular material is applied to the surface substantially only in the area of the recesses. In the region of the recesses of the stencil layer, corresponding to the pattern introduced via the laser ablation, elevated areas or thickenings on the surface, which can provide a printed image or embossed image, form on the surface.
  • the stencil layer may be removed during the electrochemical treatment or after the electrochemical treatment in an additional step so that the structured surface is exposed.
  • the high speed of the process and high resolution, which can be achieved via the laser ablation of the stencil layer are advantageous in the method described.
  • the laser ablation of the stencil layer can be performed faster and easier than a laser ablation of the material of the surface itself, as required in a laser engraving of the surface.
  • the material of the stencil layer may be better suited for rapid ablation than the material of the surface, which is usually made of a hard metal.
  • a significantly higher resolution and accuracy of the structuring of the surface can be achieved.
  • the shape of the wells or depressions which is produced by structuring with the described method, in particular in gravure printing have an improved ink delivery.
  • the shape of the wells according to the method described here differs in particular from the shape of the cells produced by mechanical engraving, etch-technically produced or by laser ablation of the surface, which result from a removal of material.
  • the shape of the cups produced by the conventional methods are determined here by the type of removal, for example the shape of the stylus or the action of the etching process or of the laser.
  • the surface is influenced only insignificantly by the laser ablation of the stencil layer, with the result, for example, that elevated areas are applied to a substantially flat surface.
  • the method described also provides a very cost-effective structuring of the surface. High process speeds can be achieved.
  • the application of material to the surface means that in contrast to the methods of the prior art, which are based on removing material from the surface, total material can be saved.
  • the application of the stencil layer to the surface comprises knife-coating and / or spraying stencil material.
  • a high process speed can be achieved by knife-coating and / or spraying on the stencil material, wherein at the same time the stencil layer can be applied in a process-reliable, durable and in particular particularly uniform manner (in particular with homogeneous layer thickness).
  • the material applied to the surface comprises nickel and / or nickel compounds and, for example, a nickel plating is carried out.
  • the material applied to the surface has at least 50% by weight, preferably at least 75% by weight, more preferably at least 90% by weight, of nickel and / or nickel compounds.
  • a corresponding nickel bath can be used, wherein in particular a nickel precipitate is selectively applied to the surface in the regions of the recesses.
  • a chromium plating can also be carried out before and / or after the application of nickel and / or nickel compounds to the surface for corresponding requirements.
  • chromium is applied after the application of nickel and / or nickel compounds, so that the layer applied by chromium plating acts as a particularly wear-resistant outer layer.
  • the surface before the application of the stencil layer at least partially on a nickel plating.
  • the surface may even before structuring nickel and / or nickel compounds (in particular at least 50 wt .-%, preferably at least 75 wt .-%, more preferably at least 90 wt .-% nickel and / or nickel compounds) or consist thereof.
  • a nickel-plated surface also has the advantage that a further application of nickel and / or nickel compounds is facilitated.
  • a stencil layer having a layer thickness of 1 ⁇ m to 50 ⁇ m is applied.
  • Corresponding layer thicknesses ensure process-reliable application of material in the electrochemical treatment and allow rapid application of the stencil layer and rapid laser ablation.
  • a high process speed can be achieved in particular with a layer thickness of 2 ⁇ m to 30 ⁇ m for the stencil layer.
  • the material for the stencil layer in particular, a material based on polymers or consisting of polymers is used.
  • the laser radiation is controlled by at least one acousto-optic deflector (AOD).
  • AOD acousto-optic deflector
  • AOD can be further combined with at least one acousto-optic modulator (AOM) as a switching device, for example as Q-switch (also called Q-switch), with which high-intensity laser pulses can be generated.
  • AOM acousto-optic modulator
  • laser radiation is used with a plurality of simultaneously acting on the stencil layer laser beams, in particular at least four laser beams are used.
  • a laser beam can be divided into a plurality of laser beams, wherein the laser beam to be split can be understood here to mean the radiation emitted by a laser source.
  • the laser beam is split into a plurality of laser beams, wherein in particular the laser beams generated by the division have mutually different propagation directions.
  • the fast switching times of an AOD make it possible to distribute a laser beam arriving at the AOD in a short time interval to a plurality of points of the stencil layer, so that several points are structured approximately simultaneously in this time interval.
  • an AOD allows for the deflection of multiple laser beams entering the AOD so that, in particular, a beam splitter in the beam direction in front of the AOD can be used to simultaneously control multiple laser beams from the AOD and simultaneously pattern different points of the template layer.
  • a beam splitter may be placed in the beam direction after the AOD to split a laser beam emanating from the AOD.
  • a resolution of the structure of the surface of 2540 dpi, in particular of 5080 dpi is provided.
  • a resolution of the structure of the surface of 2540 dpi, in particular of 5080 dpi is provided.
  • a mechanical or etching-technical structuring of the surface corresponding resolutions can be achieved by the laser ablation of the stencil layer process reliable.
  • the method steps of the described method are repeated in order to apply further material to the surface.
  • an additive process can be provided whereby multiple structured layers of material are applied to the surface.
  • different materials may be sequentially applied to the surface to produce a sequence of different materials on the surface.
  • various types of nickel coatings and / or chrome coatings can be applied.
  • the stencil layers applied one after the other are structured differently, so that the successively applied raised areas are different from each other.
  • the surface can be structured "in three dimensions" or with a defined depth profile, so that the raised areas have different patterns at different depths or heights.
  • the shape of the wells can be further designed in intaglio printing for a better color output.
  • the structuring of the surface for an embossing tool required for a reliable embossing complex shapes of the wells can be easily produced without having to resort to the known from the prior art, consuming and often inaccurate multi-stage etching processes.
  • the depth profiles can be achieved by a successive construction of material and not by removal of Material, which are given in the design of the depth profiles of the wells or wells more options.
  • a device for structuring a surface for a gravure mold or an embossing tool in a method according to the first teaching is given to achieve the above object, with a holder for a blank for a gravure mold or an embossing tool, with a means for applying a stencil layer to the blank, having at least one laser radiation source adapted to partially remove the stencil layer and having at least one means for electrochemical treatment of the surface adapted to apply material to the surface.
  • a gravure mold or an embossing tool comprising a surface is specified for achieving the abovementioned object, the surface being structured at least in part by a method according to the first teaching.
  • a shape or a depth profile of the wells or depressions is obtained, which structurally differs, in particular, from the shape produced by removal of material ,
  • the shape of the wells or the wells after a mechanical engraving, an etch-structuring or a direct structuring by laser ablation of the surface For example, the shape of the wells or the wells after a mechanical engraving, an etch-structuring or a direct structuring by laser ablation of the surface.
  • the intaglio printing die or the embossing tool is designed as a plate, roller or roll sleeve (sleeve).
  • rollers for gravure or embossing tools include or consist of steel and / or steel alloys, in particular copper steel, nickel, chromium and their Compounds is used as material for the surface of the roll or the roll shell.
  • the use of laser radiation for patterning a surface for a gravure printing die or an embossing tool is specified for achieving the above-mentioned object, wherein a stencil layer arranged on the surface is subjected to laser ablation and the laser radiation removes the stencil layer in regions and thus recesses be provided in the stencil layer.
  • Fig. 1a-c show first schematic views of structured surfaces 2 of intaglio printing dies or embossing tools 4, as they are produced by methods for structuring of the prior art.
  • a surface 2 which has a structure introduced by a mechanical engraving via a stylus.
  • the stylus (not shown) wells or depressions 6 are generated, whose shape is typically due to the shape of the stylus and which in particular as in Fig. 1a shown tapered in depth and in particular designed tapered.
  • a surface 2 which has a structure introduced by laser engraving or laser ablation directly.
  • material is directly removed from the surface 2, so that wells or depressions 6 are produced.
  • the shape of the wells or depressions 6 is dependent on the properties of the material of the surface under the action of the laser radiation during ablation and is in particular as in Fig. 1b Shown in the depth or in the depth profile rounded.
  • a surface 2 which has a structure introduced by means of etching techniques.
  • a stencil material is first applied (not shown) and in particular structured and partly removed by exposure.
  • the surface 2 is attacked with a corrosive solution, so that wells or depressions 6 arise.
  • the shape of the wells or depressions 6 is determined by the etching attack on the material of the surface 2 and is typically rounded in depth or in the depth profile. Also, like in Fig. 1c indicated undercuts of the template and the surface arise.
  • Fig. 2a-e 12 show schematic views of the method for structuring a surface 8 for a gravure mold or an embossing tool 10 or the use of laser radiation for structuring a surface 8 for a gravure mold or an embossing tool 10.
  • the surface 8 is shown before structuring.
  • the surface 8 may be, for example, a metallic surface and in particular steel, Nickel, copper, chromium and their compounds or consist of.
  • the surface 8 is nickel plated.
  • the surface 8 may in this case be a surface of a blank for a gravure mold or an embossing tool and, for example, a surface of a plate, a roll or a roll shell.
  • a stencil layer 10 is shown, which is applied to the surface 8.
  • the stencil layer 10 comprises an electrically insulating stencil material and is based in particular on polymers or consists thereof.
  • the application of the stencil layer 10 to the surface 8 comprises a doctoring and / or spraying of stencil material.
  • the stencil layer 10 is applied with a layer thickness of 1 ⁇ m to 50 ⁇ m, in particular with a layer thickness of 2 ⁇ m to 30 ⁇ m.
  • Fig. 2c The stencil layer 10 is shown after it has been laser ablated.
  • the laser radiation removes the stencil layer 10 in regions, whereby recesses 12 are provided in the stencil layer 10, the surface 8 being exposed in the region of the recesses 12.
  • the stencil layer 10 remains partly as a structured stencil layer 10 'on the surface 8.
  • laser radiation with a plurality of laser beams acting simultaneously on the stencil layer 10 is used.
  • An electrochemical treatment of the surface 8 is carried out, with material 14 being applied to the surface 8. Due to the electrically insulating materials in the patterned stencil layer 10 ', essentially no material is applied to the stencil layer 10'. In the region of the recesses 12 of the stencil layer 10 ', however, as in FIG Fig. 2d shown increased areas 14 formed on the surface 8.
  • the material applied to the surface 8 comprises nickel or nickel compounds, the electrochemical treatment comprising nickel plating, for example by Immersion in a nickel bath. Optionally, then a chrome plating can be made (not shown).
  • the stencil layer 10 ' can be removed during the electrochemical treatment or after the electrochemical treatment in an additional step, so that a structured surface is exposed, which in particular is formed in part by the surface 8 and the raised regions 14.
  • a structured surface is in Fig. 2e wherein the structured surface may serve as a surface of a gravure mold or an embossing tool 16.
  • Wells or depressions 18 are formed between the raised areas 14, which can serve for a color pickup or embossing.
  • the surface 8 can thus be structured inexpensively, with high process speeds are achievable and also by the application of material, a lesser cost of materials arises.
  • the shape of the wells or depressions which is produced by structuring with the described method, can have, in particular in gravure printing, an improved color output compared with the prior art.
  • the depth profile of the wells or depressions 18 is less rounded than in the methods of the prior art (see Fig. La-c).
  • high resolutions of the structure can also be provided, the resolution being in particular 2540 dpi or 5080 dpi.
  • the surface 8 can also be further structured in order to obtain complex shapes of the wells or depressions. This is particularly advantageous in stamping tools.
  • FIG. 3a At first, another stencil layer 20 is shown which protrudes onto the structured surface Fig. 2e was applied.
  • the stencil layer 20 is subjected to a laser ablation, wherein laser radiation removes the stencil layer 20 in regions and thereby as in Fig. 3b recesses 22 are provided in a patterned stencil layer 20 '.
  • An electrochemical treatment of the structured surface is carried out, wherein material is applied so that raised regions 24 are formed in the region of the recesses 22 of the patterned stencil layer 20 '. For example, a nickel plating is performed again or another material is applied than in the previous electrochemical treatment.
  • a structured surface now remains with a multi-layered construction of raised areas 14, 24 and of the original surface 8.
  • the structured surface can serve as the surface of a gravure mold or an embossing tool 26.
  • the method steps can be repeated as often as desired, whereby correspondingly complex shapes and different material compositions of the raised regions 14, 24 or complex shapes of the intermediate wells or depressions 28 can be generated.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
EP17200585.2A 2017-11-08 2017-11-08 Procédé de structuration d'une surface, plaque d'héliogravure ou outil d'estampage ainsi qu'utilisation Withdrawn EP3482937A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP17200585.2A EP3482937A1 (fr) 2017-11-08 2017-11-08 Procédé de structuration d'une surface, plaque d'héliogravure ou outil d'estampage ainsi qu'utilisation

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EP17200585.2A EP3482937A1 (fr) 2017-11-08 2017-11-08 Procédé de structuration d'une surface, plaque d'héliogravure ou outil d'estampage ainsi qu'utilisation

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022116426A1 (de) 2022-06-30 2024-01-04 Hueck Rheinische Gmbh Verfahren zur Bearbeitung einer Oberfläche eines Presswerkzeugs
DE102022116427A1 (de) 2022-06-30 2024-01-04 Hueck Rheinische Gmbh Verfahren zur Bearbeitung einer Oberfläche eines Presswerkzeugs

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1002611A6 (fr) * 1988-12-07 1991-04-09 Centre Rech Metallurgique Procede pour former une rugosite deterministe a la surface d'un cylindre de laminoir.
WO1999021714A1 (fr) * 1997-10-24 1999-05-06 R.R. Donnelley & Sons Company Procedes de gravure de cylindres d'heliogravure
US20040216627A1 (en) 2001-03-01 2004-11-04 Igal Koifman Process and material for producing ir imaged gravure cylinders
EP3205499A1 (fr) 2016-02-10 2017-08-16 AKK GmbH Procede destine a structurer une surface d'un moule de rotogravure

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1002611A6 (fr) * 1988-12-07 1991-04-09 Centre Rech Metallurgique Procede pour former une rugosite deterministe a la surface d'un cylindre de laminoir.
WO1999021714A1 (fr) * 1997-10-24 1999-05-06 R.R. Donnelley & Sons Company Procedes de gravure de cylindres d'heliogravure
US20040216627A1 (en) 2001-03-01 2004-11-04 Igal Koifman Process and material for producing ir imaged gravure cylinders
EP3205499A1 (fr) 2016-02-10 2017-08-16 AKK GmbH Procede destine a structurer une surface d'un moule de rotogravure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022116426A1 (de) 2022-06-30 2024-01-04 Hueck Rheinische Gmbh Verfahren zur Bearbeitung einer Oberfläche eines Presswerkzeugs
DE102022116427A1 (de) 2022-06-30 2024-01-04 Hueck Rheinische Gmbh Verfahren zur Bearbeitung einer Oberfläche eines Presswerkzeugs

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