Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
  • H01F27/00—Details of transformers or inductances, in general
  • H01F27/28—Coils; Windings; Conductive connections
  • H01F27/2804—Printed windings
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
  • H01F27/00—Details of transformers or inductances, in general
  • H01F27/28—Coils; Windings; Conductive connections
  • H01F27/2823—Wires
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
  • H01F27/00—Details of transformers or inductances, in general
  • H01F27/08—Cooling; Ventilating
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
  • H01F27/00—Details of transformers or inductances, in general
  • H01F27/24—Magnetic cores
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
  • H01F27/00—Details of transformers or inductances, in general
  • H01F27/28—Coils; Windings; Conductive connections
  • H01F27/32—Insulating of coils, windings, or parts thereof
  • H01F27/323—Insulation between winding turns, between winding layers
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
  • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
  • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
  • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
  • H01F41/12—Insulating of windings
  • H01F41/122—Insulating between turns or between winding layers
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
  • H01F27/00—Details of transformers or inductances, in general
  • H01F27/28—Coils; Windings; Conductive connections
  • H01F27/2804—Printed windings
  • H01F2027/2809—Printed windings on stacked layers
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
  • H01F27/00—Details of transformers or inductances, in general
  • H01F27/28—Coils; Windings; Conductive connections
  • H01F27/2804—Printed windings
  • H01F2027/2814—Printed windings with only part of the coil or of the winding in the printed circuit board, e.g. the remaining coil or winding sections can be made of wires or sheets

Definitions

• the present invention relates to a transformer device, to a method for manufacturing a transformer device, to a corresponding device and to a corresponding computer program product.
• Galvanic isolation transformers can be made, for example, with copper wire windings on the primary side and on the secondary side around a ferrite core.
• Another possibility for this purpose may be, for example, planar transformers whose windings can be realized within a printed circuit board.
• the present invention provides an improved transformer device, an improved method of manufacturing a transformer device, an improved device, and an improved computer program product according to the main claims.
• Advantageous embodiments will become apparent from the dependent claims and the description below.
• a combination of a press-in element with a primary winding and a printed circuit board-based planar transformer with a secondary winding can be provided and thus a hybrid or hybrid planar transformer can be realized.
• advantages of conventionally wound transformers can be combined with advantages of planar transformers.
• primary winding and secondary winding can be arranged in structurally separate units coupled to one another, of which only at least one can be designed as a printed circuit board.
• a complexity of a printed circuit board assembly can be compared compared to a completely executed in planar design transformer can be reduced. Furthermore, for example, by eliminating the primary winding within the printed circuit board, inter alia, buried by contacting, so-called buried vias, omitted within the circuit board and thus a structure of the printed circuit board. be simplified.
• air gaps and creepage distances in particular can be realized by the insert made of, for example, plastic and need not be considered within the circuit board.
• a degree of copper filling of a winding window available in the transformer core can also be increased.
• a heat dissipation or heat dissipation can be improved, manufacturing can be simplified, air and creepage distances can be realized in a simplified manner, electrical contacting can also be realized differently than through screw connections or solder joints , can also be simplified in high current applications a construction and connection technology and can be reduced leakage inductance.
• a transformer device is presented, wherein the transformer device has a transformer core, at least one primary winding and at least one secondary winding, wherein the transformer device has an insert part, in which the at least one primary winding is arranged, and a printed circuit board, in which the at least one secondary winding is arranged, wherein the insert, the circuit board and the transformer core are coupled or coupled together.
• the transformer device may be implemented as a transformer device with galvanic isolation.
• the transformer core can be used as a ferrite core or Iron core be executed.
• the insert may be mechanically or optionally additionally electrically coupled or coupled to the printed circuit board.
• the insert part may comprise at least one stranded wire and an electrically insulating material.
• the at least one strand can be embedded in the electrically insulating material.
• the electrically insulating material may comprise a plastic material.
• the at least one strand can be a high-frequency strand.
• the insert may comprise a further printed circuit board, in which the at least one primary winding may be arranged.
• the insert part can also be realized in the form of a further or additional printed circuit board as an insert part. A number of layers of the two circuit boards can also be reduced by this embodiment.
• the insert may have at least one press-in element for pressing into the printed circuit board for coupling the insert to the printed circuit board.
• the at least one press-in element can be formed, for example, from a metallic material.
• the insert may have a plurality of press-in elements.
• two press-in elements of the plurality of press-fit elements can be formed as electrical connections for the primary winding.
• two press-in elements can be electrically connected to the primary winding and be contacted by pressing into the circuit board electrically.
• the circuit board may have a plurality of layers.
• the at least one secondary winding can be formed as at least one layer of the printed circuit board.
• the printed circuit board can be designed, for example, in particular four-layered with optional intermediate layers. Such an embodiment has the advantage that the at least one secondary winding can be realized in a space-saving manner.
• the printed circuit board can have at least one plated-through hole.
• the at least one via can extend through all the layers of the printed circuit board.
• the transformer device may have at least one heat sink for dissipating heat from the circuit board and additionally or alternatively from the insert part.
• the circuit board between the at least one heat sink and the insert can be arranged or arranged.
• the transformer device may also have a heat conducting layer for dissipating heat from the printed circuit board to the at least one heat sink.
• the heat conducting layer between the circuit board and the at least one heat sink can be arranged or arranged.
• the heat conducting layer can be embodied as a heat conducting foil in both ways. Such an embodiment offers the advantage that a dissipation of the heat and a heat transfer can be further improved.
• a method for manufacturing a transformer device comprising a step of forming an insert in which at least a primary winding of the transformer device is arranged, a step of constructing a printed circuit board, in which at least one secondary winding of the transformer device is arranged, and a step of copying the insert, the printed circuit board and a transformer core together.
• an embodiment of the above-mentioned transformer device can be advantageously produced.
• the molding step and the building step may be performed in parallel or at least partially sequentially in any order.
• partial assembly may be performed on the transformer core.
• At least one strand in the forming step, can be embedded in an electrically insulating material.
• the electrically insulating material may be a plastic material.
• a further printed circuit board with the at least one secondary winding can be constructed.
• the other circuit board can be multi-layered.
• the at least one secondary winding can be formed as at least one layer of the further printed circuit board.
• the device may be an electrical device that processes electrical signals, for example sensor signals, and outputs control signals in response thereto.
• the device may have one or more suitable interfaces, which may be formed in hardware and / or software.
• the interfaces can be part of an integrated circuit in which functions of the device are implemented.
• the interfaces may also be their own integrated circuits or at least partially consist of discrete components.
• the interfaces may be software modules that are present, for example, on a microcontroller in addition to other software modules.
• a computer program product with program code which can be stored on a machine-readable carrier such as a semiconductor memory, a hard disk memory or an optical memory and is used to carry out the method according to one of the embodiments described above if the program is installed on a computer or a device is also of advantage is performed.
• Fig. 1 is a schematic sectional view of a planar transformer
• FIG. 2 is a schematic sectional view of a transformer device according to an embodiment of the present invention.
• FIG. 3 is a schematic sectional view of a partial section of the transformer device from FIG. 2; FIG.
• Fig. 4 is a schematic sectional view of the insert of the transformer device of Fig. 2;
• Fig. 5 is a schematic sectional view of the printed circuit board of the transformer device of Fig. 2;
• Fig. 6 is a schematic representation of the printed circuit board of the transformer device of Fig. 2;
• Fig. 7 is a schematic representation of the insert of the transformer device of Fig. 2;
• Fig. 8 is a flowchart of a method of manufacturing according to an embodiment of the present invention.
• Fig. 9 is a schematic representation of a device according to an embodiment of the present invention.
• FIG. 1 shows a schematic sectional view of a planar transformer 100.
• FIG. 1 shows a merely exemplary 8-layer printed circuit board construction of a planar transformer 100.
• the primary winding and secondary winding of the planar transformer 100 are arranged in a single printed circuit board.
• the second layer 102, the third layer 103, the sixth layer 106 and the seventh layer 107 are used for the primary winding
• the first layer 101, the fourth layer 104, the fifth layer 105 and the eighth layer 108 used for the secondary winding become.
• the printed circuit board construction of the printed circuit board furthermore has, by way of example only, a through-connection 130 and only two buried through-contacts 140 or so-called buried vias, by way of example.
• FIG. 2 shows a schematic sectional view of a transformer device 200 according to an exemplary embodiment of the present invention.
• the transformer Device 200 has a transformer core 210, which is formed, for example, from ferrite. Furthermore, the transformer device 200 has an insert 220, in which at least one primary winding of the transformer device 200 is arranged or formed.
• the transformer device 200 also has a printed circuit board 230, in which at least one secondary winding of the transformer device 200 is arranged or formed.
• the insert 220, the circuit board 230 and the transformer core 210 are mechanically coupled together.
• the insert 220 and the printed circuit board 230 are at least partially disposed in the transformer core 210.
• the insert 220 and the printed circuit board 230 represent separate, mutually coupled assemblies or elements.
• the at least one primary winding and the at least one secondary winding are arranged in separate elements.
• the at least one primary winding is realized by means of the insert 220, wherein the at least one secondary winding is realized by means of the printed circuit board 230.
• the insert 220 and the circuit board 230 will be discussed in more detail below with reference to the following figures.
• the insert 220 has a plurality of press-fit elements 225, of which only two press-in elements 225 are explicitly shown, for reasons of the illustration.
• the press-fit elements 225 are formed to be pressed into the circuit board 230 to couple the insert 220 to the circuit board 230.
• the press-in elements 225 are pressed into the circuit board 230.
• the transformer device 200 illustratively has a heat sink 240 for dissipating heat from the circuit board 230 and / or the insert 220.
• the printed circuit board 230 is arranged between the heat sink 240 and the insert 220.
• the heat sink 240 is thermally coupled at least to the circuit board 230.
• the transformer device 200 in this case has a heat conducting layer 250 for dissipating heat from the printed circuit board 230 to the heat sink 240.
• the heat conducting layer 250 is between the printed circuit board 230 and arranged the heat sink 240.
• the heat conducting layer 250 is designed, for example, as a heat conducting foil.
• the heat sink 240 is thermally coupled via the heat conducting layer 250 at least to the printed circuit board 230.
• FIG. 3 shows a schematic sectional view of a partial section of the transformer device from FIG. 2.
• the transformer core 210, the insert 220 and the printed circuit board 230 are shown in the transformer device.
• the primary winding of the transformer device is arranged in the insert 220.
• the secondary winding of the transformer device is arranged in the printed circuit board 230.
• FIG. 4 shows a schematic sectional view of the insert 220 of the transformer device from FIG. 2.
• the primary winding 460 is explicitly shown.
• the primary winding 460 is realized by means of at least one strand 422 or high-frequency strand 422, which is embedded in an electrically insulating material 424 as encapsulation for electrical insulation.
• the electrically insulating material 424 is, for example, a plastic material.
• the insert 220 has the strand 422 and the high-frequency strand 422 and the electrically insulating material 424, respectively.
• the primary winding 460 is formed by means of the strand 422 or high-frequency strand 422.
• the insert 220 may have another circuit board relationship manner be realized as a further circuit board in which the primary winding is arranged.
• the printed circuit board 230 has an exemplary 4-layer printed circuit board construction of a planar transformer with secondary winding and without a primary winding.
• the circuit board 230 has a plurality of layers 531, 532, 533, 534, 535, and 536.
• the at least one secondary winding of the transformer device is formed as at least one layer 531, 532, 533 and / or 534 of the printed circuit board.
• the printed circuit board 230 also has, for example, only one through-connection 537.
• the through-connection 537 extends through all layers 531, 532, 533, 534, 535 and 536 of the printed circuit board 230.
• FIG. 6 shows a schematic illustration of the printed circuit board 230 of the transformer device from FIG. 2.
• the printed circuit board 230 is shown in a schematic plan view or partially transparent top view.
• FIG. 6 explicitly shows a secondary winding 670 in the printed circuit board 230.
• the secondary winding 670 is formed or realized as at least one layer or in at least one layer of the printed circuit board 230.
• FIG. 7 shows a schematic representation of the insert 220 of the transformer device of FIG. 2.
• the insert 220 is shown in a schematic plan view or partially transparent plan view.
• a plurality of press-fit elements 225 and 725, the strand 422 and high-frequency strand 422, the electrically insulating material 424 and the primary winding 460 are shown in FIG.
• the primary winding 460 is realized in the insert 220 by means of the high-frequency strand 422.
• the high-frequency strand 422 is wound several times here.
• the high-frequency strand 422 is embedded or cast in the electrically insulating material 424.
• the insert 220 has the plurality of press-fit elements 225 and 725. More specifically, the insert 220 has, by way of example only, four press-fit elements 225 and 725. Of these, merely by way of example, two press-in elements 225 for fastening the insert 220 or pressing the insert 220 into the clamping formed terplatte the transformer device.
• two other press-fit elements 725 of the plurality of press-fit elements 225 and 725 are formed as electrical connections for the primary winding 460 and for fastening the insert 220 or press-fitting the insert 220 into the printed circuit board of the transformer device.
• the press-fit 725 serve both an electrical contact of the primary winding 460 and a mechanical fixation of the insert 220. In other words, thus electrical connections for the primary winding 460 or primary winding 460 are connected or combined with two press-in elements 725.
• FIG. 8 shows a flowchart of a method 800 for the production method 800 according to an embodiment of the present invention.
• the manufacturing method 800 is executable to manufacture a transformer device. More specifically, the manufacturing method 800 is executable to manufacture the transformer device of FIG. 2 or a similar transformer device.
• the manufacturing method 800 comprises a step 810 of forming an insert, in which at least one primary winding of the transformer device is arranged. Also, the manufacturing method 800 comprises a step 820 of constructing a printed circuit board in which at least one secondary winding of the transformer device is arranged. Further, the manufacturing method 800 includes a step 830 of interfitting the insert, the circuit board, and a transformer core.
• the step 810 of the forming and the step 820 of the construction can be carried out in any order and additionally or alternatively at least partially in parallel.
• step 810 of the molding at least one strand is embedded in an electrically insulating material.
• 9 shows a schematic representation of a device 900 according to an embodiment of the present invention.
• the device 900 is designed as a control unit.
• the device 900 is configured to effect production of a transformer device. More specifically, device 900 is configured to effect manufacture of the transformer device of FIG. 2 or similar transformer device.
• the device 900 is signal transmitting capable connected to a manufacturing system 950.
• the manufacturing system 950 includes, by way of example only, a first machine 960, a second machine 970, and a third machine 980.
• the device 900 has a molding device 910, which is designed to control the first machine 960 for forming an insert, in which at least one primary winding of the transformer device is arranged.
• the device 900 also has a build-up device 920, which is designed to control the second machine 970 for constructing a printed circuit board, in which at least one secondary winding of the transformer device is arranged.
• the device 900 has a coupling device 930, which is designed to control the third machine 970 for coupling the insert, the printed circuit board and a transformer core together.
• an exemplary embodiment comprises a "and / or" link between a first feature and a second feature
• this can be read so that the embodiment according to one embodiment, both the first feature and the second feature and according to another embodiment, either only the first Feature or only the second feature.

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• Engineering & Computer Science (AREA)
• Power Engineering (AREA)
• Manufacturing & Machinery (AREA)
• Coils Or Transformers For Communication (AREA)
• Coils Of Transformers For General Uses (AREA)
• Manufacturing Cores, Coils, And Magnets (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=58709954

Family Applications (1)

Country Status (6)

Families Citing this family (2)

Family Cites Families (18)

• 2016
  • 2016-06-22 DE DE102016211085.3A patent/DE102016211085A1/de active Pending
• 2017
  • 2017-05-16 US US16/310,604 patent/US11393620B2/en active Active
  • 2017-05-16 CN CN201780038846.6A patent/CN109564811A/zh active Pending
  • 2017-05-16 EP EP17723999.3A patent/EP3475960A1/de not_active Withdrawn
  • 2017-05-16 JP JP2018567120A patent/JP2019522901A/ja active Pending
  • 2017-05-16 WO PCT/EP2017/061703 patent/WO2017220255A1/de unknown

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