EP3335249A1 - Appareil de traitement d'un substrat utilisé dans la fabrication d'une cellule solaire, et procédé de traitement d'un substrat utilisé dans la fabrication d'une cellule solaire - Google Patents

Appareil de traitement d'un substrat utilisé dans la fabrication d'une cellule solaire, et procédé de traitement d'un substrat utilisé dans la fabrication d'une cellule solaire

Info

Publication number
EP3335249A1
EP3335249A1 EP16787898.2A EP16787898A EP3335249A1 EP 3335249 A1 EP3335249 A1 EP 3335249A1 EP 16787898 A EP16787898 A EP 16787898A EP 3335249 A1 EP3335249 A1 EP 3335249A1
Authority
EP
European Patent Office
Prior art keywords
line pattern
dimension
substrate
combined
processing device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP16787898.2A
Other languages
German (de)
English (en)
Inventor
Alessandro VOLTAN
Marco Galiazzo
Luigi De Santi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Italia SRL
Original Assignee
Applied Materials Italia SRL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Italia SRL filed Critical Applied Materials Italia SRL
Publication of EP3335249A1 publication Critical patent/EP3335249A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1876—Particular processes or apparatus for batch treatment of the devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • Embodiments of the present disclosure relate to an apparatus for processing of a substrate used in the manufacture of a solar cell, and a method for processing of a substrate used in the manufacture of a solar cell.
  • Embodiments of the present disclosure particularly relate to apparatuses and methods for deposition of a material on a substrate used in the manufacture of a solar cell, such as double printing of line patterns or printing tracks, e.g., fingers and/or busbars, of a solar cell.
  • Solar cells are photovoltaic (PV) devices that convert sunlight directly into electrical power.
  • PV photovoltaic
  • a substrate such as a crystalline silicon base
  • disposition techniques such as screen printing
  • the line patterns can be subsequently formed in a plurality of deposition processes.
  • the line patterns deposited during the deposition processes should be aligned with respect to each other in view of a quality of the manufactured solar cell.
  • the alignment of the line patterns with respect to each other can affect electrical characteristics, such as an output power, of the manufactured solar cell.
  • an apparatus for processing of a substrate such as a first substrate and a second substrate, used in the manufacture of a solar cell.
  • the apparatus includes an inspection assembly configured to detect a first dimension of a first line pattern on the first substrate, a processing device configured to provide a second line pattern over the first line pattern to form a combined line pattern, wherein the inspection assembly is further configured to detect a second dimension of the combined line pattern, and an alignment device configured to align the processing device and/or the second substrate based on the first dimension and the second dimension.
  • a method for processing of a substrate such as a first substrate and a second substrate, used in the manufacture of a solar cell.
  • the method includes detecting a first dimension of a first line pattern on the first substrate, providing a second line pattern over the first line pattern to form a combined line pattern, detecting a second dimension of the combined line pattern, and aligning a processing device and/or the second substrate based on the first dimension and the second dimension.
  • Embodiments are also directed at apparatuses for carrying out the disclosed method and include apparatus parts for performing each described method aspect. These method aspects may be performed by way of hardware components, a computer programmed by appropriate software, by any combination of the two or in any other manner. Furthermore, embodiments according to the disclosure are also directed at methods for operating the described apparatus. The methods for operating the described apparatus include method aspects for carrying out every function of the apparatus. BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 shows a schematic view of an apparatus for processing of a substrate used in the manufacture of a solar cell according to embodiments described herein;
  • FIGs. 2A and B show a solar cell having a combined line pattern according to embodiments described herein;
  • FIG. 3 shows a flow chart of a method for processing of a substrate used in the manufacture of a solar cell according to embodiments described herein;
  • FIGs. 4A to C show a sequence of a method for processing of a substrate used in the manufacture of a solar cell according to embodiments described herein;
  • FIGs. 5A to C show examples for first dimensions and second dimensions of the line patterns on a substrate according to embodiments described herein;
  • FIG. 6 shows a system for production of a solar cell according to embodiments described herein.
  • line patterns can be subsequently provided, e.g., printed, on top of each other, for example, in a screen printing process.
  • the line patterns should be aligned with respect to each other in view of a quality of the manufactured solar cell.
  • the alignment of the line patterns with respect to each other can affect electrical characteristics, such as an output power, of the manufactured solar cell.
  • the present disclosure performs a double inspection of the line patterns provided on a substrate to align line patterns to be provided on a subsequent substrate.
  • a first dimension such as a first width of the first line pattern is detected and then a second line pattern is provided, e.g., deposited, on top of the first line pattern.
  • a second dimension such as a second width of the combined line pattern is detected.
  • the processing device and/or the subsequent substrate can be aligned using the information obtained from the first dimension and the second dimension.
  • the first dimension and the second dimension can be compared and a misalignment of the second line pattern with respect to the first line pattern can be derived from the comparison.
  • FIG. 1 shows a schematic view of an apparatus 100 for processing of a substrate 10, such as a first substrate and a second substrate, used in the manufacture of a solar cell according to embodiments described herein.
  • the apparatus 100 according to the present disclosure can be part of a serial production line and can be configured to manufacture solar cells.
  • the apparatus 100 includes an inspection assembly 110 configured to detect (or determine or measure) a first dimension of a first line pattern on the first substrate, a processing device, such as a deposition device 120, configured to provide or deposit a second line pattern over, e.g., on top of, the first line pattern to form a combined line pattern, wherein the inspection assembly 110 is further configured to detect (or determine or measure) a second dimension of the combined line pattern, and an alignment device 130 configured to align the processing device (or a portion of the processing device, e.g., a process head and/or a screen) and/or a second substrate based on the first dimension and the second dimension.
  • the second substrate is a substrate that is to be processed after the first substrate.
  • dimension can be used synonymously with, for example, "extension”.
  • the processing device 120 uses the deposition device 120 as the processing device.
  • the processing device can be selected from the group consisting of a printing head, a printing head configured for screen printing, a jet printer, a laser device, and any combination thereof.
  • the apparatus 100, and particularly the processing device can be configured for double printing, multiple printing, jet printing, and/or laser scribing.
  • the first dimension and the second dimension can be compared and a misalignment of the second line pattern with respect to the first line pattern can be derived from the comparison.
  • the first dimension and the second dimension can correspond to each other so as to be comparable.
  • both the first dimension of the second dimension can be widths and/or lengths of the respective line patterns.
  • the misalignment can be determined when the second dimension is larger than the first dimension. A substantially perfect alignment can be assumed when the first dimension and the second dimension are substantially equal. If a misalignment is determined, the alignment of the second substrate, which is a subsequent substrate, can be performed such that the misalignment is corrected for the second substrate.
  • a process for forming the first line pattern and/or the second line pattern can be performed more accurately.
  • the embodiments of the present disclosure can perform a closed-control.
  • the combined line pattern can form conductive lines of the solar cell, such as fingers and/or a busbars.
  • the first line pattern and the second line pattern can be deposited, e.g., printed, on top of each other in a double printing process to form fingers of the solar cell.
  • An exemplary solar cell having the combined line pattern is shown in FIGs. 2A and B.
  • the apparatus 100 includes a rotary table 140 rotatable around a rotational axis 142 for moving the substrate 10 between at least the inspection assembly 110 and the processing device, such as the deposition device 120.
  • the present disclosure is not limited thereto and transport devices other than the rotary table 140, such as linear transport devices, can be used for transporting the substrate 10 between at least the inspection assembly 110 and the processing device.
  • the inspection assembly 110 can be included in, or be, an inspection station.
  • the processing device can be included in a processing station, such as a deposition station, a printing station, or a laser scribing station.
  • the substrate 10 is positioned on a substrate support, such as a moveable substrate support ("shuttle"), which can be attached to the rotary table 140.
  • the rotary table 140 has the substrate support.
  • the rotary table 140 can provide a support surface on which the substrate 10 can be positioned.
  • the processing device is configured for screen printing.
  • the processing device can be a printing head and the apparatus 100 can be configured for double printing or more, such as triple printing.
  • the processing device can include a screen and a printing device having, for example, at least one squeegee and optionally at least one floodbar.
  • the screen may include at least one of a net, a printing mask, a sheet, a metal sheet, a plastic sheet, a plate, a metal plate, and a plastic plate.
  • the screen defines a screen pattern or features corresponding to a structure to be printed on the substrate 10, wherein the screen pattern or features may include at least one of holes, slots, incisions or other apertures.
  • the printing device such as the squeegee contacts the screen, wherein the printing device urges material to be printed onto the substrate 10 through the screen, and particularly through the apertures defining, for example, the first line pattern and/or the second line pattern.
  • the inspection assembly 110 includes one or more cameras configured to detect the first dimension and the second dimension.
  • the one or more cameras can be high-resolution cameras.
  • the first dimension and/or the second dimension can be stored in the one or more cameras, for example, for further processing.
  • the second dimension can be compared with the first dimension previously stored and the camera.
  • at least one camera of the one or more cameras can be a matrix camera.
  • at least one camera of the one or more cameras, and particularly each camera can have a resolution of 1 megapixel more, and can specifically have a resolution of 2 megapixel or more.
  • the one or more cameras can have a resolution of 30 micrometers or less per pixel, specifically 20 micrometers or less per pixel, and more specifically 10 micrometers or less per pixel.
  • the one or more cameras can include a single camera, such as a matrix camera, or a system of cameras, such as matrix cameras.
  • the one or more cameras can be 2 cameras, 3 cameras, or 4 cameras.
  • the first dimension and/or the second dimension can be detected (or determined or measured) by counting pixels in a predetermined direction which show a respective line of the line pattern.
  • the one or more cameras include one or more first cameras configured to detect the first dimension and one or more second cameras configured to detect the second dimension.
  • the first dimension and the second dimension can be detected using different cameras.
  • the inspection assembly 110 can have at least two sub-assemblies, for example, provided at different positions of the rotary table 140.
  • one sub-assembly of the two subassemblies, such as the one or more first cameras can be provided at an "in” or "entry” position of the rotary table 140 (indicated with number "1" in FIG. 6).
  • Another subassembly of the two sub-assemblies can be provided at an "out” or “exit” position of the rotary table 140 (indicated with number "3" in FIG. 6).
  • the one or more second cameras can be high resolution cameras, such as APPVs.
  • the one or more cameras are configured to detect both the first dimension and the second dimension.
  • the first dimension and the second dimension are detected by the same camera(s).
  • the first dimension and the second dimension can be detected when the substrate 10 is at substantially the same position.
  • the first line pattern can be provided on the substrate 10 at a position corresponding to the processing device.
  • the rotary table 140 can then be rotated to move the substrate 10 to the inspection assembly 110 to detect the first dimension.
  • the rotary table 140 can be rotated to move the substrate 10 from the inspection assembly 110 to the same processing device or another processing device for providing the second line pattern on top of the first line pattern.
  • the first line pattern and the second line pattern can be deposited using the same deposition device, and particularly using the same screen.
  • the substrate 10 can then be moved back to the inspection assembly 110 by a rotation of the rotary table 140 for detection of the second dimension.
  • the alignment device 130 is configured to position or change an orientation of the processing device or a part thereof and/or the substrate 10, such as the first substrate and the second substrate.
  • the alignment device 130 can position the substrate 10 with respect to the processing device, e.g., with respect to a printing device and/or a screen. Additionally or alternatively, the alignment device 130 can position at least a part of the processing device, such as the printing device (process head) and/or the screen with respect to the substrate 10.
  • the substrate 10 is positioned on the substrate support, such as the moveable substrate support ("shuttle"), which can be attached to the rotary table 140.
  • the substrate 10 can be aligned using the substrate support.
  • the alignment device 130 can be configured to align the substrate support for aligning the substrate 10 positioned thereon.
  • the alignment device 130 can be included in the substrate support.
  • the alignment device 130 can be provided at, or included in, the rotary table 140.
  • the alignment device 130 is configured to position or align the processing device and/or the substrate 10, such as the second substrate, in the X-direction and the Y-direction, and/or is configured to adjust an angular orientation of the processing device and/or the substrate 10 e.g. to a target orientation.
  • the X-direction and the Y-direction may be the X-direction and the Y-direction of a Cartesian coordinate system, and may in particular define the horizontal plane.
  • the angular orientation may refer to an angular orientation of the substrate 10, the substrate support (e.g. a support surface supporting the substrate 10) and/or the deposition device 120 (e.g. the screen).
  • the angular orientation can be defined as an angle (e.g., theta) between a first reference line at the substrate 10 or substrate support and a second reference line at the target such as the deposition device 120.
  • the alignment device 130 is configured to calculate at least one of an X correction value, a Y correction value, and an angular correction value to align the processing device and/or the substrate 10, such as the second substrate.
  • the alignment device 130 is configured to compare the first dimension and the second dimension and calculate at least one of the X correction value, the Y correction value, and the angular correction value based on a comparison result to align the second substrate.
  • the alignment device 130 is configured to adjust at least one of the position and the angular orientation of the processing device or a part thereof and/or the substrate 10 before providing, e.g., depositing or printing, the first line pattern on the substrate 10. By performing the adjustment before forming the first line pattern on the substrate, the first line pattern can be aligned with respect to the substrate 10. A quality of the produced solar cell can be increased.
  • the inspection assembly 110 is configured for a closed loop or feedback control. By adjusting the position and/or the angular orientation for the subsequent substrate, a position accuracy of line patterns on the subsequent substrate(s) can be improved.
  • the alignment device 130 can include one or more actuators for aligning the position and/or the angular orientation of the processing device (e.g., the process head and/or the screen) and/or the substrate 10 e.g. in the horizontal plane.
  • the one or more actuators can include a stepper motor, a pneumatic motor and/or a server motor.
  • the alignment device 130 can include three actuators.
  • a first actuator can be provided for moving or positioning the processing device or a part thereof and/or the substrate 10 e.g. using the substrate support in an X-direction.
  • a second actuator can be provided for moving or positioning the processing device or a part thereof and/or the substrate 10 e.g.
  • a third actuator can be provided for angularly moving or positioning the processing device or a part thereof and/or the substrate 10 e.g. using the substrate support.
  • the first actuator and the second actuator can be linear actuators, and/or the third actuator can be a rotary actuator.
  • the inspection assembly 110 is further configured for a quality check of the first line pattern and/or the second line pattern on the substrate 10.
  • the inspection assembly 110 may use images or data taken by the one or more cameras for the quality check of the line pattern(s) on the substrate 10.
  • the inspection assembly 110 may be used for multiple tasks, such as the alignment and the quality check.
  • FIGs. 2A and B show a solar cell having a combined line pattern 12 according to embodiments described herein.
  • FIG. 2A shows a top view of the solar cell
  • FIG. 2B shows a side view of the solar cell.
  • FIGs. 2A and B exemplarily illustrate fingers of the solar cell.
  • the solar cell includes the substrate 10 having the combined line pattern 12 provided, e.g., deposited, thereon.
  • the combined line pattern 12 includes, or consists of, the first line pattern 13 and the second line pattern 14.
  • the first line pattern 13 and the second line pattern 14 can be provided, e.g., printed or laser scribed, on top of each other e.g. in a double printing process or laser scribing process.
  • the first line pattern 13 can be directly deposited on the substrate 10 and/or the second line pattern 14 can be directly printed on the first line pattern 13.
  • a printing material used in the printing of the first line pattern 13 and the second line pattern 14 may include, or be, silver. According to some embodiments, which can be combined with other embodiments described herein, the printing material can be selected from the group consisting of silver, aluminum, copper, tin, nickel, silicon based pastes, and any combination thereof.
  • the term "over” e.g., the second line pattern 14 being over the first line pattern 13, it is understood that, starting from the substrate 10, the first line pattern 13 is provided over the substrate 10, and the second line pattern 14, provided after the first line pattern 13, is thus over the first line pattern 13 and over the substrate 10.
  • the term "over” is used to define an order of line patterns, wherein the starting point is the substrate 10. This is irrespective of whether the solar cell is depicted upside down or not.
  • FIG. 3 shows a flow chart of a method 300 for processing of a substrate used in the manufacture of a solar cell according to embodiments described herein.
  • FIGs. 4 A to C show a sequence of the method 300 for processing of a substrate used in the manufacture of a solar cell according to embodiments described herein.
  • the method 300 can utilize the apparatus according to the embodiments described therein.
  • the method 300 can be a method for double printing, multiple printing, e.g., triple printing, laser scribing, or any combination thereof.
  • the first line pattern can be formed by laser scribing
  • the second line pattern can be formed by a deposition technique, such as screen printing.
  • the method 300 includes in block 310 a detecting of a first dimension of a first line pattern on a first substrate, in block 320 a providing, e.g., depositing, of a second line pattern over the first line pattern to form a combined line pattern, in block 330 a detecting of a second dimension of the combined line pattern, and in block 340 an aligning of a processing device and/or a second substrate based on the first dimension and the second dimension.
  • the aligning of the second substrate can be performed as described with respect to FIG. 1.
  • the method 300 can be performed at predetermined times during production of solar cells, such as once per day or less, and specifically once per hour or less.
  • the closed-loop control provided by the present disclosure is, according to some embodiments, not performed for each produced solar cell. Instead, the closed-loop control can be performed at regular or irregular intervals in order to improve an alignment without reducing a throughput of the solar cell production system.
  • the aligning of the processing device and/or the second substrate includes an aligning of the processing device and/or the second substrate based on the first dimension and the second dimension of the first substrate before providing, e.g., depositing, another first line pattern on the second substrate. Additionally or alternatively, the aligning of the processing device and/or the second substrate includes an aligning of the processing device and/or the second substrate based on the first dimension and the second dimension of the first substrate before providing, e.g., depositing, another second line pattern on or over the other first line pattern on the second substrate.
  • the method 300 further includes a comparing of the first dimension and the second dimension, a calculating of at least one of an X correction value, a Y correction value, and an angular correction value based on a comparison result, and an aligning of the processing device and/or the second substrate.
  • the comparing of the first dimension and the second dimension includes a determining of a relative enlargement of the combined line pattern with respect to the first line pattern. As an example, it can be determined how much larger the second dimension is compared to the first dimension. The alignment can be performed based on the determined relative enlargement. As an example, at least one of the X correction value, the Y correction value, and the angular correction value can be calculated to compensate for the relative enlargement of a combined line pattern on the second substrate, which is a subsequent substrate.
  • FIGs. 4A to C a sequence of the method of the present disclosure is illustrated.
  • the substrate 10 is positioned at the inspection assembly 110 to detect the first dimension.
  • the rotary table 140 is rotated to move the substrate 10 from the inspection assembly 110 to the processing device, such as the deposition device 120, for providing the second line pattern on top of the first line pattern.
  • the substrate 10 is then moved back to the inspection assembly 1 10 by a rotation of the rotary table 140 for detecting the second dimension.
  • the method for processing of a substrate used in the manufacture of a solar cell can be conducted using computer programs, software, computer software products and the interrelated controllers, which can have a CPU, a memory, a user interface, and input and output devices being in communication with the corresponding components of the apparatus for processing a large area substrate.
  • FIG. 5 A to C show examples of the first dimensions and the second dimension of the line patterns deposited on a substrate 10, such as the first substrate and/or the second substrate, according to embodiments described herein.
  • the first dimension of the first line pattern includes a width and/or a length e.g. of one or more individual lines of the first line pattern.
  • the first dimension of the first line pattern is a width or a length e.g. of an individual line of the first line pattern.
  • the second dimension of the combined pattern can include a width and/or a length e.g. of an individual line of the combined line pattern.
  • the second dimension of the combined line pattern is a width or a length e.g. of the individual lines of the combined line pattern.
  • the widths of the line patterns can also be referred to as "line widths".
  • the line patterns, and particularly the individual lines of the line patterns can have the aforementioned lengths and the widths.
  • the length of the line patterns, and particularly of the individual lines is substantially parallel to a processing direction, e.g., a printing direction, of the processing device and the width of the line patterns is substantially perpendicular to the processing direction.
  • the width of the first line pattern and/or the combined line pattern can be an average width or a maximum width.
  • the average width can be determined with respect to the length of the respective line pattern.
  • the average width can be determined over 50% or more, 75% or more, 90%> or more, or 100% of the length of the line pattern.
  • the average width can be determined over substantially the entire length of the respective line pattern, such as the first line pattern and the combined line pattern.
  • the length of the first line pattern and/or the combined line pattern can be an average length or a maximum length.
  • the average length can be determined with respect to the width, such as the average width or maximum width, of the respective line pattern.
  • the average length can be determined over substantially the entirety of the respective line pattern, such as the first line pattern and the combined line pattern.
  • the width of at least one of the first line pattern, the second line pattern and the combined line pattern can be 100 micrometers or less, specifically 80 micrometers or less, specifically 60 micrometers or less, and more specifically 40 micrometers or less.
  • a thickness of the combined line pattern formed by the first line pattern and the second line pattern superimposed on the first line pattern can be 15 micrometers or more, specifically 20 micrometers or more, and more specifically 30 micrometers or more.
  • the first dimension is detected for one or more lines of the first line pattern.
  • the second dimension can be detected for one or more lines of the second line pattern.
  • the first dimension and/or the second dimension can be determined for one or more lines which are present in a predetermined area (e.g., a detection area) on the substrate. If more than one line is used for detecting the first dimension and the second dimension, a dimension of each individual line of the more than one lines of the line pattern can be detected.
  • the first dimension and/or the second dimension can be defined, for example, as an average of the dimensions of each of the individual lines of the respective line pattern.
  • the first line pattern 510 has a width wl and a length 11.
  • the second line pattern 520 has a width w2 and a length 12.
  • the first line pattern 510 and the second line pattern 520 are tilted with respect to each other. In other words, the first line pattern 510 and the second line pattern 520 are misaligned with respect to each other.
  • the width twl of the combined line pattern can be defined as the maximum width or maximum extension of the combined line pattern in a width direction of the combined line pattern.
  • the length til of the combined line pattern can be defined as the maximum length or maximum extension of the combined line pattern in a length direction of the combined line pattern.
  • the first line pattern 610 has a width wl and a length 11.
  • the second line pattern 620 has a width w2 and a length 12.
  • the first line pattern 610 and the second line pattern 620 are offset with respect to each other in the width direction.
  • the width tw2 of the combined line pattern can be defined as the maximum width or maximum extension of the combined line pattern in the width direction.
  • the length tl2 of the combined line pattern can be defined as the maximum length or maximum extension of the combined line pattern in the length direction.
  • the first line pattern 710 has a width wl and a length 11.
  • the second line pattern 720 has a width w2 and a length 12.
  • the first line pattern 710 and the second line pattern 720 are offset with respect to each other in the width direction and the length direction.
  • the width tw3 of the combined line pattern can be defined as the maximum width or maximum extension of the combined line pattern in the width direction.
  • the length tl3 of the combined line pattern can be defined as the maximum length or maximum extension of the combined line pattern in the length direction.
  • FIG. 6 shows a system for production of solar cells according to embodiments described herein.
  • the system includes a transport device, such as a rotary table 1000, the processing device 910, and the inspection assembly 920 according to embodiments described therein.
  • the system includes an input device 3100 configured for transferring the substrate 10 to the rotary table 1000 and an output device 3200 configured for receiving the substrate 10 having the first line pattern and the second line pattern printed thereon from the rotary table 1000.
  • the input device 3100 can have an incoming conveyor.
  • the incoming conveyor can have one or more first conveyor belts.
  • the incoming conveyor may include two first conveyor belts 3150 arranged in parallel, for example, at a distance of between 5 cm and 15 cm from each other.
  • the output device 3200 can be configured to receive the substrate 10 having the first line pattern and the second line pattern printed thereon from the rotary table 1000.
  • the output device 3200 can have an outgoing conveyor.
  • the outgoing conveyor can have one or more second conveyor belts.
  • the outgoing conveyor may include two second conveyor belts 3250 arranged in parallel, for example, at a distance to each other of between 5 cm and 15 cm.
  • the input device 3100 and the output device 3200 may be automated substrate handling devices that are part of a larger production line.
  • the system includes the apparatus according to the present disclosure, and particularly the processing device 910, which can be a printing device e.g. configured for screen printing on the substrate 10, the inspection assembly 920, and the alignment device (not shown).
  • the processing device 910 can extend over the rotary table 1000. Providing the first line pattern and/or the second line pattern can be done while the substrate 10 is positioned at a processing position 2.
  • the rotary table 1000 can be rotatable around a rotation axis 1050.
  • the rotary table 1000 can be configured to be rotatable around the rotation axis 1050 at least between a substrate receiving position 1 and the processing position 2.
  • the rotary table 1000 is configured to be rotatable between the substrate receiving position 1, the processing position 2, and at least one of a substrate discharge position 3 and a substrate dump position 4.
  • the rotary table 1000 is configured to rotate and transport substrates 10 along an orbit as defined by the rotary table's rotational movement, e.g., around the rotation axis 1050.
  • the rotary table 1000 may be rotated in order to move the substrates 10 positioned on the rotary table 1000 or a substrate support (e.g., moveable substrate support or shuttle) attached to the rotary table 1000 according to a clockwise or anti-clockwise rotation.
  • the rotary table 1000 can be configured to accelerate to a maximum rotational speed and then to decelerate the movement again to halt the rotary table 1000 again.
  • a rotation angle between adjacent positions can be about 90°.
  • the rotary table 1000 can be rotated by 90° for moving the substrate 10 from the substrate receiving position 1 to the processing position 2.
  • the rotary table 1000 can be rotated by 90° for moving the substrate 10 from the processing position 2 to the substrate discharge position 3.
  • FIG. 6 shows the processing device 910 at the processing position 2 and the inspection assembly 920 at the substrate receiving position 1 , it is to be understood that the present disclosure is not limited thereto and that the processing device 910 and/or the inspection assembly 920 provided at different positions of, for example, the rotary table 1000.
  • the present disclosure performs a double inspection of the line patterns provided on a substrate to align line patterns to be provided on a subsequent substrate.
  • a first dimension such as a first width of the first line pattern is detected and then a second line pattern is provided, e.g., deposited, on top of the first line pattern.
  • a second dimension such as a second width of the combined line pattern is detected.
  • the processing device and/or the subsequent substrate can be aligned using the information obtained from the first dimension and the second dimension.
  • the first dimension and the second dimension can be compared and a misalignment of the second line pattern with respect to the first line pattern can be derived from the comparison.
  • the alignment for the subsequent substrate can be performed such that the misalignment is corrected for the second substrate.
  • an alignment of another first line pattern and/or another second line pattern on the subsequent substrate can be improved.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Photovoltaic Devices (AREA)

Abstract

L'invention concerne un appareil (100) pour le traitement d'un substrat (10) utilisé dans la fabrication d'une cellule solaire. L'appareil (100) comprend un ensemble d'inspection (110) configuré pour détecter une première dimension d'un premier motif de ligne (13) sur un premier substrat, un dispositif de traitement (120) configuré pour fournir un second motif de ligne (14) sur le premier motif de ligne (13) pour former un motif de ligne combiné (12), l'ensemble d'inspection (110) étant en outre configuré pour détecter une seconde dimension du motif de ligne combiné (12), et un dispositif d'alignement (130) configuré pour aligner au moins le dispositif de traitement (120) et/ou un second substrat sur la base de la première dimension et de la seconde dimension.
EP16787898.2A 2016-10-28 2016-10-28 Appareil de traitement d'un substrat utilisé dans la fabrication d'une cellule solaire, et procédé de traitement d'un substrat utilisé dans la fabrication d'une cellule solaire Withdrawn EP3335249A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2016/076086 WO2018077422A1 (fr) 2016-10-28 2016-10-28 Appareil de traitement d'un substrat utilisé dans la fabrication d'une cellule solaire, et procédé de traitement d'un substrat utilisé dans la fabrication d'une cellule solaire

Publications (1)

Publication Number Publication Date
EP3335249A1 true EP3335249A1 (fr) 2018-06-20

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EP16787898.2A Withdrawn EP3335249A1 (fr) 2016-10-28 2016-10-28 Appareil de traitement d'un substrat utilisé dans la fabrication d'une cellule solaire, et procédé de traitement d'un substrat utilisé dans la fabrication d'une cellule solaire

Country Status (4)

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EP (1) EP3335249A1 (fr)
CN (1) CN109844964B (fr)
TW (1) TW201830721A (fr)
WO (1) WO2018077422A1 (fr)

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Publication number Priority date Publication date Assignee Title
WO2021111500A1 (fr) * 2019-12-02 2021-06-10 マイクロ・テック株式会社 Dispositif et procédé de sérigraphie
CN115881573B (zh) * 2023-01-20 2024-07-05 通威太阳能（成都）有限公司 太阳能电池片表面线路形貌的检测方法

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IT1392991B1 (it) * 2009-02-23 2012-04-02 Applied Materials Inc Procedimento di stampa serigrafica autoregolantesi
IT1392992B1 (it) * 2009-02-23 2012-04-02 Applied Materials Inc Procedimento e apparecchiatura per la stampa serigrafica di uno schema a strato multiplo
ITUD20110135A1 (it) * 2011-08-25 2013-02-26 Applied Materials Italia Srl Metodo ed impianto di controllo per la stampa di uno schema multistrato
ITUD20110171A1 (it) * 2011-10-24 2013-04-25 Applied Materials Italia Srl Metodo ed impianto di controllo in retroazione ad anello chiuso per la stampa di uno schema multistrato
ITUD20120061A1 (it) * 2012-04-13 2013-10-14 Applied Materials Italia Srl Procedimento per il controllo di uno schema stampato su un substrato
ITUD20120149A1 (it) * 2012-08-31 2014-03-01 Applied Materials Italia Srl Metodo ed apparato di stampa di uno schema su un substrato

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WO2018077422A1 (fr) 2018-05-03
TW201830721A (zh) 2018-08-16
CN109844964B (zh) 2022-12-06
CN109844964A (zh) 2019-06-04

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