EP3276653A4 - Halbleiterbauelement - Google Patents

Halbleiterbauelement Download PDF

Info

Publication number
EP3276653A4
EP3276653A4 EP15886418.1A EP15886418A EP3276653A4 EP 3276653 A4 EP3276653 A4 EP 3276653A4 EP 15886418 A EP15886418 A EP 15886418A EP 3276653 A4 EP3276653 A4 EP 3276653A4
Authority
EP
European Patent Office
Prior art keywords
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP15886418.1A
Other languages
English (en)
French (fr)
Other versions
EP3276653A1 (de
Inventor
Yuta Yoshida
Makoto Yabuuchi
Yoshisato Yokoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Electronics Corp
Original Assignee
Renesas Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Publication of EP3276653A1 publication Critical patent/EP3276653A1/de
Publication of EP3276653A4 publication Critical patent/EP3276653A4/de
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B10/00Static random access memory [SRAM] devices
    • H10B10/12Static random access memory [SRAM] devices comprising a MOSFET load element
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/0203Particular design considerations for integrated circuits
    • H01L27/0207Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/41Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming static cells with positive feedback, i.e. cells not needing refreshing or charge regeneration, e.g. bistable multivibrator or Schmitt trigger
    • G11C11/413Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing, timing or power reduction
    • G11C11/417Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing, timing or power reduction for memory cells of the field-effect type
    • G11C11/418Address circuits
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/41Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming static cells with positive feedback, i.e. cells not needing refreshing or charge regeneration, e.g. bistable multivibrator or Schmitt trigger
    • G11C11/413Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing, timing or power reduction
    • G11C11/417Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing, timing or power reduction for memory cells of the field-effect type
    • G11C11/419Read-write [R-W] circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5226Via connections in a multilevel interconnection structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528Geometry or layout of the interconnection structure
    • H01L23/5286Arrangements of power or ground buses
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H01L27/08Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/085Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
    • H01L27/088Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
    • H01L27/092Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
    • H01L27/0924Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors including transistors with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B10/00Static random access memory [SRAM] devices
    • H10B10/18Peripheral circuit regions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/785Field effect transistors with field effect produced by an insulated gate having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Semiconductor Memories (AREA)
EP15886418.1A 2015-03-26 2015-03-26 Halbleiterbauelement Pending EP3276653A4 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2015/059514 WO2016151866A1 (ja) 2015-03-26 2015-03-26 半導体装置

Publications (2)

Publication Number Publication Date
EP3276653A1 EP3276653A1 (de) 2018-01-31
EP3276653A4 true EP3276653A4 (de) 2018-11-21

Family

ID=56979060

Family Applications (1)

Application Number Title Priority Date Filing Date
EP15886418.1A Pending EP3276653A4 (de) 2015-03-26 2015-03-26 Halbleiterbauelement

Country Status (7)

Country Link
US (2) US10424575B2 (de)
EP (1) EP3276653A4 (de)
JP (1) JPWO2016151866A1 (de)
KR (1) KR20170127401A (de)
CN (2) CN106716625A (de)
TW (1) TW201705376A (de)
WO (1) WO2016151866A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10424575B2 (en) * 2015-03-26 2019-09-24 Renesas Electronics Corporation Semiconductor device
JP6849927B2 (ja) * 2016-03-28 2021-03-31 株式会社ソシオネクスト 半導体集積回路装置
TWI691050B (zh) * 2018-07-31 2020-04-11 日商東芝記憶體股份有限公司 半導體記憶裝置
JP7163250B2 (ja) 2019-06-26 2022-10-31 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JPWO2021153169A1 (de) * 2020-01-27 2021-08-05
CN111965523B (zh) * 2020-08-14 2023-05-09 上海兆芯集成电路有限公司 芯片测试方法
US11943939B2 (en) * 2021-01-04 2024-03-26 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit device and method
US11877445B2 (en) 2021-01-15 2024-01-16 Micron Technology, Inc. Integrated assemblies and semiconductor memory devices
US11594536B2 (en) * 2021-03-10 2023-02-28 Micron Technology, Inc. Integrated assemblies and semiconductor memory devices

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006310467A (ja) * 2005-04-27 2006-11-09 Renesas Technology Corp 半導体記憶装置
US20080197419A1 (en) * 2007-02-15 2008-08-21 Jhon-Jhy Liaw Cell structure for dual port SRAM
US20130181297A1 (en) * 2012-01-12 2013-07-18 Taiwan Semiconductor Manufacturing Company, Ltd. SRAM Cells and Arrays
US20130258759A1 (en) * 2012-03-30 2013-10-03 Taiwan Semiconductor Manufacturing Company, Ltd. Methods and Apparatus for SRAM Cell Structure

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11111860A (ja) 1997-10-06 1999-04-23 Mitsubishi Electric Corp 半導体装置
JP3159191B2 (ja) * 1998-12-09 2001-04-23 日本電気株式会社 半導体装置
JP2004040042A (ja) * 2002-07-08 2004-02-05 Fujitsu Ltd 半導体記憶装置
JP3920804B2 (ja) 2003-04-04 2007-05-30 松下電器産業株式会社 半導体記憶装置
KR100615085B1 (ko) * 2004-01-12 2006-08-22 삼성전자주식회사 노드 콘택 구조체들, 이를 채택하는 반도체소자들, 이를채택하는 에스램 셀들 및 이를 제조하는 방법들
JP4997969B2 (ja) 2004-06-04 2012-08-15 日本電気株式会社 半導体装置およびその製造方法
WO2010050094A1 (ja) 2008-10-30 2010-05-06 パナソニック株式会社 不揮発性半導体記憶装置及びその製造方法
JP5705053B2 (ja) 2011-07-26 2015-04-22 ルネサスエレクトロニクス株式会社 半導体装置
US8830732B2 (en) * 2012-11-30 2014-09-09 Taiwan Semiconductor Manufacturing Company, Ltd. SRAM cell comprising FinFETs
JP6034764B2 (ja) 2013-08-05 2016-11-30 ルネサスエレクトロニクス株式会社 半導体記憶装置
KR20160040577A (ko) 2013-08-06 2016-04-14 르네사스 일렉트로닉스 가부시키가이샤 반도체 집적 회로 장치
US10424575B2 (en) * 2015-03-26 2019-09-24 Renesas Electronics Corporation Semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006310467A (ja) * 2005-04-27 2006-11-09 Renesas Technology Corp 半導体記憶装置
US20080197419A1 (en) * 2007-02-15 2008-08-21 Jhon-Jhy Liaw Cell structure for dual port SRAM
US20130181297A1 (en) * 2012-01-12 2013-07-18 Taiwan Semiconductor Manufacturing Company, Ltd. SRAM Cells and Arrays
US20130258759A1 (en) * 2012-03-30 2013-10-03 Taiwan Semiconductor Manufacturing Company, Ltd. Methods and Apparatus for SRAM Cell Structure

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2016151866A1 *

Also Published As

Publication number Publication date
US10811405B2 (en) 2020-10-20
JPWO2016151866A1 (ja) 2017-06-08
CN106716625A (zh) 2017-05-24
EP3276653A1 (de) 2018-01-31
US10424575B2 (en) 2019-09-24
US20190355712A1 (en) 2019-11-21
WO2016151866A1 (ja) 2016-09-29
CN114784007A (zh) 2022-07-22
US20170301664A1 (en) 2017-10-19
TW201705376A (zh) 2017-02-01
KR20170127401A (ko) 2017-11-21

Similar Documents

Publication Publication Date Title
EP3416188A4 (de) Halbleiterbauelement
EP3364449A4 (de) Halbleiterbauelement
EP3144975A4 (de) Halbleiterbauelement
EP3324544A4 (de) Halbleiterbauelement
EP3264461A4 (de) Halbleiterbauelement
EP3128550A4 (de) Halbleiterbauelement
EP3279927A4 (de) Halbleiterbauelement
EP3101685A4 (de) Halbleiterbauelement
EP3171410A4 (de) Halbleiterbauelement
EP3118896A4 (de) Halbleiterbauelement
EP3276661A4 (de) Halbleiterbauelement
EP3460979A4 (de) Halbleiterbauelement
EP3043379A4 (de) Halbleiterbauelement
EP3343598A4 (de) Halbleiterbauelement
EP3240125A4 (de) Halbleiterbauelement
EP3312875A4 (de) Halbleiterbauelement
EP3285289A4 (de) Halbleiterbauelement
EP3276671A4 (de) Halbleiterbauelement
EP3285288A4 (de) Halbleiterbauelement
EP3276653A4 (de) Halbleiterbauelement
EP3358468A4 (de) Halbleiterbauelement
EP3107123A4 (de) Halbleiterbauelement
EP3428964A4 (de) Halbleiterbauelement
EP3007231A4 (de) Halbleiterbauelement
EP3229281A4 (de) Halbleiterbauelement

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20170328

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20181018

RIC1 Information provided on ipc code assigned before grant

Ipc: H01L 27/11 20060101ALI20181012BHEP

Ipc: G11C 11/419 20060101ALI20181012BHEP

Ipc: G11C 11/418 20060101ALI20181012BHEP

Ipc: H01L 21/8244 20060101AFI20181012BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

17Q First examination report despatched

Effective date: 20210430

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS