EP3265850A1 - Feuille en métal ou constituée d'un alliage métallique - Google Patents

Feuille en métal ou constituée d'un alliage métallique

Info

Publication number
EP3265850A1
EP3265850A1 EP16720042.7A EP16720042A EP3265850A1 EP 3265850 A1 EP3265850 A1 EP 3265850A1 EP 16720042 A EP16720042 A EP 16720042A EP 3265850 A1 EP3265850 A1 EP 3265850A1
Authority
EP
European Patent Office
Prior art keywords
graphene
film
silicon
film according
aluminum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP16720042.7A
Other languages
German (de)
English (en)
Inventor
Holger Thorsten SCHUBART
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Neutrino Deutschland GmbH
Original Assignee
Neutrino Deutschland GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Neutrino Deutschland GmbH filed Critical Neutrino Deutschland GmbH
Publication of EP3265850A1 publication Critical patent/EP3265850A1/fr
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00Electrodes
    • H01M4/02Electrodes composed of, or comprising, active material
    • H01M4/64Carriers or collectors
    • H01M4/66Selection of materials
    • H01M4/661Metal or alloys, e.g. alloy coatings
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01TMEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • H01L21/02425Conductive materials, e.g. metallic silicides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02436Intermediate layers between substrates and deposited layers
    • H01L21/02439Materials
    • H01L21/02441Group 14 semiconducting materials
    • H01L21/02444Carbon, e.g. diamond-like carbon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02436Intermediate layers between substrates and deposited layers
    • H01L21/02439Materials
    • H01L21/02441Group 14 semiconducting materials
    • H01L21/0245Silicon, silicon germanium, germanium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02436Intermediate layers between substrates and deposited layers
    • H01L21/02494Structure
    • H01L21/02496Layer structure
    • H01L21/02505Layer structure consisting of more than two layers
    • H01L21/02507Alternating layers, e.g. superlattice
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02524Group 14 semiconducting materials
    • H01L21/02527Carbon, e.g. diamond-like carbon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02524Group 14 semiconducting materials
    • H01L21/02532Silicon, silicon germanium, germanium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/0256Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
    • H01L31/0264Inorganic materials
    • H01L31/028Inorganic materials including, apart from doping material or other impurities, only elements of Group IV of the Periodic System
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/06Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
    • H01L31/072Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN heterojunction type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/08Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
    • H01L31/10Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by at least one potential-jump barrier or surface barrier, e.g. phototransistors
    • H01L31/115Devices sensitive to very short wavelength, e.g. X-rays, gamma-rays or corpuscular radiation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00Electrodes
    • H01M4/02Electrodes composed of, or comprising, active material
    • H01M4/04Processes of manufacture in general
    • H01M4/0402Methods of deposition of the material
    • H01M4/0421Methods of deposition of the material involving vapour deposition
    • H01M4/0423Physical vapour deposition
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00Electrodes
    • H01M4/02Electrodes composed of, or comprising, active material
    • H01M4/13Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulators; Processes of manufacture thereof
    • H01M4/134Electrodes based on metals, Si or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00Electrodes
    • H01M4/02Electrodes composed of, or comprising, active material
    • H01M4/36Selection of substances as active materials, active masses, active liquids
    • H01M4/362Composites
    • H01M4/366Composites as layered products
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00Electrodes
    • H01M4/02Electrodes composed of, or comprising, active material
    • H01M4/36Selection of substances as active materials, active masses, active liquids
    • H01M4/38Selection of substances as active materials, active masses, active liquids of elements or alloys
    • H01M4/386Silicon or alloys based on silicon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00Electrodes
    • H01M4/02Electrodes composed of, or comprising, active material
    • H01M4/36Selection of substances as active materials, active masses, active liquids
    • H01M4/58Selection of substances as active materials, active masses, active liquids of inorganic compounds other than oxides or hydroxides, e.g. sulfides, selenides, tellurides, halogenides or LiCoFy; of polyanionic structures, e.g. phosphates, silicates or borates
    • H01M4/583Carbonaceous material, e.g. graphite-intercalation compounds or CFx
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/547Monocrystalline silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

Definitions

  • the invention relates to a foil made of metal or a metal alloy, in particular a foil made of aluminum or an aluminum alloy, a so-called neutrino or Ntrino foil (registered trademarks), a process for the production and use of a foil of metal or a metal alloy.
  • Metal foils especially aluminum foils, are well known in the art.
  • the object of the present invention is to further improve metal foils, in particular aluminum foils. These can then serve to convert invisible solar energy into direct current, this is done in particular by neutrino radiation is converted into energy.
  • This object is achieved according to a first aspect of the invention by a film of metal or a metal alloy, wherein the film has a coating comprising graphene and silicon.
  • the film has a coating comprising graphene and silicon.
  • On the metallic support in different processes (vapor-deposited, sprayed, glued on) further materials are applied in a different sequence.
  • the effect achieved is that kinetic energy of radiations (the invisible spectrum of solar or space radiation such as neutrinos) is converted into electricity. This is done by a nanotechnologically modified lattice structure of the applied materials.
  • the modified and compressed lattice structure serves as a braking medium (for example, doped graphene) which slows the wave by about 0.1% by causing molecules of the non-visible spectrum of the solar or space energy to strike molecules of the compacted, so non-natural lattice structure .
  • the pendulum motion is transferred in the next step to a conductive medium (e.g., silicon) and then to the transfer medium (e.g., aluminum, silver, gallium, etc.).
  • a conductive medium e.g., silicon
  • the transfer medium e.g., aluminum, silver, gallium, etc.
  • the metallic carrier or metal alloy may be a common alloy.
  • the foil is made of silver, gold, copper, gallium or aluminum or one of its alloys, in particular of a silver or gold alloy or an aluminum-gallium alloy.
  • a film made of aluminum or an aluminum alloy has cost advantages.
  • a foil made of silver or a silver alloy will achieve better results.
  • An aluminum alloy may be a common aluminum metal alloy.
  • an aluminum-gold or -silver alloy is possible.
  • Other alloys, such as aluminum-manganese, magnesium, copper, silicon, nickel, zinc, beryllium, and mixtures thereof are also possible.
  • the film is made of an aluminum gallium alloy or of gold or silver, a gold or silver alloy. This has the merit of higher conductivity by increasing the flow rate.
  • the film has a thickness of 0.01 mm to 4 mm, preferably from 0.01 mm to 1 mm, particularly preferably 0.05 mm - 1 mm.
  • the coating may comprise about 10% to 80% silicon, preferably 10% to 50% silicon, particularly preferably 25% silicon.
  • the coating may have 20% to 90% graphene, preferably 50% to 90% graphene, most preferably 75% graphene.
  • the coating has organic or inorganic adhesive components.
  • Other common bonding methods other than bonding, for example, by applying are advantageous.
  • the coating can be carried out in individual layered substances or by means of a mixture. It is particularly advantageous if the nanotechnologically processed substances are individually stratified, as this results in a higher efficiency, that is, more electricity is produced. It is particularly advantageous if the coating is a nano-coating in which graphene and silicon are present as nanoparticles.
  • the particles of the Silicon have a size of 5nm to 500nm, more preferably 5nm, and that of graphene 20nm to 500nm, more preferably 20nm, since the smaller the particles are, the higher the efficiency is.
  • Vorteühaft know the coating alternately layers of silicon and graphene, in particular 10 to 20 silicon graphene layers in particular 12 silicon graphene has layers.
  • 12 layers are particularly advantageous because after 12 layers, the voltage decreases again.
  • the performance of the film can be increased when applied to the silicon germanium, selenium, Kupferoxidal or tellurium.
  • Other experiments that increased performance were made with tantalum, niobium, molybdenum, and antimony.
  • the doping of the graphene contributes significantly to the increase in performance.
  • both a doping in a vacuum by ion implantation as well as a neutron transmutation doping can be doped with the ions of the following particles. Ferroniobium, nickel niobium, yttrium or samarium oxide.
  • the coating should preferably take place with exclusion of air, since, depending on the doping, the oxidation effect occurs more quickly. Even after the coating has been completed, the sequence should be sealed, as the air seal increases the stability.
  • 757g of all materials are used on 1km A 2.
  • the metallic carrier represents the negative pole, the graph the positive pole.
  • the film can be rolled or stacked to achieve the highest values.
  • a DinA4 film can be 1 watt, if you stack the films to a mobile power plant, an insulating layer should be placed between the films.
  • the power generation causes no decomposition of the conductor.
  • the conductor has a negative temperature coefficient. The optimum is 26.2 to 26.7 ° C.
  • the film can be used underground and in the water and works better at night than during the day.
  • a second aspect of the invention relates to a method for producing a film from a metal or a metal alloy, in particular a film according to the invention wherein in a first step, a silicon layer is applied to the film, in particular by spraying or steaming, in a second step, the silicon layer cured, dried and is flushed with liquid nitrogen, in a third step, a graphene layer is applied to the film and cured in a fourth step, the graphene layer, dried and rinsed with liquid nitrogen.
  • germanium, selenium, copper oxide, tellurium, tantalum, niobium, molybdenum and / or antimony can be applied in a further step.
  • the graphene can be doped, in particular with ferroniobium, nickel niumium, yttrium or samarium oxide, in particular by ion implantation or by neutron transmutation doping.
  • a third aspect of the invention relates to a method for producing a film of aluminum or an aluminum alloy, wherein in a first step graphene and silicon are pulverized and mixed and in a second step the pulverized graphene and silicon are applied to the film.
  • a fourth aspect of the invention relates to a method for producing a film of aluminum or an aluminum alloy, in particular for producing a film according to the invention, wherein in a first step graphene and silicon are pulverized and mixed and in a second step an adhesive layer is applied to the film and in a third step, the powdered graphene and silicon are applied to the adhesive layer.
  • Other common bonding methods other than bonding, for example, by applying are advantageous.
  • a fifth aspect of the invention relates to a method for producing a film of aluminum or an aluminum alloy, in particular for producing a film according to the invention, wherein graphene and silicon are pulverized and mixed in a first step and mixed with an adhesive in a second step Silicon and graphene powder is mixed and in a third step, the mixture is applied to the film or firmly connected to the film.
  • Other common bonding methods other than bonding, for example, by applying are advantageous.
  • a sixth aspect of the invention relates to a method for producing a film of aluminum or an aluminum alloy, in particular for producing a film according to the invention, wherein in a first step, an adhesive layer is applied to the film and applied in a second step, a graphene and / or silicon layer and in a third step, a second adhesive layer is applied to the film and in a fourth step, a further silicon and / or graphene layer is applied to the film.
  • Other common bonding methods other than bonding, for example, by applying are advantageous.
  • a seventh aspect of the invention relates to a use of a film according to the invention for the production of direct current from invisible solar energy.
  • the mode of operation can be summed up as follows: Nature has relatively "wide-meshed” molecules, so that the neutrinos fly through because of the low mass, so the atoms in the molecules as well as the molecules in the material structure must be so tightly “packed” that part of the neutrinos can not fly through without touching the particles.
  • the surface of the film therefore has nanotechnologically processed structures, so that analogous to a mechanical pendulum chain, the molecules abut each other and thus from the mass and the kinetic energy of a molecule flow and current flow is created (so-called lattice-guiding effect). This is analogous to a current flow in a line to understand: by magnet and coil, the molecules are set in motion in the generator and so we can use the electricity.

Abstract

L'invention concerne une feuille en métal ou constituée d'un alliage métallique, en particulier une feuille en aluminium ou constituée d'un alliage d'aluminium, dite feuille Neutrino ou feuille Ntrino (marques déposées), un procédé de fabrication ainsi qu'une utilisation d'une feuille en métal ou constituée d'un alliage métallique.
EP16720042.7A 2015-03-06 2016-03-07 Feuille en métal ou constituée d'un alliage métallique Pending EP3265850A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102015002789 2015-03-06
DE102015014721 2015-11-17
PCT/EP2016/000410 WO2016142056A1 (fr) 2015-03-06 2016-03-07 Feuille en métal ou constituée d'un alliage métallique

Publications (1)

Publication Number Publication Date
EP3265850A1 true EP3265850A1 (fr) 2018-01-10

Family

ID=55910201

Family Applications (1)

Application Number Title Priority Date Filing Date
EP16720042.7A Pending EP3265850A1 (fr) 2015-03-06 2016-03-07 Feuille en métal ou constituée d'un alliage métallique

Country Status (3)

Country Link
US (2) US20180053941A1 (fr)
EP (1) EP3265850A1 (fr)
WO (1) WO2016142056A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102018009125A1 (de) * 2018-11-21 2020-05-28 Neutrino Deutschland Gmbh Folie aus Metall oder einer Metalllegierung
DE102019008982A1 (de) 2019-12-23 2021-06-24 Neutrino Deutschland Gmbh Folie mit Beschichtung
EP4245917A1 (fr) 2022-03-14 2023-09-20 Jürgen Frenzel Traverse monobloc en acier et son procédé de fabrication

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012125853A1 (fr) * 2011-03-16 2012-09-20 The Regents Of The University Of California Procédé de préparation d'anodes à structure multicouche graphène/silicium pour batteries lithium-ion
CN103035889B (zh) * 2011-10-09 2015-09-23 海洋王照明科技股份有限公司 石墨烯/纳米硅复合电极片及其制备方法
CN103515604A (zh) * 2012-06-21 2014-01-15 海洋王照明科技股份有限公司 硅纳米线-石墨烯复合材料及其制备方法、锂离子电池
TWI461555B (zh) * 2013-06-26 2014-11-21 Univ Nat Taiwan Science Tech 一種多層膜矽/石墨烯複合材料陽極結構

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US20180053941A1 (en) 2018-02-22
US20210135235A1 (en) 2021-05-06

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