EP3183811A1 - Mikroakustisches bauelement mit verbesserter temperaturkompensation - Google Patents
Mikroakustisches bauelement mit verbesserter temperaturkompensationInfo
- Publication number
- EP3183811A1 EP3183811A1 EP15735958.9A EP15735958A EP3183811A1 EP 3183811 A1 EP3183811 A1 EP 3183811A1 EP 15735958 A EP15735958 A EP 15735958A EP 3183811 A1 EP3183811 A1 EP 3183811A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- compensation layer
- compensation
- scf
- component according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02818—Means for compensation or elimination of undesirable effects
- H03H9/02834—Means for compensation or elimination of undesirable effects of temperature influence
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
- H03H9/02102—Means for compensation or elimination of undesirable effects of temperature influence
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
- H03H9/14544—Transducers of particular shape or position
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/462—Microelectro-mechanical filters
Definitions
- SAW surface acoustic wave
- BAW bulk acoustic wave
- the temperature coefficient of the center frequency (TCF) of SAW devices based on lithium tantalate (LT 42 ° red xy) is typically at e.g. -40 ppm / K.
- TCF center frequency
- Electrode materials do not remain without influence on the TCF.
- the component has on the substrate top electrically conductive construction ⁇ element structures and on the bottom one
- Compensating on which is mechanically firmly connected to the substrate so that a mechanical strain arises, or builds up when the temperature changes.
- a Si0 2 layer is arranged over the component structures, which has a positive
- Reflectivity of the electrodes is obtained only with heavy electrodes. This is unsatisfactory especially for SAW devices and insufficient for some applications.
- a disadvantage of the temperature compensation with S1O 2 is further that its temperature compensation property is limited and by the use of S1O 2 a loss of electromechanical coupling and bandwidth, an increased Damping and the occurrence of unwanted spurious modes must be taken into account. This limits the effectively achievable TC compensation.
- Object of the present invention is to provide new possibilities or new materials for the compensation of the temperature coefficient, with both the compensation is improved, and the associated disadvantages are reduced.
- the invention is based on the recognition that among the materials with a negative coefficient of thermal expansion many materials can be found which have a positive temperature coefficient of their thermomechanical properties. Such materials can be used to compensate for a negative temperature coefficient of the thermomechanical properties, as is usually the case with piezoelectric materials.
- the chemical compound is an inorganic transition metal compound or a
- Such a device comprises at least one layer of a piezoelectric material having a pair of electrodes for exciting acoustic waves in the piezoelectric material.
- the compensation layer is arranged on this device so that in the compensation layer
- piezoelectric layer in which the acoustic wave is primarily generated.
- Materials with negative coefficients of thermal expansion e.g. from the class dielectric
- inorganic transition metal and rare earth compounds are surprisingly show a high positive temperature coefficient of their modulus of elasticity, so an increase in stiffness with increasing temperature, which is greater than the best known materials such as
- Si02- With this high stiffness change or the associated positive temperature coefficient of the modulus of elasticity succeeds to a more effective compensation layer
- the compensation layer is directly on the layer of the piezoelectric
- Electrodes and compensation layer may be disposed on the same side of the piezoelectric layer. It is also possible, however, the
- the compensation layer comprises as a rare earth compound with
- a particularly high positive temperature coefficient of the modulus of elasticity can be achieved with an yttrium-doped one
- the yttrium content of this compound is limited by the solubility of yttrium trifluoride in the scandium trifluoride, and theoretically may be higher if successful
- This material shows in pure form a temperature coefficient of the modulus of about 1500 ppm / K. This temperature coefficient is more than five times as high as that of undoped S1O 2 , which is used in today's components as a compensation layer. In comparison to the previously proposed but not yet used fluorine doped S1O 2 , the temperature coefficient of the proposed yttrium-doped scandium trifluoride is more than twice as high.
- the compensation layer has a temperature coefficient of the thermoelastic properties of> 700 ppm / K. These values are achieved by different of the mentioned materials with negative coefficients of thermal expansion.
- the said material may be present in solid pure form, in doped form, as a mixed compound together with other oxides, halides or other crystalline compounds or it may be embedded in solid form in a crystalline matrix or preferably just in a glass. It is possible that a compensation layer which does not receive the negative expansion coefficient material in a pure form achieves a lower compensation effect than a compensation layer composed exclusively of said material. But it is also possible that a layered mixture or a layered doping even increases the desired effect. Mixtures with other substances or an embedding in a matrix may be advantageous in cases where the modification of the
- Material is not directly suitable for layer deposition, or if layers so produced are mechanically and structurally unsuitable for remaining on the device.
- the component is designed as a SAW component, that is to say as a component working with surface acoustic waves. It has at least one interdigital transducer on the piezoelectric layer. On the piezoelectric layer and over the interdigital transducer a compensation layer is deposited, the
- Scandium trifluoride SCF 3 either doped (eg with YF 3 ), as mixed crystal with other oxides or halides or embedded in a crystalline matrix or in a glass.
- the compensation layer with respect to the selection of the compensating material and with respect to its proportion in the compensation layer formed so that the temperature ⁇ coefficient of the center frequency, that is, the operative for the SAW device temperature-dependent value is already at a relative layer thickness of 5 - fully 15%
- the relative layer thickness refers to the wavelength of a propagating ⁇ enabled in this material the acoustic wave, and outputs the layer thickness in
- the relative layer thickness refers to the ratio of
- the component can also be designed as a BAW component, wherein both possible embodiments are possible as SMR (solidly mounted resonator) or on the basis of resonators arranged via membranes.
- SMR solidly mounted resonator
- GBAW device working with guided volume waves
- Component may be formed.
- the devices may comprise an electrode material comprising one or more of known metals and alloys, semiconductors, and conductive borides, nitrides, carbides and mixed compounds.
- the components according to the invention can be provided or designed for a very wide variety of applications.
- the compensation layer comprises a material of oxide network formers.
- These special network formers show a negative coefficient of thermal expansion, which is usually associated with an abnormal pressure behavior ("pressure softening") .
- pressure softening an abnormal pressure behavior
- these compounds also show an abnormal thermo-mechanical behavior, which also has a positive thermal expansion coefficient
- Temperature coefficient of stiffness c and the modulus of elasticity is associated.
- Figures 1 and 2 show in schematic cross section in each case a SAW device with compensation layer in
- FIG. 3 shows a BAW component with compensation layer
- FIG. 4 shows a GBAW component with compensation layer
- FIG. 5 shows a further BAW component
- FIG. 6 shows a SAW component
- FIGS. 7a and 7b each show a SAW component with a structured compensation layer
- FIGS. 8a to 8c show SAW or GBAW devices comprising one or more additional dielectric layers DS
- FIG. 9 shows the course of the modulus of elasticity versus temperature in the system SC (i- X ) Y x F3 with different yttrium contents x.
- FIG. 1 shows the simplest embodiment of a SAW component provided with a compensation layer KS. On a substrate which has at least one thin piezoelectric
- Layer comprises, is a first electrode layer ELI
- the substrate SU consists of lithium tantalate with a cut suitable for SAW generation and propagation.
- LT42 has a temperature coefficient of elastic properties in the x-direction of about -40 ppm.
- the electrode layer ELI is the
- FIG. 2 shows a similar component in which the
- BAW component Component in which a compensation layer KS is applied directly to a piezoelectric substrate SU.
- a first electrode layer ELI On this exposed surface of the substrate SU is a first electrode layer ELI and on the exposed surface of the compensation layer KS is a second
- Electrode layer EL2 arranged.
- the thickness of Kompen ⁇ sations slaughter KS and substrate SU together determine the wavelength of the BAW device, so that at a given wavelength, a thicker compensation layer KS has a thinner substrate SU result to set the same resonance frequency in the BAW component.
- Figure 4 shows another type of working with acoustic waves components, namely with guided
- the compensation layer KS is arranged in a desired layer thickness.
- Compensation layer KS applied cladding layer ML, the has a higher velocity v (ML) of the acoustic wave than the compensation layer v (KS):
- the speed in turn, can be adjusted accordingly
- FIG. 5 shows a BAW component with a first one
- Electrode layer ELI Electrode layer ELI, a piezoelectric layer SU and a second electrode layer EL2, in which the
- Electrode layers ELI, EL 2 is applied.
- electrode layer ELI and the second electrode layer EL2.
- Compensating layers can be mounted as SMR (solidly mounted resonator) directly on the substrate or in
- FIG. 6 shows another GBAW device, in which the
- the electrode layer ELI can also be provided with a cladding layer ML.
- Figures 7a and 7b show possibilities, such as the acoustic properties of a with a compensation layer KS
- SAW device can be further improved. Due to the low acoustic impedance difference between electrodes and compensation layer material
- Piezo layer and electrodes or above the compensation ⁇ layer possible. 8a-8c show such example ⁇ liable versions.
- a dielectric layer DS is present between the first electrode layer ELI and
- FIG. 8b shows a dielectric layer DS over the cladding layer ML
- FIG. 8c shows an embodiment which simultaneously has two dielectric layers DS1 and DS2, as shown individually already in FIGS. 8a and 8b.
- Scandium-yttrium trifluorides such as stiffness, are in a similar range to the previously used Si0 2 layers. At slightly higher density than the S1O 2 is expected that the remaining component ⁇ properties are not adversely affected by the new compensation layer. Because of the better
- components are conceivable which have more than one compensation layer, or even construction ⁇ elements, the other means for reducing the
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102014111993.2A DE102014111993B4 (de) | 2014-08-21 | 2014-08-21 | Mikroakustische Bauelement mit verbesserter Temperaturkompensation |
PCT/EP2015/065728 WO2016026612A1 (de) | 2014-08-21 | 2015-07-09 | Mikroakustisches bauelement mit verbesserter temperaturkompensation |
Publications (1)
Publication Number | Publication Date |
---|---|
EP3183811A1 true EP3183811A1 (de) | 2017-06-28 |
Family
ID=53539724
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP15735958.9A Withdrawn EP3183811A1 (de) | 2014-08-21 | 2015-07-09 | Mikroakustisches bauelement mit verbesserter temperaturkompensation |
Country Status (6)
Country | Link |
---|---|
US (1) | US10224897B2 (de) |
EP (1) | EP3183811A1 (de) |
JP (1) | JP6517841B2 (de) |
CN (1) | CN106716826B (de) |
DE (1) | DE102014111993B4 (de) |
WO (1) | WO2016026612A1 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107060592B (zh) * | 2016-12-21 | 2018-05-25 | 重庆金华兴门业有限公司 | 拉簧式内缩门 |
CN107871813B (zh) * | 2017-11-17 | 2020-08-11 | 中国电子科技集团公司第二十六研究所 | 一种温度补偿型声表面波器件的温度补偿层平坦化方法 |
WO2019108758A1 (en) * | 2017-12-01 | 2019-06-06 | Skyworks Solutions, Inc. | Alternative temperature compensating materials to amorhphous silica in acoustic wave resonators |
CN108866677A (zh) * | 2018-07-05 | 2018-11-23 | 合肥萃励新材料科技有限公司 | 一种ZrW2O8亚微米纤维的制备方法 |
WO2020132999A1 (zh) * | 2018-12-26 | 2020-07-02 | 天津大学 | 带有温度补偿层的谐振器、滤波器 |
WO2022224740A1 (ja) * | 2021-04-22 | 2022-10-27 | 株式会社村田製作所 | ラダー型フィルタ |
JPWO2023021777A1 (de) * | 2021-08-19 | 2023-02-23 | ||
CN117833855A (zh) * | 2024-03-04 | 2024-04-05 | 深圳新声半导体有限公司 | 声波装置 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3965444A (en) * | 1975-01-03 | 1976-06-22 | Raytheon Company | Temperature compensated surface acoustic wave devices |
JPH08181562A (ja) * | 1994-12-21 | 1996-07-12 | Meidensha Corp | 弾性表面波素子 |
JP2000196410A (ja) | 1998-12-31 | 2000-07-14 | Kazuhiko Yamanouchi | 高安定高結合弾性表面波基板とそれを用いた弾性表面波フィルタ及び弾性表面波機能素子 |
US7400217B2 (en) * | 2003-10-30 | 2008-07-15 | Avago Technologies Wireless Ip Pte Ltd | Decoupled stacked bulk acoustic resonator band-pass filter with controllable pass bandwith |
US7358831B2 (en) | 2003-10-30 | 2008-04-15 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Film bulk acoustic resonator (FBAR) devices with simplified packaging |
US7019605B2 (en) * | 2003-10-30 | 2006-03-28 | Larson Iii John D | Stacked bulk acoustic resonator band-pass filter with controllable pass bandwidth |
JP2006033748A (ja) | 2004-07-21 | 2006-02-02 | Matsushita Electric Ind Co Ltd | 薄膜バルク音波共振子 |
DE102004045181B4 (de) | 2004-09-17 | 2016-02-04 | Epcos Ag | SAW-Bauelement mit reduziertem Temperaturgang und Verfahren zur Herstellung |
JP5039362B2 (ja) * | 2006-11-07 | 2012-10-03 | 太陽誘電株式会社 | 弾性波デバイス |
JP5190841B2 (ja) * | 2007-05-31 | 2013-04-24 | 独立行政法人産業技術総合研究所 | 圧電体薄膜、圧電体およびそれらの製造方法、ならびに当該圧電体薄膜を用いた圧電体共振子、アクチュエータ素子および物理センサー |
JP2008125130A (ja) * | 2008-02-08 | 2008-05-29 | Murata Mfg Co Ltd | 表面波装置及びその製造方法 |
JP2014027639A (ja) * | 2012-07-24 | 2014-02-06 | Kazuhiko Yamanouchi | 温度超高安定薄膜構造擬似弾性表面波基板とその基板を用いた弾性表面波機能素子 |
CN102904546B (zh) * | 2012-08-30 | 2016-04-13 | 中兴通讯股份有限公司 | 一种温度补偿能力可调节的压电声波谐振器 |
CN103684336B (zh) * | 2012-08-31 | 2017-01-11 | 安华高科技通用Ip(新加坡)公司 | 包含具有内埋式温度补偿层的电极的谐振器装置 |
DE102012111889B9 (de) * | 2012-12-06 | 2014-09-04 | Epcos Ag | Elektroakustischer Wandler |
US9401691B2 (en) * | 2014-04-30 | 2016-07-26 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Acoustic resonator device with air-ring and temperature compensating layer |
-
2014
- 2014-08-21 DE DE102014111993.2A patent/DE102014111993B4/de not_active Expired - Fee Related
-
2015
- 2015-07-09 JP JP2016570834A patent/JP6517841B2/ja not_active Expired - Fee Related
- 2015-07-09 EP EP15735958.9A patent/EP3183811A1/de not_active Withdrawn
- 2015-07-09 US US15/314,790 patent/US10224897B2/en active Active
- 2015-07-09 WO PCT/EP2015/065728 patent/WO2016026612A1/de active Application Filing
- 2015-07-09 CN CN201580050878.9A patent/CN106716826B/zh active Active
Non-Patent Citations (2)
Title |
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None * |
See also references of WO2016026612A1 * |
Also Published As
Publication number | Publication date |
---|---|
CN106716826A (zh) | 2017-05-24 |
JP2017523645A (ja) | 2017-08-17 |
JP6517841B2 (ja) | 2019-05-22 |
WO2016026612A1 (de) | 2016-02-25 |
DE102014111993A1 (de) | 2016-02-25 |
US10224897B2 (en) | 2019-03-05 |
US20170194932A1 (en) | 2017-07-06 |
CN106716826B (zh) | 2020-09-29 |
DE102014111993B4 (de) | 2017-12-21 |
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