EP3123842A1 - Couche adhérente sur céramique et/ou masque anti-soudure, en tant que vernis de protection ou masse de scellement - Google Patents

Couche adhérente sur céramique et/ou masque anti-soudure, en tant que vernis de protection ou masse de scellement

Info

Publication number
EP3123842A1
EP3123842A1 EP15712613.7A EP15712613A EP3123842A1 EP 3123842 A1 EP3123842 A1 EP 3123842A1 EP 15712613 A EP15712613 A EP 15712613A EP 3123842 A1 EP3123842 A1 EP 3123842A1
Authority
EP
European Patent Office
Prior art keywords
ceramic
potting compound
carrier
plastic
metallized
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP15712613.7A
Other languages
German (de)
English (en)
Inventor
Marco Heinrich
Anton Gschwändler
Katharina HÄRTL
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ceramtec GmbH
Original Assignee
Ceramtec GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ceramtec GmbH filed Critical Ceramtec GmbH
Publication of EP3123842A1 publication Critical patent/EP3123842A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Definitions

  • the present invention relates to an adhesive layer on a ceramic substrate and / or a solder resist, which acts as a protective coating or potting compound, and a process for their preparation and en pursueend coated components, especially circuit boards.
  • a preferred application is in the field of high-voltage boards.
  • High-voltage boards must be potted to provide protection against physical and / or environmental influences, e.g. to ensure airborne ionic elements, moisture or corrosive atmospheres, in particular to provide protection class IP68 according to DIN EN 60529. This type of protection is known to provide complete protection against dust and temporary or permanent submersion.
  • potting compounds and protective coatings are used.
  • An encapsulant is a mass used to cover, mechanically reinforce and protect components or groups to protect them from chemicals, moisture, dust, mechanical stress or the like.
  • a protective varnish is a varnish which images the contours of the components or groups and protects them from moisture or dust. Such paints are applied only a few to several ⁇ thick.
  • a solder mask is understood to mean a mostly colored organic polymer. This must not dissolve in the (clear) potting compound, but like the ceramics must be hermetically sealed with the potting compound.
  • the casting compounds and protective lacquers known from the prior art and available on the market have the disadvantage that they do not adhere permanently to ceramics or to solder resists and / or turn yellow after a certain time. Thus, over the course of time, these potting compounds and conformal coatings can be peeled off, at least in part, without great expenditure of energy, which leads to moisture being able to penetrate. The degree of protection IP68 is therefore no longer met. In addition, environmental corrosion can occur on the applied LEDs.
  • the present invention is therefore based on the object to compensate for the disadvantages known from the prior art.
  • Suitable ceramic substrates are, for example, those based on AIN or Al 2 O 3. These may contain additives like Y2O3.
  • the ceramic substrate is preferably present as a heat sink or flat body.
  • the ceramic substrates are first roughened in an alkaline or acidic etching bath.
  • a pH of from 10 to 14 and particularly preferably from 1 to 13 is preferably selected in the alkaline.
  • a sulfuric acid environment is preferred.
  • the etching bath preferably has a temperature of from 20 to 200 ° C., more preferably from 40 to 160 ° C., and particularly preferably from 60 to 120 ° C.
  • the ceramic substrates are preferably left in the etching bath for 5 to 75 minutes, more preferably for 10 to 50 minutes, and particularly preferably for 15 to 25 minutes.
  • the Ra value ie the average roughness of the ceramic surface, preferably increases by at least 0.1 ⁇ , preferably by at least 0.2 ⁇ and particularly preferably by at least 0.3 ⁇ at roughening.
  • the optionally roughened ceramic substrates are then metallized by means of a common metal paste.
  • metallizations for example, silver, copper and tungsten-nickel-gold can be used. Preference is given to silver or copper, particularly preferred is silver.
  • the corresponding metal paste is baked at a preferred temperature of 450 to 1300 ° C, more preferably 650 to 1100 ° C, and most preferably 850 to 900 ° C.
  • the metal paste is oxidized. The baking is preferably carried out for 1 to 25 minutes and more preferably for 5 to 15 minutes.
  • the corresponding metallized ceramic supports are then processed in a manner known to those skilled in the art preferably to small ceramic chips with a gehausten LED, ie a cast, drop-shaped applied clear plastic lens, or open LED chips.
  • the gehausten LEDs or the open LED chips are then connected to other electronic components such as resistors on the described (larger) metallized ceramic support, for example by sintering, soldering, bonding and / or gluing.
  • a suitable potting compound or a suitable protective lacquer is applied to the appropriately equipped carrier ceramic. This is preferably done by spraying or potting the potting compound or the protective coating.
  • dosing or coating techniques such as dipping, spinning, brushing, dosing or dropping may also be used.
  • Suitable potting compounds and protective coatings are plastic-based compounds.
  • silicones and / or polyurethanes are used as potting compound or protective varnish.
  • a suitable adhesion promoter is applied to the appropriately equipped carrier ceramic. This is preferably done by spraying the adhesion promoter.
  • alternative dosing or coating techniques such as dipping, spinning, brushing, dosing or dropping may also be used.
  • Suitable Hafvermittler are masses based on plastic.
  • a suitable potting compound or a suitable protective coating is applied as described above.
  • the adherent layer of the ceramic or solder resist thus produced comprises, in addition to the potting compound or the protective varnish on the side of the ceramic or of the solder resist, in addition, a bonding agent.
  • the carrier ceramic which is equipped with components, is first of all cleaned physically-chemically and thereby rendered adherent for a suitable potting compound or a suitable protective lacquer. The potting compound is then applied to the resulting adhesion-promoting surface of the appropriately equipped carrier ceramic.
  • the present invention shall be clarified by the following non-limiting exemplary embodiments.
  • a ceramic substrate of AIN which contains 3% by weight of Y.sub.2 O.sub.3 and is in the form of a heat sink or flat body, is roughened in an alkaline etching bath at a temperature of 60.degree. C. and a pH of 12 for 20 minutes.
  • the Ra value increases from a maximum of 0.6 ⁇ to 0.9 ⁇ .
  • a ceramic substrate which consists of 96% by weight of Al 2 O 3 and is in the form of a heat sink or flat body, is roughened in a sulfuric acid etching bath at a temperature of 120 ° C. for 20 min, the Ra value of not more than 0.6 ⁇ rises to 0.9 ⁇ .
  • the ceramic substrate treated according to Example 1 or Example 2 is metallized with a silver paste and baked oxidatively at a temperature of 870 ° C. for 10 minutes. This gives a corresponding metallized ceramic support.
  • the chopped LED or the open LED chip is then connected to other electronic components such as resistors on the described (larger) metallized ceramic support, for example by sintering, soldering, bonding and / or gluing.
  • a suitable adhesion promoter is applied by spraying onto the appropriately equipped carrier ceramic.
  • the adhesion promoter is one based on plastic.
  • the potting compound is an organic polymer, namely a polyurethane or silicone.
  • Example 3 After mounting the components according to Example 3, the appropriately equipped carrier ceramic is physically-chemically cleaned and thereby made adherent for a suitable potting compound. The potting compound according to Example 5 is then applied to the resulting adhesion-promoting surface.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

L'invention concerne une couche adhérente sur céramique et/ou masque anti-soudure, qui comprend une masse de scellement ou un vernis de protection. Par masse de scellement ou vernis de protection, on entend une masse à base de matière plastique. En outre, l'invention concerne un procédé de production d'une telle couche adhérente, selon lequel i) un substrat céramique est rendu rugueux dans un bain décapant, ii) le substrat céramique ainsi rendu rugueux est métallisé au moyen d'une pâte métallique, iii) le support céramique ainsi métallisé est transformé en une petite puce céramique présentant une LED disposée dans un boîtier, ou en une puce LED ouverte, iv) la LED disposée dans un boîtier, ou la puce LED ouverte, est liée, avec d'autres composants électroniques, sur le support céramique métallisé, et v) une masse de scellement ou un vernis de protection, étant entendu qu'il s'agit d'une masse à base de matière plastique, est appliqué aur la céramique support ainsi garnie. Enfin, l'invention concerne également un composant présentant une telle couche adhérente.
EP15712613.7A 2014-03-28 2015-03-26 Couche adhérente sur céramique et/ou masque anti-soudure, en tant que vernis de protection ou masse de scellement Withdrawn EP3123842A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014205832 2014-03-28
PCT/EP2015/056522 WO2015144810A1 (fr) 2014-03-28 2015-03-26 Couche adhérente sur céramique et/ou masque anti-soudure, en tant que vernis de protection ou masse de scellement

Publications (1)

Publication Number Publication Date
EP3123842A1 true EP3123842A1 (fr) 2017-02-01

Family

ID=52780533

Family Applications (1)

Application Number Title Priority Date Filing Date
EP15712613.7A Withdrawn EP3123842A1 (fr) 2014-03-28 2015-03-26 Couche adhérente sur céramique et/ou masque anti-soudure, en tant que vernis de protection ou masse de scellement

Country Status (4)

Country Link
EP (1) EP3123842A1 (fr)
DE (1) DE102015205486A1 (fr)
TW (1) TW201545623A (fr)
WO (1) WO2015144810A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016005291B4 (de) * 2016-04-29 2024-01-11 Ksg Austria Gmbh Verfahren zur Herstellung eines elektronischen Gerätes in der Form eines Spritzgußteils mit eingelegter Leiterplatte
DE102017217815A1 (de) * 2017-10-06 2019-04-11 Conti Temic Microelectronic Gmbh Verfahren zum Herstellen einer elektronischen Komponente, elektronische Komponente und Lötstopplack

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100712715B1 (ko) * 2001-01-31 2007-05-04 도시바세라믹스가부시키가이샤 표면에 미세한 돌기를 형성시킨 세라믹스부재 및 그제조방법
JP2002308683A (ja) * 2001-01-31 2002-10-23 Toshiba Ceramics Co Ltd 表面凹凸化したセラミックス部材及びその製造方法
WO2009075530A2 (fr) * 2007-12-13 2009-06-18 Amoleds Co., Ltd. Semi-conducteur et son procédé de fabrication
DE102009037249A1 (de) * 2009-03-18 2010-11-11 Kay Schumann Stablampe
CN103547850A (zh) * 2011-03-29 2014-01-29 陶瓷技术有限责任公司 具有陶瓷冷却器和led的浇注灯体

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2015144810A1 *

Also Published As

Publication number Publication date
TW201545623A (zh) 2015-12-01
DE102015205486A1 (de) 2015-10-01
WO2015144810A1 (fr) 2015-10-01

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