EP3114393A1 - Halbleiterlampe mit wärmesenke - Google Patents
Halbleiterlampe mit wärmesenkeInfo
- Publication number
- EP3114393A1 EP3114393A1 EP15702489.4A EP15702489A EP3114393A1 EP 3114393 A1 EP3114393 A1 EP 3114393A1 EP 15702489 A EP15702489 A EP 15702489A EP 3114393 A1 EP3114393 A1 EP 3114393A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- semiconductor lamp
- area
- semiconductor
- cup
- lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 28
- 238000003780 insertion Methods 0.000 claims abstract description 18
- 230000037431 insertion Effects 0.000 claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims description 26
- 239000002184 metal Substances 0.000 claims description 26
- 229910052736 halogen Inorganic materials 0.000 abstract description 2
- 150000002367 halogens Chemical class 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000006223 plastic coating Substances 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- QXAITBQSYVNQDR-UHFFFAOYSA-N amitraz Chemical compound C=1C=C(C)C=C(C)C=1N=CN(C)C=NC1=CC=C(C)C=C1C QXAITBQSYVNQDR-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
- F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/237—Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V15/00—Protecting lighting devices from damage
- F21V15/04—Resilient mountings, e.g. shock absorbers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the invention relates to a semiconductor lamp with a heat sink
- Heat sink which has a first part and a second part, which by means of a press fit with each other
- the invention is particularly applicable to retrofit lamps, in particular incandescent lamps or
- Halogen lamp retrofit lamps are provided.
- a lamp cap is provided at a rear end of the base body and a plurality of LEDs are attached to a front end of the base body.
- an injection-molded aluminum heat sink is coated on the base body, which then covers a lateral surface of the base body.
- the object is achieved by a semiconductor lamp with a heat sink, which heat sink has a first part and a second part, wherein these two parts by means of a
- Press fit are connected together and together define or form a receiving space for a driver, and wherein the first part has an insert area for use in the second part, which use area
- Heat dissipation are formed in the environment.
- the first part can be cheap with simple means
- Starting materials can be prepared, e.g. made of iron or aluminum sheet.
- the insertion may be e.g. also be referred to as insertion, insertion or insertion.
- the insert movement may be achieved by moving one of the two parts toward the other stationary part or moving both parts towards each other.
- the first part and the second part may also be referred to as "lids" or "cups".
- the second part in particular at its rear end, has a socket for connection to a suitable socket, eg an Edison socket or a bipin socket.
- a suitable socket eg an Edison socket or a bipin socket.
- the second part in particular has an opening to a cavity located in the second part.
- the first part or lid can then be press fitted into the opening and closes the cavity.
- the first part may protrude forwards so that the receiving space for accommodating the driver is then formed overall by means of the cavity of the second part and a curvature of the first part.
- first of all the driver eg a driver electronics
- the first part may be put on.
- the first part serves in particular as a carrier for at least one semiconductor light source.
- the at least one semiconductor light source comprises at least one
- a color may be monochrome (e.g., red, green, blue, etc.) or multichrome (e.g., white). Also, the light emitted by the at least one light emitting diode, an infrared light
- IR-LED infrared light
- UV-LED ultraviolet light
- Several light emitting diodes can produce a mixed light; e.g. a white mixed light.
- the at least one light-emitting diode may contain at least one wavelength-converting phosphor
- the phosphor may alternatively or additionally be arranged away from the light-emitting diode
- the at least one light-emitting diode can be in the form of at least one individually housed light-emitting diode or in the form of at least one LED chip. Several LED chips can be mounted on a common substrate (“submount").
- the at least one light emitting diode may be equipped with at least one own and / or common optics for beam guidance, e.g. at least one Fresnel lens,
- the at least a semiconductor light source eg have at least one diode laser.
- the first part is preferably made of metal, e.g. Aluminum, which allows effective heat dissipation from the at least one semiconductor light source to the first part.
- the first part may in particular be a sheet metal part, e.g.
- Spring elements adapt by elastic bending of the shape of the second part in which they are used.
- the spring elements also cause AdZentr mich.
- the spring elements are in particular pressed inward to bring the first part in a press fit simply by insertion into the opening.
- an outer diameter of the annular insert region may be slightly larger than an inner diameter of a circular opening of the second part, so that the spring elements automatically deflect when inserted into this opening.
- an outer diameter of the second part may be slightly larger than an inner diameter of a circular opening of the second part, so that the spring elements automatically deflect when inserted into this opening.
- the slots emanate from a rear edge of the application area, with which the application area is first introduced into the second part. They can be aligned parallel to an axis of symmetry of the annular insert area. The slots may, for example, be aligned parallel to an insertion direction of the two parts. Adjacent slots can be
- the slots may extend from the back edge to a forward end of the annular insert area
- the slots may also be shorter, e.g. extend only over half the height of the annular insert area. This allows a higher elastic restoring force at the same penetration depth in
- the application area is bevelled starting from its rear edge on its outer side. This facilitates the introduction of the
- the first part has a hollow cylinder-like basic shape closed on the front side, the area of use of which is formed by the side wall. This form is particularly simple and inexpensive
- Slots may be aligned parallel to a longitudinal axis of the first part, starting in particular at the rear free edge.
- the front-side end surface or cover surface can be used as a support surface for the at least one semiconductor light source.
- the second part has at its opening for use of the first part at least one inwardly directed slope, to which the
- Spring elements of the first part can put on their use. This also facilitates the introduction of the Area of application in the second part.
- the outside bevelled edge of the insert portion of the first part and the inside beveled opening of the second part can meet in an insert, which is a
- Plastic casing occupied, cup-shaped metal body which is exposed at its front region in particular only on the inside for engagement with the application region of the first part.
- the metal body therefore also has a front opening.
- the exposed part likes
- This embodiment has the advantage that it is safe to touch and many air and
- Creepage distances are avoided. So can be dispensed with a separate electrically insulated insert body in the receiving space.
- all areas which can typically be touched during use can be electrically insulated. The fact that the metal body is exposed at its front region, causes a direct contact of metal to metal with the spring elements and thus a particularly effective
- the metal body may e.g. only at this area and possibly at a rear area for connection to a socket element (e.g., a cap for an Edison socket).
- a socket element e.g., a cap for an Edison socket
- a second part according to this embodiment may e.g. be achieved by molding the metal body with plastic.
- the metal body is bent at its front portion edge outward.
- the inwardly directed slope be easily formed, for example without a material removal.
- the front region of the cup-shaped metal body may have a collar, in particular a circumferential one.
- Section is received by the plastic sheath and the plastic sheath on the inside as a
- Insertion bevel is formed. This improves one
- Plastic coating meets, it is bent on further use or further introduction to the second part already by the plastic sheath inward.
- the insertion bevel of the plastic casing merges into the inwardly directed slope of the metal body.
- the second part inside at least one stop for the
- Plastic casing at least one projecting into the cavity projection, eg rib, has as a stop.
- a non-tilting stop are preferably three in
- FIG. 1 shows a detail of a first and a second part of the semiconductor lamp according to the invention as a sectional side view in an exploded view;
- Fig.l shows a sectional view in an oblique view of several parts of a composite semiconductor lamp in the form of a LED incandescent retrofit lamp 1, namely a first part in the form of a lid 2, a second part in the form of a cup 3, a semiconductor light source module in the form of an LED Submounts 4 and a driver in the form of a driver board 5.
- the lamp 1 has a longitudinal axis L which extends from back to front.
- the cover 2 has a hollow cylindrical basic shape, which is open at the rear and the front side by a
- End wall 6 is closed. At the end wall 6, a lateral surface in the form of an annular closes laterally
- the cup 3 has for this purpose an elongated, front and back open shape, which in the direction of
- a base element (not shown, for example an Edison socket) can be placed on a rear opening 9.
- the driver board 5 is partially inserted in a cavity 10 of the cup 3, wherein it protrudes through a front opening 11 of the cup 3.
- the driver board 5 has one or more electrical and / or electronic components (not shown) which supply the electrical signals fed in via the base element
- an AC signal is converted into electrical signals suitable for operation of the LED submount 4.
- the lid 2 is connected to the cup 3 so that the lid 2 together with its inner arch 12 and the cavity 10 of the cup 3 together form a receiving space 10, 12 for the driver board 5.
- the lid 2 and the cup 3 thus limit or form the receiving space 10, 12.
- the end wall 6 of the lid 2 is broken to
- the cover 2 thus serves as a support for the LED submount 4.
- the electrical leads conduct electrical operating signals generated by the driver board 5 to the LED submount 4.
- the LED submount 4 has a plate-shaped ceramic substrate 13 which is provided on the front side with a plurality of LEDs. Chips 14 is populated. The LED chips 14 may emit white light, for example.
- the lid 2 is connected to the cup 3 by means of a press fit.
- the lid 2 with his as
- Use area 8 serving part of the side wall 7 has been inserted into the front opening 11 of the cup 3 until it abuts a plurality of projecting into the cavity 10 stop portions 15 of the cup 3.
- the stop regions 15 terminate at the same height with respect to the longitudinal axis L. In the presence of the interference fit, the insert region 8 makes contact with an interior or cavity 10 exposed
- Metal body 18 is also cup-shaped with a
- the plastic sheath 17 forms the inside of the
- the side wall 7 of the lid 2 has a plurality of parallel to the longitudinal axis L extending slots 20 which begin at a rear edge 19 of the side wall 7.
- the slots 20 extend here over a large part of a height (along the longitudinal axis L) of the side wall 8. Through the slots 20, the areas of the side wall 7 interrupted therefrom become spring elements 21
- Spring elements 21 can be pressed elastically inwards or outwards.
- the insert area 8 of the lid 2 consists of a plurality of spring elements 21 arranged annularly along a circumferential direction about the longitudinal axis L. Since an outer diameter of the insert area 8 of the lid 2 is slightly larger than an inner diameter of the contact area 16 of the cup 3, the spring elements become 21 at the onset of Cover 2 pressed inwards. By its spring force, the lid 2 is then held in the cup 3.
- a pair of opposing slots 20a each have a narrowed portion 20b to this in a
- FIG. 1 shows a detail of a pictorial overlay of the lid 2 and the cup 3 with inserted cover 2, wherein the spring elements 21 relaxed or not by the
- Restoring force is generated, which causes the interference fit.
- the metal body 18 is bent at its front edge 22 rounded collar-like outward.
- a for the lid 2 inwardly directed bevel 23 is generated, which is an insert of the
- Lids 2 facilitates.
- the bent edge 22 of the cup-shaped metal body is received at its foremost portion 25 of the plastic sheath 17.
- the plastic sheath 17 is in this area
- Insertion bevel 26 is formed.
- the insertion bevel 26 merges into the slope 23.
- the insertion area 8 or the spring elements 21, starting from their rear edge 19 on their outer side, have a further bevel 27 which widened in the longitudinal direction L.
- a number may include exactly the specified number as well as a usual tolerance range, as long as this is not explicitly excluded.
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102014203192.3A DE102014203192B4 (de) | 2014-02-21 | 2014-02-21 | Halbleiterlampe mit Wärmesenke |
| PCT/EP2015/052283 WO2015124426A1 (de) | 2014-02-21 | 2015-02-04 | Halbleiterlampe mit wärmesenke |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP3114393A1 true EP3114393A1 (de) | 2017-01-11 |
Family
ID=52446373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP15702489.4A Withdrawn EP3114393A1 (de) | 2014-02-21 | 2015-02-04 | Halbleiterlampe mit wärmesenke |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10208944B2 (de) |
| EP (1) | EP3114393A1 (de) |
| CN (1) | CN106030189A (de) |
| DE (1) | DE102014203192B4 (de) |
| WO (1) | WO2015124426A1 (de) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102015110769A1 (de) * | 2015-07-03 | 2017-01-05 | NORKA Norddeutsche Kunststoff- und Elektro-Gesellschaft Stäcker mbH & Co. KG | Leuchte und Verfahren zum Austausch eines elektronischen Betriebsgerätes |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012095584A2 (fr) * | 2011-01-13 | 2012-07-19 | Homelights | Ampoule a diode avec dissipateur |
| DE102011004022A1 (de) * | 2011-02-14 | 2012-08-16 | Osram Ag | Leuchtvorrichtung |
| JP2013048039A (ja) * | 2011-08-29 | 2013-03-07 | Hitachi Appliances Inc | 電球型照明装置 |
| US20130301268A1 (en) * | 2012-05-08 | 2013-11-14 | 3M Innovative Properties Company | Solid state light with aligned light guide and integrated vented thermal guide |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100109499A1 (en) * | 2008-11-03 | 2010-05-06 | Vilgiate Anthony W | Par style lamp having solid state light source |
| DE102009035517A1 (de) | 2009-07-31 | 2011-02-03 | Osram Gesellschaft mit beschränkter Haftung | Leuchtvorrichtung und Verfahren zum Montieren einer Leuchtvorrichtung |
| DE102009052930A1 (de) * | 2009-09-14 | 2011-03-24 | Osram Gesellschaft mit beschränkter Haftung | Leuchtvorrichtung und Verfahren zum Herstellen eines Kühlkörpers der Leuchtvorrichtung und der Leuchtvorrichtung |
| CN102588757B (zh) * | 2011-01-14 | 2015-06-17 | 富瑞精密组件(昆山)有限公司 | 灯具 |
| CN202140821U (zh) * | 2011-04-26 | 2012-02-08 | 景发照明科技股份有限公司 | Led灯泡的结构 |
| CH705088A1 (de) | 2011-05-31 | 2012-12-14 | Regent Beleuchtungskoerper Ag | Kühlsystem für eine Leuchte. |
| TW201251148A (en) * | 2011-06-10 | 2012-12-16 | Pan Jit Internat Inc | Manufacturing method of LED heat conduction device |
| CN202177042U (zh) * | 2011-06-20 | 2012-03-28 | 深圳市洲明科技股份有限公司 | 灯具及其灯壳 |
| CN103244926A (zh) * | 2012-02-14 | 2013-08-14 | 欧司朗股份有限公司 | 用于照明装置的散热装置、照明装置及灯具 |
| CN203349186U (zh) * | 2013-06-17 | 2013-12-18 | 新和(绍兴)绿色照明有限公司 | 一种节能灯基座 |
-
2014
- 2014-02-21 DE DE102014203192.3A patent/DE102014203192B4/de active Active
-
2015
- 2015-02-04 EP EP15702489.4A patent/EP3114393A1/de not_active Withdrawn
- 2015-02-04 CN CN201580009488.7A patent/CN106030189A/zh active Pending
- 2015-02-04 WO PCT/EP2015/052283 patent/WO2015124426A1/de not_active Ceased
- 2015-02-04 US US15/120,070 patent/US10208944B2/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012095584A2 (fr) * | 2011-01-13 | 2012-07-19 | Homelights | Ampoule a diode avec dissipateur |
| DE102011004022A1 (de) * | 2011-02-14 | 2012-08-16 | Osram Ag | Leuchtvorrichtung |
| JP2013048039A (ja) * | 2011-08-29 | 2013-03-07 | Hitachi Appliances Inc | 電球型照明装置 |
| US20130301268A1 (en) * | 2012-05-08 | 2013-11-14 | 3M Innovative Properties Company | Solid state light with aligned light guide and integrated vented thermal guide |
Non-Patent Citations (1)
| Title |
|---|
| See also references of WO2015124426A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106030189A (zh) | 2016-10-12 |
| WO2015124426A1 (de) | 2015-08-27 |
| US10208944B2 (en) | 2019-02-19 |
| US20170227206A1 (en) | 2017-08-10 |
| DE102014203192B4 (de) | 2022-03-03 |
| DE102014203192A1 (de) | 2015-08-27 |
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