EP3114393A1

EP3114393A1 - Semiconductor lamp having a heat sink

Info

Publication number: EP3114393A1
Application number: EP15702489.4A
Authority: EP
Inventors: Carolin MÜHLBAUER; Klaus Eckert
Original assignee: Osram GmbH
Current assignee: Ledvance GmbH
Priority date: 2014-02-21
Filing date: 2015-02-04
Publication date: 2017-01-11
Also published as: DE102014203192A1; WO2015124426A1; US20170227206A1; US10208944B2; CN106030189A; DE102014203192B4

Abstract

The semiconductor lamp (1) is equipped with a heat sink (2, 3) which has a first part (2) and a second part (3) connected to each other by way of a press fit and which together delimit a receptacle (10, 12) for a driver (5), the first part (2) having an insert region (8) for insertion into the second part (3), which insert region consists of spring elements (21) that can be pushed inwards. The invention is particularly useful for retrofit lamps, in particular incandescent or halogen retrofit lamps.

Description

description

The invention relates to a semiconductor lamp with a heat sink

Heat sink, which has a first part and a second part, which by means of a press fit with each other

are connected and together define a cavity for a driver. The invention is particularly applicable to retrofit lamps, in particular incandescent lamps or

Halogen lamp retrofit lamps.

There are retrofit lamps known as a replacement for conventional light bulbs, which has a metallic body with a

Driver cavity, wherein a lamp cap is provided at a rear end of the base body and a plurality of LEDs are attached to a front end of the base body. For cooling the LEDs, an injection-molded aluminum heat sink is coated on the base body, which then covers a lateral surface of the base body. The

Driver cavity is lined with a plastic sheath to ensure electrical contact safety of the body and the heat sink. It is disadvantageous that a large-scale connection of the heat sink to the body is only possible with high precision of the manufactured parts effectively. The use of thermal grease to compensate for tolerances causes less heat transfer and can also make the lamp look less high quality. Furthermore, such a filament retrofit lamp is expensive to produce.

It is the object of the present invention to at least partially overcome the disadvantages of the prior art, and in particular to an efficiently coolable semiconductor lamp

which is easy to construct using inexpensive materials. This object is achieved according to the characteristics of the independent

Claims solved. Preferred embodiments are

in particular the dependent claims. The object is achieved by a semiconductor lamp with a heat sink, which heat sink has a first part and a second part, wherein these two parts by means of a

Press fit are connected together and together define or form a receiving space for a driver, and wherein the first part has an insert area for use in the second part, which use area

Consists of spring elements.

This semiconductor lamp has the advantage that a

Press fit is particularly easy to implement and no tight tolerances for the application must be complied with. So can on glue or thermal paste for

Ensuring an effective connection between the two parts is waived. The connection allows good heat transfer between the two parts. The second part can already be effective in its production

Heat dissipation are formed in the environment. The first part can be cheap with simple means

Starting materials can be prepared, e.g. made of iron or aluminum sheet.

The insertion may be e.g. also be referred to as insertion, insertion or insertion. In this case, the insert movement may be achieved by moving one of the two parts toward the other stationary part or moving both parts towards each other.

The first part and the second part may also be referred to as "lids" or "cups". Without loss of generality, it is assumed in the following that the second part, in particular at its rear end, has a socket for connection to a suitable socket, eg an Edison socket or a bipin socket. At his front end, the second part in particular has an opening to a cavity located in the second part. The first part or lid can then be press fitted into the opening and closes the cavity. In particular, the first part may protrude forwards so that the receiving space for accommodating the driver is then formed overall by means of the cavity of the second part and a curvature of the first part. For example, first of all the driver (eg a driver electronics) may at least partially be inserted into the cavity and then the first part may be put on.

The first part serves in particular as a carrier for at least one semiconductor light source. Preferably, the at least one semiconductor light source comprises at least one

Led. If several LEDs are present, they can be lit in the same color or in different colors. A color may be monochrome (e.g., red, green, blue, etc.) or multichrome (e.g., white). Also, the light emitted by the at least one light emitting diode, an infrared light

(IR-LED) or an ultraviolet light (UV-LED). Several light emitting diodes can produce a mixed light; e.g. a white mixed light. The at least one light-emitting diode may contain at least one wavelength-converting phosphor

(Conversion LED). The phosphor may alternatively or additionally be arranged away from the light-emitting diode

("Remote Phosphor"). The at least one light-emitting diode can be in the form of at least one individually housed light-emitting diode or in the form of at least one LED chip. Several LED chips can be mounted on a common substrate ("submount"). The at least one light emitting diode may be equipped with at least one own and / or common optics for beam guidance, e.g. at least one Fresnel lens,

Collimator, and so on. Instead of or in addition to inorganic light-emitting diodes, for example based on InGaN or AlInGaP, it is generally also possible to use organic LEDs (OLEDs, for example polymer OLEDs). Alternatively, the at least a semiconductor light source eg have at least one diode laser.

The first part is preferably made of metal, e.g. Aluminum, which allows effective heat dissipation from the at least one semiconductor light source to the first part. The first part may in particular be a sheet metal part, e.g.

has been formed by forming. However, it may be e.g. also be a casting or a pressed part. Electrical connections of the driver can be performed in particular by the first part.

The fact that the application area consists of spring elements, a firm and precise use can be achieved without adherence to close tolerances in the production. The

Spring elements adapt by elastic bending of the shape of the second part in which they are used. The spring elements also cause SelbstZentrierung. The spring elements are in particular pressed inward to bring the first part in a press fit simply by insertion into the opening.

It is a particularly easy to manufacture design that the application as a multiple-sided

slotted, annular insert area is formed. Thus, a particularly large contact surface is provided to the second part. Without slots, there would be no significant inward elastic bending of the insert, resulting in significantly tighter manufacturing tolerances.

In particular, an outer diameter of the annular insert region may be slightly larger than an inner diameter of a circular opening of the second part, so that the spring elements automatically deflect when inserted into this opening. In this case, an outer diameter of the second

In part, at the level of the opening, in particular, be larger than the outer diameter of the annular insert area. It is a development that the slots emanate from a rear edge of the application area, with which the application area is first introduced into the second part. They can be aligned parallel to an axis of symmetry of the annular insert area. The slots may, for example, be aligned parallel to an insertion direction of the two parts. Adjacent slots can

be equidistant from each other. The slots may extend from the back edge to a forward end of the annular insert area

extend. This allows a particularly large deflection of the spring elements. However, the slots may also be shorter, e.g. extend only over half the height of the annular insert area. This allows a higher elastic restoring force at the same penetration depth in

Compared to a longer slit.

It is a further embodiment that the application area is bevelled starting from its rear edge on its outer side. This facilitates the introduction of the

Area of application in the second part.

It is yet another embodiment that the first part has a hollow cylinder-like basic shape closed on the front side, the area of use of which is formed by the side wall. This form is particularly simple and inexpensive

produced. Slots may be aligned parallel to a longitudinal axis of the first part, starting in particular at the rear free edge. The front-side end surface or cover surface can be used as a support surface for the at least one semiconductor light source.

It is also an embodiment that the second part has at its opening for use of the first part at least one inwardly directed slope, to which the

Spring elements of the first part can put on their use. This also facilitates the introduction of the Area of application in the second part. In particular, the outside bevelled edge of the insert portion of the first part and the inside beveled opening of the second part can meet in an insert, which is a

Introduction especially relieved.

It is also an embodiment that the second part is partially made of an electrically insulating

Plastic casing occupied, cup-shaped metal body which is exposed at its front region in particular only on the inside for engagement with the application region of the first part. The metal body therefore also has a front opening. The exposed part likes

serve at least partially as a contact area with the inserted first part. This embodiment has the advantage that it is safe to touch and many air and

Creepage distances are avoided. So can be dispensed with a separate electrically insulated insert body in the receiving space. In addition, on the outside, all areas which can typically be touched during use can be electrically insulated. The fact that the metal body is exposed at its front region, causes a direct contact of metal to metal with the spring elements and thus a particularly effective

Heat transfer from the at least one

Semiconductor light source on the first part, continue on the

Metal body and then by the plastic coating to the environment. Thus, a particularly effective cooling is achieved in a simple manner. The metal body may e.g. only at this area and possibly at a rear area for connection to a socket element (e.g., a cap for an Edison socket).

A second part according to this embodiment may e.g. be achieved by molding the metal body with plastic.

It is a development of the fact that the metal body is bent at its front portion edge outward. As a result, in particular the inwardly directed slope be easily formed, for example without a material removal. In other words, the front region of the cup-shaped metal body may have a collar, in particular a circumferential one.

It is also an embodiment that the bent edge of the cup-shaped metal body at its foremost

Section is received by the plastic sheath and the plastic sheath on the inside as a

Insertion bevel is formed. This improves one

Insertability of the application area or the spring elements of the first part still further. Because if the rear edge of the application area on the insertion bevel of

Plastic coating meets, it is bent on further use or further introduction to the second part already by the plastic sheath inward.

It is also an embodiment that the insertion bevel of the plastic casing merges into the inwardly directed slope of the metal body. Thus, the spring elements of the first part continue with use of the insertion of the plastic sheath on the inside

directed slope of the metal body, whereby they are further inflected. The use of these two in

Insert direction inwardly leading inclined surfaces

one behind the other allows a relation to a lateral offset of the two parts to each other particularly insensitive possibility of an insertion or use process. It is also an embodiment that the second part inside at least one stop for the

Use of the first part has. So can on

a simple way an exact depth of use of the first part are set in the second part. The plot likes

be formed for example by means of plastic coating. It is a continuing education that the

Plastic casing at least one projecting into the cavity projection, eg rib, has as a stop. For a non-tilting stop are preferably three in

Circumferentially distributed projections used, wherein

but in principle only one, two or more than three projections can be used.

The above-described characteristics, features and advantages of this invention as well as the manner in which they are achieved will become clearer and more clearly understood

In connection with the following schematic description of an embodiment that is related to the

Drawings will be explained in more detail. It can to

Clarity identical or equivalent elements must be provided with the same reference numerals. shows a sectional view in an oblique view parts of a composite semiconductor lamp according to the invention;

shows a detail of a first and a second part of the semiconductor lamp according to the invention as a sectional side view in an exploded view;

shows part of the first part and the second part inserted into each other without

Consideration of deformation at a contact area; and

partially the first part and the second part inserted into each other taking into account the deformation at the contact area. Fig.l shows a sectional view in an oblique view of several parts of a composite semiconductor lamp in the form of a LED incandescent retrofit lamp 1, namely a first part in the form of a lid 2, a second part in the form of a cup 3, a semiconductor light source module in the form of an LED Submounts 4 and a driver in the form of a driver board 5. The lamp 1 has a longitudinal axis L which extends from back to front. The cover 2 has a hollow cylindrical basic shape, which is open at the rear and the front side by a

End wall 6 is closed. At the end wall 6, a lateral surface in the form of an annular closes laterally

Side wall 7 at. The side wall 7 serves with her

rear half as use area 8 for use in the cup 3.

The cup 3 has for this purpose an elongated, front and back open shape, which in the direction of

Longitudinal axis L or forward at least partially widened. For example, a base element (not shown, for example an Edison socket) can be placed on a rear opening 9.

be placed and with the driver board 5 to the

Supply electrically connected. The driver board 5 is partially inserted in a cavity 10 of the cup 3, wherein it protrudes through a front opening 11 of the cup 3. The driver board 5 has one or more electrical and / or electronic components (not shown) which supply the electrical signals fed in via the base element

(e.g., an AC signal) is converted into electrical signals suitable for operation of the LED submount 4.

The lid 2 is connected to the cup 3 so that the lid 2 together with its inner arch 12 and the cavity 10 of the cup 3 together form a receiving space 10, 12 for the driver board 5. The lid 2 and the cup 3 thus limit or form the receiving space 10, 12. The end wall 6 of the lid 2 is broken to

electrical lines (not shown) from the driver board 5 to the front of the end wall 6 resting LED submount 4 pass. The cover 2 thus serves as a support for the LED submount 4. The electrical leads conduct electrical operating signals generated by the driver board 5 to the LED submount 4. The LED submount 4 has a plate-shaped ceramic substrate 13 which is provided on the front side with a plurality of LEDs. Chips 14 is populated. The LED chips 14 may emit white light, for example.

The lid 2 is connected to the cup 3 by means of a press fit. For this purpose, the lid 2 with his as

Use area 8 serving part of the side wall 7 has been inserted into the front opening 11 of the cup 3 until it abuts a plurality of projecting into the cavity 10 stop portions 15 of the cup 3. The stop regions 15 terminate at the same height with respect to the longitudinal axis L. In the presence of the interference fit, the insert region 8 makes contact with an interior or cavity 10 exposed

Contact area 16 of one else with a

Plastic casing 17 surrounded metal body 18th Der

Metal body 18 is also cup-shaped with a

configured rearward and a front opening and is at least basically similar to the form

associated portion of the cup 3 along the longitudinal axis L. The plastic sheath 17 forms the inside of the

rib-like abutment portions 15 and has at her

Front an annular groove-shaped receptacle 24 for a piston (not shown) on. As shown in Figure 2, the side wall 7 of the lid 2 has a plurality of parallel to the longitudinal axis L extending slots 20 which begin at a rear edge 19 of the side wall 7. The slots 20 extend here over a large part of a height (along the longitudinal axis L) of the side wall 8. Through the slots 20, the areas of the side wall 7 interrupted therefrom become spring elements 21

Spring elements 21 can be pressed elastically inwards or outwards. Thus, the insert area 8 of the lid 2 consists of a plurality of spring elements 21 arranged annularly along a circumferential direction about the longitudinal axis L. Since an outer diameter of the insert area 8 of the lid 2 is slightly larger than an inner diameter of the contact area 16 of the cup 3, the spring elements become 21 at the onset of Cover 2 pressed inwards. By its spring force, the lid 2 is then held in the cup 3.

A pair of opposing slots 20a each have a narrowed portion 20b to this in a

bring frictional engagement with the driver board 5 can. The cover 2 thus also serves as a holder and possibly guide for the driver board 5. Figure 3 shows a detail of a pictorial overlay of the lid 2 and the cup 3 with inserted cover 2, wherein the spring elements 21 relaxed or not by the

Press fit are pressed inwards. In this case, there is an overlap of a lateral depth 1. In the in

4, the spring element 21 is bent inwardly by this depth 1, whereby the elastic

Restoring force is generated, which causes the interference fit.

As shown in all figures, the metal body 18 is bent at its front edge 22 rounded collar-like outward. As a result, a for the lid 2 inwardly directed bevel 23 is generated, which is an insert of the

Lids 2 facilitates. For the same purpose, the bent edge 22 of the cup-shaped metal body is received at its foremost portion 25 of the plastic sheath 17. The plastic sheath 17 is in this area

rounded on the inside and therefore also as one

Insertion bevel 26 is formed. The insertion bevel 26 merges into the slope 23. For the purpose of a simple and

In addition, the insertion area 8 or the spring elements 21, starting from their rear edge 19 on their outer side, have a further bevel 27 which widened in the longitudinal direction L. Although the invention in detail by the shown

Embodiment has been illustrated and described in detail, the invention is not limited thereto and others Variations may be deduced therefrom by those skilled in the art without departing from the scope of the invention.

Generally, "on", "an", etc. may be taken to mean a singular or a plurality, in particular in the sense of "at least one" or "one or more" etc., unless this is explicitly excluded, e.g. by the expression "exactly one", etc.

Also, a number may include exactly the specified number as well as a usual tolerance range, as long as this is not explicitly excluded.

Reference sign

1 LED incandescent retrofit lamp

2 lids

3 cups

4 LED submount

5 driver board

6 end wall

7 sidewall

8 Application area of the side wall

9 rear opening of the cup

10 cavity of the cup

11 front opening of the cup

12 inner curvature of the lid

13 ceramic substrate

14 LED chip

15 stop area

16 contact area of the metal body

17 plastic coating

18 metal body

19 rear edge of the application area

20 slot

20a slot with narrowed section

20b narrowed section of the slot

21 spring element

22 front edge of the metal body

23 slope

24 ringnutförmige recording

25 foremost portion of the edge of the metal body

26 insertion bevel

27 slope

1 depth

L longitudinal axis

Claims

A semiconductor lamp (1) having a heat sink (2, 3) which has a first part (2) and a second part (3) which are connected to one another by means of a press fit and which together form a receiving space (10, 12) for a driver ( 5) limit,

wherein the first part (2) has an insert area (8) for use in the second part (3), which consists of inwardly compressible spring elements (21).

A semiconductor lamp (1) according to claim 1, wherein said

Application area (8) as a multiple-sided

slotted, annular insert area (8)

is trained.

Semiconductor lamp (1) according to one of the preceding

Claims, wherein the insert area (8) is chamfered from its rear edge (19) on its outside.

Semiconductor lamp (1) according to one of the preceding

Claims, wherein the first part (2) has a hollow cylinder-like basic shape closed on the front side, whose insert area (8) is formed by a side wall (7).

Semiconductor lamp (1) according to one of the preceding

Claims, wherein the second part (3) at its opening (11) for use of the first part (2) has at least one inwardly directed bevel (23) on which the spring elements (21) of the first part (2) in their use can put on.

Semiconductor lamp (1) according to claim 5, wherein the second part (3) has a cup-shaped metal body (18) partly covered by a plastic casing (17).

which at its front region (16) for Exposed engagement with the insert area (8) of the first part (2) and there to form the inwardly directed slope (23) is bent edge-wise outwards.

A semiconductor lamp (1) according to claim 6, wherein said

bent edge (22) of the cup-shaped metal body (18) at its foremost portion (25) of the

Plastic sheath (17) is received and the plastic sheath (17) on the inside as an insertion bevel (26) is formed.

Semiconductor lamp (1) according to claims 6 and 7, wherein the insertion bevel (26) of the plastic sheath (17) in the inwardly directed slope (23) of the

Metal body (18) passes.

Semiconductor lamp (1) according to one of the preceding

Claims, wherein the second part (3) on the inside at least one stop (15) for the application area (8) of the first part (1).

Semiconductor lamp (1) according to one of the preceding

Claims, wherein the semiconductor lamp (1) a

Retrofitlampe is, the second part (3) has a rearward backplate and the first part (2) serves as a support for at least one semiconductor light source (14).