EP3013744A1 - Verfahren zum betreiben eines wirbelschichtreaktors - Google Patents
Verfahren zum betreiben eines wirbelschichtreaktorsInfo
- Publication number
- EP3013744A1 EP3013744A1 EP14730539.5A EP14730539A EP3013744A1 EP 3013744 A1 EP3013744 A1 EP 3013744A1 EP 14730539 A EP14730539 A EP 14730539A EP 3013744 A1 EP3013744 A1 EP 3013744A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- reactor
- gas
- halosilane
- fluidized bed
- purge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 33
- 239000011261 inert gas Substances 0.000 claims abstract description 27
- 238000011010 flushing procedure Methods 0.000 claims abstract description 15
- 239000000203 mixture Substances 0.000 claims abstract description 13
- 238000010926 purge Methods 0.000 claims description 24
- 239000012495 reaction gas Substances 0.000 claims description 24
- 239000001257 hydrogen Substances 0.000 claims description 12
- 229910052739 hydrogen Inorganic materials 0.000 claims description 12
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 11
- 239000002245 particle Substances 0.000 claims description 10
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 8
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical group Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 claims description 8
- 239000005052 trichlorosilane Substances 0.000 claims description 8
- 230000008021 deposition Effects 0.000 claims description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 229910052756 noble gas Inorganic materials 0.000 claims description 2
- 239000007789 gas Substances 0.000 abstract description 47
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052736 halogen Inorganic materials 0.000 abstract 2
- 150000002367 halogens Chemical class 0.000 abstract 2
- 229910000077 silane Inorganic materials 0.000 abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 12
- 229910052710 silicon Inorganic materials 0.000 description 12
- 239000010703 silicon Substances 0.000 description 12
- 238000006243 chemical reaction Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 9
- 239000005046 Chlorosilane Substances 0.000 description 8
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 8
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical class Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 8
- 238000000151 deposition Methods 0.000 description 8
- 229910052698 phosphorus Inorganic materials 0.000 description 8
- 239000011574 phosphorus Substances 0.000 description 8
- 239000011856 silicon-based particle Substances 0.000 description 8
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 7
- 229910052796 boron Inorganic materials 0.000 description 7
- 238000011109 contamination Methods 0.000 description 7
- 239000008187 granular material Substances 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 5
- 229910052786 argon Inorganic materials 0.000 description 4
- 229910052734 helium Inorganic materials 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 239000002019 doping agent Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000005243 fluidization Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- VXEGSRKPIUDPQT-UHFFFAOYSA-N 4-[4-(4-methoxyphenyl)piperazin-1-yl]aniline Chemical compound C1=CC(OC)=CC=C1N1CCN(C=2C=CC(N)=CC=2)CC1 VXEGSRKPIUDPQT-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 208000034809 Product contamination Diseases 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- HICCMIMHFYBSJX-UHFFFAOYSA-N [SiH4].[Cl] Chemical compound [SiH4].[Cl] HICCMIMHFYBSJX-UHFFFAOYSA-N 0.000 description 1
- VQPFDLRNOCQMSN-UHFFFAOYSA-N bromosilane Chemical class Br[SiH3] VQPFDLRNOCQMSN-UHFFFAOYSA-N 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 239000005049 silicon tetrachloride Substances 0.000 description 1
- 238000009491 slugging Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/08—Compounds containing halogen
- C01B33/107—Halogenated silanes
- C01B33/1071—Tetrachloride, trichlorosilane or silicochloroform, dichlorosilane, monochlorosilane or mixtures thereof
- C01B33/10742—Tetrachloride, trichlorosilane or silicochloroform, dichlorosilane, monochlorosilane or mixtures thereof prepared by hydrochlorination of silicon or of a silicon-containing material
- C01B33/10757—Tetrachloride, trichlorosilane or silicochloroform, dichlorosilane, monochlorosilane or mixtures thereof prepared by hydrochlorination of silicon or of a silicon-containing material with the preferential formation of trichlorosilane
- C01B33/10763—Tetrachloride, trichlorosilane or silicochloroform, dichlorosilane, monochlorosilane or mixtures thereof prepared by hydrochlorination of silicon or of a silicon-containing material with the preferential formation of trichlorosilane from silicon
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/02—Silicon
- C01B33/021—Preparation
- C01B33/027—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/02—Silicon
- C01B33/021—Preparation
- C01B33/027—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material
- C01B33/03—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material by decomposition of silicon halides or halosilanes or reduction thereof with hydrogen as the only reducing agent
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/08—Compounds containing halogen
- C01B33/107—Halogenated silanes
- C01B33/1071—Tetrachloride, trichlorosilane or silicochloroform, dichlorosilane, monochlorosilane or mixtures thereof
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/08—Compounds containing halogen
- C01B33/107—Halogenated silanes
- C01B33/1071—Tetrachloride, trichlorosilane or silicochloroform, dichlorosilane, monochlorosilane or mixtures thereof
- C01B33/10742—Tetrachloride, trichlorosilane or silicochloroform, dichlorosilane, monochlorosilane or mixtures thereof prepared by hydrochlorination of silicon or of a silicon-containing material
- C01B33/10757—Tetrachloride, trichlorosilane or silicochloroform, dichlorosilane, monochlorosilane or mixtures thereof prepared by hydrochlorination of silicon or of a silicon-containing material with the preferential formation of trichlorosilane
Definitions
- the invention relates to a method for operating a fluidized bed reactor.
- Fluidized bed reactors are used, for example, to produce trichlorosilane (TCS) by the reaction of metallurgical silicon with HCl at 350-400 ° C.
- TCS trichlorosilane
- Fluidized bed reactors are also used to produce polycrystalline silicon granules. This is done by fluidization of silicon particles by means of a gas flow in a fluidized bed, which is heated by a heater to high temperatures. By adding a silicon-containing reaction gas, a pyrolysis reaction takes place on the hot particle surface. Here, elemental silicon is deposited on the silicon particles and the individual particles grow in diameter. Due to the regular removal of adipated particles and the addition of smaller silicon particles as seed particles (referred to below as “seed”), the process can be operated continuously with all the advantages associated therewith. B. chlorosilanes or bromosilanes), monosilane (SiH 4 ), as well as mixtures of these gases with hydrogen described Such deposition methods and devices for this purpose, for example, from US 4786477 A known.
- the object is achieved by a method for operating a fluidized bed reactor, comprising a purge a of the reactor and the feed lines with an inert gas; a purge b of the reactor and the feed lines with H2; a purge c of the reactor and the feed lines with a halosilane or with a mixture containing a halosilane.
- a-b-c i. first rinsing with an inert gas, followed by rinsing with H2, then rinsing with halosilane or a mixture containing halosilane, polycrystalline silicon deposited on seed particles, wherein a reaction gas comprises halosilane.
- the high-purity polycrystalline silicon granules according to the invention are prepared by depositing a reaction gas onto seed crystals of silicon in a fluidized bed.
- the reaction gas preferably consists of a mixture of hydrogen and halosilanes, more preferably of a mixture of hydrogen and trichlorosilane.
- the deposition is preferably carried out at a temperature of the fluidized bed in the reaction range from 700 ° C to 1200 ° C.
- the seed crystals present in the fluidized bed are preferably fluidized with the aid of a silicon-free fluidizing gas, preferably hydrogen, and heated by means of temperature radiation.
- a silicon-free fluidizing gas preferably hydrogen
- the heat energy is preferably introduced uniformly over the circumference of the fluidized bed by means of flat radiant heaters.
- the silicon-containing reaction gas is deposited on the silicon particles as elemental silicon due to a CVD reaction. Unreacted reaction gas, fluidizing gas and gaseous side reaction products are removed from the reactor.
- the process can be operated continuously.
- the temperature of the fluidized bed in the reaction zone is particularly preferably from 850 ° C to 1100 ° C, most preferably from 900 ° C to 1050 ° C.
- the reaction gas is preferably injected into the fluidized bed via one or more nozzles.
- the absolute pressure in the fluidized bed is preferably between 0.1 MPa and 1.1 MPa, more preferably between 0.15 MPa and 0.7 MPa, most preferably between 0.2 MPa and 0.5 MPa.
- the concentration of the silicon-containing reaction gas is preferably 10 mol% to 50 mol%, particularly preferably 15 mol% to 40 mol%, based on the total quantity of gas conveyed through the fluidized bed.
- the concentration of the silicon-containing reaction gas in the reaction gas nozzle is preferably from 20 mol% to 50 mol% based on the total amount of gas delivered by the reaction gas nozzle.
- the average residence time of the reaction gas in the fluidized bed is preferably 100 ms to 10 s, preferably 150 ms to 5 s, particularly preferably 200 ms to 2 s.
- the fluidized bed is preferably operated as a bubbling fluidized bed.
- a slugging mode in which bubbles in the fluidized bed rise to the diameter of the fluidized bed, which then push up compressed fluidized bed material as a solid piston until the bubbles collapse, is preferably passed through
- a supply of reaction gas containing halosilane is terminated, after which the rinsing operations b - a follow, ie first rinsing with H 2 and subsequently rinsing with an inert gas, after which the reactor is opened and dismantled.
- a further flushing of the reactor and the draw-off lines with an inert gas takes place.
- one or more of the flushes a, b and c are reinforced by pressure swing purging.
- the inert gas is nitrogen or a noble gas, e.g. Helium or argon.
- the invention provides for inerting the reactor before it is retracted with a halosilane / hydrogen mixture. On the one hand, this serves to avoid a blast gas explosion, on the other hand, contamination of the product polycrystalline silicon granules with moisture or the impurities caused by the moisture (for example phosphorus from steel) is avoided. It has been found that the rinsing operations according to the invention are significantly more effective than the procedure known from the prior art.
- reaction gas can enter the environment.
- the flushing with inert gas and then hydrogen (at retraction) or hydrogen and then inert gas (during extension) thus serves to separate environmental conditions from reaction conditions before and after deposition.
- the halosilane is preferably a chlorosilane. Particularly preferred is the use of trichlorosilane.
- the inerting takes place by means of a rinsing process between the corresponding phases with an inert gas for a defined time with a defined volume flow.
- a particular advantage is that flushing processes with inert gas additionally reduce the moisture contamination introduced by the seed particles.
- the volume of the piping and reactor is critical to both the purge times and purge gas volumes.
- the desired level of product quality of the silicon granules produced in the later deposition process affects the purge time and purge gas levels. For high-purity products for the semiconductor industry, it is necessary to flush longer than for solar applications. Preferred procedure when retracting:
- Purge a Rinse the reactor and the feed lines with an inert gas (N2, Ar, He) for a defined period of time to remove O2 and moisture.
- an inert gas N2, Ar, He
- the rinsing process a is operated for a period of 0.5 to 10 hours.
- the gas heaters for fluidization and for reaction gas are thereby driven at room temperature. It is flushed with a purge gas amount of 10 to 500 Nm 3 / h, wherein the purge gas to 100% of inert gas such. As nitrogen exists.
- Purge Procedure b Rinse the reactor and the feed lines with H2 for a defined period of time to remove the inert gas.
- the rinsing process b is operated for a period of 2 to 100 hours.
- the gas heaters are operated at temperatures of 100 to 1000 ° C. It is flushed with a purge gas of 200 to 1000 Nm 3 / h, the purge gas consists of 100% hydrogen.
- Rinsing process c Replacement of H2 by a chlorosilane or a mixture of chlorosilanes in counter-rotating ramps, at a constant empty-tube gas velocity.
- the rinse c is operated for a period of 2 to 50 hours.
- the purge gas quantities are adjusted so that the following criteria are met:
- the concentration of the silicon-containing reaction gas is preferably 10 mol% to 50 mol%, particularly preferably 15 mol% to 40 mol%, based on the total quantity of gas conveyed through the fluidized bed.
- the concentration of the silicon-containing reaction gas in the reaction gas nozzle is preferably from 20 mol% to 50 mol%, based on the total amount of gas conveyed through the reaction gas nozzle.
- the gas heaters are operated at temperatures of 100 to 1000 ° C.
- the reactor heater is on.
- the rinse can be continuous or can be enhanced by pressure swing rinsing.
- Preferred procedure for extension 1. closing the chlorosilane feed;
- 2nd flushing process b purging the reactor and the feed lines with H2.
- the rinsing process b is operated for a period of 1 to 20 hours.
- the gas heaters are operated at temperatures of 100 to 1000 ° C. It is rinsed with a purge gas of 50 to 800 Nm 3 / h. 3.
- the rinsing process a is operated for a period of 1 to 20 hours.
- the gas heaters are run at room temperature. It is flushed with a purge gas amount of 10 to 500 Nm 3 / h.
- the rinse can also be intensified by pressure swing rinsing.
- an additional purge can be carried out with an inert gas.
- all pipes leading to the reactor and leading away from the reactor are flushed with an inert gas.
- the amount of flushing gas is between 1 and 500 Nm 3 / h at room temperature.
- Fig. 1 shows the time course of the proportions of the gas streams inert gas, H2 and chlorosilane during retraction.
- Fig. 2 shows the time course of the proportions of the gas streams inert gas, H2 and chlorosilane during extension.
- Fig. 1 shows that initially rinsed exclusively for several hours with an inert gas. Then it is also rinsed with H2 only for a few hours. Subsequently, chlorosilane is added to the H2 gas stream, so that the o. G. Concentrations result.
- FIG. 2 shows that first the chlorine-silane feed is stopped, the H2-feed is increased and rinsed exclusively with H2 for a few hours. Subsequently, it is also rinsed with an inert gas for a few hours.
- a reactor with 400 mm internal diameter is rinsed in the rinse b for a period of 2 h.
- the gas amounts to 600
- the gas heaters for reaction and fluidizing gas are set at a temperature of 500 ° C.
- the entry curve with respect to the dopants phosphorus and boron is relatively sluggish, so that only after a reactor life of 2 weeks the highest quality material with a contamination
- Phosphorus ⁇ 800 ppta and boron ⁇ 50 ppta can be produced.
- a reactor with 400 mm internal diameter is rinsed in the flushing process b for a period of 30 h.
- the gas quantities are 600 Nm 3 / h, the gas heaters for reaction and fluidizing gas are set to a temperature of 100 ° C.
- the entry curve with respect to the dopants phosphorus and boron is sluggish, so that only after a reactor life of 1.5 weeks can material of the highest quality be produced with a contamination of phosphorus ⁇ 800 ppta and boron ⁇ 50 ppta. Although this material is sufficient for solar applications, it is not enough for semiconductor applications.
- a reactor with 400 mm internal diameter is rinsed in the flushing process b for a period of 30 h.
- the gas quantities are 200 Nm 3 / h, the gas heaters for reaction and fluidizing gas are set to a temperature of 500 ° C.
- the entry curve with respect to the dopants phosphorus and boron is slow, so that only after a reactor runtime of 2 weeks can material of the highest quality be produced with a contamination of phosphorus ⁇ 800 ppta and boron ⁇ 50 ppta. This material is sufficient for solar, but not for semiconductor applications.
- a reactor with 400 mm internal diameter is rinsed in the flushing process b for a period of 30 h.
- the gas quantities are 600 Nm 3 / h, the gas heaters for reaction and fluidizing gas are set to a temperature of 500 ° C.
- the highest quality material is obtained for the semiconductor industry with con- taminations of phosphorus ⁇ 200 ppta and boron ⁇ 30 ppta.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Silicon Compounds (AREA)
- Devices And Processes Conducted In The Presence Of Fluids And Solid Particles (AREA)
- Engineering & Computer Science (AREA)
- Combustion & Propulsion (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102013212406.6A DE102013212406A1 (de) | 2013-06-27 | 2013-06-27 | Verfahren zum Betreiben eines Wirbelschichtreaktors |
| PCT/EP2014/062661 WO2014206805A1 (de) | 2013-06-27 | 2014-06-17 | Verfahren zum betreiben eines wirbelschichtreaktors |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP3013744A1 true EP3013744A1 (de) | 2016-05-04 |
| EP3013744B1 EP3013744B1 (de) | 2017-09-20 |
Family
ID=50943323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP14730539.5A Not-in-force EP3013744B1 (de) | 2013-06-27 | 2014-06-17 | Verfahren zum betreiben eines wirbelschichtreaktors |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US10526206B2 (de) |
| EP (1) | EP3013744B1 (de) |
| JP (1) | JP6178006B2 (de) |
| KR (1) | KR101842373B1 (de) |
| CN (1) | CN105339303B (de) |
| DE (1) | DE102013212406A1 (de) |
| ES (1) | ES2647501T3 (de) |
| MY (1) | MY170696A (de) |
| SA (1) | SA515370311B1 (de) |
| TW (1) | TWI526395B (de) |
| WO (1) | WO2014206805A1 (de) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102016203082A1 (de) * | 2016-02-26 | 2017-08-31 | Wacker Chemie Ag | Verfahren zur Abscheidung einer In Situ-Beschichtung auf thermisch und chemisch beanspruchten Bauteilen eines Wirbelschichtreaktors zur Herstellung von hochreinem Polysilicium |
| MY190848A (en) * | 2016-12-14 | 2022-05-12 | Wacker Chemie Ag | Process for preparing polycrystalline silicon |
| EP3649078A1 (de) * | 2016-12-14 | 2020-05-13 | Wacker Chemie AG | Verfahren zur herstellung von polykristallinem silicium |
| WO2020125944A1 (de) * | 2018-12-18 | 2020-06-25 | Wacker Chemie Ag | Verfahren zur herstellung von chlorsilanen |
| CN112657436B (zh) * | 2020-12-31 | 2026-03-24 | 新疆协鑫新能源材料科技有限公司 | 一种改善流化床密、稀相段压差的装置及应用 |
| CN115594184B (zh) * | 2022-10-31 | 2023-10-10 | 唐山三孚硅业股份有限公司 | 电子级四氯化硅生产系统及方法 |
| CN118026184A (zh) * | 2024-03-01 | 2024-05-14 | 新特能源股份有限公司 | 一种三氯氢硅合成炉和均衡三氯氢硅合成炉温度的方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4359490A (en) | 1981-07-13 | 1982-11-16 | Fairchild Camera & Instrument Corp. | Method for LPCVD co-deposition of metal and silicon to form metal silicide |
| US4416913A (en) * | 1982-09-28 | 1983-11-22 | Motorola, Inc. | Ascending differential silicon harvesting means and method |
| US4642228A (en) | 1985-07-24 | 1987-02-10 | Angel Sanjurjo | Fluxing system for reactors for production of silicon |
| KR880000618B1 (ko) * | 1985-12-28 | 1988-04-18 | 재단법인 한국화학연구소 | 초단파 가열 유동상 반응에 의한 고순도 다결정 실리콘의 제조 방법 |
| JP3737863B2 (ja) * | 1996-11-26 | 2006-01-25 | 株式会社トクヤマ | 粒状ポリシリコンの製造方法 |
| US6827786B2 (en) | 2000-12-26 | 2004-12-07 | Stephen M Lord | Machine for production of granular silicon |
| DE10203833B4 (de) | 2002-01-31 | 2007-02-08 | Siltronic Ag | Verfahren und Vorrichtung zur Differenzdruckregelung an Epitaxiereaktoren |
| KR100813131B1 (ko) | 2006-06-15 | 2008-03-17 | 한국화학연구원 | 유동층 반응기를 이용한 다결정 실리콘의 지속 가능한제조방법 |
| DE102006037020A1 (de) * | 2006-08-08 | 2008-02-14 | Wacker Chemie Ag | Verfahren und Vorrichtung zur Herstellung von hochreinem polykristallinem Silicium mit reduziertem Dotierstoffgehalt |
| WO2009049477A1 (en) * | 2007-09-20 | 2009-04-23 | Changzhou Ennoah Energy Technology Corporation Ltd. | Process and apparatus for producing polysilicon sheets |
| US8765090B2 (en) * | 2010-09-08 | 2014-07-01 | Dow Corning Corporation | Method for preparing a trihalosilane |
-
2013
- 2013-06-27 DE DE102013212406.6A patent/DE102013212406A1/de not_active Withdrawn
-
2014
- 2014-06-17 ES ES14730539.5T patent/ES2647501T3/es active Active
- 2014-06-17 MY MYPI2015003011A patent/MY170696A/en unknown
- 2014-06-17 KR KR1020167002240A patent/KR101842373B1/ko not_active Expired - Fee Related
- 2014-06-17 JP JP2016522390A patent/JP6178006B2/ja not_active Expired - Fee Related
- 2014-06-17 CN CN201480035962.9A patent/CN105339303B/zh not_active Expired - Fee Related
- 2014-06-17 EP EP14730539.5A patent/EP3013744B1/de not_active Not-in-force
- 2014-06-17 WO PCT/EP2014/062661 patent/WO2014206805A1/de not_active Ceased
- 2014-06-17 US US14/899,143 patent/US10526206B2/en not_active Expired - Fee Related
- 2014-06-18 TW TW103121005A patent/TWI526395B/zh not_active IP Right Cessation
-
2015
- 2015-12-24 SA SA515370311A patent/SA515370311B1/ar unknown
Non-Patent Citations (1)
| Title |
|---|
| See references of WO2014206805A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| MY170696A (en) | 2019-08-26 |
| JP2016530184A (ja) | 2016-09-29 |
| WO2014206805A1 (de) | 2014-12-31 |
| US10526206B2 (en) | 2020-01-07 |
| ES2647501T3 (es) | 2017-12-21 |
| EP3013744B1 (de) | 2017-09-20 |
| SA515370311B1 (ar) | 2017-06-27 |
| KR20160022930A (ko) | 2016-03-02 |
| JP6178006B2 (ja) | 2017-08-09 |
| DE102013212406A1 (de) | 2014-12-31 |
| US20160145109A1 (en) | 2016-05-26 |
| TW201500280A (zh) | 2015-01-01 |
| CN105339303B (zh) | 2017-12-19 |
| TWI526395B (zh) | 2016-03-21 |
| KR101842373B1 (ko) | 2018-03-26 |
| CN105339303A (zh) | 2016-02-17 |
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