EP2977158A1 - Traitement d'une surface de piece a usiner - Google Patents

Traitement d'une surface de piece a usiner Download PDF

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Publication number
EP2977158A1
EP2977158A1 EP15174245.9A EP15174245A EP2977158A1 EP 2977158 A1 EP2977158 A1 EP 2977158A1 EP 15174245 A EP15174245 A EP 15174245A EP 2977158 A1 EP2977158 A1 EP 2977158A1
Authority
EP
European Patent Office
Prior art keywords
workpiece
wood
mixture
processing
curing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP15174245.9A
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German (de)
English (en)
Other versions
EP2977158B1 (fr
Inventor
Marcus Fritz
Gotthilf Sturm
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Homag GmbH
Original Assignee
Homag Holzbearbeitungssysteme GmbH
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Publication date
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Publication of EP2977158A1 publication Critical patent/EP2977158A1/fr
Application granted granted Critical
Publication of EP2977158B1 publication Critical patent/EP2977158B1/fr
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N7/00—After-treatment, e.g. reducing swelling or shrinkage, surfacing; Protecting the edges of boards against access of humidity
    • B27N7/005—Coating boards, e.g. with a finishing or decorating layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N1/00—Pretreatment of moulding material
    • B27N1/02—Mixing the material with binding agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/002—Manufacture of substantially flat articles, e.g. boards, from particles or fibres characterised by the type of binder

Definitions

  • the present invention relates to a method for tempering a surface of a workpiece, as well as a corresponding device. Such a method and device are used in the field of component and furniture industry.
  • Chipboard In the field of component and furniture industry chipboard is increasingly being used to achieve further cost reduction in production. Chipboard are usually produced in presses. For the further processing of chipboard, which are delivered as semi-finished products in defined sizes, these are divided to a certain extent. Before the actual surface finishing, in particular the application of a coating / edge material in narrow surface areas, they are then again dimensionally processed.
  • the hotmelt adhesive may have the disadvantage that, unless the hotmelt adhesive is removed, it forms an elastic body between the core layer and the coating material.
  • UV varnish An alternative method is therefore the use of UV varnish.
  • the thus annealed surface can be machined after curing of the UV varnish.
  • the UV varnish is relatively expensive, so that its use is rather uneconomical, especially when chipboard are used as a comparatively inexpensive material.
  • UV hot melt adhesive Another way to close the pores of the core layer of a chipboard or the like is the use of a UV hot melt adhesive, which can also be machined as the UV coating after application and curing. But even the raw material of the UV hot melt adhesive is very expensive and causes the UV hot melt adhesive reached no economic breakthrough.
  • a surface treatment agent comprising a film-forming plastic composition and filler elements.
  • a surface treatment agent in liquid form which contains wood flour in addition to a film-forming plastic composition as a filler.
  • the Wood flour is provided in a range of 40-80% by volume.
  • UV curing, heat curing or acid curing is preferred.
  • the plastic composition to be formed is a non-liquid but highly viscous liquid.
  • the present invention aims to provide a method and a device, with which a piece-wise pores having workpiece, such as a chipboard, before the further processing, in particular the application of a coating material, can be tempered.
  • the method and the device should be inexpensive to implement and enable improved environmental performance.
  • the subject-matter of claim 1 provides a corresponding method. Further preferred embodiments are listed in the dependent claims. Furthermore, the present invention aims with a device according to claim 10 to a solution.
  • the field of application of the present invention is in particular in the range of workpieces which have sections of workpiece surfaces having pores, as is the case with chipboard in the region of the core layer exposed on the narrow sides.
  • the invention is not limited to use in such workpieces. Also, other sections than the narrow sides may possibly have pores and should still be provided in high quality with a coating material, so that the Compensation according to the invention can also be used in these areas.
  • a material "produced during processing of a semifinished product” is mixed with a binder to form a curable composition.
  • the use of a material produced during the processing of a semifinished product realizes effective recycling, in particular if the "accumulating material” is “produced” in the area where its further use takes place (mixing with binder and tempering of a workpiece surface). In the latter case, therefore, not only a recycling takes place, but it can also short ways are guaranteed, especially if the processing of the semi-finished product and the compensation of a workpiece surface in the immediate vicinity, possibly in the same or an adjacent production line - or the same machine , respectively.
  • a semifinished product in the furniture and component sector is preferably a chipboard, an HDF board, an MDF board, a composite board, a lightweight building board with honeycomb structure, a plywood element or a laminate workpiece.
  • it may be a door element with a composite structure.
  • the "accumulating material” includes wood chips or grains, as they occur during a milling or grinding process of a chipboard.
  • a chipboard contains not only wood-based components but also other additives, which can also be included in the "accumulating material”.
  • the material produced during processing of a semifinished product preferably wood chips or dust
  • the resulting material can be prepared for use as a filler, so that the surface to be coated reaches excellent surface properties.
  • the surface is post-processed after curing of the mixture, in particular machined by machining. This can be done with a milling cutter or a grinder. In this way, the surface of the surface provided with the curable mixture is further improved.
  • the method is characterized in that a machinable lacquer is applied to the surface, wherein the application preferably takes place after curing of the mixture.
  • the curable composition applied to the surface may be shaped with a former prior to curing. In this way, the curable mixture is possibly further pressed into pores of the surface of the workpiece, or it is achieved an additional smoothing.
  • the workpiece with the surface to be coated can be a chipboard.
  • the recycling of materials allows (accumulating material), which may otherwise be disposed of, especially in the same or similar types of work that already used to recover the resulting material.
  • the binder is an adhesive, in particular a wood glue.
  • the adhesive is PVAc (polyvinyl acetate), a two-part adhesive, or a bio-polymer based adhesive.
  • PVAc polyvinyl acetate
  • a two-part adhesive or a bio-polymer based adhesive.
  • a binder extrudable wood material for example using PP or PE.
  • the mixture is cured by means of electromagnetic radiation, in particular by means of microwave, laser radiation, IR radiation, plasma or hot air. In this way, a rapid further processing of the surface provided with the curable mixture is possible.
  • the present invention relates to a device for the compensation of a surface of a workpiece, in particular for carrying out the method according to one of the aforementioned aspects, which device comprises the features of claim 10.
  • the device is equipped with a processing device for processing the material produced during the processing of a semifinished product, in particular for adjusting the chip or grain size of the resulting material by grinding, crushing and / or sieving.
  • the apparatus is further provided with a post-processing device for post-processing, in particular post-machining, the surface in order to further compensate for the surface provided with the curable mixture.
  • the device may be provided with a shaping device for shaping the applied mixture.
  • the curable mixture may still be further pressed into pores of the surface of the workpiece or it is achieved an additional smoothing of the created surface.
  • the shaping device is a sliding shoe.
  • a device for applying a machinable paint to the surface is a further optional component within the scope of the invention, wherein the device may be provided separately from the application device.
  • Chipboard is usually produced in relatively large formats of, for example, 5 x 2.5 m in presses. Such particleboard represent semi-finished products, which are divided for further processing. Before the actual surface finishing, for example, the application of a coating material, the plate blanks are again processed dimensionally stable. This dimensional editing is also referred to as formatting (see step S1 in FIG Fig. 1 ).
  • step S2 The resulting in the processing of the chipboard material, especially chips and other contained in particle board Materials (hereinafter also referred to as "accumulating material") are processed in the present embodiment (step S2), in particular brought to a defined maximum grain size / crushed, for example, ground, separated or chopped, and / or sieved.
  • a defined maximum grain size / crushed for example, ground, separated or chopped, and / or sieved.
  • ingredients can be filtered out in the process step of the preparation, since in the case of chipboard and in the use of the costs incurred in dividing the chipboard material higher wood proportions may be desired.
  • the material is ground and fed to a water bath so that the wood grains float on the water surface while heavier materials sink in the water.
  • the processing may include the admixing of additives, for example in order to make the accumulated (wood) material more flexible.
  • the obtained in the manner described above and possibly processed, accumulating material can be mixed in a further embodiment with other wood material, such as wood flour or other wood chips.
  • a wood-based material possibly with further portions, is thus provided, which can thus be provided or kept in a memory.
  • This material is mixed with an adhesive or adhesives, in particular PVAC, (step S2) in such a way that the wood-based material occupies 50% by volume, in particular 70% by volume, particularly preferably 80% by volume or more as base material ,
  • the material mixed with the adhesive is hereinafter also referred to as a "curable mixture”.
  • the curable mixture is pressed by means of pumps, for example by means of screw pumps, through a nozzle and applied to the narrow surface of a chipboard (step S4). Possibly. is the thus pressed-on mixture, which at least partially penetrates into the pores of the chipboard, brought into shape by means of a shoe or a doctor blade.
  • the curable mixture is dried or cured (step S5).
  • PVAC glue is used as an adhesive for the curable mixture, it can be cured relatively quickly by means of a microwave energy source. Air drying is also possible after activation of the hardenable mixture.
  • step S6 After curing, the treated with the curable mixture surface of the chipboard, in particular the narrow side, again machined and brought into a defined dimensionally stable shape (step S6).
  • a coating material is then applied to the coated surface (step S7).
  • the present invention thus has the advantage that a comparatively inexpensive filler (curable mixture) is provided for the particleboard which is increasingly being used, in some cases with relatively large pores. This leads to possible cost savings in improving the surface quality of a narrow surface of the particularly porous plates.
  • the ecological use should also be pointed out, since on the one hand wood material is used as a filler and, in the above-described direction, is set especially on recycled material.
  • the present invention is not limited to use in the field of chipboard, but can be used in workpieces that due to their production or processing - have comparatively large pores, defects or the like on a surface with a finishing layer, such as a coating material how to provide an edge band.

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Wood Science & Technology (AREA)
  • Forests & Forestry (AREA)
  • Paints Or Removers (AREA)
  • Dry Formation Of Fiberboard And The Like (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
EP15174245.9A 2014-07-25 2015-06-29 Traitement d'une surface d'un panneau de particules Active EP2977158B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102014214686.0A DE102014214686A1 (de) 2014-07-25 2014-07-25 Vergüten einer Werkstückfläche

Publications (2)

Publication Number Publication Date
EP2977158A1 true EP2977158A1 (fr) 2016-01-27
EP2977158B1 EP2977158B1 (fr) 2021-04-21

Family

ID=53524584

Family Applications (1)

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EP15174245.9A Active EP2977158B1 (fr) 2014-07-25 2015-06-29 Traitement d'une surface d'un panneau de particules

Country Status (2)

Country Link
EP (1) EP2977158B1 (fr)
DE (1) DE102014214686A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1028906B1 (nl) * 2020-12-15 2022-07-19 Dovy Keukens Nv Werkwijze voor het met lak afwerken van een substraat en substraat hierdoor verkregen

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1295180B (de) * 1962-06-21 1969-05-14 Annand David Logan Verfahren zur Herstellung von Spanplatten mit mindestens einer Feinstdeckschicht
WO1980000256A1 (fr) * 1977-06-24 1980-02-21 C Livingstone Composition amelioree et sa methode d'utilisation
WO2001047683A1 (fr) 1999-12-29 2001-07-05 Security Plastics, Inc. Serrure a cle pour systemes de moulage par injection
EP1068026B1 (fr) * 1998-04-07 2003-03-12 Ulmadan APS Procede et systeme d'application de vernis, et utilisation de ce procede ou de ce systeme
EP0956196B1 (fr) * 1997-01-27 2004-01-02 Therma-tru Corporation Materiaux de construction resistant aux intemperies
DE102007062941A1 (de) * 2007-12-21 2009-06-25 Akzenta Paneele + Profile Gmbh Verfahren zur Herstellung eines Laminats
DE102008039720A1 (de) * 2008-08-26 2010-03-04 Siempelkamp Maschinen- Und Anlagenbau Gmbh & Co. Kg Verfahren zur Herstellung von Holzfaser-Dämmplatten
EP2213431A2 (fr) * 2009-01-29 2010-08-04 Dieffenbacher GmbH + Co. KG Procédé de fonctionnement d'une installation de fabrication de plaques en fibres, en MDF, en HDF, en matériau dérivé du bois ou en plastique à partir de fibres ou de matériau semblable à la fibre

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2630395A (en) * 1947-06-06 1953-03-03 Union Carbide & Carbon Corp Thermosetting wood filler composition
US2746873A (en) * 1949-07-21 1956-05-22 Chadeloid Corp Stain filler combination for wood
US4294874A (en) * 1979-07-23 1981-10-13 Ppg Industries, Inc. Silicate-containing latex coating compositions

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1295180B (de) * 1962-06-21 1969-05-14 Annand David Logan Verfahren zur Herstellung von Spanplatten mit mindestens einer Feinstdeckschicht
WO1980000256A1 (fr) * 1977-06-24 1980-02-21 C Livingstone Composition amelioree et sa methode d'utilisation
EP0956196B1 (fr) * 1997-01-27 2004-01-02 Therma-tru Corporation Materiaux de construction resistant aux intemperies
EP1068026B1 (fr) * 1998-04-07 2003-03-12 Ulmadan APS Procede et systeme d'application de vernis, et utilisation de ce procede ou de ce systeme
WO2001047683A1 (fr) 1999-12-29 2001-07-05 Security Plastics, Inc. Serrure a cle pour systemes de moulage par injection
DE102007062941A1 (de) * 2007-12-21 2009-06-25 Akzenta Paneele + Profile Gmbh Verfahren zur Herstellung eines Laminats
DE102008039720A1 (de) * 2008-08-26 2010-03-04 Siempelkamp Maschinen- Und Anlagenbau Gmbh & Co. Kg Verfahren zur Herstellung von Holzfaser-Dämmplatten
EP2213431A2 (fr) * 2009-01-29 2010-08-04 Dieffenbacher GmbH + Co. KG Procédé de fonctionnement d'une installation de fabrication de plaques en fibres, en MDF, en HDF, en matériau dérivé du bois ou en plastique à partir de fibres ou de matériau semblable à la fibre

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1028906B1 (nl) * 2020-12-15 2022-07-19 Dovy Keukens Nv Werkwijze voor het met lak afwerken van een substraat en substraat hierdoor verkregen

Also Published As

Publication number Publication date
DE102014214686A1 (de) 2016-01-28
EP2977158B1 (fr) 2021-04-21

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