EP2936076A2 - Electronic device and method for producing an electronic device - Google Patents
Electronic device and method for producing an electronic deviceInfo
- Publication number
- EP2936076A2 EP2936076A2 EP13799037.0A EP13799037A EP2936076A2 EP 2936076 A2 EP2936076 A2 EP 2936076A2 EP 13799037 A EP13799037 A EP 13799037A EP 2936076 A2 EP2936076 A2 EP 2936076A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- circuit
- electronic device
- circuit housing
- molding compound
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 238000000465 moulding Methods 0.000 claims description 50
- 150000001875 compounds Chemical class 0.000 claims description 40
- 230000004913 activation Effects 0.000 claims description 5
- HUWSZNZAROKDRZ-RRLWZMAJSA-N (3r,4r)-3-azaniumyl-5-[[(2s,3r)-1-[(2s)-2,3-dicarboxypyrrolidin-1-yl]-3-methyl-1-oxopentan-2-yl]amino]-5-oxo-4-sulfanylpentane-1-sulfonate Chemical compound OS(=O)(=O)CC[C@@H](N)[C@@H](S)C(=O)N[C@@H]([C@H](C)CC)C(=O)N1CCC(C(O)=O)[C@H]1C(O)=O HUWSZNZAROKDRZ-RRLWZMAJSA-N 0.000 description 10
- 238000011161 development Methods 0.000 description 6
- 230000018109 developmental process Effects 0.000 description 6
- 230000006378 damage Effects 0.000 description 5
- 230000001419 dependent effect Effects 0.000 description 5
- 230000001133 acceleration Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000013178 mathematical model Methods 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000002277 temperature effect Effects 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0034—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having an overmolded housing covering the PCB
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/245—Housings for sensors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D18/00—Testing or calibrating apparatus or arrangements provided for in groups G01D1/00 - G01D15/00
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
- G01R33/09—Magnetoresistive devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0017—Casings, cabinets or drawers for electric apparatus with operator interface units
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/003—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having an integrally preformed housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/062—Hermetically-sealed casings sealed by a material injected between a non-removable cover and a body, e.g. hardening in situ
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
- H01L2223/54486—Located on package parts, e.g. encapsulation, leads, package substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49004—Electrical device making including measuring or testing of device or component part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
Definitions
- the invention relates to an electronic device and a method for manufacturing the electronic device.
- an electronic device in the form of a sensor for outputting an electrical signal based on a detected physical quantity is known.
- the electronic device has an electronic circuit housed in a circuit package.
- an electronic device comprises an electronic circuit, which in one
- Expansion coefficient is housed and preferably contacted via an electrical signal terminal to an external circuit, and surrounding the circuit housing
- Circuit housing is fixed to at least two different and spaced apart fixing points on the circuit housing.
- the thermal expansion coefficient in the context of the specified electronic device describes the heat-dependent expansion and shrinkage of the circuit housing
- the specified electronic device is based on the consideration that the electronic circuit used on the one hand must be protected against mechanical and electrical damage, on the other hand, but must also be adapted to their Endap rates. During the mechanical and electrical protection in the form of the circuit housing together with the electronic
- Circuit itself can be mass-produced, the shape of the molding compound depends on the end application and must be made individualized for this.
- the molding compound could be fixed to the circuit housing. This could be realized, for example, by choosing a suitable adhesive molding compound which forms a firm connection with the circuit housing. For a complete, flat fixation between the
- Circuit housing and the molding compound occurs here, however, the problem that mechanically clamped by the different expansion coefficients between the molding compound and the circuit housing against each other. These mechanical tensions then act on the electronic circuit and load them accordingly.
- the stated electronic device sets with the proposal to fix the molding compound on the circuit housing only via fixing points, which are spaced apart. These fixation points can also be parts of fixation surfaces, but then the fixing surfaces are bridged from each other.
- the molding compound which is usually softer than that
- Circuit housing can then like a cloth around the
- Fixing points are attached. As is known, a cloth attached to an expansive body at certain points throws creases, as can be observed, for example, when putting on a too tight jacket. The mechanical stresses affect the direction of what can be used in the specified electronic housing to the
- the two fixing points are chosen such that a caused by the second expansion coefficient thermal molding stress on the electronic
- Circuit housing clamping counteracts For example, the electronic device can be simulated for the selection, for example, wherein the at least two fixing points are then moved within the scope of the simulation until the counteracting of the molding compound stress and the
- Circuit-housing voltage at the location of the electronic circuit to meet a certain criterion For the simulation, a suitable mathematical model can be modeled by the electronic device in a manner known per se and investigated for the expected stresses.
- the aforementioned criterion is selected such that, with an appropriate choice of fixing points, the molding compound stress and the circuit package distortion cancel each other, so that mechanical stresses on the electronic circuit due to the different
- the specified electronic Device is selected at least one of the fixing points such that a gap between the circuit housing and the molding compound is sealed against ingress of moisture.
- Migration of the electronic device for example, lead in the range of a signal terminal and so the
- At least one of the fixing points should be placed so that the aforementioned gap is sealed to an outside.
- the molding compound is sprayable or castable around the circuit housing, wherein the shrinkage during curing after spraying or potting is selected to be smaller than a shrinkage during cooling from a working temperature of the electronic device to a solidification temperature of the molding compound. In this way it is ensured that the molding compound also applies to the circuit housing during solidification and closes the gap so reliable in the manner described above.
- Circuit housing activated at the fixing points. Activation of the surface of the circuit housing is to be understood below as a partial destruction of the molecular structure of the surface of the circuit package, so that free radicals are formed on the surface of the circuit package. These free radicals are able to form chemical and / or physical compounds with the molding compound so that they no longer depend on the surface of the molding compound Can solve circuit housing. In this way, the molding compound is firmly fixed to the circuit housing.
- the molding compound may comprise a polar material, such as polyamide.
- the polar polyamide may be physically bonded to the activated surface of the circuit package in a manner known to those skilled in the art and thus fixedly secured to the circuit package.
- Other compounds are possible which have a polar surface in the molten state of the molding compound and thereby form a connection with the activated surface of the circuit housing. This incoming compound remains after the solidification of the molten molding composition.
- At least part of the surface of the circuit housing is roughened in the contact area with the molding compound, so that the effective activated surface is increased and the adhesive effect between circuit housing and molding compound is increased.
- the roughened part of the surface of the circuit housing is roughened in the contact area with the molding compound, so that the effective activated surface is increased and the adhesive effect between circuit housing and molding compound is increased.
- Circuit housing with a laser roughened With the laser, the surface of the circuit housing can not only be activated by the laser from the surface of the
- Circuit housing also removed any existing mold release agents that could suppress adhesion between the circuit housing and the molding compound.
- the laser can also be used only for roughening the surface.
- the activation can then be carried out, for example, with a plasma.
- the roughening can be used in addition to identification of the electronic device.
- the feature can be in everyone be chosen in any way. So can the feature
- the specified electronic device is configured as a sensor to output with the circuit an electrical signal based on a detected physical quantity.
- the electronic circuit may include a sensor.
- the physical variable may be, for example, the position of an object to which the sensor is attached, in space, a mechanical stress, a magnetic field or any other physical quantity.
- the above-mentioned, caused by the circuit housing and the molding material mechanical stresses on the sensor for so-called cross-sensitivities, which distort the actual electrical signal with the relevant information about the physical size.
- the indicated electronic device attacks particularly favorable, because by minimizing the mechanical stresses on the electronic circuit and the cross sensitivities of
- a method of manufacturing an electronic device comprises the steps of:
- Circuit housing comprises at least the fixing points.
- the specified method can be extended by features that correspond to the features of the above-mentioned device mutatis mutandis. ⁇
- 1 is a schematic view of a vehicle with a vehicle dynamics control
- Fig. 2 is a schematic view of an inertial sensor of Fig. 1, and
- Fig. 3 shows a further schematic view of the inertial sensor of Fig. 1 show.
- Fig. 1 is a schematic view of a vehicle 2 with a known per se
- Vehicle dynamics control can be found for example in DE 10 2011 080 789 AI.
- the vehicle 2 comprises a chassis 4 and four wheels 6. Each wheel 6 can be slowed down relative to the chassis 4 via a brake 8 fastened fixedly to the chassis 4 in order to slow down a movement of the vehicle 2 on a road (not shown).
- the vehicle 2 for speed sensors 10 on the wheels 6, which detect a rotational speed 12 of the wheels 6. Furthermore, the vehicle 2 has a
- the driving dynamics data 16 of the vehicle 2 detects from which, for example, a pitch rate, a roll rate, a yaw rate, a lateral acceleration, a
- Longitudinal acceleration and / or vertical acceleration can be output in a manner known to those skilled in the art.
- a controller 18 can determine in a manner known to those skilled, whether the vehicle 2 slips on the road or even deviates from the above-mentioned predetermined trajectory and react with a known controller output signal 20 to respond.
- the regulator output signal 20 can then be used by an actuator 22 to control actuators 24, such as the brakes 8, to respond to slippage and deviation from the given trajectory in a manner known per se by means of actuating signals.
- the controller 18 may be integrated, for example, in a known motor control of the vehicle 2. Also, the controller 18 and the actuator 22 as a common
- Control device formed and optionally be integrated into the aforementioned engine control.
- the inertial sensor 14 is shown as an external device outside the controller 18. In such a case, one speaks of an inertial sensor 14 designed as a satellite. However, the inertial sensor 14 could also be constructed as an SMD component so that it can be integrated into a housing of the controller 18, for example.
- the inertial sensor 14 includes an electronic circuit with at least one microelectromechanical system 26, called MEMS 26, as a sensor, which in a conventional manner dependent on the vehicle dynamics data 16, not further
- ASIC 30 (English: application-specific integrated circuit) called.
- the ASIC 30 may then generate the vehicle dynamics data 16 based on the received signal dependent on the vehicle dynamics data 16.
- the MEMS 26, the amplifier circuit 28 and the ASIC 30 are supported on a printed circuit board 32 and electrically contacted with various electrical leads 34 and bonding wires 35 formed on the printed circuit board 32.
- the circuit board 32 could also be formed as a leadframe.
- an interface 36 could be present.
- the MEMS 26 and the ASIC 30 may further in a
- Circuit housing 38 may be cast in, which may be made of thermoset, for example.
- the circuit housing 38 could thus already serve alone as the housing of the inertial sensor 14 and protect the circuit components accommodated therein.
- the inertial sensor 14 is not limited to the application in the vehicle dynamics control described above and is therefore produced for a large number of different end applications. To fit the inertial sensor 14 in the vehicle dynamics control this is molded with a molding compound 40, also called Overmold 40. It can be a
- This molding compound 40 may be, for example, a thermoplastic and has a thermal expansion coefficient of the coefficient of thermal expansion of the circuit housing 38 is different.
- the circuit package 38 in the present embodiment is activated on the surface in certain surface zones 46 as shown in FIG. As part of the activation, the molecular structure of the
- Circuit housing 38 in the region of the surface zones 46 can solve. In this way, the molding compound 40 is fixed on
- Circuit housing 38 fixed.
- the surface zones 46 are further mutually formed at predetermined intervals 48 to each other, of which in Fig. 3 for reasons of clarity, only one is indicated by a distance arrow. Within these distances 48, the surface of the circuit housing 38 is not activated, so that the molding compound 40 remains movable to the circuit housing 38. The molding compound 40 can thus be distorted like heat during a thermal movement of the circuit housing 38 fixed to the activated surface zones 46 of the circuit housing 38 and a mechanical stress due to the thermal movement of the circuit housing 38 on the molding compound 40th is applied, oppose their own mechanical tension. If the spacings 48 of the surface zones 46 are appropriately selected, the mechanical stresses of the circuit package 38 and the molding compound 40 may be eliminated at the location of the MEMS 26, thus reducing cross sensitivities of the MEMS 26 which would otherwise occur under the influence of these mechanical stresses.
- the inertial sensor 14 can be mechanically simulated in advance.
- the location of the activated surface zones 46 could of course also be tested on prototypes.
- the activation can be carried out with a laser, with some activated surface zones 46
- these surface zones 46 could be formed, for example, as lettering, which subsequently allow data to be read out via the interference sensor, such as date of manufacture and / or location.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Casings For Electric Apparatus (AREA)
- Transmission And Conversion Of Sensor Element Output (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Gyroscopes (AREA)
- Measuring Magnetic Variables (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Measuring Fluid Pressure (AREA)
- General Engineering & Computer Science (AREA)
- Investigating Or Analyzing Materials By The Use Of Magnetic Means (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102012224102 | 2012-12-20 | ||
DE102013217892.1A DE102013217892A1 (en) | 2012-12-20 | 2013-09-06 | Electronic device and method for manufacturing an electronic device |
PCT/EP2013/075188 WO2014095316A2 (en) | 2012-12-20 | 2013-11-29 | Electronic device and method for producing an electronic device |
Publications (1)
Publication Number | Publication Date |
---|---|
EP2936076A2 true EP2936076A2 (en) | 2015-10-28 |
Family
ID=49681044
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP13799037.0A Ceased EP2936076A2 (en) | 2012-12-20 | 2013-11-29 | Electronic device and method for producing an electronic device |
EP13799036.2A Ceased EP2936075A1 (en) | 2012-12-20 | 2013-11-29 | Electronic device and method for producing an electronic device |
EP13798670.9A Active EP2936074B1 (en) | 2012-12-20 | 2013-11-29 | Sensor for outputting an electric signal on the basis of a detected physical variable |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP13799036.2A Ceased EP2936075A1 (en) | 2012-12-20 | 2013-11-29 | Electronic device and method for producing an electronic device |
EP13798670.9A Active EP2936074B1 (en) | 2012-12-20 | 2013-11-29 | Sensor for outputting an electric signal on the basis of a detected physical variable |
Country Status (9)
Country | Link |
---|---|
US (3) | US10178781B2 (en) |
EP (3) | EP2936076A2 (en) |
JP (3) | JP6302928B2 (en) |
KR (4) | KR102112894B1 (en) |
CN (4) | CN104870945B (en) |
BR (2) | BR112015014490B1 (en) |
DE (4) | DE102013217892A1 (en) |
MX (2) | MX348915B (en) |
WO (4) | WO2014095314A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3055737B1 (en) * | 2016-09-08 | 2018-11-30 | Continental Automotive France | METHOD FOR MANUFACTURING ON A METAL SUPPORT PLATE OF AT LEAST ONE ELECTRONIC MODULE INCLUDING AT LEAST ONE ELECTRICAL TEST |
JP2018151304A (en) * | 2017-03-14 | 2018-09-27 | エイブリック株式会社 | Magnetic sensor circuit, inspection method, and manufacturing method |
CN108964251A (en) * | 2018-04-17 | 2018-12-07 | 黑龙江博瑞特高新技术开发有限公司 | The test method of twin-power switch monitoring based on mems technology |
DE102018207694B4 (en) * | 2018-05-17 | 2020-10-08 | Audi Ag | High-voltage component for arrangement in a high-voltage electrical system of a motor vehicle, motor vehicle and method for protecting a high-voltage component |
DE102019210373A1 (en) * | 2019-07-12 | 2021-01-14 | Continental Teves Ag & Co. Ohg | Sensor with tight encapsulation and an exposed area |
DE102019210375A1 (en) * | 2019-07-12 | 2021-01-14 | Continental Teves Ag & Co. Ohg | Method of manufacturing a robust sensor |
Family Cites Families (100)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DD50658A1 (en) | 1965-07-27 | 1966-10-05 | Peter Kolodziej | Component with integrated circuit in thin-film technology |
JPS5326670A (en) * | 1976-08-25 | 1978-03-11 | Hitachi Ltd | Manufacture of semiconductor device |
US4295117A (en) | 1980-09-11 | 1981-10-13 | General Motors Corporation | Pressure sensor assembly |
DE3243132C2 (en) | 1982-11-22 | 1985-06-27 | Siemens AG, 1000 Berlin und 8000 München | Box-shaped printed circuit board |
JPS59202652A (en) * | 1983-04-30 | 1984-11-16 | Mitsubishi Electric Corp | Manufacture of semiconductor device |
DE3506639A1 (en) | 1985-02-26 | 1986-08-28 | Thielmann-Luwa GmbH, 5920 Bad Berleburg | TRANSPORT AND / OR STORAGE CONTAINER WITH DATA CARRIER |
JP2569717B2 (en) * | 1987-06-05 | 1997-01-08 | 日本電装株式会社 | Resin-sealed semiconductor device and method of manufacturing the same |
DE3913966B4 (en) * | 1988-04-28 | 2005-06-02 | Ibiden Co., Ltd., Ogaki | Adhesive dispersion for electroless plating, and use for producing a printed circuit |
US4994895A (en) * | 1988-07-11 | 1991-02-19 | Fujitsu Limited | Hybrid integrated circuit package structure |
JPH04268789A (en) | 1991-02-23 | 1992-09-24 | Taiyo Yuden Co Ltd | Hybrid integrated circuit device and manufacture thereof |
DE4141958A1 (en) * | 1991-12-19 | 1993-06-24 | Swf Auto Electric Gmbh | SPEED SENSOR, IN PARTICULAR GEAR SENSOR |
DE9202995U1 (en) | 1992-03-06 | 1992-06-11 | Aug. Winkhaus Gmbh & Co Kg, 4404 Telgte, De | |
JPH0613475A (en) * | 1992-04-28 | 1994-01-21 | Matsushita Electric Ind Co Ltd | Method of forming electronic part, printed wiring board and electronic apparatus having code, and code |
US5386730A (en) | 1992-06-25 | 1995-02-07 | Nippondenso Co., Ltd. | Pressure sensor having a sealed water-resistant construction |
US5598034A (en) * | 1992-07-22 | 1997-01-28 | Vlsi Packaging Corporation | Plastic packaging of microelectronic circuit devices |
JP2851491B2 (en) * | 1992-08-13 | 1999-01-27 | 三菱電機株式会社 | Ignition device for internal combustion engine |
DE4237870A1 (en) * | 1992-11-10 | 1994-03-10 | Daimler Benz Ag | Electronic control appts. for road vehicle - has conductor plate acting as bearer for electronic circuit with components at least on one side |
US5557066A (en) * | 1993-04-30 | 1996-09-17 | Lsi Logic Corporation | Molding compounds having a controlled thermal coefficient of expansion, and their uses in packaging electronic devices |
US5383788A (en) * | 1993-05-20 | 1995-01-24 | W. L. Gore & Associates, Inc. | Electrical interconnect assembly |
US5656782A (en) | 1994-12-06 | 1997-08-12 | The Foxboro Company | Pressure sealed housing apparatus and methods |
TW323432B (en) * | 1995-04-28 | 1997-12-21 | Victor Company Of Japan | |
JP3127812B2 (en) * | 1995-12-27 | 2001-01-29 | 株式会社デンソー | Sealing structure of electric circuit device |
KR100498821B1 (en) * | 1996-03-29 | 2005-11-11 | 아이티티 매뉴팩츄어링 엔터프라이즈, 인코포레이티드 | Plastic resistor and process for producing it |
DE19612765A1 (en) * | 1996-03-29 | 1997-11-13 | Teves Gmbh Alfred | Plastic sensor and method for its production |
US5948991A (en) | 1996-12-09 | 1999-09-07 | Denso Corporation | Semiconductor physical quantity sensor device having semiconductor sensor chip integrated with semiconductor circuit chip |
JP3671563B2 (en) * | 1996-12-09 | 2005-07-13 | 株式会社デンソー | Semiconductor device having a structure in which a mold IC is fixed to a case |
DE19709364C2 (en) | 1997-03-07 | 1998-12-24 | Diehl Ident Gmbh | Seal for a split housing |
US6003369A (en) * | 1997-05-19 | 1999-12-21 | Continental Teves, Inc. | Method for manufacturing encapsulated semiconductor devices |
US5910760A (en) | 1997-05-28 | 1999-06-08 | Eaton Corporation | Circuit breaker with double rate spring |
JP3284925B2 (en) | 1997-06-03 | 2002-05-27 | 株式会社デンソー | Ignition device |
US5963028A (en) | 1997-08-19 | 1999-10-05 | Allegro Microsystems, Inc. | Package for a magnetic field sensing device |
US6178359B1 (en) | 1998-03-31 | 2001-01-23 | Tektronix, Inc. | Instrument with installation-evident accessory modules |
KR100328807B1 (en) * | 1998-05-08 | 2002-03-14 | 가네코 히사시 | Resin structure in which manufacturing cost is cheap and sufficient adhesive strength can be obtained and method of manufacturing it |
JP2000074694A (en) * | 1998-08-27 | 2000-03-14 | Hitachi Ltd | Method and apparatus for detecting abnormality of rotation sensor |
US6221459B1 (en) | 1998-11-30 | 2001-04-24 | Intel Corporation | Controlling the heat expansion of electrical couplings |
DE20017105U1 (en) | 2000-10-04 | 2001-01-18 | Siemens Ag | Circuit arrangement |
DE10146949A1 (en) | 2000-11-22 | 2002-06-06 | Continental Teves Ag & Co Ohg | Active magnetic sensor for electronic brake systems |
US20020170897A1 (en) * | 2001-05-21 | 2002-11-21 | Hall Frank L. | Methods for preparing ball grid array substrates via use of a laser |
JP3809353B2 (en) | 2001-08-02 | 2006-08-16 | キヤノン株式会社 | Manufacturing method of workpiece with ID |
JP2003098213A (en) * | 2001-09-20 | 2003-04-03 | Oht Inc | Inspection device and inspection method |
JP3832641B2 (en) * | 2001-12-14 | 2006-10-11 | シャープ株式会社 | Semiconductor device, stacked semiconductor device, and method for manufacturing semiconductor device |
DE10207762A1 (en) | 2002-02-23 | 2003-09-04 | Endress & Hauser Gmbh & Co Kg | Electrotechnical device |
US20040051211A1 (en) * | 2002-09-12 | 2004-03-18 | Xerox Corporation | Production of seamless belts and seamless belt products |
US7417315B2 (en) | 2002-12-05 | 2008-08-26 | International Business Machines Corporation | Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging |
JP2004198240A (en) | 2002-12-18 | 2004-07-15 | Denso Corp | Sensor device |
DE10300171A1 (en) | 2003-01-08 | 2004-07-22 | Hella Kg Hueck & Co. | Electronic unit has metal housing part with at least the inner surface roughened by sand blasting, electronic components in interior of housing and setting material filling interior of housing |
DE10300175B4 (en) | 2003-01-08 | 2016-12-29 | Hella Kgaa Hueck & Co. | Electronic assembly with heat-dissipating housing part |
DE10313832A1 (en) | 2003-03-21 | 2004-10-14 | Tyco Electronics Pretema Gmbh | Assembly and method for manufacturing an assembly |
JP4197140B2 (en) * | 2003-06-19 | 2008-12-17 | パナソニック株式会社 | Semiconductor device |
US6953891B2 (en) * | 2003-09-16 | 2005-10-11 | Micron Technology, Inc. | Moisture-resistant electronic device package and methods of assembly |
JP4300521B2 (en) * | 2004-02-12 | 2009-07-22 | 富士フイルム株式会社 | Electromagnetic induction tag, component selection system, and component selection method |
DE102004015597B4 (en) | 2004-03-30 | 2007-12-06 | Qimonda Ag | Semiconductor device with protective housing structure |
JP2006222406A (en) * | 2004-08-06 | 2006-08-24 | Denso Corp | Semiconductor device |
DE202004020518U1 (en) | 2004-08-13 | 2006-04-06 | Robert Bosch Gmbh | Casing part for hand-held machine tool is made up of two types of materials, whereby labeling element made up of first material type is fixed on component made up of second material type |
EP1630913B1 (en) * | 2004-08-31 | 2007-10-03 | Infineon Technologies AG | Method for manufacturing an optical or electronic modul with a plastic casing containing an optical or electronic component as well as said optical or electronic modul |
DE102004054622A1 (en) | 2004-11-11 | 2006-05-18 | Ksg Leiterplatten Gmbh | Laminated module for circuit board for electronic circuit with stack of several layers, i.e. at least one conductive layer and at least one electrically insulating material |
JP2006303106A (en) * | 2005-04-19 | 2006-11-02 | Denso Corp | Electronic circuit device |
WO2007005864A1 (en) | 2005-07-01 | 2007-01-11 | King Owyang | Complete power management system implemented in a single surface mount package |
WO2007025252A1 (en) * | 2005-08-26 | 2007-03-01 | Tk Holdings Inc. | Electronic module and method for sealing an electronic module |
JP4631727B2 (en) * | 2006-01-30 | 2011-02-16 | 株式会社デンソー | Gas sensor |
JP4868887B2 (en) * | 2006-02-28 | 2012-02-01 | パナソニック電工Sunx株式会社 | Resin welding method, resin parts |
JP4503039B2 (en) * | 2006-04-27 | 2010-07-14 | 三洋電機株式会社 | Circuit equipment |
JPWO2007138694A1 (en) * | 2006-05-31 | 2009-10-01 | 株式会社日立製作所 | Verification method |
JP5200338B2 (en) | 2006-06-15 | 2013-06-05 | ソニー株式会社 | RFID tags and products |
TWI309467B (en) | 2006-06-21 | 2009-05-01 | Advanced Semiconductor Eng | Substrate strip and substrate structure and method for manufacturing the same |
DE102006032073B4 (en) * | 2006-07-11 | 2016-07-07 | Intel Deutschland Gmbh | Electrically conductive composite of a component and a carrier plate |
DE102006032998B4 (en) | 2006-07-17 | 2010-09-16 | Continental Automotive Gmbh | Sensor assembly with a sensor band, in particular with a fiber-optic sensor band |
JP2008033724A (en) * | 2006-07-31 | 2008-02-14 | Mitsumi Electric Co Ltd | Manufacturing method of single-chip semiconductor integrated circuit device, program-debugging method, and manufacturing method of microcontroller |
DE102006042556A1 (en) | 2006-09-11 | 2008-03-27 | Siemens Ag | Electronic module e.g. sensor component for use in transportation unit, has cover formed by substrate, and conductor pulling structure in area of main side that is recessed by housing material, on which electronic circuit is arranged |
JP2008172172A (en) * | 2007-01-15 | 2008-07-24 | Denso Corp | Electronic controller and method of manufacturing the same |
US7849843B2 (en) * | 2007-04-27 | 2010-12-14 | Denso Corporation | Ignition coil |
US20080290482A1 (en) * | 2007-05-25 | 2008-11-27 | National Semiconductor Corporation | Method of packaging integrated circuits |
JP4380748B2 (en) * | 2007-08-08 | 2009-12-09 | ヤマハ株式会社 | Semiconductor device and microphone package |
US7830135B2 (en) | 2007-08-14 | 2010-11-09 | Fluke Corporation | Digital multimeter having housing sealing arrangement |
US8207607B2 (en) * | 2007-12-14 | 2012-06-26 | Denso Corporation | Semiconductor device with resin mold |
EP2154713B1 (en) | 2008-08-11 | 2013-01-02 | Sensirion AG | Method for manufacturing a sensor device with a stress relief layer |
DE102008064046A1 (en) | 2008-10-02 | 2010-04-08 | Continental Teves Ag & Co. Ohg | Method for producing a speed sensor element |
DE102008064047A1 (en) * | 2008-10-02 | 2010-04-08 | Continental Teves Ag & Co. Ohg | Sensor element and carrier element for producing a sensor |
DE102008043773A1 (en) | 2008-11-17 | 2010-05-20 | Robert Bosch Gmbh | Electrical and/or micromechanical component, has base substrate whose main side is provided with portions, where portions exceeding over region of cap are decoupled from material of package |
JP5339968B2 (en) | 2009-03-04 | 2013-11-13 | パナソニック株式会社 | Mounting structure and motor |
JP5110049B2 (en) * | 2009-07-16 | 2012-12-26 | 株式会社デンソー | Electronic control device |
WO2011015642A1 (en) * | 2009-08-05 | 2011-02-10 | Continental Teves Ag & Co. Ohg | Sensor arrangement and chip comprising additional fixing pins |
DE102009028956A1 (en) * | 2009-08-28 | 2011-03-03 | Robert Bosch Gmbh | magnetic field sensor |
JP5075171B2 (en) * | 2009-09-02 | 2012-11-14 | パナソニック株式会社 | Ultrasonic sensor |
JP2011100718A (en) | 2009-10-05 | 2011-05-19 | Yazaki Corp | Connector |
JP2011086685A (en) | 2009-10-13 | 2011-04-28 | Asmo Co Ltd | Resin-sealed semiconductor device and method for manufacturing the same |
JP5412357B2 (en) | 2010-04-01 | 2014-02-12 | 株式会社フジクラ | Membrane wiring board |
JP5195819B2 (en) * | 2010-06-02 | 2013-05-15 | 株式会社デンソー | Air flow measurement device |
US20120031786A1 (en) * | 2010-06-02 | 2012-02-09 | Patrick Mish | Protective skin for an e-reader |
WO2012020069A1 (en) | 2010-08-10 | 2012-02-16 | Continental Teves Ag & Co. Ohg | Method and system for regulating driving stability |
JP2012073113A (en) | 2010-09-29 | 2012-04-12 | Misuzu Kogyo:Kk | Chemical sensor, manufacturing method of chemical sensor |
DE102011004144A1 (en) | 2011-02-15 | 2012-08-16 | Robert Bosch Gmbh | Vibration sensor and method for producing such a vibration sensor |
DE102012201018B4 (en) | 2012-01-24 | 2016-03-31 | Ifm Electronic Gmbh | Measuring instrument with air passage provided on the housing |
DE102012203222A1 (en) | 2012-03-01 | 2013-09-05 | Robert Bosch Gmbh | Housing part for driving unit for actuating moving parts of car, has groove for receiving radial joint, which radially ensures sealing of part, where wall of groove comprises projections that carry out interlocking connection with joint |
DE202012003728U1 (en) | 2012-04-15 | 2013-07-17 | Dietmar Friedrich Brück | Message device for mounting in or on an element, in particular in a room ceiling |
JP6296687B2 (en) * | 2012-04-27 | 2018-03-20 | キヤノン株式会社 | Electronic components, electronic modules, and methods for manufacturing them. |
DE102012213917A1 (en) * | 2012-08-06 | 2014-02-20 | Robert Bosch Gmbh | Component sheath for an electronics module |
EP2725715B1 (en) * | 2012-10-29 | 2018-12-12 | Optosys SA | Proximity sensor |
DE102014205922B4 (en) * | 2014-03-31 | 2020-12-03 | Aktiebolaget Skf | Module for recording the vibration behavior of a mechanical component |
TWI567475B (en) * | 2014-12-02 | 2017-01-21 | 明基電通股份有限公司 | Projection fixing apparatus |
-
2013
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Non-Patent Citations (1)
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