JPH0613475A - Method of forming electronic part, printed wiring board and electronic apparatus having code, and code - Google Patents

Abstract

PURPOSE:To readily mechanize to assign a bar code and prevent the bar code from being erased or separating in resin mold type electronic parts provided with the bar code or matrix code. CONSTITUTION:In a resin mold type electronic part, for example, a QEP 1, a bar code 2 is provided at the same time as a package and arranged in the form of a uneven surface on a recessed part bottom surface 4 provided on the surface, whereby the bar code is prevented from being erased or separating, the reliability in bar code read is enhanced also the bar code is automatically given and the producibility is raised.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component having a bar code (one-dimensional code (one-dimensional code)) or a matrix code (two-dimensional code), and a printed wiring board having the electronic component mounted thereon. And an electronic device on which the printed wiring board is mounted, and a code for the electronic component
The present invention relates to a forming method.

As the above-mentioned electronic parts, parts for various electronic circuits, such as a transistor (Tr), a diode (Di), an integrated circuit (IC), a relay (which constitutes a VTR, a television receiver, a predetermined printed wiring board, etc., are used. Re) and other semiconductor components, coils (L), resistors (R), capacitors (C) and other passive element components, vibrators (resonators), and flyback transformers and other odd-shaped components, especially package ( The exterior) relates to a resin-molded electronic component.

[0003]

2. Description of the Related Art Conventionally, as means for identifying the cost, product number, etc. of electronic parts for production management or sales management, an identification symbol consisting of numbers and alphabets, or an actual flattening 0
As proposed in Japanese Laid-Open Patent Publication No. 2-11338, a means for sticking a label printed with a bar code on an electronic component or for printing a bar code, or a means for printing a bar code on a wrapping paper or a box for housing the electronic component is adopted. ing.

[0004]

However, in the conventional method as described above, a bar code is provided whenever necessary. In addition, it requires labor and time for labeling and printing, and the amount of investment is large for automatically identifying the identification symbol and mechanizing and automating the labeling operation. Further, even if a label with a barcode is attached to an electronic component, there is a problem that the barcode is worn out and disappears or the label is peeled off in the process of handling the electronic component. In view of the above problems, the present invention has an electronic component that prevents code abrasion and label peeling during electronic component manufacturing and distribution, a printed wiring board on which the electronic component is mounted, and the printed wiring board. Another object of the present invention is to provide an electronic device and a code forming method that can easily perform code assignment to the electronic component.

[0005]

In order to solve the above-mentioned problems, the electronic component of the present invention has a bar code (one-dimensional code) or a matrix code (two-dimensional code) integrally provided on the package surface of the electronic component. In addition, the electronic component is mounted to form a printed wiring board, and the printed wiring board is mounted and housed in various electronic devices such as a television receiver.

[0006]

With the above-described structure, the present invention can provide a bar code which is resistant to peeling and abrasion by slightly changing the external shape of a conventional electronic component. It also facilitates mechanization of bar code or matrix code application. Furthermore, it is possible to detect and read the code by using a light beam having a wavelength other than infrared rays or a stylus.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings shown in FIGS. 1 and 2 by using an example of a resin mold type electronic component having a bar code. 1 is a perspective view of a resin mold type semiconductor component QFP (flat pack IC) according to the first embodiment of the present invention, and FIG.
-The sectional view seen from the S1 direction is shown.

The flat pack IC of the present invention is formed by molding an IC chip with a predetermined epoxy resin member or a pattern (exterior) with a ceramic member such as alumina porcelain. The bar code 2 is arranged on the surface in a predetermined manner. I have set up. Specifically, a rectangular recess 3 having a predetermined depth is arranged on the surface,
The barcode 2 is disposed on the bottom surface 4 of the recess by injection molding, printing, or other means. Hereinafter, a method of arranging a code on the package surface of the flat pack IC1 will be described based on Examples 1 to 4.

(Embodiment 1) A structure in which a bar code 2 is integrally formed in a concave-convex shape on a bottom surface 4 of a concave portion provided in a predetermined portion of the surface of a flat pack IC 1. That is, when the package of the electronic component 1 is molded, the barcode 2 is also integrally integrally molded by injection molding or press molding. In this case, a predetermined color, for example, black or white, is arbitrarily applied by a predetermined means to the projection surface of the barcode in order to clearly exhibit the contrast as the barcode. In the code of the embodiment shown in FIGS. 1 and 2, the bar code 2 is formed in the shape of a protrusion having a predetermined height from the bottom surface 4 of the recess. Of course, it goes without saying that press molding may be performed in the direction in which the recess bottom surface 4 is recessed. In this case as well, it is the same that a predetermined color may be applied to the recess or the bottom surface of the recess, if necessary. Further, instead of applying the color as in the above-mentioned embodiment, the color of the bottom surface 4 of the concave portion and the color of the cord portion may be made different by the two-color molding method. Of course, it goes without saying that the package member of the electronic component and the member having the reference numeral may be different by the two-color injection molding method. For example, an epoxy resin member may be used as the package member, and a member in which a conductive member is mixed in the constituent member indicated by the reference numeral, a member in which a magnetic member is mixed, or the like may be used. The two-color molding method is generally performed using a mold having two cavities and two injection molding nozzles (that is, resins of two different colors), and is performed by rotating or shifting the mold. In the case of this means, it is possible to dispose the barcode-corresponding shape pattern as a nested die in the electronic component molding die without separately requiring a bar-code applying facility. By using a nested mold, it is easy to change the barcode pattern. As a means for forming the bar code portion on the nesting die, a method such as electric discharge machining, etching, engraving or milling may be used. Of course, without forming the bar code forming mold part into a nested shape, directly
There is no problem in arranging concavely or convexly on the surface of the electronic component molding die.

(Embodiment 2) A bar code is formed on the bottom surface of a recess provided in a predetermined portion of the main plane of the flat pack IC1 by using a marking means. It is formed by curing or firing the barcode as required. In this case, the target electronic component material to which the reference numeral is given is preferably a metal member in addition to a ceramic member or a resin member.

(Embodiment 3) A code is formed on the bottom surface 4 of the concave portion provided at a predetermined portion of the main plane of the flat pack IC 1 by printing or the like using ink that can be erased by irradiation of ultraviolet rays or a halogen lamp. That is, the purpose is to rewrite the code, and the visible light is 400 nm to 800 n.
A bar code is printed or applied in a predetermined manner using an ink that disappears in response to light in a wavelength range outside the wavelength range of m.

(Example 4) A coating film having a thickness of several tens of micrometers is arranged on the package surface of an electronic component by means such as printing, coating, transferring, or molding, and the coating film is sandblasted, laser-coated, or laser-coated. It is removed by a means such as water jet to form a barcode (not shown). The removal pattern may be arbitrarily selected depending on whether the coating film is left in the form of a bar code or conversely, the coating film is trimmed into the bar code pattern. Also in this case, the mass productivity is excellent, and the bar code can be changed very easily.

As described in Embodiments 1 to 4, the bar code 2 provided on the surface of the flat pack IC 1 can transmit data via a non-contact bar code reader (not shown).

As a matter of course, the top surface of the bar code 2 arranged on the bottom surface 4 of the recess is constructed to be lower than the surface of the flat pack IC 1 by a predetermined amount. With this configuration, even if the surface of the flat pack IC1 is rubbed during use or handling, the barcode 2 will not be erased. Furthermore, by arranging the code within the predetermined size of the recess 3 of the flat pack IC1, the direction and position of the code are kept within a certain range, the mechanization of the code reading is facilitated, and the reading reliability is improved. improves. The input / output information of barcode 2 is color /
Any product management information such as size, shape, lot number, product number, manufacturing date, cost, etc. can be used, and it can be performed according to the management purpose.

Next, the identification management method of the flat pack IC 1 having the above configuration will be briefly described. Flat pack I
In the exterior process of C1, a management code is first applied to the recess of the package by using a predetermined bar code writer (code giving machine / not shown) means or the like. Next, a bar code reader (code decoder / not shown) reads necessary necessary data from the bar code at each production process of the flat pack IC1 or at the time of delivery, thereby collecting and managing the necessary data. Accurately and promptly implemented. As described above, the flat pack IC1 of the present invention has a bar code integrated with the package so that it can be mechanically identified and managed, and the management data can be effectively utilized for various purposes. Needless to say, the same effect can be obtained even if the barcode is a matrix code (two-dimensional code).

In the embodiment of the present invention, the members constituting the package of electronic parts are optional, and in addition to ceramic or resin members such as pottery and porcelain, a kneading member of gluten consisting of natural protein and a solvent is compressed. It may be formed by molding or injection molding. Gluten, a natural protein, is easily decomposed by microorganisms in water and soil, so it is convenient for disposal after use and there is no concern about environmental pollution due to disposable use.

Furthermore, metal powder or metal particles (for example, Ag or the like) may be added to the resin member such as epoxy resin or phenol resin.
It is also possible to knead a conductive member such as powder) or carbon fiber or carbon particles to give a shielding effect. Further, a magnetic material such as a ferrite powder material may be kneaded in a predetermined resin material so that the unevenness of the barcode can be detected by a magnetic sensor or the like.

In addition, regarding the type of electronic parts, QF
It is optional in addition to semiconductor parts such as P, passive element parts, and odd-shaped parts such as FBT.

Further, a printed wiring board on which the above-mentioned electronic parts are arbitrarily mounted may be configured in a predetermined manner so as to be mounted / stored in an electronic device such as a television receiver.

[0020]

As described above, according to the electronic component of the present invention and the method of forming a code on the electronic component, the direction and position of the code are within a certain range, and the mechanization of the code reading is facilitated. Improves reliability. Further, it makes it possible to inexpensively and easily mechanize the application of a bar code or a matrix code that is resistant to peeling and abrasion. Furthermore, it is possible to detect and read the code by light rays with wavelengths other than infrared rays and stylus, and it is not affected by dust adhesion or contamination of the bar code by writing instruments. The management of the presence / absence check of components on the wiring board, the erroneous mounting, and the component mounting state check is simplified, and many effects such as the automation of the printed wiring board manufacturing can be obtained.

[Brief description of drawings]

FIG. 1 is a perspective view of a flat pack IC1 according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view from a side surface of FIG. 1 viewed from the cutting line S1 to S1 direction.

[Explanation of symbols]

 1 Flat pack IC 2 Bar code 3 Recess 4 Bottom of recess

Claims (16)

[Claims] 1. An electronic component, wherein the package of the electronic component and the code are integrally molded at the same time. 2. An electronic component, wherein a package of the electronic component and the code are integrally molded at the same time so that the code is formed in a concavo-convex shape on the surface of the electronic component. 3. A method for forming a code, wherein the code is integrally molded on the surface of the electronic component by injection molding or press molding. 4. A method of forming a code, wherein the color of the package of the electronic component and the color of the code are made different by a two-color injection molding method. 5. A method for forming a code, wherein the code is formed on the surface of the electronic component by engraving. 6. A method for forming a code, wherein a coating film is formed on the surface of an electronic component and the coating film is removed by means of sandblasting, laser or water jet to form a bar code. . 7. An electronic component in which a code is formed by printing or applying an ink that can be erased by irradiation with invisible light. 8. An electronic component, wherein a kneading member of gluten of natural protein and a solution is injection-molded or compression-molded to integrally mold the package and the code. 9. An electronic component, characterized in that the package of the electronic component and the code are simultaneously formed integrally by using a member mixed with a conductive member. 10. An electronic component, characterized in that a package of an electronic component and a code are integrally formed at the same time by using a member mixed with a magnetic member. 11. An electronic component, wherein a package member of the electronic component and a member having a reference numeral are different from each other by a two-color injection molding method. 12. The electronic component according to claim 11, wherein a member mixed with a conductive member or a member mixed with a magnetic member is used as the constituent member of the reference numeral. 13. The electronic component is a resin-molded electronic component, and the electronic component is a resin molded electronic component.
The electronic component according to 9, 10, or 11. 14. The code type is a one-dimensional code or a two-dimensional code.
4,5,6,7,8,9,10,11,12 or 13
Electronic components listed. 15. A printed wiring board on which the electronic component according to claim 14 is mounted. 16. An electronic device on which the printed wiring board according to claim 15 is mounted.