CN103390610B - Electronic component module and manufacture method thereof - Google Patents
Electronic component module and manufacture method thereof Download PDFInfo
- Publication number
- CN103390610B CN103390610B CN201310114467.4A CN201310114467A CN103390610B CN 103390610 B CN103390610 B CN 103390610B CN 201310114467 A CN201310114467 A CN 201310114467A CN 103390610 B CN103390610 B CN 103390610B
- Authority
- CN
- China
- Prior art keywords
- electronic component
- guard block
- marking
- sealing parts
- component module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54406—Marks applied to semiconductor devices or parts comprising alphanumeric information
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54413—Marks applied to semiconductor devices or parts comprising digital information, e.g. bar codes, data matrix
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
- H01L2223/54486—Located on package parts, e.g. encapsulation, leads, package substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Abstract
The invention provides a kind of electronic component module and manufacture method thereof.Possessing substrate (1), be arranged on the multiple electronic components (2) on a face of aforesaid substrate (1), by the sealing parts (3) of above-mentioned electronic component (2) sealing, in the electronic component module (100) of the guard block (4) applied with the surface in order to cover above-mentioned sealing parts (3), owing to carrying out the 1st marking (5) to the surface of sealing parts (3), coating guard block (4) is to cover the 1st marking (5), and the 2nd marking (6) is carried out to the surface of guard block (4), so can effectively utilize limited region to record the product information required for traceability, even if when the mark of piece surface is impaired, also the 1st marking (5) can be identified by part or all removing by guard block (4), so can traceability be guaranteed.
Description
Technical field
The present invention relates to the packaging structure of electronic component, particularly can identify the packaging structure of the electronic component of much information in limited region.
Background technology
In the past, the object to find out etc. of reason when becoming malfunction from the electronic equipment being equipped with electronic component module, carry out at large by goods name, manufacture that the goods intrinsic informations such as batch number are printed onto electronic component module above namely in appearance can on the face of easy identification, so-called mark.
In recent years, owing to requiring the traceability (trackability) of quality management information and circulation control information equal altitudes, so increase about the amount of information of traceability, on the other hand, because electronic equipment is required miniaturization and high performance consumingly, so also require miniaturization consumingly for the electronic component module carried in the electronic device, the region that can show about the information of traceability diminishes, and is difficult to guarantee enough viewing areas.
As the electronic component module of conventional art, there will be a known the electronic component module described in following patent documentation 1.
In the electronic component module described in patent documentation 1, as shown in Figure 4, it is the electrical/electronic part identifying multiple character or figure on piece surface in mode overlapping at least partially, mark be by by the dyestuff that can confirm by visible light or the pigment mark that be formed at least partially, or the point 901 that the mark to be formed by physics concavo-convex shows, goods name 902 and manufacture batches 903, another part of mark is the mark 904 of the dyestuff of the fluorescent material by developing the color containing the near ultraviolet ray being 300nm ~ 450nm or the goods intrinsic information of pigment formation with wavelength, so sign content in the past can not hindered and new logo product information in limited identified areas, can show, record more goods intrinsic information, so can traceability be improved.
But, in above-mentioned past case, due to carried out on piece surface by containing with wavelength be 300nm ~ 450nm near ultraviolet ray colour developing the dyestuff of fluorescent material or the mark of pigment, so when the peeling off containing the dyestuff of fluorescent material or pigment of piece surface or the identification identified when piece surface is stained become difficulty, there is the problem can not guaranteeing traceability.
Patent documentation 1: JP 2007-109750 publication
Summary of the invention
Namely the present invention makes to solve the problem, even if object is to provide a kind of various product information that can effectively utilize limited regional record to need in traceability also can guarantee traceability electronic component module and manufacture method thereof when the mark of piece surface is impaired.
In order to solve this problem, electronic component module described in technical scheme 1, possess substrate, the multiple electronic components be arranged on a face of aforesaid substrate, by the sealing parts of above-mentioned electronic component sealing and the guard block that applies in order to the surface covering above-mentioned sealing parts, it is characterized in that, the 1st marking is carried out to the surface of above-mentioned sealing parts; Apply above-mentioned guard block above-mentioned 1st marking to be covered, and the 2nd marking is carried out to the surface of above-mentioned guard block.
Electronic component module described in technical scheme 2, in the electronic component module described in technical scheme 1, is characterized in that, the color of above-mentioned sealing parts is different from the color of above-mentioned guard block.
Electronic component module described in technical scheme 3, in the electronic component module described in technical scheme 2, is characterized in that, above-mentioned guard block is opaque.
The manufacture method of the electronic component module described in technical scheme 4, possessing substrate, in the multiple electronic components be arranged on a face of aforesaid substrate, the manufacture method of the electronic component module of guard block that the sealing parts of above-mentioned electronic component sealing and the surface covering above-mentioned sealing parts are applied, it is characterized in that, the 1st marking is carried out to the surface of above-mentioned sealing parts; Apply above-mentioned guard block above-mentioned 1st marking to be covered, and the 2nd marking is carried out to the surface of above-mentioned guard block.
The effect of invention:
According to the invention of technical scheme 1, due to possessing substrate, in the multiple electronic components be arranged on a face of substrate, the electronic component module of guard block that the sealing parts of electronic component sealing and the surface covering sealing parts applied, the 1st marking is carried out to the surface of sealing parts; Coating guard block is to cover the 1st marking; and the 2nd marking is carried out to the surface of guard block; so the various product information required for limited regional record traceability effectively can be utilized; even if when the mark of piece surface is impaired; also can by part or all removing of guard block be identified that the 1st marks, so can guarantee traceability.
According to the invention of technical scheme 2; because the color of sealing parts is different with the color of guard block; so can identify the 2nd marking from the surface of electronic component module respectively by visible light, this is external marks according to the difference identification the 1st of the color of sealing parts and the color of guard block when a part for guard block being removed.
According to the invention of technical scheme 3, because guard block is opaque, so can not mark through identification the 1st, clearly can identify that the 2nd marks.
According to the invention of technical scheme 4, due to possessing substrate, in the multiple electronic components be arranged on a face of substrate, the manufacture method of the electronic component module of guard block that the sealing parts of electronic component sealing and the surface covering sealing parts applied, the 1st marking is carried out to the surface of sealing parts; Coating guard block is to cover the 1st marking; and the 2nd marking is carried out to the surface of guard block; so the various product information that can effectively utilize limited region and record required for traceability; even if when the mark of piece surface is impaired; also can by part or all removing of guard block be identified that the 1st marks, so can manufacture the electronic component module can guaranteeing traceability.
By more than, according to the present invention, even if a kind of various product information that can effectively utilize limited regional record to need in traceability can be provided when the mark of piece surface is impaired also can to guarantee electronic component module and the manufacture method thereof of traceability.
Accompanying drawing explanation
Fig. 1 is the structural map of the electronic component module of execution mode for the present invention.
Fig. 2 is the figure of the state of the 1st marking illustrated when a part for guard block being removed.
Fig. 3 is the figure of the manufacturing process of the electronic component module that execution mode for the present invention is described.
Fig. 4 is the electronic component module of conventional art.
Description of reference numerals
1 substrate
2 electronic components
2a chip element
2bIC
3 sealing parts
4 guard blocks
5 the 1st markings
6 the 2nd markings
6a direction
6b goods type name
6c batch number
100 electronic component modules
Embodiment
[the 1st execution mode]
Below, the electronic component module 100 of the 1st execution mode of the present invention is described.
First, the structure of Fig. 1 to the electronic component mould fast 100 of the 1st execution mode is used to be described.Fig. 1 is the figure of the structure representing electronic component module 100, Fig. 1 (a) is the vertical view observing electronic component module 100 from above, and Fig. 1 (b) is the cutaway view of the A-A cross-section from Fig. 1 (a).
Electronic component module 100 as shown in Figure 1, possess substrate 1, multiple electronic component 2 such as chip element 2a and IC2b be arranged on a face of substrate 1, by the sealing parts 3 of electronic component 2 sealing and coating with the guard block 4 of the surface coverage by sealing parts 3.
The ceramic substrate etc. of the resin substrate that substrate 1 uses its base material to be made by glass fibre and resin etc. or use pottery, on substrate 1, with not shown conductive pattern, the part installation pad for mounting electronic parts 2 is provided with at superficial layer, in order to by interconnected for multiple electronic component 2 and forming circuit, be provided with pattern at its superficial layer and internal layer, this its back layer external is respectively equipped with and is used for the connecting pad with equipment connection when being installed to equipment by electronic component module 100.
Multiple electronic components 2 such as chip element 2a or IC2b are arranged on the part installation pad of the superficial layer being located at substrate 1, are connected with installation pad by soldering etc.
Sealing parts 3 are with dark-coloured resin by multiple electronic component 2 sealing such as chip element 2a and IC2b, and the product information required for traceability of in its surface the inspection resume etc. in the attribute number of the model of goods, goods, management number, serial number, sequence number and operation being produced the information of resume etc. is with letter, numeral, mark, bar code or 2 dimension codes or their combinations be recorded in the 1st marking 5.
Guard block 4 with the opaque resin of light tone different from sealing parts 3 apply with by sealing parts 3 and the surface of sealing parts 3 is implemented the 1st mark 5 and cover, and implement the 2nd marking 6 in its surface.
Due to the outward appearance identification that the 1st marking 5 implemented the surface of sealing parts 3 can not cover from protected parts 4; even if mark 6 overlapping regions so have with the implement the surface of guard block 4 the 2nd, bring impact and identify the 2nd marking 6 also can not to the identification of the 2nd marking 6.
Because the 2nd marking 6 implemented the surface of guard block 4 can from outward appearance Direct Recognition, so marking same can be carried out needing from information such as direction display 6a, goods type name 6b and the batch number 6c of the electronic component module 100 of outward appearance identification.
Then, for the situation needing to be recorded in the product information in the 1st marking 5 in the finding out etc. of the reason when the electronic equipment being equipped with electronic component module 100 reaches malfunction and read, Fig. 2 is used to be described.
Fig. 2 is the figure of the state of the 1st marking 5 illustrated when a part for the guard block 4 of electronic component module 100 being removed; Fig. 2 (a) is the vertical view observing electronic component module 100 from above, and Fig. 2 (b) is the cutaway view of the A-A cross-section from Fig. 2 (a).
In Fig. 2 (a), represent the example of the 1st marking 5 by arranging with the concavo-convex geometry pattern of systematicness arrangement rectangle in the roughly whole region on the surface of sealing parts 3.As shown in Fig. 2 (b); when the guard block 4 on the surface by overlay electronic part module 100 remove until the protuberance of sealing parts 3 expose height; owing to remaining guard block 4 in the recess of sealing parts 3; so can according to the difference of the color of the color of sealing parts 3 and guard block 4, by the product information of visible light easily identification record in the 1st marking 5 implemented the surface of sealing parts 3.
As above; the electronic component module 100 of the 1st execution mode for the present invention is owing to the surface of the sealing parts 3 to multiple electronic components 2 sealing that will be arranged on a face of substrate 1 being implemented can not mark 5 from the 1st of outward appearance Direct Recognition; even if mark 6 overlapping regions so have with the implement the surface of guard block 4 the 2nd, bring impact and utilize the whole surface of sealing parts 3 to mark in 5 the 1st the various product information recorded required for traceability also can not to the identification of the 2nd marking 6.
Sealing parts 3 dark-coloured resin coating; guard block 4 applies with the opaque resin of the light tone different from sealing parts 3 and covers so that the surface of sealing parts 3 and the 1st are marked 5; and the 2nd marking 6 is implemented to its surface; so pass through visible light; can identify the 2nd marking 6 from the surface of electronic component module 100, by visible light, this is external can identify that the 1st marks 5 according to the difference of the color of sealing parts 3 and the color of guard block 4 when a part for guard block 4 being removed.
Owing to being coated with guard block 4 to be covered by sealing parts 3; even if so when the mark of the piece surface of the 2nd marking 6 display by implementing the surface of guard block 4 is impaired, also traceability can be guaranteed by the 1st marking 5 implemented the surface of sealing parts 3.
As above, according to the electronic component module 100 of the 1st execution mode for the present invention, the electronic component module 100 can provide and can effectively utilize various product information required for limited regional record traceability, also can guaranteed traceability when the mark of piece surface is impaired.
[the 2nd execution mode]
Below, as the 2nd execution mode of the present invention, Fig. 3 is used to be described to the manufacture method of electronic component module 100.
Fig. 3 is the figure of the manufacturing process of the electronic component module 100 that the 2nd execution mode for the present invention is described, Fig. 3 (a) to Fig. 3 (e) represents the cross section of the module in each operation.
First, as shown in Fig. 3 (a), on a face of substrate 1, chip part 2a and IC2b etc. form multiple electronic components 2 of the circuit of electronic component module 100.
Then, as shown in Fig. 3 (b), the sealing parts 3 dark-coloured to a face entirety of the substrate 1 being provided with multiple electronic component 2 carry out sealing.
After sealing completes, as shown in Fig. 3 (c), the various product information required for traceability are recorded in the 1st marking 5 by methods such as laser beam markings by the surface of sealing parts 3.
After enforcement the 1st marks 5, as shown in Fig. 3 (d), the guard block 4 applying the opaque resin of the light tone different from sealing parts 3 covers so that the surface of sealing parts 3 and the 1st are marked 5, makes guard block 4 stabilisation by sclerosis or drying.
Finally, as shown in Fig. 3 (d), implement the 2nd marking 6 by methods such as the surface laser beam markings to guard block 4 and record product information.
By operation such above, in the manufacture method of the electronic component module 100 of the 2nd execution mode for the present invention, can implement the surface of the sealing parts 3 of multiple electronic components 2 sealing that will be arranged on a face of substrate 1 can not the 1st marking 5 of Direct Recognition from outward appearance, even if mark 6 overlapping regions so can manufacture with the implement the surface of guard block 4 the 2nd, bring impact and utilize the whole surface of sealing parts 3 in the 1st marking 5, record the electronic component module 100 of the various product information required for traceability also can not to the identification of the 2nd marking 6.
Due to for by guard block 4 by the opaque resin-coating of the light tone different from sealing parts 3 sealing parts 3 are covered and implement the operation that the 2nd marks 6 in its surface, so the electronic component module 100 that can identifying the 2nd marking 6 by visible light from the surface of electronic component module 100, being marked 5 when a part for guard block 4 being removed according to the difference of the color of sealing parts 3 and the color of guard block 4 by visible light identification the 1st can be manufactured.
Due to guard block 4 is applied to be covered by sealing parts 3, even if so the electronic component module 100 also can being guaranteed traceability when the mark of the piece surface of the 2nd marking 6 display by implementing the surface of guard block 4 is impaired by the 1st marking 5 implemented the surface of sealing parts 3 can be manufactured.
As above, according to the manufacture method of the electronic component module 100 of the 2nd execution mode for the present invention, even if the manufacture method that can effectively utilize the various product information required for limited regional record traceability also can guarantee the electronic component module 100 of traceability when the mark of piece surface is impaired can be provided.
As above, specifically understand electronic component module 100 for the present invention and manufacture method thereof, but the present invention is not limited to above-mentioned execution mode, can carry out various change to implement in the scope not departing from purport.Such as can be out of shape as follows to implement, these execution modes also belong to technical scope of the present invention.
(1) the 2nd marking 6 illustrates alphabetical and digital and is illustrated, but also can use bar code or 2 dimension codes, also can use them in addition simultaneously.
(2) the 2nd markings 6 form concavo-convex method exemplified with laser etc. on the surface of guard block 4, but the surface of pigment to guard block 4 also can be used to print.
(3) color of sealing parts 3 is used the different light tone of lightness from the difference of the color of guard block 4, dead color is illustrated; but light tone also can be contrary with dark-coloured relation, also can change form and aspect or colorfulness etc. to implement beyond this external lightness.
(4) guard block 4 uses the resin of opaque light tone to be illustrated, but also can use the conductive material of conductive paste etc. and make guard block 4 have electric function of shielding.
The operation marked is carried out after (5) the 1st markings 5 are illustrated in sealing, and be illustrated, but the 1st marking 5 also can the metal pattern of the sealing of use when carrying out sealing with sealing parts 3 be arranged concavo-convex, implement marking by the surface transfer of operation to sealing parts 3 of carrying out sealing is concavo-convex.
(6) illustrate when identification the 1st marks 5 and guard block 4 removed until the situation of height that the protuberance of sealing parts 3 exposes is illustrated; but also can bring impact with not giving substrate 1 and sealing parts 3 and only guard block 4 all be removed by the solvent etc. that guard block 4 removes, the information be engraved in the 1st marking 5 concavo-convexly to be identified with this.
(7) in the manufacture method of the electronic component module 100 about the 2nd execution mode, each operation illustrates and represents that the figure of electronic component module 100 monomer is illustrated, but also can with the form manufacture of the assembly substrate linking multiple electronic component module 100, be finally divided into electronic component module 100 monomer, in addition wait after also the 1st marking 5 or can being carried out after sealing operation, arrange the operation of assembly substrate segmentation after certain operation, and carry out later operation.
Claims (2)
1. an electronic component module, possesses substrate, the multiple electronic components be arranged on a face of aforesaid substrate, by the sealing parts of above-mentioned electronic component sealing and the guard block that applies in order to the surface covering above-mentioned sealing parts, to it is characterized in that,
1st marking is carried out to the surface of above-mentioned sealing parts;
Apply above-mentioned guard block above-mentioned 1st marking to be covered, and the 2nd marking is carried out to the surface of above-mentioned guard block;
The color of above-mentioned sealing parts is different from the color of above-mentioned guard block;
Above-mentioned guard block is opaque.
2. the manufacture method of an electronic component module; described electronic component module possesses substrate, the multiple electronic components be arranged on a face of aforesaid substrate, by the sealing parts of above-mentioned electronic component sealing and the guard block that applies in order to the surface covering above-mentioned sealing parts; the feature of the manufacture method of this electronic component module is
1st marking is carried out to the surface of above-mentioned sealing parts;
Apply above-mentioned guard block above-mentioned 1st marking to be covered, and the 2nd marking is carried out to the surface of above-mentioned guard block;
The color of above-mentioned sealing parts is different from the color of above-mentioned guard block;
Above-mentioned guard block is opaque.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-105655 | 2012-05-07 | ||
| JP2012105655A JP5885342B2 (en) | 2012-05-07 | 2012-05-07 | Electronic component module and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103390610A CN103390610A (en) | 2013-11-13 |
| CN103390610B true CN103390610B (en) | 2016-04-13 |
Family
ID=49534834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310114467.4A Expired - Fee Related CN103390610B (en) | 2012-05-07 | 2013-04-03 | Electronic component module and manufacture method thereof |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP5885342B2 (en) |
| CN (1) | CN103390610B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW202008534A (en) * | 2018-07-24 | 2020-02-16 | 日商拓自達電線股份有限公司 | Shield package and method of manufacturing shield package |
| JP2020035820A (en) * | 2018-08-28 | 2020-03-05 | 太陽誘電株式会社 | Module and manufacturing method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101894763A (en) * | 2009-05-19 | 2010-11-24 | 中芯国际集成电路制造(上海)有限公司 | Chip assembling method |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07106103A (en) * | 1993-10-07 | 1995-04-21 | Rohm Co Ltd | Manufacture of chip resistor |
| JP2007109750A (en) * | 2005-10-12 | 2007-04-26 | Hitachi Metals Ltd | Electric/electronic component and its manufacturing method |
| JP2010161095A (en) * | 2009-01-06 | 2010-07-22 | Rohm Co Ltd | Marking method for semiconductor device and semiconductor device manufactured using the printing method |
| JP2011054606A (en) * | 2009-08-31 | 2011-03-17 | Yamaha Corp | Semiconductor package |
-
2012
- 2012-05-07 JP JP2012105655A patent/JP5885342B2/en not_active Expired - Fee Related
-
2013
- 2013-04-03 CN CN201310114467.4A patent/CN103390610B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101894763A (en) * | 2009-05-19 | 2010-11-24 | 中芯国际集成电路制造(上海)有限公司 | Chip assembling method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5885342B2 (en) | 2016-03-15 |
| CN103390610A (en) | 2013-11-13 |
| JP2013235883A (en) | 2013-11-21 |
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