CN113973485A - Membrane and circuit board - Google Patents

Membrane and circuit board Download PDF

Info

Publication number
CN113973485A
CN113973485A CN202010724915.2A CN202010724915A CN113973485A CN 113973485 A CN113973485 A CN 113973485A CN 202010724915 A CN202010724915 A CN 202010724915A CN 113973485 A CN113973485 A CN 113973485A
Authority
CN
China
Prior art keywords
film
layer
base layer
metal layer
dark
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010724915.2A
Other languages
Chinese (zh)
Inventor
苏陟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangzhou Fangbang Electronics Co Ltd
Original Assignee
Guangzhou Fangbang Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangzhou Fangbang Electronics Co Ltd filed Critical Guangzhou Fangbang Electronics Co Ltd
Priority to CN202010724915.2A priority Critical patent/CN113973485A/en
Publication of CN113973485A publication Critical patent/CN113973485A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224Patterned shielding planes, ground planes or power planes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means

Abstract

The embodiment of the invention discloses a membrane and a circuit board. The film includes: a dark base layer; a metal layer on one side of the dark base layer; and the gray value of the color of the dark color base layer is smaller than that of the metal layer. The technical scheme of the embodiment of the invention realizes the formation of the clearly distinguishable identification code and has wide application range.

Description

Membrane and circuit board
Technical Field
The embodiment of the invention relates to the technical field of identification code manufacturing, in particular to a membrane and a circuit board.
Background
With the rapid development of the electronic industry, electronic products are further miniaturized, light-weighted and high-density assembled, and the development of flexible circuit boards is greatly promoted, so that the connection integration of various components and wires is realized.
Various components and parts have been integrateed in the inside of electronic product, and in order to the certain device of this electronic product of better retrospecting or its inside, often be provided with the identification code in electronic product, can carry out the information of product or certain part through scanning this identification code and traceed back.
At present, set up identification code (for example two-dimensional code) on a steel sheet among the prior art, but because the size of steel sheet has been injectd in electronic product's frivolousization, lead to being difficult to print the two-dimensional code on the steel sheet. And then, the identification code is printed on the soft board in a printing mode, but the printed identification code is unclear and has low resolution due to small size of the soft board, and the identification code cannot be printed.
Disclosure of Invention
The embodiment of the invention provides a film and a circuit board, which are used for forming clearly distinguishable identification codes and have wide application range.
In a first aspect, embodiments of the present invention provide a film, comprising:
a dark base layer;
a metal layer on one side of the dark base layer;
and the gray value of the color of the dark color base layer is smaller than that of the metal layer.
Optionally, the adhesive layer is further included;
the glue layer is positioned on one side of the dark color base layer, which is far away from the metal layer.
Optionally, the light-emitting diode further comprises a protective layer arranged on one side of the glue layer, which is far away from the dark color base layer.
Optionally, a difference between the gray value of the color of the dark color base layer and the gray value of the color of the metal layer is smaller than or equal to a first gray threshold, and the first gray threshold is greater than or equal to 10.
Optionally, the first grayscale threshold is 50.
Optionally, the first grayscale threshold is 100.
Optionally, the metal layer is made of at least one simple substance of nickel, silver, platinum, titanium, aluminum and chromium; or the metal layer is made of an alloy formed by at least two of nickel, silver, platinum, titanium, aluminum and chromium, or the metal layer is made of a combination of alloys formed by at least two of nickel, silver, platinum, titanium, aluminum and chromium.
Optionally, the thickness of the metal layer is 0.05-5 μm, the thickness range of the dark color base layer is 0.5-20 μm, and the thickness range of the glue layer is 1-30 μm.
Optionally, the metal layer further comprises a low-adhesion film, and the low-adhesion film is arranged on the side, away from the dark base layer, of the metal layer.
Optionally, the film further comprises a first film layer;
the first film layer is arranged on one side of the metal layer, which is far away from the dark color base layer.
Optionally, the first film layer is a colorless adhesive layer.
In a second aspect, embodiments of the present invention also provide a film, the film comprising:
a dark base layer;
a metal layer on one side of the dark base layer;
the glue layer is positioned on one side of the dark color base layer, which is far away from the metal layer;
the grey scale value of the color of the dark color base layer is smaller than the grey scale value of the color of the metal layer; the metal layer is used for forming hollow patterns of the identification code so as to expose the dark color base layer at the corresponding positions of the hollow patterns.
Optionally, a groove pattern is formed on one side of the dark color base layer close to the metal layer, and a vertical projection of the hollow pattern on a plane where the dark color base layer is located completely coincides with the groove pattern.
Optionally, the identification code includes at least one of a barcode, a two-dimensional code, and a character.
In a third aspect, an embodiment of the present invention further provides a circuit board, where the circuit board includes a printed circuit board and the film provided in any one of the embodiments of the present invention;
and removing the protective layer of the film, and attaching one side of the glue layer of the film to the printed circuit board.
In a fourth aspect, an embodiment of the present invention further provides a circuit board, where the circuit board includes a printed circuit board, an electromagnetic shielding film, and any one of the films provided in the embodiments of the present invention, where the electromagnetic shielding film is disposed on the printed circuit board;
and removing the protective layer of the film, and attaching one side of the glue layer of the film to the printed circuit board.
According to the technical scheme of the embodiment of the invention, the film comprises: a dark base layer; a metal layer on one side of the dark base layer; the glue layer is positioned on one side of the dark color base layer, which is far away from the metal layer; and the gray value of the color of the dark color base layer is smaller than that of the metal layer. The problem of among the prior art steel sheet size restriction unable printing identification code to and identification code printing definition is not high in the soft board is solved to realize forming clear identification code of distinguishing, and application scope is extensive.
Drawings
FIG. 1 is a schematic structural diagram of a membrane provided in an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of another membrane provided in an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of another membrane provided in an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of yet another membrane provided by an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a circuit board according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of another circuit board according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention are described in further detail below with reference to the accompanying drawings. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention.
It should be further noted that, for the convenience of description, only some but not all of the relevant aspects of the present invention are shown in the drawings. Before discussing exemplary embodiments in more detail, it should be noted that some exemplary embodiments are described as processes or methods depicted as flowcharts. Although a flowchart may describe the operations (or steps) as a sequential process, many of the operations can be performed in parallel, concurrently or simultaneously. In addition, the order of the operations may be re-arranged. The process may be terminated when its operations are completed, but may have additional steps not included in the figure. The processes may correspond to methods, functions, procedures, subroutines, and the like.
The embodiment of the invention provides a film which can be suitable for setting identification codes for various components integrated in an electronic product. Fig. 1 is a schematic structural diagram of a film according to an embodiment of the present invention. Referring to fig. 1, the specific structure of the membrane includes:
a dark base layer 110;
a metal layer 120 on one side of the dark base layer 110;
wherein the gray value of the color of the dark color base layer 110 is less than the gray value of the color of the metal layer 120.
The dark color base layer 110 provides protection and support for the metal layer 120, and forms a relatively obvious bright-dark brightness contrast with the metal layer 120 to some extent. The dark color base layer 110 may be black, or a color with a gray value closer to black, such as dark blue, and the specific color of the dark color base layer 110 is not limited in this embodiment.
Optionally, the deep color base layer 110 may include a PPS film layer, a PEN film layer, a polyester film layer, a polyimide film layer, a film layer formed after curing epoxy resin ink, a film layer formed after curing polyurethane ink, a film layer formed after curing modified acrylic resin, or a film layer formed after curing polyimide resin.
The metal layer 120 is used to form a distinct color or brightness difference with the dark base layer 110, and the gray value of the color of the metal layer 120 is greater than that of the color of the dark base layer 110.
In this embodiment, the gray scale parameter is used to convert the color into high quality gray scale gradient to detect the contrast between the brightness of the metal layer 120 and the dark base layer 110. The gray scale uses black tone to represent various colors, that is, black is used as a reference color, and different colors are displayed by black with different saturation. The gray scale value of white is 255, and the gray scale value of black is 0.
For example, in the present embodiment, the gray-level value of the metal layer 120 is defined to be greater than the gray-level value of the dark color base layer 110, that is, the difference between the gray-level value of the color of the metal layer 120 and the gray-level value of the color of the dark color base layer 110 is greater. For example, if the metal layer 120 is silver and the gray level of the silver is higher, the silver of the metal layer 120 is clearly contrasted with the dark color of the dark color base layer 110.
Further, the difference between the gray value of the color of the metal layer 120 and the gray value of the color of the dark base layer 110 is greater than or equal to the first gray threshold; if the first gray threshold is greater than or equal to 10, the difference between the gray value of the color of the metal layer 120 and the gray value of the color of the dark color base layer 110 is at least 10, so that a relatively obvious light-dark difference is formed between the metal layer 120 and the dark color base layer 110, and the accuracy of the identification code identification device in identifying the identification code formed by the metal layer 120 and the dark color base layer 110 is improved.
In order to further increase the brightness difference between the metal layer 120 and the dark color base layer 110, the first gray threshold may be defined as 50, and the difference between the gray value of the color of the metal layer 120 and the gray value of the color of the dark color base layer 110 is at least 50, the color brightness of the metal layer 120 is stronger, and the color brightness of the dark color base layer 110 is smaller, so as to further increase the contrast between the metal layer 120 and the dark color base layer 110, and improve the identification precision and accuracy of the identification code.
Based on the above embodiment, in this embodiment, it may be further defined that the first gray threshold is 100, and the difference between the gray value of the color of the metal layer 120 and the gray value of the color of the dark color base layer 110 is at least 100, for example, if the gray value of the color of the dark color base layer 110 is 0, and the gray value of the color of the metal layer 120 is different from the gray value of the color of the dark color base layer 110 by at least 100, even by 255, the gray value of the metal layer 120 may be greater than or equal to 100. In the case of the difference between the gray values of 255, one of the metal layer 120 and the dark base layer 110 is pure black, and the other is pure white, i.e. one of the gray values of 255 and the other is 0, the difference between the brightness and the color is large, and the definition of the identification code is further enhanced.
Fig. 2 is a schematic structural diagram of another film according to an embodiment of the present invention. Referring to fig. 2, on the basis of the above embodiment, the film further includes a glue layer 130; the glue layer 130 is disposed on a side of the dark color base layer 110 away from the metal layer 120. Wherein the glue layer 130 plays a role of connection.
Fig. 3 is a schematic structural diagram of another film according to an embodiment of the present invention. Referring to fig. 3, on the basis of the above embodiment, the film further includes a protective layer 140 disposed on a side of the glue layer 130 away from the dark base layer 110.
The protective layer 140 provides protection and support for the adhesive layer 130. Referring to fig. 2 and 3, the protective layer 140 provides protection and support for the adhesive layer 130, and a certain thickness of adhesive is coated on the protective layer 140 to form the adhesive layer 130.
The protective layer 140 may include a PPS film layer, a PEN film layer, a polyester film layer, a polyimide film layer, a film layer formed after curing of epoxy resin ink, a film layer formed after curing of polyurethane ink, a film layer formed after curing of modified acrylic resin, or a film layer formed after curing of polyimide resin.
It is understood that the glue layer 130 is used for attaching the film provided in this embodiment to a corresponding shielding film or component, and the protective layer 140 is removed when the glue layer 130 needs to attach the shielding film or component corresponding to the film.
According to the technical scheme of the embodiment of the invention, the film comprises: a dark base layer; a metal layer on one side of the dark base layer; and the gray value of the color of the dark color base layer is smaller than that of the metal layer. The problem of among the prior art steel sheet size restriction unable printing identification code to and identification code printing definition is not high in the soft board is solved to realize forming clear identification code of distinguishing, and application scope is extensive.
The metal layer 120 may be white or silver white, and the metal layer is made of at least one simple substance of nickel, silver, platinum, titanium, aluminum, and chromium based on the above embodiment; or the metal layer is made of an alloy formed by at least two of nickel, silver, platinum, titanium, aluminum and chromium, or the metal layer is made of a combination of alloys formed by at least two of nickel, silver, platinum, titanium, aluminum and chromium.
With continued reference to fig. 2, based on the above embodiment, the thickness of the metal layer 120 is 0.05 to 5 μm, preferably, the thickness of the metal layer 120 is 0.1 μm, the thickness of the deep color base layer 110 is in the range of 0.5 to 20 μm, preferably, the thickness of the deep color base layer 110 is in the range of 2 to 8 μm, the thickness of the glue layer 130 is in the range of 1 to 30 μm, and preferably, the thickness of the glue layer 130 is in the range of 3 to 4 μm.
In order to adapt to the thinning trend of electronic products, the thickness range of the deep color base layer 110 may be 2 to 8 μm, so as to reduce the thickness of the deep color base layer 110 as much as possible, optionally, the thickness of the deep color base layer 110 may be 4 μm, and on the premise of having good insulation and protection properties, the deep color base layer 110 is thinned.
Fig. 4 is a schematic structural diagram of another film according to an embodiment of the present invention. Referring to fig. 4, on the basis of the above embodiment, the film further includes a low-adhesion film 150, and the low-adhesion film 150 is disposed on a side of the metal layer 120 away from the dark-base layer 110.
The low-viscosity film 150 is generally an adhesive with little or no adhesive, and can be directly electrostatically adsorbed without affecting the adsorption effect, and can be removed without leaving residues on the attached part.
Alternatively, the low-tack film 150 may be a silicone film.
Optionally, in order to prevent the metal layer 120 from contacting with an external electronic component and causing short circuit, the film further includes a first film layer (not identified in the figure), the first film layer is disposed on one side of the metal layer 120 away from the deep color base layer 110, and an opening portion can be formed at a position corresponding to the hollow pattern of the identification code, so as to expose the identification code for user identification.
The embodiment of the invention also provides the membrane which can be suitable for setting the identification codes for various components integrated in the electronic product. With continued reference to fig. 2, the specific structure of the membrane includes:
a dark base layer 110;
a metal layer 120 on one side of the dark base layer 110;
a glue layer located on the side of the dark base layer 110 away from the metal layer 120;
wherein the gray value of the color of the dark color base layer 110 is less than the gray value of the color of the metal layer 120; the metal layer 120 is used to form hollow patterns of the identification code, so that the dark color base layer 110 is exposed at positions corresponding to the hollow patterns.
Wherein the identification code includes at least one of a barcode, a two-dimensional code, and a character.
The identification code is a unique corresponding identification mark for identifying the component or the electronic product. The identification code may include figures of characters such as numbers and letters, and may also be a bar code or a two-dimensional code, and the film of this embodiment may include at least one of the above-mentioned bar code, two-dimensional code and characters to identify a corresponding component or electronic product.
It can be understood that the film provided by the embodiment can be used for setting the identification code, so as to realize better tracing of the electronic product or a certain component inside the electronic product corresponding to the identification code. The film can be used together with a shielding film and arranged on a circuit board, the film can be directly attached to the shielding film or a component through a glue layer, further, the circuit board is arranged in corresponding electronic equipment, the electronic equipment can comprise electronic products such as a mobile phone and a computer, and the embodiment does not specially limit the number of the electronic equipment.
In this embodiment, the dark color base layer 110 increases the identification for the identification code formed on the film.
The metal layer 120 is disposed on one side of the deep color base layer 110, and the metal layer 120 can form a relatively obvious contrast between light and dark brightness with the deep color base layer 110, thereby forming an identification code with a relatively good identification degree.
Alternatively, the hollow pattern may be formed by laser ablation.
It should be noted that when the hollow pattern is ablated, there are two situations:
first, the metal layer 120 is only burned through to form the hollow pattern of the identification code, and the dark color base layer 110 is not ablated, that is, the ablation depth of the hollow pattern is the thickness of the metal layer 120. The hollowed-out pattern just exposes the deep color base layer 110 that is not ablated, i.e., the deep color base layer 110 and the metal layer 120 form the identification code.
Secondly, burn through the metal layer 120 and form the fretwork pattern of identification code, also carried out partial ablation to dark colour basic unit 110, promptly, carry out partial ablation and not complete ablation to dark colour basic unit 110, consequently, after the identification code ablation is accomplished, the fretwork pattern can expose dark colour basic unit 110 equally for dark colour basic unit 110 forms the identification code with metal layer 120. Specifically, the metal layer 120 is burned through to form a hollow pattern, a groove pattern (not shown) is formed on one side of the dark color base layer 110 close to the metal layer 120, and a vertical projection of the hollow pattern on a plane where the dark color base layer 110 is located completely coincides with the groove pattern. The deep color base layer 110 is ablated on the side close to the metal layer 120 to form a groove pattern, and because the groove pattern and the hollow pattern are formed through one process, the vertical projection of the hollow pattern on the plane of the deep color base layer 110 is completely overlapped with the groove pattern.
Further, referring to fig. 3, on the basis of the above embodiment, the film provided by this embodiment further includes a protective layer 140, and the protective layer 140 is disposed on a side of the glue layer 130 away from the dark color base layer 110. The film of the embodiment includes the technical features of the protective layer 140 provided in any embodiment of the present invention, and has the beneficial effects of the protective layer 140 provided in any embodiment of the present invention.
Further, referring to fig. 4, on the basis of the above embodiment, the film provided by the present embodiment further includes a low adhesive film 150; the low adhesive film 150 is used to provide protection and support for the metal layer 120, and when the metal layer 120 forms the hollow pattern of the identification code, the low adhesive film 150 needs to be removed, and the effect that no adhesive residue exists on the metal layer 120 is achieved. Alternatively, the low-tack film 150 may be a silicone film. The film of this embodiment includes the features of the low-adhesion membrane 150 provided by any of the embodiments of the present invention, and has the beneficial effects of the low-adhesion membrane 150 provided by any of the embodiments of the present invention.
On the basis of the above embodiments, the embodiment of the present invention further provides a circuit board, as shown in fig. 5, fig. 5 is a schematic structural diagram of a circuit board provided in the embodiment of the present invention, where the circuit board includes a printed circuit board 2 and any one of the films 1 provided in the embodiment of the present invention; and after the protective layer of the film 1 is removed, one side of the glue layer of the film 1 is attached to the printed circuit board 2. The circuit board of the embodiment comprises the technical characteristics of the film provided by any embodiment of the invention, and has the beneficial effects of the film provided by any embodiment of the invention.
The printed circuit board 2 is integrated with a large number of components with different functions, and in the embodiment, the positions, corresponding to the components, on the film 1 can be provided with identification codes of the components.
It can be understood that, an embodiment of the present invention further provides an electronic device, where the electronic device includes the circuit board provided in the foregoing embodiment, and the electronic device provided in the embodiment of the present invention may be a computer, a television, an intelligent wearable device, or the like, and the embodiment of the present invention is not particularly limited in this respect.
On the basis of the above embodiments, an embodiment of the present invention further provides a circuit board, as shown in fig. 6, fig. 6 is a schematic structural diagram of a circuit board provided in an embodiment of the present invention, where the circuit board includes a printed circuit board 2, an electromagnetic shielding film 3, and any one of the films 1 provided in the embodiments of the present invention; and after the protective layer of the film 1 is removed, one side of the glue layer of the film 1 is attached to the printed circuit board 2. The circuit board of the embodiment comprises the technical characteristics of the film provided by any embodiment of the invention, and has the beneficial effects of the film provided by any embodiment of the invention.
The printed circuit board 2 is integrated with a large number of components with different functions, and in the embodiment, the positions, corresponding to the components, on the film 1 can be provided with identification codes of the components. The electromagnetic shielding film 3 may cover the printed circuit board in a whole layer for realizing electromagnetic shielding in the whole layer, and the electromagnetic shielding film 3 may also include a plurality of sub-shielding films with smaller sizes, each of which is used for covering a corresponding area of the printed circuit board, which is not limited in this embodiment. In addition, the circuit board may be attached with the electromagnetic shielding film 3 first, and then attached with the film 1 provided in the above embodiment, for example, the identification code of the corresponding electronic device formed on the film 1 may be disposed in the edge area of the electromagnetic shielding film 3.
It can be understood that, an embodiment of the present invention further provides an electronic device, where the electronic device includes the circuit board provided in the foregoing embodiment, and the electronic device provided in the embodiment of the present invention may be a computer, a television, an intelligent wearable device, or the like, and the embodiment of the present invention is not particularly limited in this respect.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims (16)

1. A film, comprising:
a dark base layer;
a metal layer on one side of the dark base layer;
and the gray value of the color of the dark color base layer is smaller than that of the metal layer.
2. The film of claim 1, further comprising a subbing layer;
the glue layer is positioned on one side of the dark color base layer, which is far away from the metal layer.
3. The film of claim 2, further comprising a protective layer disposed on a side of the glue layer facing away from the dark base layer.
4. The film of claim 1, wherein the difference in the grayscale value of the color of the dark base layer and the grayscale value of the color of the metal layer is less than or equal to a first grayscale threshold value, the first grayscale threshold value being greater than or equal to 10.
5. The film of claim 4, wherein the first grayscale threshold is 50.
6. The film of claim 4, wherein the first grayscale threshold is 100.
7. The film of claim 1, wherein the metal layer is made of at least one element selected from the group consisting of nickel, silver, platinum, titanium, aluminum, and chromium; or the metal layer is made of an alloy formed by at least two of nickel, silver, platinum, titanium, aluminum and chromium, or the metal layer is made of a combination of alloys formed by at least two of nickel, silver, platinum, titanium, aluminum and chromium.
8. The film of claim 2, wherein the metal layer has a thickness in the range of 0.05 to 5 μm, the dark base layer has a thickness in the range of 0.5 to 20 μm, and the glue layer has a thickness in the range of 1 to 30 μm.
9. The film of claim 1, further comprising a low adhesion film disposed on a side of the metal layer remote from the dark base layer.
10. The film of claim 1 or 9, further comprising a first film layer disposed on a side of the metal layer remote from the dark base layer.
11. The film of claim 10, wherein the first film layer is a clear adhesive layer.
12. A film, comprising:
a dark base layer;
a metal layer on one side of the dark base layer;
the glue layer is positioned on one side of the dark color base layer, which is far away from the metal layer;
the grey scale value of the color of the dark color base layer is smaller than the grey scale value of the color of the metal layer; the metal layer is used for forming hollow patterns of the identification code so as to expose the dark color base layer at the corresponding positions of the hollow patterns.
13. The film of claim 12, wherein a groove pattern is formed on one side of the dark base layer close to the metal layer, and a perpendicular projection of the hollow pattern on a plane of the dark base layer is completely coincident with the groove pattern.
14. The film of claim 12, wherein the identification code comprises at least one of a bar code, a two-dimensional code, and a character.
15. A wiring board comprising a printed circuit board and the film of any one of claims 1-11;
and removing the protective layer of the film, and attaching one side of the glue layer of the film to the printed circuit board.
16. A circuit board comprising a printed circuit board, an electromagnetic shielding film and the film of any one of claims 1-11, said electromagnetic shielding film being disposed on said printed circuit board;
and removing the protective layer of the film, and attaching one side of the glue layer of the film to the printed circuit board.
CN202010724915.2A 2020-07-24 2020-07-24 Membrane and circuit board Pending CN113973485A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010724915.2A CN113973485A (en) 2020-07-24 2020-07-24 Membrane and circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010724915.2A CN113973485A (en) 2020-07-24 2020-07-24 Membrane and circuit board

Publications (1)

Publication Number Publication Date
CN113973485A true CN113973485A (en) 2022-01-25

Family

ID=79585719

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010724915.2A Pending CN113973485A (en) 2020-07-24 2020-07-24 Membrane and circuit board

Country Status (1)

Country Link
CN (1) CN113973485A (en)

Similar Documents

Publication Publication Date Title
JP2012008817A (en) Semiconductor memory card
US20130161322A1 (en) Housing and method for making the same
CN212970635U (en) Membrane and circuit board
CN113973485A (en) Membrane and circuit board
CN113973486A (en) Shielding film and circuit board
CN108064116A (en) A kind of flexible PCB and its code spraying method
CN213126973U (en) Membrane and circuit board
CN108122476B (en) Method for making mark on mobile phone cover plate and mobile phone
CN212970633U (en) Membrane and circuit board
CN213126974U (en) Membrane and circuit board
CN113973482A (en) Membrane and circuit board
CN213126975U (en) Shielding film and circuit board
JP6597178B2 (en) Bonded IC card and manufacturing method thereof
CN103390610B (en) Electronic component module and manufacture method thereof
CN212970634U (en) Membrane and circuit board
CN113973483A (en) Membrane and circuit board
CN116419467A (en) Double-sided identification film and circuit board
CN215895497U (en) Ultramicro-characteristic anti-counterfeiting chip
CN213343217U (en) Shielding film and circuit board
CN213343216U (en) Shielding film and circuit board
US20220184742A1 (en) Connector and label forming method thereof
CN113973484A (en) Shielding film and circuit board
CN219418173U (en) Carrier plate with embedded bar code
CN111065219A (en) Decoration assembly
JPH0727189Y2 (en) IC card pseudo sample for design presentation

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination