CN113973483A - Membrane and circuit board - Google Patents

Abstract

The embodiment of the invention discloses a membrane and a circuit board. The film includes: a glue film layer; the metal layer is located on one side of the adhesive film layer and used for forming hollow-out patterns of the identification codes, the thickness of the metal layer is H, the thickness of the identification codes is H, and H is less than H. The technical scheme of the embodiment of the invention realizes the formation of the clearly distinguishable identification code and has wide application range.

Description

Membrane and circuit board

Technical Field

The embodiment of the invention relates to the technical field of identification code manufacturing, in particular to a membrane and a circuit board.

Background

With the rapid development of the electronic industry, electronic products are further miniaturized, light-weighted and high-density assembled, and the development of flexible circuit boards is greatly promoted, so that the connection integration of various components and wires is realized.

Various components and parts have been integrateed in the inside of electronic product, and in order to the certain device of this electronic product of better retrospecting or its inside, often be provided with the identification code in electronic product, can carry out the information of product or certain part through scanning this identification code and traceed back.

At present, set up identification code (for example two-dimensional code) on a steel sheet among the prior art, but because the size of steel sheet has been injectd in electronic product's frivolousness, lead to not printing the two-dimensional code on the steel sheet well. And then, the identification code is printed on the soft board in a printing mode, but the printed identification code is unclear and has low resolution due to the small soft board, and the identification code cannot be printed.

Disclosure of Invention

The embodiment of the invention provides a film and a circuit board, which are used for forming clearly distinguishable identification codes and have wide application range.

In a first aspect, embodiments of the present invention provide a film, comprising:

a glue film layer;

the metal layer is located on one side of the adhesive film layer and used for forming hollow-out patterns of the identification codes, the thickness of the metal layer is H, the thickness of the identification codes is H, and H is less than H.

Optionally, the adhesive film layer includes a first adhesive layer and a second adhesive layer;

the first adhesive layer is arranged on one side close to the metal layer; the second adhesive layer is arranged on one side, far away from the metal layer, of the first adhesive layer.

Optionally, the first adhesive layer is thermosetting adhesive, and the second adhesive layer is thermoplastic adhesive or thermosetting adhesive.

Optionally, the identification code includes at least one of a barcode, a two-dimensional code, and a character.

Optionally, the protective layer is arranged on one side of the adhesive film layer, which is away from the metal layer.

Optionally, the metal layer includes a first metal layer and a second metal layer;

the first metal layer is arranged on one side close to the adhesive film layer; the second metal layer is arranged on one side of the first metal layer far away from the adhesive film layer.

Optionally, the metal layer is made of at least one simple substance of nickel, silver, platinum, titanium, aluminum, cobalt and chromium; or the metal layer is made of an alloy formed by at least two of nickel, silver, platinum, titanium, aluminum, cobalt and chromium; or the material of the metal layer is a combination of alloys formed by at least two of nickel, silver, platinum, aluminum, titanium, aluminum, cobalt and chromium.

Optionally, the first metal layer is a black metal layer, or the second metal layer is a black metal layer.

Optionally, the film further includes a first film layer, and the first film layer is disposed on one side of the metal layer far away from the adhesive film layer.

Optionally, the first film layer is a colorless adhesive layer or a colorless ink layer.

Optionally, the adhesive film further comprises a low-adhesion film, and the low-adhesion film is arranged on one side of the metal layer far away from the adhesive film layer.

In a second aspect, an embodiment of the present invention further provides a circuit board, including a printed circuit board and the film according to any one of the embodiments of the present invention;

and removing the protective layer of the film, and attaching the adhesive film layer of the film to the printed circuit board.

In a third aspect, an embodiment of the present invention further provides a circuit board, where the circuit board includes a printed circuit board, an electromagnetic shielding film, and any one of the films provided in the embodiments of the present invention, where the electromagnetic shielding film is disposed on the printed circuit board;

and removing the protective layer of the film, and attaching the adhesive film layer of the film to the printed circuit board.

According to the technical scheme of the embodiment of the invention, the film comprises: a glue film layer; the metal layer is located on one side of the adhesive film layer and used for forming hollow-out patterns of the identification codes, the thickness of the metal layer is H, the thickness of the identification codes is H, and H is less than H. The problem of among the prior art steel sheet size restriction unable printing identification code to and identification code printing definition is not high in the soft board is solved to realize forming clear identification code of distinguishing, and application scope is extensive.

Drawings

FIG. 1 is a schematic structural diagram of a membrane provided in an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of another membrane provided in an embodiment of the present invention;

FIG. 3 is a schematic structural diagram of yet another membrane provided by an embodiment of the present invention;

FIG. 4 is a schematic structural diagram of yet another film provided by an embodiment of the present invention;

FIG. 5 is a schematic structural diagram of a new membrane provided by an embodiment of the present invention;

FIG. 6 is a schematic structural diagram of a new membrane provided in an embodiment of the present invention;

fig. 7 is a schematic structural diagram of a circuit board according to an embodiment of the present invention;

fig. 8 is a schematic structural diagram of another circuit board according to an embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention are described in further detail below with reference to the accompanying drawings. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention.

It should be further noted that, for the convenience of description, only some but not all of the relevant aspects of the present invention are shown in the drawings. Before discussing exemplary embodiments in more detail, it should be noted that some exemplary embodiments are described as processes or methods depicted as flowcharts. Although a flowchart may describe the operations (or steps) as a sequential process, many of the operations can be performed in parallel, concurrently or simultaneously. In addition, the order of the operations may be re-arranged. The process may be terminated when its operations are completed, but may have additional steps not included in the figure. The processes may correspond to methods, functions, procedures, subroutines, and the like.

The embodiment of the invention provides a film which can be suitable for setting identification codes for various components integrated in an electronic product. Fig. 1 is a schematic structural diagram of a film according to an embodiment of the present invention. Referring to fig. 1, the specific structure of the membrane includes:

a glue film layer 110;

the metal layer 120 is located on one side of the adhesive film layer 110, the metal layer 120 is used for forming hollow patterns of the identification codes, the thickness of the metal layer 120 is H, the thickness of the identification codes is H, and H is less than H.

The adhesive film layer 110 mainly serves as a connection, for example, a circuit board.

It can be understood that, in the present embodiment, the thickness H of the metal layer 120 is greater than the thickness H of the identification code, which is an arrangement for ensuring that the metal layer 120 is not burned through during ablation, so as to achieve the purpose of forming the identification code on the metal layer 120.

In this embodiment, since the thickness of the metal layer 120 is set to be thicker, after the metal layer 120 is ablated by laser, the metal layer 120 is not completely burned through, and an uneven identification code hollowed-out pattern is formed on the metal layer 120, thereby generating reflection light, and the shape of the identification code can be identified through the reflection light.

In order to meet the requirement of lightness and thinness of the conventional electronic device, optionally, the thickness of the metal layer 120 may be greater than or equal to 2 micrometers, and the thickness of the adhesive film layer 110 may be in a range of 1-30 μm. Preferably, the thickness of the metal layer 120 is 4 μm, and the thickness of the adhesive film layer 110 is 4 μm.

On the basis of the above embodiment, the material of the metal layer is at least one simple substance of nickel, silver, platinum, titanium, aluminum, cobalt and chromium; or the metal layer is made of an alloy formed by at least two of nickel, silver, platinum, titanium, aluminum, cobalt and chromium; or the material of the metal layer is a combination of alloys formed by at least two of nickel, silver, platinum, aluminum, titanium, aluminum, cobalt and chromium.

Further, optionally, the identification code includes at least one of a barcode, a two-dimensional code, and a character.

The identification code is a unique corresponding identification mark for identifying the component or the electronic product. The identification code may include figures of characters such as numbers and letters, and may also be a bar code or a two-dimensional code, and the film of this embodiment may include at least one of the above-mentioned bar code, two-dimensional code and characters to identify a corresponding component or electronic product.

It can be understood that the film provided by the embodiment can be used for setting the identification code, so as to realize better tracing of the electronic product or a certain component inside the electronic product corresponding to the identification code. The film can be used together with a shielding film and arranged on a circuit board, the film can be directly attached to the shielding film or a component through a glue layer, further, the circuit board is arranged in corresponding electronic equipment, the electronic equipment can comprise electronic products such as a mobile phone and a computer, and the embodiment does not specially limit the number of the electronic equipment.

According to the technical scheme of the embodiment of the invention, the film comprises: a glue film layer; the metal layer is located on one side of the adhesive film layer and used for forming hollow-out patterns of the identification codes, the thickness of the metal layer is H, the thickness of the identification codes is H, and H is less than H. The problem of among the prior art steel sheet size restriction unable printing identification code to and identification code printing definition is not high in the soft board is solved to realize forming clear identification code of distinguishing, and application scope is extensive.

Fig. 2 is a schematic structural diagram of another film according to an embodiment of the present invention. Referring to fig. 2, on the basis of the above embodiment, the adhesive layer 110 includes a first adhesive layer 111 and a second adhesive layer 112;

the first glue layer 111 is disposed on a side close to the metal layer 120; the second adhesive layer 112 is disposed on a side of the first adhesive layer 111 away from the metal layer 120.

The first glue layer 111 is cured after being formed, and may serve as an insulation for the metal layer 120. Optionally, the first adhesive layer 111 is a colorless adhesive.

Illustratively, the metal layer 120 is formed on the first glue layer 111 by a sputtering and electroplating process, and optionally, the metal layer 120 is a silver white metal layer.

On the basis of the above embodiment, the first adhesive layer is thermosetting adhesive, and the second adhesive layer is thermoplastic adhesive or thermosetting adhesive.

The thermosetting adhesive is an adhesive which can form chemical bonds under the independent action or combined action of a thermal catalyst, and is not melted or dissolved after being cured. The first adhesive layer 111 may be phenolic, urea formaldehyde, melamine, epoxy, polyurethane, acrylate, unsaturated polyester, silicone, and the like.

Thermoplastic rubber is a kind of high molecular material which shows rubber elasticity at normal temperature and is plastic when heated. The second adhesive layer 112 may be a styrene resin, a vinyl acetate resin, a polyester resin, a polyethylene resin, a polyphenylene resin, an imide resin, an acrylic resin, or the like. Specifically, the second adhesive layer 112 may be polyvinyl acetate, polyvinyl acetal, ethylene-vinyl acetate copolymer resin, vinyl chloride-vinyl acetate copolymer resin, perchloroethylene resin, polyacrylate, polyamide, polysulfone, or the like.

Fig. 3 is a schematic structural diagram of another film according to an embodiment of the present invention. Referring to fig. 3, on the basis of the above embodiment, the film further includes a protection layer 130 disposed on a side of the adhesive film layer 110 away from the metal layer 120.

The protective layer 130 provides protection and support for the adhesive film layer 110. With reference to fig. 2 and 3, the protective layer 130 provides protection and support for the second adhesive layer 112, and a certain thickness of adhesive is coated on the protective layer 130 to form the second adhesive layer 112.

It is understood that the second adhesive layer 112 is used for attaching the film provided in this embodiment to a corresponding shielding film or component, and the protective layer 130 is removed when the second adhesive layer 112 needs to attach the shielding film or component corresponding to the film.

Fig. 4 is a schematic structural diagram of another film according to an embodiment of the present invention. Referring to fig. 4, on the basis of the above embodiment, the film further includes a low-adhesive film 140, and the low-adhesive film 140 is disposed on a side of the metal layer 120 away from the adhesive film layer 110.

The low-adhesive film 140 is used to provide protection and support for the metal layer 120, and when the metal layer 120 forms a hollow pattern of the identification code, the low-adhesive film 140 needs to be removed, so that no adhesive residue is left on the metal layer 120.

The low-adhesion film 140 is generally an adhesive with little or no adhesive to be electrostatically adsorbed directly without affecting the adsorption effect, and can be removed without leaving a residue on the adhered portion. Alternatively, the low-tack film 140 may be a silicone film.

Fig. 5 is a schematic structural diagram of a new film according to an embodiment of the present invention. Referring to fig. 5, on the basis of the above embodiment, the metal layer 120 includes a first metal layer 121 and a second metal layer 122;

the first metal layer 121 is disposed on one side close to the adhesive film layer 110; the second metal layer 122 is disposed on a side of the first metal layer 121 far away from the adhesive film layer 110.

The first metal layer 121 is sputtered on the adhesive film layer 110 by a sputtering process, the first metal layer 121 may be white or silvery white or other light-colored metal, for example, nickel, silver, platinum, chromium, titanium, aluminum, cobalt, or an alloy of any two or more of the foregoing metals, and optionally, the first metal layer 121 is nickel.

The second metal layer 122 is electroplated on the first metal layer 121 by an electroplating process, the second metal layer 122 may be a light-colored metal such as white or silvery white, for example, a metal such as nickel, silver, platinum, chromium, titanium, aluminum, cobalt, or an alloy of any two or more of the above metals, and optionally, the second metal layer 122 is nickel.

It is understood that, on the basis of the above-mentioned embodiment, with continued reference to fig. 5, the first metal layer 121 is a black metal layer, or the second metal layer 122 is a black metal layer.

Specifically, the first metal layer 121 is a ferrous metal layer, for example, a simple metal such as iron, chromium, or manganese, or an alloy thereof, and exemplarily, ferrous metal and an alloy thereof such as steel, pig iron, an iron alloy, cast iron, etc., the second metal layer 122 may be a metal with a lighter color such as white or silver white, for example, a metal such as nickel, silver, platinum, chromium, titanium, aluminum, cobalt, or an alloy of any two or more of the above metals, and optionally, the second metal layer 122 is nickel. To some extent, the first metal layer 121 and the second metal layer 122 form a relatively obvious brightness contrast, and thus, the definition and resolution of the identification code formed on the metal layer 120 can be enhanced.

In another alternative, the second metal layer 122 is a ferrous metal layer, for example, a simple metal such as iron, chromium, or manganese, or an alloy thereof, for example, ferrous metal iron and an alloy thereof such as steel, pig iron, an iron alloy, cast iron, etc., the first metal layer 121 may be a metal with a light color such as white or silver white, for example, a metal such as nickel, silver, platinum, chromium, titanium, aluminum, cobalt, or an alloy of any two or more of the above metals, and optionally, the first metal layer 121 may be nickel. Also, a more distinct contrast in brightness may be formed by the first metal layer 121 and the second metal layer 122 to some extent, so as to enhance the definition and resolution of the identification code formed on the metal layer 120.

Alternatively, the first metal layer 121 may also be formed by other processes, for example, one or more of electroless plating, physical vapor deposition, chemical vapor deposition, evaporation plating, sputtering plating, electroplating and hybrid plating, and the preparation process of the first metal layer 121 is not particularly limited in this embodiment. The second metal layer 122 may also be formed by other processes, for example, one or more of electroless plating, physical vapor deposition, chemical vapor deposition, evaporation plating, sputtering plating, electroplating, and hybrid plating, and the process for preparing the second metal layer 122 is not particularly limited in this embodiment.

Fig. 6 is a schematic structural diagram of a new film according to an embodiment of the present invention. Referring to fig. 5, on the basis of the above embodiment, the film further includes a first film layer 150, and the first film layer 150 is disposed on a side of the metal layer 120 away from the adhesive film layer 110. Optionally, the first glue film layer 150 is disposed between the low adhesive film 140 and the metal layer 120.

The first film layer 150 is disposed on a side of the metal layer 120 away from the adhesive film layer 110, so as to prevent a short circuit from occurring when the metal layer 120 contacts with an external electronic component.

In addition, first rete 150 can be formed with the opening in the position that corresponds with the fretwork pattern of identification code to expose the identification code and be used for the user to discern, also can not set up above-mentioned opening, and at this moment, first rete 150 is colorless transparent insulating film, can expose the identification code equally and be used for the user to discern, and is optional, first rete colorless glue film or colorless printing ink layer.

In this embodiment, the metal layer 120 includes a first metal layer 121 and a second metal layer 122, and the first film layer 150 is disposed on a side of the first metal layer 121 away from the second metal layer 122, so as to prevent a short circuit from occurring when the first metal layer 121 contacts an external electronic component.

On the basis of the above embodiments, the embodiment of the present invention further provides a circuit board, as shown in fig. 7, fig. 7 is a schematic structural diagram of a circuit board provided in the embodiment of the present invention, where the circuit board includes a printed circuit board 2 and any one of the films 1 provided in the embodiment of the present invention; and after the protective layer of the film 1 is removed, one side of the adhesive film layer of the film 1 is attached to the printed circuit board 2. The circuit board of the embodiment comprises the technical characteristics of the film provided by any embodiment of the invention, and has the beneficial effects of the film provided by any embodiment of the invention.

The printed circuit board 2 is integrated with a large number of components with different functions, and in the embodiment, the positions, corresponding to the components, on the film 1 can be provided with identification codes of the components.

It can be understood that, an embodiment of the present invention further provides an electronic device, where the electronic device includes the circuit board provided in the foregoing embodiment, and the electronic device provided in the embodiment of the present invention may be a computer, a television, an intelligent wearable device, or the like, and the embodiment of the present invention is not particularly limited in this respect.

On the basis of the above embodiment, an embodiment of the present invention further provides a circuit board, as shown in fig. 8, fig. 8 is a schematic structural diagram of a circuit board provided in an embodiment of the present invention, where the circuit board includes a printed circuit board 2, an electromagnetic shielding film 3, and any one of the films 1 provided in the embodiments of the present invention; and after the protective layer of the film 1 is removed, one side of the adhesive film layer of the film 1 is attached to the printed circuit board 2. The circuit board of the embodiment comprises the technical characteristics of the film provided by any embodiment of the invention, and has the beneficial effects of the film provided by any embodiment of the invention.

The printed circuit board 2 is integrated with a large number of components with different functions, and in the embodiment, the positions, corresponding to the components, on the film 1 can be provided with identification codes of the components. The electromagnetic shielding film 3 may cover the printed circuit board in a whole layer for realizing electromagnetic shielding in the whole layer, and the electromagnetic shielding film 3 may also include a plurality of sub-shielding films with smaller sizes, each of which is used for covering a corresponding area of the printed circuit board, which is not limited in this embodiment. In addition, the circuit board may be attached with the electromagnetic shielding film 3 first, and then attached with the film 1 provided in the above embodiment, for example, the identification code of the corresponding electronic device formed on the film 1 may be disposed in the edge area of the electromagnetic shielding film 3.

It can be understood that, an embodiment of the present invention further provides an electronic device, where the electronic device includes the circuit board provided in the foregoing embodiment, and the electronic device provided in the embodiment of the present invention may be a computer, a television, an intelligent wearable device, or the like, and the embodiment of the present invention is not particularly limited in this respect.

It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims (13)

1. A film, comprising:

a glue film layer;

the metal layer is located on one side of the adhesive film layer and used for forming hollow-out patterns of the identification codes, the thickness of the metal layer is H, the thickness of the identification codes is H, and H is less than H.

2. The film of claim 1, wherein the glue film layer comprises a first glue layer and a second glue layer;

the first adhesive layer is arranged on one side close to the metal layer; the second adhesive layer is arranged on one side, far away from the metal layer, of the first adhesive layer.

3. The film of claim 2, wherein the first layer of glue is a thermosetting glue and the second layer of glue is a thermoplastic or thermosetting glue.

4. The film of claim 1, wherein the identification code comprises at least one of a bar code, a two-dimensional code, and a character.

5. The film of claim 1, further comprising a protective layer disposed on a side of the adhesive film layer facing away from the metal layer.

6. The film of claim 1, wherein the metal layer comprises a first metal layer and a second metal layer;

the first metal layer is arranged on one side close to the adhesive film layer; the second metal layer is arranged on one side of the first metal layer far away from the adhesive film layer.

7. The film of claim 1, wherein the metal layer is made of at least one element selected from the group consisting of nickel, silver, platinum, titanium, aluminum, cobalt, and chromium; or the metal layer is made of an alloy formed by at least two of nickel, silver, platinum, titanium, aluminum, cobalt and chromium; or the material of the metal layer is a combination of alloys formed by at least two of nickel, silver, platinum, aluminum, titanium, aluminum, cobalt and chromium.

8. The film of claim 6, wherein the first metal layer is a black metal layer or the second metal layer is a black metal layer.

9. The film of claim 1, further comprising a first film layer disposed on a side of the metal layer remote from the adhesive film layer.

10. The film of claim 9, wherein the first film layer is a colorless glue layer or a colorless ink layer.

11. The film of claim 1, further comprising a low-tack film disposed on a side of the metal layer remote from the adhesive film layer.

12. A wiring board comprising a printed circuit board and the film of any one of claims 1-11;

and removing the protective layer of the film, and attaching the adhesive film layer of the film to the printed circuit board.

13. A circuit board comprising a printed circuit board, an electromagnetic shielding film and the film of any one of claims 1-11, wherein the electromagnetic shielding film is disposed on the printed circuit board;

and removing the protective layer of the film, and attaching the adhesive film layer of the film to the printed circuit board.

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