CN113973482A - Membrane and circuit board - Google Patents

Membrane and circuit board Download PDF

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Publication number
CN113973482A
CN113973482A CN202010724480.1A CN202010724480A CN113973482A CN 113973482 A CN113973482 A CN 113973482A CN 202010724480 A CN202010724480 A CN 202010724480A CN 113973482 A CN113973482 A CN 113973482A
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China
Prior art keywords
film
metal layer
layer
color
aluminum
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CN202010724480.1A
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Chinese (zh)
Inventor
苏陟
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Guangzhou Fangbang Electronics Co Ltd
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Guangzhou Fangbang Electronics Co Ltd
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Priority to CN202010724480.1A priority Critical patent/CN113973482A/en
Publication of CN113973482A publication Critical patent/CN113973482A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Laminated Bodies (AREA)

Abstract

The embodiment of the invention discloses a membrane and a circuit board. The film includes: a first film layer; a metal layer on one side of the first film layer; and the gray value of the color of the first film layer is smaller than that of the metal layer. The technical scheme of the embodiment of the invention realizes more obvious contrast of light and shade brightness, thereby widening the application range of the film.

Description

Membrane and circuit board
Technical Field
The embodiment of the invention relates to the technical field of identification code manufacturing, in particular to a membrane and a circuit board.
Background
With the rapid development of the electronic industry, electronic products are further miniaturized, light-weighted and high-density assembled, and the development of flexible circuit boards is greatly promoted, so that the connection integration of various components and wires is realized.
Various components and parts have been integrateed in the inside of electronic product, and in order to the certain device of this electronic product of better retrospecting or its inside, often be provided with the identification code in electronic product, can carry out the information of product or certain part through scanning this identification code and traceed back.
At present, set up identification code (for example two-dimensional code) on a steel sheet among the prior art, but because the frivolous size of steel sheet has been injectd to electronic product, lead to can't printing the two-dimensional code on the steel sheet. And then, the identification code is printed on the soft board in a printing mode, but the printed identification code is unclear and has low resolution due to the small soft board, and the identification code cannot be printed.
Disclosure of Invention
The embodiment of the invention provides a film and a circuit board, which are used for realizing obvious brightness contrast and widening the application range of the film.
In a first aspect, embodiments of the present invention provide a film, comprising:
a first film layer;
a metal layer on one side of the first film layer;
and the gray value of the color of the first film layer is smaller than that of the metal layer.
Optionally, the film further comprises a subbing layer;
the adhesive layer is arranged on one side of the metal layer, which is far away from the first film layer;
optionally, the metal layer includes a first metal layer and a second metal layer;
the first metal layer is arranged on one side close to the first film layer; the second metal layer is arranged on one side of the first metal layer far away from the first film layer.
Optionally, the first metal layer includes a first sputtered metal layer and a second sputtered metal layer;
the first sputtering metal layer is arranged on one side close to the first film layer; the second sputtering metal layer is arranged on one side of the first sputtering metal layer, which is deviated from the first film layer.
Optionally, the material of the first metal layer is at least one simple substance of nickel, silver, platinum, gold, titanium, aluminum, cobalt and chromium; or the material of the first metal layer is an alloy formed by at least two of nickel, silver, platinum, gold, titanium, aluminum, cobalt and chromium; the material of the second metal layer is at least one simple substance of nickel, silver, platinum, aluminum, titanium, aluminum, cobalt and chromium; or the material of the second metal layer is an alloy formed by at least two of nickel, silver, platinum, aluminum, titanium, aluminum, cobalt and chromium; or the material of the second metal layer is a combination of alloys formed by at least two of nickel, silver, platinum, aluminum, titanium, aluminum, cobalt and chromium.
Optionally, the thickness range of the first film layer is 0.5 to 40 μm, the thickness range of the metal layer is 0.05 to 10 μm, and the thickness range of the glue layer is 1 to 30 μm.
Optionally, a plurality of protruding structures are formed on one side of the metal layer away from the first film layer through roughening treatment.
Optionally, the roughness of the surface of the metal layer away from the first film layer ranges from 0.5 μm to 30 μm.
Optionally, a difference between the gray value of the color of the first film layer and the gray value of the color of the metal layer is smaller than or equal to a first gray threshold, and the first gray threshold is greater than or equal to 10.
Optionally, the first grayscale threshold is 50.
Optionally, the first grayscale threshold is 100.
In a second aspect, embodiments of the present invention also provide a film, the film comprising:
a first film layer;
a metal layer on one side of the first film layer;
the adhesive layer is arranged on one side of the metal layer, which is far away from the first film layer;
the grey scale value of the color of the first film layer is smaller than the grey scale value of the color of the metal layer, and the first film layer forms a hollow-out pattern of the identification code.
Optionally, a groove pattern is formed on one side of the metal layer close to the first film layer, and a vertical projection of the hollow pattern on a plane where the metal layer is located completely coincides with the groove pattern. In a fourth aspect, an embodiment of the present invention further provides a circuit board, where the circuit board includes a circuit board body, a shielding film, and the film according to any one of the embodiments of the present invention, where the shielding film is disposed on the circuit board body, and the film is disposed on the shielding film.
In a fifth aspect, an embodiment of the present invention further provides a circuit board, where the circuit board includes a circuit board body and the film according to any one of the embodiments of the present invention, and the shielding film is disposed on the circuit board body, and the film is disposed on the shielding film.
According to the technical scheme of the embodiment of the invention, the film comprises: a first film layer; a metal layer on one side of the first film layer; and the gray value of the color of the first film layer is smaller than that of the metal layer. The problem of among the prior art steel sheet size restriction unable printing identification code to and identification code printing definition is not high in the soft board is solved to realize having more obvious light and shade luminance contrast through the membrane, and then widen the application scope of membrane.
Drawings
FIG. 1 is a schematic structural diagram of a membrane provided in an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of another membrane provided in an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of another membrane provided in an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of yet another membrane provided by an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a circuit board according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of another circuit board according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention are described in further detail below with reference to the accompanying drawings. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention.
It should be further noted that, for the convenience of description, only some but not all of the relevant aspects of the present invention are shown in the drawings. Before discussing exemplary embodiments in more detail, it should be noted that some exemplary embodiments are described as processes or methods depicted as flowcharts. Although a flowchart may describe the operations (or steps) as a sequential process, many of the operations can be performed in parallel, concurrently or simultaneously. In addition, the order of the operations may be re-arranged. The process may be terminated when its operations are completed, but may have additional steps not included in the figure. The processes may correspond to methods, functions, procedures, subroutines, and the like.
The embodiment of the invention provides a film which can be suitable for setting identification codes for various components integrated in an electronic product. Fig. 1 is a schematic structural diagram of a film according to an embodiment of the present invention. Referring to fig. 1, the specific structure of the membrane includes:
a first film layer 110;
a metal layer 120 on one side of the first film layer 110;
wherein the gray value of the color of the first film layer 110 is smaller than the gray value of the color of the metal layer 120.
The first film layer 110 is used for insulating and supporting the metal layer 120, and forms a relatively obvious brightness contrast with the metal layer 120 to a certain extent. The first film 110 may be black, or a color with a gray value closer to black, such as dark blue, and the specific color of the first film 110 is not limited in this embodiment.
Optionally, the first film layer 110 may include a PPS film layer, a PEN film layer, a polyester film layer, a polyimide film layer, a film layer formed after curing epoxy resin ink, a film layer formed after curing polyurethane ink, a film layer formed after curing modified acrylic resin, or a film layer formed after curing polyimide resin.
In order to adapt to the trend of thinning electronic products, the thickness of the first film layer 110 may be in a range of 2 μm to 15 μm, so as to reduce the thickness of the first film layer 110 as much as possible, optionally, the thickness of the first film layer 110 may be selected to be 4 μm, and on the premise of having good insulation and protection properties, thinning of the first film layer 110 is achieved.
The metal layer 120 is used to form an obvious color or brightness difference with the first film layer 110, and the gray value of the metal layer 120 is greater than that of the first film layer 110.
In the present embodiment, the gray scale parameter is used to convert the color into high-quality gray scale gradient to detect the contrast of the brightness of the metal layer 120 and the first film 110. The gray scale uses black tone to represent various colors, that is, black is used as a reference color, and different colors are displayed by black with different saturation. The gray scale value of white is 255, and the gray scale value of black is 0.
For example, in the present embodiment, the gray-level value of the metal layer 120 is defined to be greater than the gray-level value of the first film layer 110, that is, the difference between the gray-level value of the color of the metal layer 120 and the gray-level value of the color of the first film layer 110 is defined to be greater. For example, the metal layer 120 is silver, and the gray scale value of the silver is larger, so that the silver of the metal layer 120 is in sharp contrast with the dark color of the first film layer 110.
Further, the difference between the gray value of the color of the metal layer 120 and the gray value of the color of the first film layer 110 is greater than or equal to the first gray threshold; if the first gray threshold is greater than or equal to 10, the difference between the gray value of the color of the metal layer 120 and the gray value of the color of the first film layer 110 is at least 10, so that a relatively obvious light-dark difference is formed between the metal layer 120 and the first film layer 110, and the accuracy of the identification code identification device in identifying the identification code formed by the metal layer 120 and the first film layer 110 is improved.
In order to further increase the brightness difference between the metal layer 120 and the first film layer 110, the first grayscale threshold may be defined to be 50, and the difference between the grayscale value of the color of the metal layer 120 and the grayscale value of the color of the first film layer 110 is at least 50, the color brightness of the metal layer 120 is stronger, and the color brightness of the first film layer 110 is smaller, so as to further increase the light-dark contrast between the metal layer 120 and the first film layer 110, and improve the identification precision and accuracy of the identification code.
Based on the above embodiment, the embodiment may further define that the first gray threshold is 100, and the difference between the gray value of the color of the metal layer 120 and the gray value of the color of the first film layer 110 is at least 100, for example, if the gray value of the color of the first film layer 110 is 0, and the gray value of the color of the metal layer 120 and the gray value of the color of the first film layer 110 are different by at least 100, even by 255, the gray value of the metal layer 120 may be greater than or equal to 100. In the case of the difference between the gray values of 255, one of the metal layer 120 and the first film layer 110 is pure black, and the other is pure white, i.e. one of the gray values of 255 and the other is 0, the difference between the brightness and the color is large, and the definition of the identification code is further enhanced.
According to the technical scheme of the embodiment of the invention, the film comprises: a first film layer; a metal layer on one side of the first film layer; and the gray value of the color of the first film layer is smaller than that of the metal layer. The problem of among the prior art steel sheet size restriction unable printing identification code to and identification code printing definition is not high in the soft board is solved to realize having more obvious light and shade luminance contrast through the membrane, and then widen the application scope of membrane.
Fig. 2 is a schematic structural diagram of another film provided in an embodiment of the present invention, referring to fig. 2, on the basis of the above embodiment, the film further includes a glue layer 130; the adhesive layer 130 is disposed on a side of the metal layer 120 away from the first film layer 110. Wherein the glue layer 130 plays a role of connection.
Fig. 3 is a schematic structural diagram of another film provided in an embodiment of the present invention, referring to fig. 3, on the basis of the above embodiment, the metal layer 120 includes a first metal layer 121 and a second metal layer 122; the first metal layer 121 is disposed on a side close to the first film layer 110; the second metal layer 122 is disposed on a side of the first metal layer 121 far away from the first film layer 110.
Specifically, the first metal layer 121 is sputtered on the first film layer 110 by a sputtering process, and the first metal layer 121 may be understood as a sputtered metal layer in this embodiment. Of course, the first metal layer 121 may also be formed by other processes, for example, one or more of electroless plating, physical vapor deposition, chemical vapor deposition, evaporation plating, electroplating and hybrid plating, and the preparation process of the first metal layer 121 is not particularly limited in this embodiment.
The purpose of the first metal layer 121 and the second metal layer 122 is to form a stronger color difference with the first film layer 110, and have a distinct black-white contrast, so as to improve the identification of the formed identification code.
A second metal layer 122 is formed on the first metal layer 121 by an electroplating process, and the second metal layer 122 may be understood as an electroplated metal layer. Of course, the second metal layer 122 may also be formed by other processes, for example, one or more of electroless plating, physical vapor deposition, chemical vapor deposition, evaporation plating, sputtering plating and hybrid plating, and the preparation process of the second metal layer 122 is not particularly limited in this embodiment.
In this embodiment, the first metal layer 121 and the second metal layer 122 are both made of light-colored metal such as white or silver-white. The first metal layer is made of at least one simple substance of nickel, silver, platinum, gold, titanium, aluminum, cobalt and chromium; or the material of the first metal layer is an alloy formed by at least two of nickel, silver, platinum, gold, titanium, aluminum, cobalt and chromium; the material of the second metal layer is at least one simple substance of nickel, silver, platinum, aluminum, titanium, aluminum, cobalt and chromium; or the material of the second metal layer is an alloy formed by at least two of nickel, silver, platinum, aluminum, titanium, aluminum, cobalt and chromium; or, the material of the second metal layer is a combination of alloys formed by at least two of nickel, silver, platinum, aluminum, titanium, aluminum, cobalt, and chromium, and optionally, both the first metal layer 121 and the second metal layer 122 adopt nickel.
It will be appreciated that when the identification code is to be ablated, the laser energy forms a pattern of hollows in the first film layer 110, thereby exposing the color of the first metal layer 121, and therefore the gray scale value corresponding to the color of the first metal layer 121 is preferably greater than the gray scale value corresponding to the color of the second metal layer 122, for example, the first metal layer 121 may be selected to be silver and the second metal layer 122 may be selected to be nickel.
Further, when the thickness of the first metal layer 121 is thin, when the identification code is formed by ablation, the color of the second metal layer 122 is exposed because the first metal layer 121 is completely burned through by a large amount of laser energy, and at this time, the gray value corresponding to the color of the first metal layer 121 and the gray value corresponding to the color of the second metal layer may not be selected in any way.
Fig. 4 is a schematic structural diagram of another film provided in an embodiment of the present invention, referring to fig. 4, based on the above embodiment, the first metal layer 121 includes a first sputtered metal layer 1211 and a second sputtered metal layer 1212;
the first sputtered metal layer 1211 is disposed on a side close to the first film layer 110; the second sputtered metal layer 1212 is disposed on a side of the first sputtered metal layer 1211 facing away from the first film layer 110.
On the basis of the above embodiment, the material of the first sputtered metal layer 1211 is at least one simple substance of nickel, silver, platinum, gold, titanium, aluminum, cobalt and chromium; or, the material of the first sputtered metal layer 1211 is an alloy formed by at least two of nickel, silver, platinum, gold, titanium, aluminum, cobalt and chromium; the material of the second sputtered metal layer 1212 is at least one simple substance of nickel, silver, platinum, titanium, aluminum, cobalt and chromium; or, the material of the second sputtered metal layer 1212 is an alloy formed by at least two of nickel, silver, platinum, titanium, aluminum, cobalt and chromium; the material of the second metal layer 122 is at least one simple substance of nickel, silver, platinum, aluminum, titanium, aluminum, cobalt and chromium; or, the material of the second metal layer 122 is an alloy formed by at least two of nickel, silver, platinum, aluminum, titanium, aluminum, cobalt and chromium; alternatively, the material of the second metal layer 122 is a combination of alloys formed by at least two of nickel, silver, platinum, aluminum, titanium, aluminum, cobalt and chromium.
It can be understood that, in this embodiment, two sputtered metal layers may be provided, and since the laser energy may possibly punch through the first sputtered metal layer 1211 during the process of actually ablating the first film layer 110 to form the hollow-out pattern of the identification code, the guarantee may be increased by the second sputtered metal layer 1212, so as to keep the exposed hollow-out pattern as a sputtered metal layer with higher flatness.
Further, the gray scale value of the color of the first sputtered metal layer 1211 may be set to be greater than the gray scale value of the color of the second sputtered metal layer 1212, for example, if the first sputtered metal layer 1211 is silver and the second sputtered metal layer 1212 is nickel, the metal surface of silver can form a sharp color contrast with the first film layer 110 with a dark color, thereby improving the definition of the identification code.
On the basis of the above embodiment, the thickness range of the first film layer is 0.5-40 μm, the thickness range of the metal layer is 0.05-10 μm, and the thickness range of the glue layer is 1-30 μm.
The thickness of the metal layer ranges from 0.05 to 10 μm, that is, the total thickness of the first metal layer 120 and the second metal layer 130 may range from 0.05 to 10 μm.
On the basis of the above embodiment, a plurality of protruding structures are formed on the side of the metal layer away from the first film layer through roughening treatment.
In this embodiment, the protruding structure improves the bonding force and the adhesion between the metal layer 120 and the adhesive layer 130, thereby achieving the function of preventing the plate from being exploded. Specifically, when the film is pressed onto the shielding film of the wiring board,
the overflow glue jacked by the convex structure can be extruded to the concave part of the metal layer, the glue containing amount between the metal layer and the printed circuit board is increased, and the stripping between the film and the printed circuit board is avoided. Due to the arrangement of the protruding structures, when the film is pressed with the circuit board, the glue of the protruding parts can be extruded to the concave parts, so that the glue containing amount is increased, and the phenomenon of board explosion is avoided.
On the basis of the above embodiment, the roughness of the surface of the metal layer away from the first film layer ranges from 0.5 μm to 30 μm.
Optionally, the material for micro-roughening between the metal layer 120 and the glue layer 130 may be copper. The embodiment of the invention provides a film which can be suitable for setting identification codes for various components integrated in an electronic product. With continued reference to fig. 2, the specific structure of the membrane includes:
a first film layer 110;
a metal layer 120 on one side of the first film layer 110;
the adhesive layer is arranged on one side of the metal layer 120 far away from the first film layer 110;
the gray value of the color of the first film layer 110 is smaller than the gray value of the color of the metal layer 120, and the first film layer 110 forms a hollow pattern of the identification code.
The identification code formed by the first film 110 can be increased by the contrast between the brightness of the first film 110 and the brightness of the metal layer 120.
Specifically, the metal layer 120 is disposed on one side of the first film layer 110, a hollow pattern of the identification code is formed on the first film layer 110, and the metal layer 120 can generate a strong color difference contrast with the gray value of the first film layer 110, so that the identification code can obtain a better identification degree.
Alternatively, the hollow pattern may be formed by laser ablation.
It should be noted that when the hollow pattern is ablated, there are two situations:
first, the first film layer 110 is only burned through to form the hollow pattern of the identification code, and the metal layer 120 is not ablated, that is, the ablation depth of the hollow pattern is the thickness of the first film layer 110. The hollow pattern just exposes the metal layer 120 that is not ablated, i.e., the first film layer 110 and the metal layer 120 form the identification code.
Secondly, when the first film layer 110 is burnt through to form the hollow-out pattern of the identification code, the metal layer 120 is also partially ablated, that is, the metal layer 120 is partially ablated but not completely ablated, so that after the identification code is ablated, the hollow-out pattern can also expose the metal layer 120, so that the first film layer 110 and the metal layer 120 form the identification code. Specifically, the first film layer 110 is burned through to form a hollow pattern, a groove pattern (not labeled in the figure) is formed on one side of the metal layer 120 close to the first film layer 110, and a vertical projection of the hollow pattern on a plane where the metal layer 120 is located completely coincides with the groove pattern. The side of the metal layer 120 close to the first film layer 110 is ablated to form a groove pattern, and because the groove pattern and the hollow pattern are formed through one process, the vertical projection of the hollow pattern on the plane of the metal layer 120 is completely overlapped with the groove pattern.
The identification code is a unique corresponding identification mark for identifying the component or the electronic product. The identification code may include figures of characters such as numbers and letters, and may also be a bar code or a two-dimensional code, and the film of this embodiment may include at least one of the above-mentioned bar code, two-dimensional code and characters to identify a corresponding component or electronic product.
It can be understood that the film provided by the embodiment can be used for setting the identification code, so as to realize better tracing of the electronic product or a certain component inside the electronic product corresponding to the identification code. The film can be used together with a shielding film and arranged on a circuit board, the film can be directly attached to the shielding film or a component through a glue layer, further, the circuit board is arranged in corresponding electronic equipment, the electronic equipment can comprise electronic products such as a mobile phone and a computer, and the embodiment does not specially limit the number of the electronic equipment.
On the basis of the above embodiment, the thickness of the first film layer is H1, the thickness of the identification code is H, the thickness of the metal layer is H2, and H is not less than H1 and is less than H2.
On the basis of the above embodiment, an embodiment of the present invention further provides a circuit board, as shown in fig. 5, fig. 5 is a schematic structural diagram of a circuit board provided in an embodiment of the present invention, where the circuit board includes a circuit board body 2, a shielding film 3, and any one of the films 1 provided in the embodiments of the present invention; and the shielding film 3 is arranged on the circuit board body 2, and the film 1 is arranged on the shielding film 3. The circuit board of the embodiment comprises the technical characteristics of the film provided by any embodiment of the invention, and has the beneficial effects of the film provided by any embodiment of the invention.
The circuit board body 2 is integrated with a large number of components with different functions, and identification codes of the components can be arranged on the positions, corresponding to the components, of the membrane 1 in the embodiment. The shielding film 3 may cover the circuit board body 2 in a whole layer for realizing electromagnetic shielding in the whole layer, and the shielding film 3 may also include a plurality of sub-shielding films with smaller sizes, each sub-shielding film being used for covering a corresponding area of the printed circuit board, which is not limited in this embodiment. In addition, the circuit board may be attached with the shielding film 3 first, and then attached with the film 1 provided in the above embodiment, for example, the identification code of the corresponding electronic device formed on the film 1 may be disposed in the edge area of the shielding film 3.
It can be understood that, an embodiment of the present invention further provides an electronic device, where the electronic device includes the circuit board provided in the foregoing embodiment, and the electronic device provided in the embodiment of the present invention may be a computer, a television, an intelligent wearable device, or the like, and the embodiment of the present invention is not particularly limited in this respect.
On the basis of the foregoing embodiment, an embodiment of the present invention further provides a circuit board, as shown in fig. 6, fig. 6 is a schematic structural diagram of the circuit board provided in the embodiment of the present invention, where the circuit board includes a circuit board body 2 and any one of the films 1 provided in the embodiment of the present invention, and the film 1 is attached to the circuit board body 2 through the adhesive layer. The circuit board of the embodiment comprises the technical characteristics of the film provided by any embodiment of the invention, and has the beneficial effects of the film provided by any embodiment of the invention.
The circuit board body 2 is integrated with a large number of components with different functions, and identification codes of the components can be arranged on the positions, corresponding to the components, of the membrane 1 in the embodiment.
It can be understood that, an embodiment of the present invention further provides an electronic device, where the electronic device includes the circuit board provided in the foregoing embodiment, and the electronic device provided in the embodiment of the present invention may be a computer, a television, an intelligent wearable device, or the like, and the embodiment of the present invention is not particularly limited in this respect.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims (14)

1. A film, comprising:
a first film layer;
a metal layer on one side of the first film layer;
and the gray value of the color of the first film layer is smaller than that of the metal layer.
2. The film of claim 1, further comprising a subbing layer;
the glue layer is arranged on one side of the metal layer, which deviates from the first film layer.
3. The film of claim 1, wherein the metal layer comprises a first metal layer and a second metal layer;
the first metal layer is arranged on one side close to the first film layer; the second metal layer is arranged on one side of the first metal layer far away from the first film layer.
4. The film of claim 3, wherein the material of the first metal layer is at least one simple substance of nickel, silver, platinum, gold, titanium, aluminum, cobalt, and chromium; or the material of the first metal layer is an alloy formed by at least two of nickel, silver, platinum, gold, titanium, aluminum, cobalt and chromium; the material of the second metal layer is at least one simple substance of nickel, silver, platinum, aluminum, titanium, aluminum, cobalt and chromium; or the material of the second metal layer is an alloy formed by at least two of nickel, silver, platinum, aluminum, titanium, aluminum, cobalt and chromium; or the material of the second metal layer is a combination of alloys formed by at least two of nickel, silver, platinum, aluminum, titanium, aluminum, cobalt and chromium.
5. The film of claim 2, wherein the first film layer has a thickness in the range of 0.5-40 μm, the metal layer has a thickness in the range of 0.05-10 μm, and the glue layer has a thickness in the range of 1-30 μm.
6. The film of claim 1, wherein a side of the metal layer remote from the first film layer is roughened to form a plurality of raised structures.
7. A membrane according to claim 1 or 6, wherein the roughness of the surface of the metal layer remote from the first membrane layer is in the range 0.5-30 μm.
8. The film of claim 1, wherein a difference in a grayscale value of a color of the first film layer and a grayscale value of a color of the metal layer is less than or equal to a first grayscale threshold, the first grayscale threshold being greater than or equal to 10.
9. The film of claim 8, wherein the first grayscale threshold is 50.
10. The film of claim 8, wherein the first grayscale threshold is 100.
11. A film, comprising:
a first film layer;
a metal layer on one side of the first film layer;
the adhesive layer is arranged on one side of the metal layer, which is far away from the first film layer;
the grey scale value of the color of the first film layer is smaller than the grey scale value of the color of the metal layer, and the first film layer forms a hollow-out pattern of the identification code.
12. The film of claim 11, wherein a groove pattern is formed on a side of the metal layer close to the first film layer, and a vertical projection of the hollow pattern on a plane of the metal layer is completely overlapped with the groove pattern.
13. A wiring board comprising a wiring board body, a shielding film and the film according to any one of claims 1 to 10, wherein the shielding film is provided on the wiring board body, and the film is provided on the shielding film.
14. A wiring board comprising a wiring board body and the film according to any one of claims 1 to 10, wherein the film is attached to the wiring board body through the adhesive layer.
CN202010724480.1A 2020-07-24 2020-07-24 Membrane and circuit board Pending CN113973482A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010724480.1A CN113973482A (en) 2020-07-24 2020-07-24 Membrane and circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010724480.1A CN113973482A (en) 2020-07-24 2020-07-24 Membrane and circuit board

Publications (1)

Publication Number Publication Date
CN113973482A true CN113973482A (en) 2022-01-25

Family

ID=79585665

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010724480.1A Pending CN113973482A (en) 2020-07-24 2020-07-24 Membrane and circuit board

Country Status (1)

Country Link
CN (1) CN113973482A (en)

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