JPH0727189Y2 - IC card pseudo sample for design presentation - Google Patents

Description

[Detailed description of the device] [Industrial applications]

The present invention relates to an IC card pseudo sample for design presentation.

[Prior art]

As electronic recording media, "IC cards", which have dramatically increased the amount of information compared to magnetic cards, have been commercialized and are becoming popular. The IC card is a card substrate made of a plastic plate having a predetermined size and shape on which characters and patterns are printed, and a recess is provided in the IC substrate, and the IC module is embedded in the recess. The surface of the IC module is a terminal, and a pattern of conductive ink connected to each lead wire of the built-in IC chip is provided. With the spread of IC cards, not only the function as a recording medium but also the design has come to be emphasized, and the harmony between the design of the card base material and the design of the IC module terminal surface is a problem. Pseudo samples are often required to show the design of IC cards. Conventionally, the sample card for seeing the design used the IC module mounted. However, if the IC module is mounted on the sample card, there will be a problem with regard to information security and it will be expensive to manufacture. The measures taken to avoid this are to print the terminal surface of the IC module on a card substrate or to stamp it. However, these are also troublesome, and without cost and time
It is desirable to be able to present the IC card design.

[Problems to be solved by the device]

In view of the above circumstances, an object of the present invention is to provide an IC card pseudo sample for design presentation that is inexpensive and easy to manufacture.

[Means for Solving the Problems]

The IC card pseudo sample for presenting the design of the present invention is, as shown in FIGS. 1 and 2, formed on a card base material (1) obtained by cutting a plastic plate on which letters and patterns are printed into a predetermined size. , A tack seal (2) selected from a plurality of tack seals having the appearance of the IC module terminal surface designed according to the standard of the IC module terminal is attached. The card base material is typically composed of a white polyvinyl chloride (PVC) center core on which a desired picture or character is printed, and a protective layer made of a transparent PVC film is laminated on both surfaces thereof. The shape and size of the card may conform to the JIS standard and other standards. An example of the tack seal used in the present invention is the third
As shown in the cross section of the figure, a transparent plastic base film (21) has a printed layer (24) with the same pattern as the insulating part on the IC module terminal surface on the surface, and a gold colored layer (22) and adhesive on the back Layers (23) are provided in order. The same pattern as the insulating portion means the same pattern as the line that divides the conductive ink layer forming the terminals of the IC module, and may include through holes. The plastic used for the base film of the tack seal is arbitrary, but PVC is suitable like the card substrate. The printing layer may be provided by a known means using a conventional ink, for example, white PVC-based ink is silk screen printed. The gold color of the colored layer can be expressed by combining a known method with, for example, an aluminum vapor deposition layer and a yellow ink layer. The pressure-sensitive adhesive is not particularly limited, and is appropriately selected in consideration of other materials used. As shown in Fig. 3, the tack seal before sticking to the card base material has a release paper (3) on the back for convenient handling.
It is good to apply. The release paper may be a conventional release paper such as a silicone release paper.

[Function] By attaching a tack seal that has the same appearance as the terminal surface of the IC module to the card base material to create a pseudo sample, a sample with the same design as a real IC card can be created without mounting the IC module. To be realized. The terminal surface of the IC module is standardized including the number of poles, the position of each terminal and the position of the through hole. Typical examples of these are
This is as shown in FIGS. 4 to 9. If a tack seal is prepared for each of these patterns, a tack seal can be attached on the card base material as soon as it is made, and an IC card pseudo sample for design presentation can be manufactured.

【Example】

A 90 μm thick transparent PVC film is used as the base film for the tack seal, a predetermined pattern is silk-screen printed with acrylic resin white ink on one side, and a yellow transparent ink layer and an aluminum vapor deposition layer are formed on the other side. A gold colored layer was formed, an acrylic resin adhesive was gravure coated thereon, and silicone release paper was applied to the adhesive layer to produce a tack seal as shown in FIG. A pattern and letters on the front and back of the card were printed on another transparent PVC film, which was laminated on both sides of a white PVC core sheet to prepare a 0.76 mm thick plastic plate. This plastic plate was cut into a predetermined size to obtain a card substrate. The above-mentioned tack seal was peeled off from the release paper and attached to the card base material to manufacture an IC card pseudo sample for design presentation of the present invention as shown in FIG.

[Effect of device]

The IC card pseudo sample for design presentation of the present invention can be manufactured at low cost because an expensive IC module is not used.
The tack seal can be attached more easily than the IC module can be attached, which shortens the card production period. Use of the sample IC card of the present invention can prevent leakage of the IC module and information recorded therein, which is preferable in terms of information security.

[Brief description of drawings]

1 and 2 are views for explaining an IC card pseudo sample for design presentation of the present invention, in which FIG. 1 is a plan view and FIG. 2 is II of FIG. It is sectional drawing of a direction. FIG. 3 is a schematic cross-sectional view for explaining an example of the tack seal used in the IC card pseudo sample of the present invention. FIG. 4 to FIG. 9 are enlarged views showing typical examples of the electrode shape of the IC module terminal surface which is a tack seal, in other words, the pattern of the insulating portion. 1 …… Card base material 2 …… Tack seal 21 …… Base film, 22 …… Gold color layer 23 …… Adhesive layer, 24 …… Printing layer 3 …… Release paper

Claims (2)

[Scope of utility model registration request] 1. A plurality of tacks having an appearance of an IC module terminal surface designed in conformity with the IC module terminal standard, on a card base material 1 in which a plastic plate on which characters and patterns are printed is cut into a predetermined size. An IC card pseudo sample for design presentation, which is made by sticking the tack seal 2 selected from the stickers. 2. A tack seal (2) has a transparent plastic base film (21) provided with a printed layer having the same pattern as an insulating portion of a terminal surface of an IC module, and a gold colored layer (22) and The IC card pseudo sample according to claim 1, wherein the adhesive layer (23) is provided in order.