EP2928630A1 - Procédés destinés à relier au moins deux composants en mettant en uvre un processus de frittage - Google Patents

Procédés destinés à relier au moins deux composants en mettant en uvre un processus de frittage

Info

Publication number
EP2928630A1
EP2928630A1 EP13773796.1A EP13773796A EP2928630A1 EP 2928630 A1 EP2928630 A1 EP 2928630A1 EP 13773796 A EP13773796 A EP 13773796A EP 2928630 A1 EP2928630 A1 EP 2928630A1
Authority
EP
European Patent Office
Prior art keywords
polymerizable
temperature
polymeric
organic compound
equal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP13773796.1A
Other languages
German (de)
English (en)
Inventor
Andrea Feiock
Michael Guenther
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP2928630A1 publication Critical patent/EP2928630A1/fr
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
    • B22F7/064—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts using an intermediate powder layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/008—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression characterised by the composition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29005—Structure
    • H01L2224/29006—Layer connector larger than the underlying bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29399—Coating material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/3201—Structure
    • H01L2224/32012—Structure relative to the bonding area, e.g. bond pad
    • H01L2224/32013—Structure relative to the bonding area, e.g. bond pad the layer connector being larger than the bonding area, e.g. bond pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8384—Sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED

Definitions

  • the present invention relates to a method of joining at least two components using a sintering process.
  • Power electronics are used in many areas of technology. Especially in electrical or electronic devices in which large currents flow, the use of power electronics is unavoidable. The currents required in the power electronics lead to a self-heating of the electrical or electronic components contained. In addition, the
  • Components of the power electronics be used in places that are constantly exposed to an elevated temperature. Examples include control units in the automotive sector, which are directly in the engine compartment or in
  • Gear compartment are arranged.
  • the control unit is also exposed to a constant temperature change, whereby the electrical and / or electronic components contained are subjected to high thermal loads.
  • temperature changes in a range up to a temperature of 200 ° C are common. However, more and more operating temperatures are increasingly required. This will increase overall
  • connection of electrical or electronic components - for example, to a carrier substrate - by a
  • Link layer As such a bonding layer are solder joints known, for example, lead-free solder joints of tin-silver or tin-silver-copper. At higher operating temperatures, lead-containing soldered joints can be used. However, lead-containing solder joints are by law
  • Lead-free brazing alloys Use at elevated or high temperatures, in particular over 200 ° C, lead-free brazing alloys.
  • Lead-free brazing alloys generally have a higher melting point than 200 ° C.
  • sintered connections which are already at low temperatures
  • Temperatures can be processed and yet are suitable for operation at elevated temperatures.
  • Such sintered connections offer the advantage of an increased choice of electrical or electronic
  • Sintered connections For the preparation of a sintered compound is a
  • Document EP 2 278 593 A1 discloses a sintered compound made from a paste containing particles of a silver compound.
  • the document US 2008/0211095 A1 also describes a semiconductor component which has a connection between a semiconductor element and an electrode which is configured by an electrically conductive adhesive.
  • the document US 6,832,915 B2 further discloses a thermally conductive adhesive bond between two components. From the document DE 10 2007 27 999 AI a transfer film for transferring a silver sintered layer is also known.
  • Components are mounted on a substrate by pressure sintering using a pasty layer.
  • Starting materials include, but are not limited to, molecular metals, numerous nano- or micro-sized metallic particles, coatings, solvents, additives, reducing agents,
  • the subject matter of the present invention is a method for joining at least two components using a sintering process, comprising the method steps:
  • sinterable particles comprising at least one metal or at least one metal compound, and at least one polymeric, polymerizable and / or monomeric organic compound, wherein the polymeric, polymerizable and / or monomeric organic compound has a flow temperature greater than or equal to
  • Tl which is greater than or equal to the flow temperature of the polymeric, polymerizable and / or monomeric organic compound and less than the desorption temperature of the polymeric, polymerizable and / or monomeric organic compound for a time tl;
  • the above-described method can in particular make it possible to carry out a sintering process in a particularly simple manner and thereby to produce a particularly stable and reliable sintered connection.
  • a sintered compound comprising sinterable particles comprising at least one metal or at least one metal compound, and at least one polymeric, polymerizable and / or monomeric organic compound, wherein the polymeric, polymerizable and / or monomeric organic compound has a flow temperature greater than or equal to room temperature and is smaller than the sintering temperature, and wherein the polymeric, polymerizable and / or monomeric organic compound further has a desorption temperature greater than the flow temperature and less than or equal to the sintering temperature.
  • a starting material which is intended to form the sintered connection in the further method.
  • the starting material in this case comprises a background material, which after sintering may represent the actual sintered connection or at least forms a large proportion of the sintered connection.
  • This background material may in particular at least one metal or at least one
  • the starting material has at least one polymeric, polymerizable and / or monomeric organic compound.
  • the polymeric, polymerizable and / or monomeric organic compound can serve to hold the background material together and so on permit the starting material to be provided as a compact, for example malleable, for example thermoplastic, shaped body, for example.
  • a polymeric organic compound by way of example and not by way of limitation, a hydrocarbon-based compound which is polymerized can be considered. Accordingly, under a
  • organic monomeric compound may further be understood as meaning, for example and not by way of limitation, such a compound which may also be hydrocarbon-based but need not have any groups suitable for polymerization.
  • the starting material can be provided as a transportable and storable material that can be applied at any time and without special effort.
  • the starting material may be produced in advance and stored and fed to its use immediately prior to carrying out the process. This allows very dynamic and changeable production processes, which are directly adaptable to the desired requirements.
  • the starting material can be provided, for example, as a large-area material, from which in each case a material part of a suitable size can be separated, for example punched out or cut out, before it can be used.
  • only one starting material can be provided for a wide range of applications, which can further improve the costs for the above-described method.
  • the starting material such as by film casting or
  • Handling systems are handled, which is a particularly good Integration of the starting material into existing process peripherals.
  • Unevenness of the joining partners such as substrate unevenness or component unevenness, optimally adapt, so that a particularly intimate contact is possible, which can also bring a particularly stable sintered connection with it.
  • the polymeric, polymerizable and / or monomeric organic compound and the background material or the at least one metal or the at least one metal compound are particularly matched to one another such that the polymeric, polymerizable and / or monomeric organic compound has a flow temperature which is greater than or equal to Room temperature and less than the sintering temperature of the background material, and wherein the polymeric, polymerizable and / or monomeric organic compound further has a desorption temperature which is greater than the flow temperature and less than or equal to the sintering temperature of the background material.
  • a flow temperature can be understood to mean, in particular, a specific temperature or a temperature range from which the polymeric, polymerizable and / or monomeric organic compound is flowable and thus flowable, ie can be removed automatically from the joining zone by a flow process.
  • a flow temperature in particular a melting temperature or a melting range or a glass transition temperature or
  • the starting material such as the polymeric, polymerizable and / or monomeric organic compound, or another excipient, such as a solvent, may have suitable tackiness that allows the starting material to adhere to the mating partners. This allows a particularly good applicability, since the starting material, once arranged, can safely remain there.
  • an adhesion force or tackiness can be obtained at temperatures below the flow temperature, ie, purely by way of example, at temperatures in a range of less than or equal to 100 ° C.
  • polymeric, polymerizable and / or monomeric organic compound can serve to prevent cold welding of the particles and also to allow shaping of the film material.
  • this starting material is arranged according to method step b) between two components to be connected. This can
  • the starting material can be arranged, for example, between a substrate and an electronic component to be mounted on the substrate.
  • a further step is carried out to heat the starting material to a temperature Tl which is greater than or equal to
  • Flow temperature of the polymeric, polymerizable and / or monomeric organic compound and smaller than the desorption temperature of the polymeric, polymerizable and / or monomeric organic compound is for a time tl.
  • connecting components adheres and thus already forms an arrangement that already has a good stability for the further sintering process.
  • Starting material is placed at a desired position, and further remains there. As a result, specially defined products can be obtained.
  • the starting material in particular stable forces, can be held in its position by raising the temperature above the flow temperature of the polymerizable polymerizable and / or monomeric organic compound.
  • an additional fixation medium is not necessary, which can make the method described above particularly simple and inexpensive.
  • the starting material clings to the components to be connected and otherwise by a particular reversible softening of the polymeric
  • Connection is removed by a fluidity of the joining zone. This can be achieved that it at a subsequent distance
  • the gas transport is limited by the density of the joining material and thus, for example, in a production of a tight connection, the material is pressed by mechanical pressure and thus just inhibits the gas transport.
  • the time duration t 1, for which the temperature T 1 is maintained can be selected depending on the actual starting material used.
  • the period of time should be long enough for sufficient flowability of the polymeric, polymerizable and / or monomeric organic compound to be realized, and for the aforementioned advantages to be achieved in a particularly advantageous manner.
  • step d) in a method described above, the starting material is heated to a temperature T2 is greater than or equal to the sintering temperature of the sinterable particles,
  • the chemically stabilized particles for example, are burnt out until the bonding temperature or sintering temperature is reached, so that the particles or released metal atoms come into direct contact with one another and with the material of the joining partners.
  • a high-temperature-stable compound then forms even at low temperatures.
  • the starting material is heated alone or together with at least one joining region of the components to be connected to a temperature T2, for example by a heating source or electromagnetic radiation.
  • the temperature T2 is greater than or equal to the sintering temperature of the sinterable particles, ie the particles, comprising at least one metal or at least one metal compound.
  • the temperature T2 is maintained for a predetermined period t2, which is sufficient that a stable
  • the polymeric, polymerizable and / or monomeric organic compound furthermore has a desorption temperature, that is to say a specific desorption temperature or a broad desorption temperature, that is to say a desorption range which is greater than the flow temperature and less than or equal to the sintering temperature, can be the stability of the trained sintered compound can be further increased.
  • the polymeric, polymerizable and / or monomeric organic compound is both sinterable
  • the method described above in particular allows a particularly simple and defined production of a sintered connection between two components to be connected, wherein the formed
  • sintered compound can be particularly stable.
  • the desorption temperature can be any suitable substance. In an embodiment, the desorption temperature can be any suitable substance.
  • Boiling temperature, decomposition temperature or a reaction temperature of the polymer, polymerizable and / or monomeric organic compound with the sinterable and / or with sintered particles can be advantageously ensured that in the
  • Process step d) the polymeric, polymerizable and / or monomeric organic compound can be removed completely or without residue and the polymeric, polymerizable and / or monomeric organic compound thus does not adversely affect the stability of the sintered compound.
  • the fact that at least a certain proportion or advantageously a large part of the polymeric, polymerizable and / or monomeric organic compound is no longer disposed in the immediate joining zone during process step d), can also by evaporation, decomposition or combustion or Abreagieren, such as Oxidizing by a constituent of the sintered material, which in particular arranged outside the joining zone polymer, polymerizable and / or monomeric organic compound is not in the risk that a significant gas generation adversely affects the sintering process.
  • the proportion of the polymer, polymerizable and / or monomeric organic compound still in the joining zone can be so low in particular that no significant gas transport takes place, which adversely affects the forming sintered compound or the stability of the formed sintered connection.
  • a removal by the abovementioned processes can be possible without any problems here, or it may also be possible for the polymeric, polymerizable and / or monomeric organic compound in the joining zone to remain in place without negatively influencing the sintering process.
  • the sinterable particles silver, gold, platinum, palladium and / or copper, an organic metal compound, in particular silver carbonate, silver lactate or silver stearate, a metal oxide, in particular silver oxide, or a mixture comprising one or more of the aforementioned substances.
  • an organic metal compound in particular silver carbonate, silver lactate or silver stearate, a metal oxide, in particular silver oxide, or a mixture comprising one or more of the aforementioned substances.
  • Such particles may be particularly advantageous, a highly stable and electrically conductive
  • both the pure metals and corresponding metal compounds can be provided.
  • the metals can allow directly by a heat input or an entry of pressure in particular a cohesive connection between the joining partners, thereby enabling a stable sintered connection.
  • these can be used in a
  • Temperature treatment of the starting material for example in a range of less than 300 ° C, decompose to form the elemental metal and form the sintered bond.
  • contacting can already take place with low contact pressures of the contacting partners, which is thus mild
  • the polymeric, polymerizable and / or monomeric organic compound may be a polyolefin, in particular comprising polyethylene and / or polypropylene, a polyethylene copolymer
  • Polyketone or a mixture comprising one or more of the aforementioned substances may have the advantage that they can be easily integrated into a sintering process with regard to their flow temperature or their desorption behavior, in particular in combination with the aforementioned background materials, ie in particular metals or metal compounds.
  • the above-mentioned polymeric, polymerizable and / or monomeric organic compounds may be particularly advantageously suitable for receiving the background material and furthermore being removed substantially without residue by desorption from a component to be joined.
  • the above-mentioned polymeric, polymerizable and / or monomeric organic compounds are stable under ambient conditions, ie also in an oxidative atmosphere and / or in a humid atmosphere, so that a particularly advantageous storage life can also be achieved over a long period of time for the starting material.
  • the polymeric, polymerizable and / or monomeric organic compound can form a matrix in which the sinterable particles are embedded, or the polymeric, polymerizable and / or monomeric organic compound can be present as a coating on the sinterable particles.
  • a shaped body can thus be produced which can be adaptable in all dimensions to the desired field of application.
  • a body in its length, width and height can be adapted to the components to be joined.
  • the method can be further facilitated and also made more cost-effective.
  • a mutually adhering moldable mass can be produced, which can be handled particularly well.
  • such a starting material can be produced approximately by melting the polymer, polymerizable and / or monomeric organic compound with subsequent mixing with the background material and a final cooling.
  • the proportion of the polymeric, polymerizable and / or monomeric organic compound can be kept particularly low, so that the mass emerging from the joining region when the temperature rises above the flow temperature of the polymeric, polymerizable and / or monomeric organic compound can be kept particularly low ,
  • the coating of the particles can be applied already in the production of the particles, in particular in order to prevent a reaction of the sinterable particles with one another, such as a cold welding.
  • the metal particles which are produced, for example, as silver particles, by a vapor deposition or precipitation in a solvent, can be coated by the solution
  • Coating material for example as a surface-active material having. After removal of the solvent, for example, which can be handled as a powder starting materials comprising the sinterable particles with the in particular chemically or physically bound coating can be obtained.
  • the starting material can now powder or as a compact from the powder or as a paste with a solvent on basically known methods, such as placing the powder
  • the viscosity of the polymer, polymerizable and / or monomeric organic compound can be adjusted via a temperature control, so that the viscosity can be controlled by a temperature setting and thereby increase the temperature can cause the compound in particular by capillary forces removed from the joint and in another
  • Process step can be completely removed or desorbed.
  • the starting material can be applied to at least one component to be joined by printing, doctoring or dispensing. These are particularly simple and sophisticated processes for applying the starting material to at least one of the components to be joined. In these embodiments, a particularly precise and highly accurate arrangement of the starting material is possible, which can allow highly stable sintered connections even in small-sized components. In this case, the starting material can be applied to only one of the components to be connected, or to use both on the output components.
  • the starting material may comprise a transfer layer which is arranged between at least two protective layers, in particular comprising a polymeric, polymerizable and / or monomeric organic compound.
  • the transfer layer may comprise the background material or the sinterable particles and optionally the polymeric, polymerizable and / or monomeric organic compound.
  • the polymeric, polymerizable and / or monomeric organic compound of the transfer layer may be the same compound as the compound of the protective layers.
  • the polymeric, polymerizable and / or monomeric organic compound of the transfer layer may be the same compound as the compound of the protective layers.
  • the polymeric, polymerizable and / or monomeric organic compound of the transfer layer may be the same compound as the compound of the protective layers.
  • Coating or as a matrix can be omitted, so that the sinterable particles are surrounded only by the protective layers comprising a polymeric, polymerizable and / or monomeric organic compound.
  • the starting material can be particularly easy to handle and still be arranged very precisely at the desired location.
  • the transfer layer is particularly well protected against external influences and thus particularly storable. In this case, arranging the starting material on one of the to be joined
  • Components can be realized by way of example and not limitation such that the protective layers are removed before or during method step b).
  • a protective layer can be removed and the exposed side of the transfer layer can be arranged on the component, and subsequently the further protective layer can be removed.
  • Starting material in particular have a transfer layer which is surrounded on two opposite sides of the protective layer.
  • the protective layers can furthermore be designed such that essentially the entire transfer layer is surrounded by protective layers. This can be achieved by providing more than two protective layers as well as by a corresponding shape of the at least two protective layers.
  • Polyethylene terephthalate have.
  • polyethylene terephthalate can serve as a stable protective layer to safely protect the transfer layer from external influences such as mechanical influences.
  • it is inert to the materials occurring in the transfer layer, so that even over a longer period of storage no negative influence the transfer layer is to be expected.
  • polyethylene terephthalate can serve as a stable protective layer to safely protect the transfer layer from external influences such as mechanical influences.
  • it is inert to the materials occurring in the transfer layer, so that even over a longer period of storage no negative influence the transfer layer is to be expected.
  • the starting material may be provided in the form of a paste, a powder, a granulate or a film.
  • Such forms of the starting material can be handled easily, inexpensively and with known methods, so that the method can be particularly simple and inexpensive, especially in these embodiments.
  • storage without hesitation is possible, so that the advantages in terms of production in advance and an application or provision immediately before the process can be easily possible.
  • the polymeric, polymerizable and / or monomeric organic compound may be added during or after
  • Process step c) are derived or removed.
  • the effect basically occurring by a flowability of the polymer, polymerizable and / or monomeric organic compound, according to which the compound from the joint zone already occurs by flowing away, can be further enhanced or supported.
  • polymeric, polymerizable and / or monomeric organic compound for example, one or a
  • a plurality of collecting containers such as cavities, be provided, in which the flowable compound derived, so can be performed.
  • channels may be provided, which are arranged such that flows into the compound in a flowable state, or the collecting container may itself be arranged directly so that the flowable
  • the collecting container can be arranged approximately immediately adjacent to the components to be joined and the channels extend approximately into the joining region.
  • the flowable compound can be taken up and removed, for example, by means of a suitable device.
  • a suitable device for example, spongy devices or capillary bundles can be used, which absorb the compound by means of capillary forces or can suck. This can cause a particularly gentle removal of the compound and not adversely affect the sintering process.
  • the polymeric, polymerizable and / or monomeric organic compound may comprise at least one additive which is compatible with the sinterable particles, in particular with the organic
  • Metal compound reacting with reduction of the sintering temperature.
  • a particularly gentle method can be made possible, since even low temperatures can be sufficient for a sintering process.
  • such components can be connected to each other, which should not be exposed to high temperatures.
  • polymeric, polymerizable and / or monomeric organic compounds may also be used which have a relatively low desorption temperature, which may increase the selection of such compounds also with respect to conventional polymers, for example.
  • oxidizable organic compounds such as fatty acids, for example stearic acid or lauric acid, in particular in combination with the aforementioned background materials, such as silver.
  • a sintered connection can be produced which has an electrical conductivity of greater than or equal to 30 MS / m to, in particular, less than or equal to 45 MS / m, in particular greater than or equal to 36 MS / m to in particular less than or equal to 44 MS / m, and / or a sintered compound can be produced which has a thermal conductivity of greater than or equal to 200 W / mK to less than or equal to 300 W / m K, in particular greater than or equal to 220 W / mK to less than or equal to 275 W. / mK.
  • one of the components to be connected may be an electronic component and, as another of the components to be connected, a substrate, for example comprising one
  • Copper compound can be used.
  • electronic components can be applied to the corresponding substrates.
  • a very stable compound which is additionally electrically conductive is useful. Therefore, it is particularly advantageous in this embodiment that the
  • Component is attached to a substrate by a sintering process.
  • power semiconductors or integrated circuits can be attached to the substrate as electronic components by the sintered connection.
  • the method described above can be used in components to be joined, which only a small
  • Embodiment silicon chips or silicon carbide components which Temperatures of 250 ° C or 350 ° C, for example, can be easily added, such as the so-called "The Attach".
  • this embodiment thus comprises a use of the above-described method in the field of electronic construction technology or connection technology, in particular as a low-temperature sintering technique.
  • diffusion soldering or active soldering can be replaced by the method described above.
  • Fig. La-c is a schematic representation of a preparation of a
  • Fig. 2a-c is a schematic representation of a method according to the invention using a starting material according to Figure 1;
  • Fig. 3a-c is a schematic representation of a method according to the invention using a further embodiment of a starting material
  • FIG. 1 c shows a starting material 10 for a method according to the invention for connecting at least two components using a sintering process.
  • the starting material 10 of a sintered connection in the embodiment according to FIG. 1c comprises sinterable particles 12, comprising at least one metal or at least one metal compound.
  • the starting material 10 comprises at least one polymeric, polymerizable and / or monomeric organic compound 14, which is arranged according to FIG. 1 as a coating on the sinterable particles 12.
  • the sinterable particles 12 or the polymeric, polymerizable and / or monomeric organic compound 14 are chosen such that the polymeric, polymerizable and / or monomeric organic compound 14 has a flow temperature which is greater than or equal to the room temperature, ie greater or equal to the invention is equal to 22 ° C, and is less than the sintering temperature of the sinterable particles, and wherein the polymeric, polymerizable and / or monomeric organic
  • Compound 14 further has a desorption temperature that is greater than the flow temperature and less than or equal to the sintering temperature.
  • a sinterable particle 12 is shown, which was produced in a solvent 16.
  • the sinterable particle 12 may be, for example, a silver particle.
  • a coating of a polymeric is further shown on the sinterable particles 12, a coating of a polymeric,
  • polymerizable and / or monomeric organic compound 14 is arranged. This can be produced by adding the polymeric, polymerizable and / or monomeric organic compound 14 to the solvent 16, for example, dissolved or dispersed.
  • solvent 16 for example, dissolved or dispersed.
  • Rosin resin which can serve as a flux find use.
  • this has the advantage that it is soft and sticky at slightly elevated temperatures of well below 100.degree. C., but volatilizes almost without residue with decomposition in the further process control and can be produced as a preform at 25.degree.
  • the finished starting material 10 is shown by evaporation of the solvent.
  • Such a starting material 10 can be arranged directly between two components 18, 20 to be connected, as shown in FIG. 2a.
  • the starting material 10 can be applied to at least one component 20 to be joined by printing, doctoring or dispensing
  • the component 20 may be a substrate, whereas component 18 may be an electronic device, such as a power semiconductor device.
  • FIG. 2b shows a first temperature treatment step.
  • FIG. 2 shows a state after a method step comprising heating the starting material 10 to a temperature T 1 which is greater than or equal to the flow temperature of the polymerizable, polymerizable and / or monomeric organic compound 14 and less than that
  • Desorption of the polymer, polymerizable and / or monomeric organic compound 14 is for a time tl.
  • a portion of the polymeric, polymerizable and / or monomeric organic compound 14 is removed from the joint zone and rests on the component 20 or wets the surface of the component 20.
  • the polymeric, polymerizable and / or monomeric organic compound 14 can be removed or removed during or after this process step of the first heat treatment.
  • FIG. 2 c further shows a formed sintered connection 22 of the two components 18, 20.
  • a sintered connection 22 is formed by sintered sinterable particles 12 by a further method step comprising heating the starting material 10 to a temperature T2 which is greater than or equal to the sintering temperature of the sinterable particles 10, optionally under the influence of a sintering pressure, for a temperature t2 under formation a sintered connection 22.
  • the sintered connection 22 can,
  • an electrical conductivity of greater than or equal to 30 MS / m to in particular less than or equal to 45 MS / m, in particular greater than or equal to 36 MS / m to, in particular less than or equal to 44 MS / m have, and / or may have a thermal conductivity of greater than or equal to 200 W / mK to less than or equal to 300 W / m K, in particular from greater than or equal to 220 W / mK to less than or equal to 275 W / m K.
  • sintering may take place by way of example at a sintering pressure of less than or equal to 10 MPa, for example less than or equal to 1 MPa and / or at a sintering temperature in a range of less than or equal to 300 ° C, for example less than or equal to 250 ° C.
  • a sintering pressure of less than or equal to 10 MPa, for example less than or equal to 1 MPa and / or at a sintering temperature in a range of less than or equal to 300 ° C, for example less than or equal to 250 ° C.
  • the polymeric, polymerizable and / or monomeric organic compound 14 forms a matrix in which the sinterable particles 12 are embedded.
  • the polymeric, polymerizable and / or monomeric organic compound 14 is arranged together with the sinterable particles 12 in a transfer layer 24, for example as an adhesive film.
  • Transfer layer 24 is arranged between at least two protective layers 26, 28, in particular comprising a polymeric, polymerizable and / or monomeric organic compound 30.
  • a protective layer 28 may first be removed and the starting material 10 transferred to the first component 20. After removal of the second protective layer 26, respectively, of all protective layers still present, the second component 18 is correspondingly deposited on the starting material 10 or on the
  • Transfer layer 14 is positioned.
  • the starting material 10 is spoken although at least partially only a part of the starting material is present, which may be included within the meaning of the invention of starting material 10. This condition is shown in FIG. 3b.
  • first temperature treatment in which the polymeric, polymerizable and / or monomeric organic compound 14 melts and can become tacky, for example.
  • the polymeric, polymerizable and / or monomeric organic compound 14 may be removed, and further, by the elevated temperature, the sintered sinterable particles form a sintered bond 22, as shown in FIG. 3c.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Powder Metallurgy (AREA)

Abstract

La présente invention concerne des procédés destinés à relier au moins deux composants (18, 20) en mettant en œuvre un processus de frittage. Pour perfectionner le processus de frittage, le procédé comprend les étapes consistant à : fournir un matériau de départ (10) d'un composé fritté (22), ledit matériau comprenant des particules (12) aptes au frittage et comportant au moins un métal ou au moins un composé métallique, et au moins un composé organique (14) polymère, polymérisable et/ou monomère, le composé organique (14) polymère, polymérisable et/ou monomère présentant une température de fluage supérieure ou égale à la température ambiante et inférieure à la température de frittage, et le composé organique (14) polymère, polymérisable et/ou monomère présentant en outre une température de désorption supérieure à la température de fluage et inférieure ou égale à la température de frittage; b) disposer le matériau de départ (10) entre deux composants (18, 20) destinés à être reliés; c) chauffer le matériau de départ (10), pendant un temps (t1), à une température (T1) qui est supérieure ou égale à la température de fluage du composé organique (14) polymère, polymérisable et/ou monomère et qui est inférieure à la température de désorption du composé organique (14) polymère, polymérisable et/ou monomère; et d) chauffer le matériau de départ (10), pendant un temps (t2) et le cas échéant un exerçant une pression de frittage, à une température (T2) supérieure ou égale à la température de frittage des particules (12) frittables, pour ainsi former un composé fritté (22).
EP13773796.1A 2012-12-06 2013-10-09 Procédés destinés à relier au moins deux composants en mettant en uvre un processus de frittage Ceased EP2928630A1 (fr)

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DE102012222416.5A DE102012222416A1 (de) 2012-12-06 2012-12-06 Verfahren zum Verbinden von wenigstens zwei Komponenten unter Verwendung eines Sinterprozesses
PCT/EP2013/070991 WO2014086519A1 (fr) 2012-12-06 2013-10-09 Procédés destinés à relier au moins deux composants en mettant en œuvre un processus de frittage

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US10104759B2 (en) * 2016-11-29 2018-10-16 Nxp Usa, Inc. Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereof
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US20150306669A1 (en) 2015-10-29

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