EP3116009B1 - Procédé pour la fabrication d'un contact électrique - Google Patents

Procédé pour la fabrication d'un contact électrique Download PDF

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Publication number
EP3116009B1
EP3116009B1 EP15175612.9A EP15175612A EP3116009B1 EP 3116009 B1 EP3116009 B1 EP 3116009B1 EP 15175612 A EP15175612 A EP 15175612A EP 3116009 B1 EP3116009 B1 EP 3116009B1
Authority
EP
European Patent Office
Prior art keywords
contact
layer
carrier
electrical switching
silver
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP15175612.9A
Other languages
German (de)
English (en)
Other versions
EP3116009A1 (fr
Inventor
Heinz WÖLLMER
Karl-Heinz Schaller
Heinz Speil
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to EP15175612.9A priority Critical patent/EP3116009B1/fr
Priority to US15/741,858 priority patent/US20180197695A1/en
Priority to PCT/EP2016/061279 priority patent/WO2017005401A1/fr
Priority to BR112018000173-2A priority patent/BR112018000173A2/pt
Priority to CN201680039681.XA priority patent/CN107851529B/zh
Publication of EP3116009A1 publication Critical patent/EP3116009A1/fr
Application granted granted Critical
Publication of EP3116009B1 publication Critical patent/EP3116009B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
    • H01H11/041—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
    • H01H11/048—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by powder-metallurgical processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
    • H01H11/041—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion
    • H01H11/045—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion with the help of an intermediate layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
    • H01H11/06—Fixing of contacts to carrier ; Fixing of contacts to insulating carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/25—Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru
    • B22F2301/255—Silver or gold
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2201/00—Contacts
    • H01H2201/022—Material
    • H01H2201/024—Material precious

Definitions

  • the invention relates to a method for producing an electrical switch contact.
  • the switching contact comprises a contact carrier and a contact pad, which has a contact material.
  • Switching contacts consist essentially of a contact carrier and at least one contact piece.
  • the contact piece is subject to high demands regarding the material properties.
  • the requirements include, for example, a low contact resistance and a high arc erosion resistance.
  • Contact carriers and contact pieces are usually connected by soldering and / or welding and / or riveting and / or screwing and / or shrinking or by combining these methods.
  • the disadvantage here is the high production costs for producing a complete switching contact.
  • the contact pieces consist of contact pads made of highly silver-containing materials that are bonded to carrier materials. Due to their function and manufacture, the contact pieces consist of a wear layer of contact material, a pure silver layer, which acts as a ductile buffer, a solder layer and the carrier material.
  • Essential steps in the production of contact pieces are the production of the contact material, the application of the pure silver layer, the application of a solder layer and the soldering of the contact pads on the support.
  • the pure silver layer is applied by compound extrusion, rolling or by sintering the contact material.
  • the solder layer is produced by plating or possigbelotung.
  • the brazing is done by brazing at temperatures above 600 ° C.
  • the DE 3304637 A1 discloses a sintered contact material for low-voltage switching devices made of AgSnO2 with at least two further metal oxide additives, wherein as further metal oxides Bi203, CuO and optionally CdO are provided.
  • the production process of the sintered contact material is based on a coordinated mixture of these compounds, wherein from the dried powder mixture, a molding is compacted.
  • it is provided to compress the contact layer produced with a second powder layer, for example of pure silver to form a two-layer compact.
  • the disadvantages of the known from the prior art manufacturing method for electrical switching contacts consist on the one hand in the complex process flow and on the other hand in the high process temperature.
  • the object of the present invention is to provide a method with reduced process complexity for producing an electrical switch contact.
  • the object of the present invention is achieved by a method for producing an electrical switching contact with a contact carrier and a contact pad with a contact material, wherein the contact material is connected to the contact carrier via a sinterable layer between the contact material and the contact carrier.
  • a separate solder layer is therefore no longer required.
  • the contact material is sintered over a Layer, in particular a silver layer connected to the carrier.
  • the process consists of applying a layer of sinterable material between the contact support and the carrier, followed by sintering of the structure under the action of pressure and temperature.
  • the invention provides that the sintering process is carried out in a temperature range of 250 to 300 ° C. This temperature range is well below the temperatures achieved in brazing.
  • the inventive method may also provide that the sintering process is carried out in a pressure range of 0 to 30 MPa.
  • the electrical switching contact has a contact carrier and a contact pad, wherein the contact pad includes a contact material which is separated from the contact carrier via a sinterable layer, in particular a silver layer.
  • the sinterable layer is thus arranged between the contact material and the contact carrier.
  • the usual solder layer between the contact carrier and a silver layer is thus omitted.
  • the electrical switching contact is characterized by a simplified layer structure, since the solder layer is no longer necessary. This reduces the process flow to the effect that the application of the sinterable layer can be used simultaneously as a connection process with the carrier. It is also advantageous that the total amount of silver used can be reduced by reducing the layer thicknesses.
  • the process can run at significantly lower temperatures than welding or brazing. The lower heat input into the component leads to a lower material hardening of the carrier.
  • the compound layer also has a higher electrical conductivity than a comparable solder layer. It concludes that the cleaning process of the parts is reduced after the bonding process.
  • Fig. 1 shows an electrical switching contact with a contact carrier 1, on which a contact pad 2 is arranged on the upper side.
  • the contact carrier 1 is formed from a contact carrier material.
  • the contact pad 2 comprises three layers, a silver solder layer 3, a silver layer 4 and a layer of contact material 5.
  • the silver solder layer 3 is formed directly on the upper side of the contact carrier 1.
  • the silver layer 4 is formed, on which the contact material 5 is finally applied.
  • Fig. 3 shows the structure of an electrical switch contact.
  • a sinterable layer 6 is arranged on the upper side of the contact carrier 1.
  • the sinterable layer 6 is preferably a powdered silver layer.
  • Fig. 4 the sintering process according to the invention for an electrical switching contact is shown.
  • the contact carrier 1 including the contact pad 2, which is composed of the sinterable layer 6 and the contact material 5, are positioned between two tools 7 which press from above or from below by means of pressure 8 on the component of contact carrier 1 and contact pad 2.
  • heat is introduced into the component 9, for example in the form of a stamp.
  • Fig. 5 is shown the direct resistance heating by current flow in the electrical contact.
  • the current flows directly through the component, which is composed of a contact carrier 1 and a contact pad 2.
  • Fig. 6 shows the indirect resistance heating, in which the current flow flows indirectly through the component of contact carrier 1 and the contact pad 2.
  • Fig. 7 the inductive heating is shown by a magnetic field in the contact carrier 1 and the contact pad 2.
  • the electrical switching contact is characterized by a simplified layer structure, since the solder layer is no longer necessary. This reduces the process flow to the effect that the application of the sinterable layer can be used simultaneously as a connection process with the carrier. It is also advantageous that the total amount of silver used can be reduced by reducing the layer thicknesses.
  • the process can run at significantly lower temperatures than welding or brazing. The lower heat input into the component leads to a lower material hardening of the carrier.
  • the compound layer also has a higher electrical conductivity than a comparable solder layer. It concludes that the cleaning process of the parts is reduced after the bonding process.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Contacts (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Switches (AREA)

Claims (3)

  1. Procédé pour la fabrication d'un contact de commutation électrique comportant un support de contact (1) et un appui de contact (2) avec un matériau de contact (5), le matériau de contact (5) étant relié au support de contact (1) par une couche frittable (6) entre le matériau de contact (5) et le support de contact (1), caractérisé en ce que le processus de frittage est exécuté dans une plage de température de 250 à 300 °C.
  2. Procédé selon la revendication 1, caractérisé en ce que la production de chaleur est effectuée, dans le contact de commutation électrique, par soudage par résistance et/ou brasage par induction et/ou soudage aux ultrasons et/ou au moyen d'un piston de chauffage et/ou au moyen de gaz chaud et/ou au moyen de chaleur rayonnante ou d'une combinaison de ces procédés d'apport de chaleur.
  3. Procédé selon l'une des revendications 1 ou 2, caractérisé en ce que le processus de frittage est effectué dans une plage de pression de 0 à 30 MPa.
EP15175612.9A 2015-07-07 2015-07-07 Procédé pour la fabrication d'un contact électrique Active EP3116009B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
EP15175612.9A EP3116009B1 (fr) 2015-07-07 2015-07-07 Procédé pour la fabrication d'un contact électrique
US15/741,858 US20180197695A1 (en) 2015-07-07 2016-05-19 Electrical switching contact
PCT/EP2016/061279 WO2017005401A1 (fr) 2015-07-07 2016-05-19 Contact de commutation électrique
BR112018000173-2A BR112018000173A2 (pt) 2015-07-07 2016-05-19 ?contato de comutação elétrico, método para fabricação de um contato de comutação elétrico, e, aparelho de comutação?
CN201680039681.XA CN107851529B (zh) 2015-07-07 2016-05-19 电开关触点

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP15175612.9A EP3116009B1 (fr) 2015-07-07 2015-07-07 Procédé pour la fabrication d'un contact électrique

Publications (2)

Publication Number Publication Date
EP3116009A1 EP3116009A1 (fr) 2017-01-11
EP3116009B1 true EP3116009B1 (fr) 2019-08-28

Family

ID=53514107

Family Applications (1)

Application Number Title Priority Date Filing Date
EP15175612.9A Active EP3116009B1 (fr) 2015-07-07 2015-07-07 Procédé pour la fabrication d'un contact électrique

Country Status (5)

Country Link
US (1) US20180197695A1 (fr)
EP (1) EP3116009B1 (fr)
CN (1) CN107851529B (fr)
BR (1) BR112018000173A2 (fr)
WO (1) WO2017005401A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10241972B2 (en) 2017-03-16 2019-03-26 International Business Machines Corporation Matrix multiplication on a systolic array
US11347517B2 (en) 2019-06-20 2022-05-31 International Business Machines Corporation Reduced precision based programmable and SIMD dataflow architecture
CN112768279B (zh) * 2020-12-30 2024-01-02 浙江福达合金材料科技有限公司 电触头组件的一种制造装置
DE102022200192A1 (de) * 2022-01-11 2023-07-13 Siemens Aktiengesellschaft Kontaktträger, Kontaktträgeranordnung und Niederspannungs-Schutzschaltgerät

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015068853A1 (fr) * 2013-11-11 2015-05-14 新日鐵住金株式会社 Structure de liaison métallique, procédé de liaison métallique et matériau de liaison métallique utilisant des nanoparticules métalliques

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB991433A (en) * 1961-09-23 1965-05-05 Siemens Ag A three-layer electric contact body and a process for the production thereof
DE1209223B (de) * 1961-09-26 1966-01-20 Siemens Ag Sinterkontaktkoerper mit zwei oder mehreren Schichten
DE2718975C3 (de) * 1977-04-28 1981-11-26 SIEMENS AG AAAAA, 1000 Berlin und 8000 München Verfahren zur Herstellung einer Kontaktbrücke
DE3304637A1 (de) * 1983-02-10 1984-08-16 Siemens AG, 1000 Berlin und 8000 München Sinterkontaktwerkstoff fuer niederspannungsschaltgeraete
CN100481292C (zh) * 2007-01-24 2009-04-22 西安理工大学 一种连接钨铜合金与铜尾整体电触头的制备方法
FR2933541B1 (fr) * 2008-07-07 2016-03-25 Schneider Electric Ind Sas Procede d'assemblage par resistance d'un materiau de contact sur un support metallique, contact electrique realise par un tel procede et pastille de contact utilisee
DE102012222416A1 (de) * 2012-12-06 2014-06-12 Robert Bosch Gmbh Verfahren zum Verbinden von wenigstens zwei Komponenten unter Verwendung eines Sinterprozesses

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015068853A1 (fr) * 2013-11-11 2015-05-14 新日鐵住金株式会社 Structure de liaison métallique, procédé de liaison métallique et matériau de liaison métallique utilisant des nanoparticules métalliques
EP3069811A1 (fr) * 2013-11-11 2016-09-21 Nippon Steel & Sumitomo Metal Corporation Structure de liaison métallique, procédé de liaison métallique et matériau de liaison métallique utilisant des nanoparticules métalliques

Also Published As

Publication number Publication date
CN107851529B (zh) 2020-07-28
CN107851529A (zh) 2018-03-27
US20180197695A1 (en) 2018-07-12
BR112018000173A2 (pt) 2018-09-11
EP3116009A1 (fr) 2017-01-11
WO2017005401A1 (fr) 2017-01-12

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