EP3116009B1 - Process for making an electric switch contact - Google Patents

Process for making an electric switch contact Download PDF

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Publication number
EP3116009B1
EP3116009B1 EP15175612.9A EP15175612A EP3116009B1 EP 3116009 B1 EP3116009 B1 EP 3116009B1 EP 15175612 A EP15175612 A EP 15175612A EP 3116009 B1 EP3116009 B1 EP 3116009B1
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EP
European Patent Office
Prior art keywords
contact
layer
carrier
electrical switching
silver
Prior art date
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Application number
EP15175612.9A
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German (de)
French (fr)
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EP3116009A1 (en
Inventor
Heinz WÖLLMER
Karl-Heinz Schaller
Heinz Speil
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Siemens AG
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Siemens AG
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Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to EP15175612.9A priority Critical patent/EP3116009B1/en
Priority to US15/741,858 priority patent/US20180197695A1/en
Priority to CN201680039681.XA priority patent/CN107851529B/en
Priority to PCT/EP2016/061279 priority patent/WO2017005401A1/en
Priority to BR112018000173-2A priority patent/BR112018000173A2/en
Publication of EP3116009A1 publication Critical patent/EP3116009A1/en
Application granted granted Critical
Publication of EP3116009B1 publication Critical patent/EP3116009B1/en
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Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
    • H01H11/041—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
    • H01H11/048—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by powder-metallurgical processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
    • H01H11/041—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion
    • H01H11/045—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion with the help of an intermediate layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
    • H01H11/06—Fixing of contacts to carrier ; Fixing of contacts to insulating carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/25—Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru
    • B22F2301/255—Silver or gold
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2201/00—Contacts
    • H01H2201/022—Material
    • H01H2201/024—Material precious

Definitions

  • the invention relates to a method for producing an electrical switch contact.
  • the switching contact comprises a contact carrier and a contact pad, which has a contact material.
  • Switching contacts consist essentially of a contact carrier and at least one contact piece.
  • the contact piece is subject to high demands regarding the material properties.
  • the requirements include, for example, a low contact resistance and a high arc erosion resistance.
  • Contact carriers and contact pieces are usually connected by soldering and / or welding and / or riveting and / or screwing and / or shrinking or by combining these methods.
  • the disadvantage here is the high production costs for producing a complete switching contact.
  • the contact pieces consist of contact pads made of highly silver-containing materials that are bonded to carrier materials. Due to their function and manufacture, the contact pieces consist of a wear layer of contact material, a pure silver layer, which acts as a ductile buffer, a solder layer and the carrier material.
  • Essential steps in the production of contact pieces are the production of the contact material, the application of the pure silver layer, the application of a solder layer and the soldering of the contact pads on the support.
  • the pure silver layer is applied by compound extrusion, rolling or by sintering the contact material.
  • the solder layer is produced by plating or possigbelotung.
  • the brazing is done by brazing at temperatures above 600 ° C.
  • the DE 3304637 A1 discloses a sintered contact material for low-voltage switching devices made of AgSnO2 with at least two further metal oxide additives, wherein as further metal oxides Bi203, CuO and optionally CdO are provided.
  • the production process of the sintered contact material is based on a coordinated mixture of these compounds, wherein from the dried powder mixture, a molding is compacted.
  • it is provided to compress the contact layer produced with a second powder layer, for example of pure silver to form a two-layer compact.
  • the disadvantages of the known from the prior art manufacturing method for electrical switching contacts consist on the one hand in the complex process flow and on the other hand in the high process temperature.
  • the object of the present invention is to provide a method with reduced process complexity for producing an electrical switch contact.
  • the object of the present invention is achieved by a method for producing an electrical switching contact with a contact carrier and a contact pad with a contact material, wherein the contact material is connected to the contact carrier via a sinterable layer between the contact material and the contact carrier.
  • a separate solder layer is therefore no longer required.
  • the contact material is sintered over a Layer, in particular a silver layer connected to the carrier.
  • the process consists of applying a layer of sinterable material between the contact support and the carrier, followed by sintering of the structure under the action of pressure and temperature.
  • the invention provides that the sintering process is carried out in a temperature range of 250 to 300 ° C. This temperature range is well below the temperatures achieved in brazing.
  • the inventive method may also provide that the sintering process is carried out in a pressure range of 0 to 30 MPa.
  • the electrical switching contact has a contact carrier and a contact pad, wherein the contact pad includes a contact material which is separated from the contact carrier via a sinterable layer, in particular a silver layer.
  • the sinterable layer is thus arranged between the contact material and the contact carrier.
  • the usual solder layer between the contact carrier and a silver layer is thus omitted.
  • the electrical switching contact is characterized by a simplified layer structure, since the solder layer is no longer necessary. This reduces the process flow to the effect that the application of the sinterable layer can be used simultaneously as a connection process with the carrier. It is also advantageous that the total amount of silver used can be reduced by reducing the layer thicknesses.
  • the process can run at significantly lower temperatures than welding or brazing. The lower heat input into the component leads to a lower material hardening of the carrier.
  • the compound layer also has a higher electrical conductivity than a comparable solder layer. It concludes that the cleaning process of the parts is reduced after the bonding process.
  • Fig. 1 shows an electrical switching contact with a contact carrier 1, on which a contact pad 2 is arranged on the upper side.
  • the contact carrier 1 is formed from a contact carrier material.
  • the contact pad 2 comprises three layers, a silver solder layer 3, a silver layer 4 and a layer of contact material 5.
  • the silver solder layer 3 is formed directly on the upper side of the contact carrier 1.
  • the silver layer 4 is formed, on which the contact material 5 is finally applied.
  • Fig. 3 shows the structure of an electrical switch contact.
  • a sinterable layer 6 is arranged on the upper side of the contact carrier 1.
  • the sinterable layer 6 is preferably a powdered silver layer.
  • Fig. 4 the sintering process according to the invention for an electrical switching contact is shown.
  • the contact carrier 1 including the contact pad 2, which is composed of the sinterable layer 6 and the contact material 5, are positioned between two tools 7 which press from above or from below by means of pressure 8 on the component of contact carrier 1 and contact pad 2.
  • heat is introduced into the component 9, for example in the form of a stamp.
  • Fig. 5 is shown the direct resistance heating by current flow in the electrical contact.
  • the current flows directly through the component, which is composed of a contact carrier 1 and a contact pad 2.
  • Fig. 6 shows the indirect resistance heating, in which the current flow flows indirectly through the component of contact carrier 1 and the contact pad 2.
  • Fig. 7 the inductive heating is shown by a magnetic field in the contact carrier 1 and the contact pad 2.
  • the electrical switching contact is characterized by a simplified layer structure, since the solder layer is no longer necessary. This reduces the process flow to the effect that the application of the sinterable layer can be used simultaneously as a connection process with the carrier. It is also advantageous that the total amount of silver used can be reduced by reducing the layer thicknesses.
  • the process can run at significantly lower temperatures than welding or brazing. The lower heat input into the component leads to a lower material hardening of the carrier.
  • the compound layer also has a higher electrical conductivity than a comparable solder layer. It concludes that the cleaning process of the parts is reduced after the bonding process.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Contacts (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Switches (AREA)

Description

Die Erfindung betrifft ein Verfahren zur Herstellung eines elektrischen Schaltkontakts. Der Schaltkontakt umfasst einen Kontaktträger und eine Kontaktauflage, welche einen Kontaktwerkstoff aufweist.The invention relates to a method for producing an electrical switch contact. The switching contact comprises a contact carrier and a contact pad, which has a contact material.

Schaltkontakte bestehen im Wesentlichen aus einem Kontaktträger und wenigstens einem Kontaktstück. Das Kontaktstück unterliegt hohen Anforderungen bezüglich der Materialbeschaffenheit. Zu den Anforderungen gehören beispielsweise ein geringer Übergangswiderstand und eine hohe Lichtbogenabbrandfestigkeit. Kontaktträger und Kontaktstücke werden üblicher Weise durch Löten und/oder Schweißen und/oder Nieten und/oder Schrauben und/oder Schrumpfen oder durch Kombinieren dieser Verfahren verbunden. Nachteilig ist hierbei der hohe Fertigungsaufwand zum Herstellen eines kompletten Schaltkontaktes.Switching contacts consist essentially of a contact carrier and at least one contact piece. The contact piece is subject to high demands regarding the material properties. The requirements include, for example, a low contact resistance and a high arc erosion resistance. Contact carriers and contact pieces are usually connected by soldering and / or welding and / or riveting and / or screwing and / or shrinking or by combining these methods. The disadvantage here is the high production costs for producing a complete switching contact.

So müssen beispielsweise für einen doppelunterbrechenden Schaltkontakt mit zwei gegenüberliegenden Kontaktstücken fünf Komponenten miteinander verbunden werden, wobei ein hoher Aufwand zur Vermeidung von Lageabweichungen getrieben wird. Ebenso ist zu berücksichtigen, dass nicht alle gewünschten Materialkombinationen zwischen Kontaktträger und Kontaktstück geschweißt und/oder gelötet werden können.Thus, for example, for a double-breaking switching contact with two opposing contact pieces five components must be connected to each other, with a high effort to avoid positional deviations is driven. It should also be noted that not all desired combinations of materials between contact carrier and contact piece can be welded and / or soldered.

Elektrische Schaltstücke werden zum Öffnen und Schließen von Stromkreisen verwendet. Bei qualitativ anspruchsvollen Kontakten wie sie beispielsweise in Relais, Schaltschützen oder Leistungsschaltern der Niederspannungstechnik Anwendung finden, bestehen die Schaltstücke aus Kontaktauflagen aus hoch silberhaltigen Werkstoffen, die mit Trägerwerkstoffen verbunden sind. Funktions- und herstellungsbedingt bestehen die Schaltstücke aus einer Nutzschicht aus Kontaktwerkstoff, einer Reinsilberschicht, die als duktiler Puffer wirkt, einer Lotschicht und dem Trägerwerkstoff.Electrical contacts are used to open and close circuits. In the case of high-quality contacts, such as those used in relays, contactors or low-voltage circuit breakers, for example, the contact pieces consist of contact pads made of highly silver-containing materials that are bonded to carrier materials. Due to their function and manufacture, the contact pieces consist of a wear layer of contact material, a pure silver layer, which acts as a ductile buffer, a solder layer and the carrier material.

Wesentliche Schritte bei der Herstellung von Schaltstücken sind das Herstellen des Kontaktmaterials, das Aufbringen der Reinsilberschicht, das Aufbringen einer Lotschicht und das Löten der Kontaktauflagen auf den Träger. Die Reinsilberschicht wird durch Verbindungsstrangpressen, Walzplatieren oder im Sinterprozess des Kontaktmaterials aufgebracht. Die Lotschicht wird durch Platieren oder Flüssigbelotung erzeugt. Das Löten erfolgt dabei durch Hartlöten bei Temperaturen oberhalb von 600°C.Essential steps in the production of contact pieces are the production of the contact material, the application of the pure silver layer, the application of a solder layer and the soldering of the contact pads on the support. The pure silver layer is applied by compound extrusion, rolling or by sintering the contact material. The solder layer is produced by plating or Flüssigbelotung. The brazing is done by brazing at temperatures above 600 ° C.

Die DE 3304637 A1 offenbart einen Sinterkontaktwerkstoff für Niederspannungsschaltgeräte aus AgSnO2 mit mindestens zwei weiteren Metalloxidzusätzen, wobei als weitere Metalloxide Bi203, CuO und wahlweise CdO vorgesehen sind. Das Herstellungsverfahren des Sinterkontaktwerkstoffs geht von einer abgestimmten Mischung dieser Verbindungen aus, wobei aus der getrockneten Pulvermischung ein Formkörper verdichtet wird. Um eine optimierte Verbindung der Kontaktstücke mit einem Träger für zahlreiche Schaltspiele des Niederspannungsgeräts zu gewährleisten, ist es vorgesehen, die hergestellte Kontaktschicht mit einer zweiten Pulverschicht, z.B. aus Reinsilber zu einem Zweischichten-Presskörper zu verdichten. Die Nachteile der aus dem Stand der Technik bekannten Herstellungsverfahren für elektrische Schaltkontakte bestehen zum Einen im aufwändigen Prozessablauf und zum Anderen in der hohen Prozesstemperatur.The DE 3304637 A1 discloses a sintered contact material for low-voltage switching devices made of AgSnO2 with at least two further metal oxide additives, wherein as further metal oxides Bi203, CuO and optionally CdO are provided. The production process of the sintered contact material is based on a coordinated mixture of these compounds, wherein from the dried powder mixture, a molding is compacted. In order to ensure an optimized connection of the contact pieces with a carrier for numerous operations of the low-voltage device, it is provided to compress the contact layer produced with a second powder layer, for example of pure silver to form a two-layer compact. The disadvantages of the known from the prior art manufacturing method for electrical switching contacts consist on the one hand in the complex process flow and on the other hand in the high process temperature.

Demgemäß besteht die Aufgabe der vorliegenden Erfindung darin, ein Verfahren mit reduzierten Prozessaufwand zur Herstellung eines elektrischen Schaltkontakts anzugeben.Accordingly, the object of the present invention is to provide a method with reduced process complexity for producing an electrical switch contact.

Diese Aufgabe wird erfindungsgemäß durch ein Verfahren gemäß Patentanspruch 1 gelöst. Vorteilhafte Aus- und Weiterbildungen, welche einzeln oder in Kombination miteinander eingesetzt werden können, sind der Gegenstand der abhängigen Ansprüche.This object is achieved by a method according to claim 1. Advantageous training and further education, which individually or in combination can be used with each other, are the subject of the dependent claims.

Die erfindungsgemäße Aufgabe der vorliegenden Erfindung wird durch ein Verfahren zur Herstellung eines elektrischen Schaltkontaktes mit einem Kontaktträger und einer Kontaktauflage mit einem Kontaktwerkstoff gelöst, wobei der Kontaktwerkstoff mit dem Kontaktträger über eine sinterfähige Schicht zwischen dem Kontaktwerkstoff und dem Kontaktträger verbunden wird. Eine eigene Lotschicht ist somit nicht mehr erforderlich. Das Kontaktmaterial wird über eine gesinterte Schicht, insbesondere einer Silberschicht mit dem Träger verbunden. Der Prozessablauf besteht im Wesentlichen dabei durch Aufbringen einer Schicht aus sinterfähigem Material zwischen Kontaktauflage und Träger mit anschließendem Sintern des Aufbaus unter Einwirkung von Druck und Temperatur.The object of the present invention is achieved by a method for producing an electrical switching contact with a contact carrier and a contact pad with a contact material, wherein the contact material is connected to the contact carrier via a sinterable layer between the contact material and the contact carrier. A separate solder layer is therefore no longer required. The contact material is sintered over a Layer, in particular a silver layer connected to the carrier. Essentially, the process consists of applying a layer of sinterable material between the contact support and the carrier, followed by sintering of the structure under the action of pressure and temperature.

Es hat sich dabei als vorteilhaft erwiesen, dass die Wärmeerzeugung im elektrischen Schaltkontakt mittels Widerstandsschweißen und/oder Induktionslöten und/oder Ultraschallschweißen und/oder mittels Heizstempel und/oder mittels heißen Gases und/oder mittels Strahlungswärme oder einer Kombination dieser Verfahren zur Wärmeeinbringung durchgeführt wird.It has proved to be advantageous that the heat generation in the electrical switching contact by means of resistance welding and / or induction soldering and / or ultrasonic welding and / or by means of hot stamp and / or by means of hot gas and / or by means of radiant heat or a combination of these methods for heat input is performed.

Die Erfindung sieht vor, dass der Sinterprozess in einem Temperaturbereich von 250 bis 300°C durchgeführt wird. Dieser Temperaturbereich liegt deutlich unterhalb der Temperaturen, die beim Hartlöten erreicht werden.The invention provides that the sintering process is carried out in a temperature range of 250 to 300 ° C. This temperature range is well below the temperatures achieved in brazing.

Das erfindungsgemäße Verfahren kann außerdem vorsehen, dass der Sinterprozess in einem Druckbereich von 0 bis 30 MPa durchgeführt wird.The inventive method may also provide that the sintering process is carried out in a pressure range of 0 to 30 MPa.

Zudem entspricht es einer Fortführung des erfindungsgemäßen Konzepts, wenn die nach dem obigen Verfahren beschriebenen elektrischen Schaltkontakte in einem Schaltgerät, insbesondere einem Schütz oder einem Leistungsschalter Anwendung finden.In addition, it corresponds to a continuation of the inventive concept when the electrical switching contacts described in the above method find application in a switching device, in particular a contactor or a circuit breaker.

Der elektrische Schaltkontakt weist einen Kontaktträger und eine Kontaktauflage auf, wobei die Kontaktauflage einen Kontaktwerkstoff beinhaltet, der über eine sinterfähige Schicht, insbesondere eine Silberschicht, vom Kontaktträger getrennt ist. Die sinterfähige Schicht ist somit zwischen dem Kontaktwerkstoff und dem Kontaktträger angeordnet. Auf die übliche Lotschicht zwischen dem Kontaktträger und einer Silberschicht wird somit verzichtet.The electrical switching contact has a contact carrier and a contact pad, wherein the contact pad includes a contact material which is separated from the contact carrier via a sinterable layer, in particular a silver layer. The sinterable layer is thus arranged between the contact material and the contact carrier. The usual solder layer between the contact carrier and a silver layer is thus omitted.

Der elektrische Schaltkontakt zeichnet sich durch einen vereinfachten Schichtaufbau aus, da die Lotschicht nicht mehr erforderlich ist. Dies reduziert den Prozessablauf dahingehend, dass das Aufbringen der sinterfähigen Schicht gleichzeitig auch als Verbindungsprozess mit dem Träger genutzt werden kann. Vorteilhaft ist außerdem, dass die insgesamt verwendete Silbermenge durch Reduzierung der Schichtdicken verringert werden kann. Der Prozess kann bei deutlich niedrigeren Temperaturen als beim Verschweißen oder Hartlöten ablaufen. Der geringere Wärmeeintrag in das Bauteil führt zu einer geringeren Materialentfestigung des Trägers. Die Verbindungschicht weist zudem eine höhere elektrische Leitfähigkeit auf als eine vergleichbare Lotschicht. Es kommt abschließend hinzu, dass der Reinigungsprozess der Teile nach dem Verbindungsprozess reduziert wird.The electrical switching contact is characterized by a simplified layer structure, since the solder layer is no longer necessary. This reduces the process flow to the effect that the application of the sinterable layer can be used simultaneously as a connection process with the carrier. It is also advantageous that the total amount of silver used can be reduced by reducing the layer thicknesses. The process can run at significantly lower temperatures than welding or brazing. The lower heat input into the component leads to a lower material hardening of the carrier. The compound layer also has a higher electrical conductivity than a comparable solder layer. It concludes that the cleaning process of the parts is reduced after the bonding process.

Weitere Vorteile und Ausführungen der Erfindung werden nachfolgend anhand eines Ausführungsbeispiels sowie anhand der Zeichnung näher erläutert.Further advantages and embodiments of the invention will be explained in more detail using an exemplary embodiment and with reference to the drawing.

Dabei zeigen:

  • Fig. 1 in einer perspektivischen Darstellung einen elektrischen Schaltkontakt;
  • Fig. 2 in einer schematischen Darstellung den Aufbau eines elektrischen Schaltkontakts aus dem Stand der Technik;
  • Fig. 3 in einer schematischen Darstellung den Aufbau eines erfindungsgemäßen elektrischen Schaltkontakts;
  • Fig. 4 in einer schematischen Darstellung den erfindungsgemäßen Sinterprozess für einen elektrischen Schaltkontakt;
  • Fig. 5 in einer schematischen Darstellung die direkte Widerstandserwärmung durch Stromfluss im elektrischen Schaltkontakt;
  • Fig. 6 in einer schematischen Darstellung die indirekte Widerstandserwärmung durch Stromfluss im elektrischen Schaltkontakt;
  • Fig. 7 in einer schematischen Darstellung die induktive Erwärmung durch Stromfluss im elektrischen Schaltkontakt.
Showing:
  • Fig. 1 in a perspective view of an electrical switching contact;
  • Fig. 2 in a schematic representation of the structure of an electrical switch contact of the prior art;
  • Fig. 3 in a schematic representation of the structure of an electrical switch contact according to the invention;
  • Fig. 4 in a schematic representation of the sintering process according to the invention for an electrical switching contact;
  • Fig. 5 in a schematic representation of the direct resistance heating by current flow in the electrical switching contact;
  • Fig. 6 in a schematic representation of the indirect resistance heating by current flow in the electrical switching contact;
  • Fig. 7 in a schematic representation of the inductive heating by current flow in the electrical switching contact.

Fig. 1 zeigt einen elektrischen Schaltkontakt mit einem Kontaktträger 1, auf welchem auf der Oberseite eine Kontaktauflage 2 angeordnet ist. Fig. 1 shows an electrical switching contact with a contact carrier 1, on which a contact pad 2 is arranged on the upper side.

In Fig. 2 ist der Aufbau eines elektrischen Schaltkontakts aus dem Stand der Technik dargestellt. Dabei ist der Kontaktträger 1 aus einem Kontaktträgerwerkstoff ausgebildet. Die Kontaktauflage 2 umfasst drei Schichten, eine Silberlotschicht 3, eine Silberschicht 4 und eine Schicht aus Kontaktwerkstoff 5. Dabei ist die Silberlotschicht 3 direkt auf der Oberseite des Kontaktträgers 1 ausgebildet. Auf der Silberlotschicht 3 ist die Silberschicht 4 ausgebildet, auf welcher abschließend der Kontaktwerkstoff 5 aufgetragen ist.In Fig. 2 the construction of an electrical switching contact from the prior art is shown. In this case, the contact carrier 1 is formed from a contact carrier material. The contact pad 2 comprises three layers, a silver solder layer 3, a silver layer 4 and a layer of contact material 5. Here, the silver solder layer 3 is formed directly on the upper side of the contact carrier 1. On the silver solder layer 3, the silver layer 4 is formed, on which the contact material 5 is finally applied.

Fig. 3 zeigt den Aufbau eines elektrischen Schaltkontakts. Zwischen dem Kontaktträger 1 und dem Kontaktwerkstoff 5 ist eine sinterfähige Schicht 6 auf der Oberseite des Kontaktträgers 1 angeordnet. Die sinterfähige Schicht 6 ist vorzugsweise eine pulverförmige Silberschicht. Fig. 3 shows the structure of an electrical switch contact. Between the contact carrier 1 and the contact material 5, a sinterable layer 6 is arranged on the upper side of the contact carrier 1. The sinterable layer 6 is preferably a powdered silver layer.

In Fig. 4 ist der erfindungsgemäße Sinterprozess für einen elektrischen Schaltkontakt dargestellt. Der Kontaktträger 1 inklusive der Kontaktauflage 2, die aus der sinterfähigen Schicht 6 und dem Kontaktwerkstoff 5 zusammengesetzt ist, sind zwischen zwei Werkzeugen 7 positioniert, die von oben beziehungsweise von unten mittels Druck 8 auf das Bauteil aus Kontaktträger 1 und Kontaktauflage 2 drücken. Zudem wird in das Bauteil Wärme 9 beispielsweise in Form eines Stempels eingebracht.In Fig. 4 the sintering process according to the invention for an electrical switching contact is shown. The contact carrier 1 including the contact pad 2, which is composed of the sinterable layer 6 and the contact material 5, are positioned between two tools 7 which press from above or from below by means of pressure 8 on the component of contact carrier 1 and contact pad 2. In addition, heat is introduced into the component 9, for example in the form of a stamp.

In Fig. 5 ist die direkte Widerstandserwärmung durch Stromfluss im elektrischen Kontakt dargestellt. Bei der direkten Widerstandserwärmung fließt der Strom direkt durch das Bauteil, welches aus einem Kontaktträger 1 und einer Kontaktauflage 2 zusammengesetzt ist.In Fig. 5 is shown the direct resistance heating by current flow in the electrical contact. In direct resistance heating, the current flows directly through the component, which is composed of a contact carrier 1 and a contact pad 2.

Fig. 6 zeigt die indirekte Widerstandserwärmung, bei der der Stromfluss indirekt durch das Bauteil aus Kontaktträger 1 und der Kontaktauflage 2 fließt. Fig. 6 shows the indirect resistance heating, in which the current flow flows indirectly through the component of contact carrier 1 and the contact pad 2.

In Fig. 7 ist die induktive Erwärmung durch ein magnetisches Feld im Kontaktträger 1 und der Kontaktauflage 2 gezeigt.In Fig. 7 the inductive heating is shown by a magnetic field in the contact carrier 1 and the contact pad 2.

Der elektrische Schaltkontakt zeichnet sich durch einen vereinfachten Schichtaufbau aus, da die Lotschicht nicht mehr erforderlich ist. Dies reduziert den Prozessablauf dahingehend, dass das Aufbringen der sinterfähigen Schicht gleichzeitig auch als Verbindungsprozess mit dem Träger genutzt werden kann. Vorteilhaft ist außerdem, dass die insgesamt verwendete Silbermenge durch Reduzierung der Schichtdicken verringert werden kann. Der Prozess kann bei deutlich niedrigeren Temperaturen als beim Verschweißen oder Hartlöten ablaufen. Der geringere Wärmeeintrag in das Bauteil führt zu einer geringeren Materialentfestigung des Trägers. Die Verbindungschicht weist zudem eine höhere elektrische Leitfähigkeit auf als eine vergleichbare Lotschicht. Es kommt abschließend hinzu, dass der Reinigungsprozess der Teile nach dem Verbindungsprozess reduziert wird.The electrical switching contact is characterized by a simplified layer structure, since the solder layer is no longer necessary. This reduces the process flow to the effect that the application of the sinterable layer can be used simultaneously as a connection process with the carrier. It is also advantageous that the total amount of silver used can be reduced by reducing the layer thicknesses. The process can run at significantly lower temperatures than welding or brazing. The lower heat input into the component leads to a lower material hardening of the carrier. The compound layer also has a higher electrical conductivity than a comparable solder layer. It concludes that the cleaning process of the parts is reduced after the bonding process.

BezugszeichenlisteLIST OF REFERENCE NUMBERS

11
Kontaktträgercontact support
22
Kontaktauflagecontact support
33
SilberlotschichtSilver solder layer
44
Silberschichtsilver layer
55
KontaktwerkstoffContact material
66
sinterfähige Schichtsinterable layer
77
WerkzeugTool
88th
Druckprint
99
Wärmewarmth

Claims (3)

  1. Method for manufacturing an electrical switching contact comprising a contact carrier (1) and a contact facing (2) with a contact material (5), the contact material (5) being connected to the contact carrier (1) by way of a sinterable layer (6) between the contact material (5) and the contact carrier (1), characterized in that the sintering process is carried out in a temperature range from 250 to 300°C.
  2. Method according to Claim 1, characterized in that the generation of heat in the electrical switching contact is carried out by means of resistance welding and/or induction soldering and/or ultrasonic welding and/or by means of a heating die and/or by means of hot gas and/or by means of radiant heat or a combination of these methods for introducing heat.
  3. Method according to one of Claims 1 or 2, characterized in that the sintering process is carried out in a pressure range from 0 to 30 MPa.
EP15175612.9A 2015-07-07 2015-07-07 Process for making an electric switch contact Active EP3116009B1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
EP15175612.9A EP3116009B1 (en) 2015-07-07 2015-07-07 Process for making an electric switch contact
US15/741,858 US20180197695A1 (en) 2015-07-07 2016-05-19 Electrical switching contact
CN201680039681.XA CN107851529B (en) 2015-07-07 2016-05-19 Electric switch contact
PCT/EP2016/061279 WO2017005401A1 (en) 2015-07-07 2016-05-19 Electrical switching contact
BR112018000173-2A BR112018000173A2 (en) 2015-07-07 2016-05-19 Electrical switching contact, method for manufacturing an electrical switching contact, and switching apparatus

Applications Claiming Priority (1)

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EP15175612.9A EP3116009B1 (en) 2015-07-07 2015-07-07 Process for making an electric switch contact

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EP3116009B1 true EP3116009B1 (en) 2019-08-28

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CN (1) CN107851529B (en)
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US10241972B2 (en) 2017-03-16 2019-03-26 International Business Machines Corporation Matrix multiplication on a systolic array
US11347517B2 (en) 2019-06-20 2022-05-31 International Business Machines Corporation Reduced precision based programmable and SIMD dataflow architecture
CN112768279B (en) * 2020-12-30 2024-01-02 浙江福达合金材料科技有限公司 Manufacturing device for electric contact assembly
DE102022200192A1 (en) * 2022-01-11 2023-07-13 Siemens Aktiengesellschaft Contact carrier, contact carrier arrangement and low-voltage protective switching device

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DE1209223B (en) * 1961-09-26 1966-01-20 Siemens Ag Sintered contact bodies with two or more layers
DE2718975C3 (en) * 1977-04-28 1981-11-26 SIEMENS AG AAAAA, 1000 Berlin und 8000 München Method for producing a contact bridge
DE3304637A1 (en) * 1983-02-10 1984-08-16 Siemens AG, 1000 Berlin und 8000 München SINTER CONTACT MATERIAL FOR LOW VOLTAGE SWITCHGEAR
CN100481292C (en) * 2007-01-24 2009-04-22 西安理工大学 A preparation method for connecting tungsten copper alloy and whole electrical contact of the copper end
FR2933541B1 (en) * 2008-07-07 2016-03-25 Schneider Electric Ind Sas METHOD FOR RESISTOR ASSEMBLY OF A CONTACT MATERIAL ON A METAL SUPPORT, ELECTRICAL CONTACT PRODUCED BY SUCH A METHOD AND CONTACT POCKET USED
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EP3069811A1 (en) * 2013-11-11 2016-09-21 Nippon Steel & Sumitomo Metal Corporation Metal bonding structure, metal bonding method, and metal bonding material using metal nanoparticles

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CN107851529A (en) 2018-03-27
BR112018000173A2 (en) 2018-09-11
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CN107851529B (en) 2020-07-28
US20180197695A1 (en) 2018-07-12

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