EP3116009A1 - Electric switch contact - Google Patents
Electric switch contact Download PDFInfo
- Publication number
- EP3116009A1 EP3116009A1 EP15175612.9A EP15175612A EP3116009A1 EP 3116009 A1 EP3116009 A1 EP 3116009A1 EP 15175612 A EP15175612 A EP 15175612A EP 3116009 A1 EP3116009 A1 EP 3116009A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- contact
- electrical switching
- carrier
- layer
- switching contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims abstract description 47
- 239000000463 material Substances 0.000 claims abstract description 40
- 238000004519 manufacturing process Methods 0.000 claims abstract description 12
- 229910052709 silver Inorganic materials 0.000 claims description 18
- 239000004332 silver Substances 0.000 claims description 18
- 238000005245 sintering Methods 0.000 claims description 16
- 238000003466 welding Methods 0.000 claims description 12
- 238000005219 brazing Methods 0.000 claims description 10
- 230000020169 heat generation Effects 0.000 claims description 4
- 230000006698 induction Effects 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 18
- 229910000679 solder Inorganic materials 0.000 description 14
- 238000010438 heat treatment Methods 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 4
- 239000012876 carrier material Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000001939 inductive effect Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
- H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
- H01H11/041—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
- H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
- H01H11/048—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by powder-metallurgical processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
- H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
- H01H11/041—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion
- H01H11/045—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion with the help of an intermediate layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
- H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
- H01H11/06—Fixing of contacts to carrier ; Fixing of contacts to insulating carrier
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2301/00—Metallic composition of the powder or its coating
- B22F2301/25—Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru
- B22F2301/255—Silver or gold
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2201/00—Contacts
- H01H2201/022—Material
- H01H2201/024—Material precious
Definitions
- the invention relates to an electrical switching contact with a contact carrier and a contact pad, which has a contact material, and a method for its production and a switching device with this electrical switching contact.
- Switching contacts consist essentially of a contact carrier and at least one contact piece.
- the contact piece is subject to high demands regarding the material properties.
- the requirements include, for example, a low contact resistance and a high arc erosion resistance.
- Contact carriers and contact pieces are usually connected by soldering and / or welding and / or riveting and / or screwing and / or shrinking or by combining these methods.
- the disadvantage here is the high production costs for producing a complete switching contact. Thus, for example, for a double-breaking switching contact with two opposing contact pieces five components must be connected to each other, with a high effort to avoid positional deviations is driven. It should also be noted that not all desired combinations of materials between contact carrier and contact piece can be welded and / or soldered.
- the contact pieces consist of contact pads made of highly silver-containing materials that are bonded to carrier materials. Due to their function and manufacture, the contact pieces consist of a wear layer of contact material, a pure silver layer, which acts as a ductile buffer, a solder layer and the carrier material.
- Essential steps in the production of contact pieces are the production of the contact material, the application of the pure silver layer, the application of a solder layer and the soldering of the contact pads on the support.
- the pure silver layer is applied by compound extrusion, rolling or by sintering the contact material.
- the solder layer is produced by plating or possigbelotung.
- the brazing is done by brazing at temperatures above 600 ° C.
- the object of the present invention is to provide an electrical switching contact, which is to produce with a reduced process cost, and to provide a method for producing the electrical switch contact.
- this object is achieved by an electrical switching contact with a contact carrier and a contact pad, which has a contact material.
- the invention is characterized in that for the connection of the contact material with the contact carrier, a sinterable layer between the contact material and the contact carrier is arranged.
- This sinterable layer means that no own solder layer has to be used anymore.
- the contact material is directly connected to the carrier via a sintered layer, that is, there are only three layers left, wherein the sinterable layer is positioned directly on the contact material or directly on the contact carrier.
- the process consists essentially in the application of a layer of sinterable material between contact support and carrier with subsequent sintering of the structure under the action of pressure and temperature.
- Silver powder has proven to be particularly advantageous as a sinterable material. Silver has the property even at temperatures that are significantly lower than sintering in brazing processes. Therefore, in the described process at temperatures in the range between 250 and 300 ° C and pressures of 0 to 30 MPa very good conductive and mechanically durable compounds can be produced.
- the sinterable layer contains silver.
- Silver has the property to sinter at temperatures that are significantly lower than brazing processes.
- the process temperature for the connection of the contact material with the contact carrier can be selected here between 250 and 500 ° C, preferably 250 and 300 ° C.
- An inventive continuation of this concept may consist in that the sinterable layer is formed powdery.
- Sintering refers to a process for the production or modification of materials.
- substantially fine-grained ceramic or metallic substances are heated under elevated pressure, but the temperatures remain below the melting temperature of the main components, so that the shape of the workpiece is maintained. It comes in the regulation to a shrinkage, because the particles of the starting material compress and pore spaces are filled.
- a solid or coarse-grained basic body which has been formed in a preceding process step, becomes a solid workpiece.
- the Sintered product only obtains its final properties such as hardness, strength or thermal diffusivity, which are required in the respective application by the temperature treatment.
- the sintering process can be carried out in a temperature range of 250 to 300 ° C.
- the temperatures used in the manufacturing process are thus significantly lower than in welding or brazing.
- the lower heat input during the process leads to a lower material hardening of the carrier.
- the sintering process can be carried out in a pressure range of 0 to 30 MPa.
- the increase in pressure leads to a shrinkage, in which the particles of the starting material are compressed and pore spaces are filled.
- An inventive continuation of the concept may consist in that the heat generation in the electrical contact by means of resistance welding and / or induction brazing and / or ultrasonic welding and / or a Schust Zis and / or hot gas and / or radiant heat or a combination of these methods is to bring heat input. Due to the new joining technique using silver sintering technology, it is no longer necessary to braze hard at a temperature above 600 ° C.
- the object of the present invention is also achieved by a method for producing an electrical switching contact with a contact carrier and a contact pad with a contact material, wherein the contact material is connected to the contact carrier via a sinterable layer between the contact material and the contact carrier.
- a separate solder layer is therefore no longer required.
- the contact material is sintered over a Layer, in particular a silver layer connected to the carrier.
- the process consists of applying a layer of sinterable material between the contact support and the carrier, followed by sintering of the structure under the action of pressure and temperature.
- An inventive continuation of this concept may provide that the sintering process is carried out in a temperature range of 250 to 300 ° C. This temperature range is well below the temperatures achieved in brazing.
- the inventive method may also provide that the sintering process is carried out in a pressure range of 0 to 30 MPa.
- the electrical switching contact according to the invention has a contact carrier and a contact pad, wherein the contact pad includes a contact material which is separated from the contact carrier via a sinterable layer, in particular a silver layer.
- the sinterable layer is thus arranged between the contact material and the contact carrier.
- the usual solder layer between the contact carrier and a silver layer is thus omitted.
- the electrical switching contact according to the invention is characterized by a simplified layer structure, since the solder layer is no longer required. This reduces the process flow to the effect that the application of the sinterable layer can be used simultaneously as a connection process with the carrier. It is also advantageous that the total amount of silver used can be reduced by reducing the layer thicknesses.
- the process can run at significantly lower temperatures than welding or brazing. The lower heat input into the component leads to a lower material hardening of the carrier.
- the compound layer also has a higher electrical conductivity than a comparable solder layer. It concludes that the cleaning process of the parts is reduced after the bonding process.
- Fig. 1 shows an electrical switching contact with a contact carrier 1, on which a contact pad 2 is arranged on the upper side.
- the contact carrier 1 is formed from a contact carrier material.
- the contact pad 2 comprises three layers, a silver solder layer 3, a silver layer 4 and a layer of contact material 5.
- the silver solder layer 3 is formed directly on the upper side of the contact carrier 1.
- the silver layer 4 is formed, on which the contact material 5 is finally applied.
- Fig. 3 shows the structure of an electrical switch contact according to the invention.
- a sinterable layer 6 is arranged on the upper side of the contact carrier 1.
- the sinterable layer 6 is preferably a powdered silver layer.
- Fig. 4 the sintering process according to the invention for an electrical switching contact is shown.
- the contact carrier 1 including the contact support 2, which is composed of the sinterable layer 6 and the contact material 5, are positioned between two tools 7 which press from above or from below by means of pressure 8 on the component of contact carrier 1 and contact pad 2.
- heat is introduced into the component 9, for example in the form of a stamp.
- Fig. 5 is shown the direct resistance heating by current flow in the electrical contact.
- the current flows directly through the component, which is composed of a contact carrier 1 and a contact pad 2.
- Fig. 6 shows the indirect resistance heating, in which the current flow flows indirectly through the component of contact carrier 1 and the contact pad 2.
- Fig. 7 the inductive heating is shown by a magnetic field in the contact carrier 1 and the contact pad 2.
- the electrical switching contact according to the invention is characterized by a simplified layer structure, since the solder layer is no longer required. This reduces the process flow to the effect that the application of the sinterable layer can be used simultaneously as a connection process with the carrier. It is also advantageous that the total amount of silver used can be reduced by reducing the layer thicknesses.
- the process can run at significantly lower temperatures than welding or brazing. The lower heat input into the component leads to a lower material hardening of the carrier.
- the compound layer also has a higher electrical conductivity than a comparable solder layer. It concludes that the cleaning process of the parts is reduced after the bonding process.
Abstract
Die Erfindung betrifft einen elektrischen Schaltkontakt mit einem Kontaktträger (1) und einer Kontaktauflage (2), welche einen Kontaktwerkstoff (5) aufweist, sowie ein Verfahren zu dessen Herstellung. Die Erfindung zeichnet sich dadurch aus, dass zur Verbindung des Kontaktwerkstoffs (5) mit dem Kontaktträger (1) eine sinterfähige Schicht (6) zwischen dem Kontaktwerkstoff (5) und dem Kontaktträger (1) angeordnet ist.The invention relates to an electrical switching contact with a contact carrier (1) and a contact support (2), which has a contact material (5), and a method for its production. The invention is characterized in that a sinterable layer (6) is arranged between the contact material (5) and the contact carrier (1) for connecting the contact material (5) to the contact carrier (1).
Description
Die Erfindung betrifft einen elektrischen Schaltkontakt mit einem Kontaktträger und einer Kontaktauflage, welche einen Kontaktwerkstoff aufweist, sowie ein Verfahren zu dessen Herstellung und ein Schaltgerät mit diesem elektrischen Schaltkontakt.The invention relates to an electrical switching contact with a contact carrier and a contact pad, which has a contact material, and a method for its production and a switching device with this electrical switching contact.
Schaltkontakte bestehen im Wesentlichen aus einem Kontaktträger und wenigstens einem Kontaktstück. Das Kontaktstück unterliegt hohen Anforderungen bezüglich der Materialbeschaffenheit. Zu den Anforderungen gehören beispielsweise ein geringer Übergangswiderstand und eine hohe Lichtbogenabbrandfestigkeit. Kontaktträger und Kontaktstücke werden üblicher Weise durch Löten und/oder Schweißen und/oder Nieten und/oder Schrauben und/oder Schrumpfen oder durch Kombinieren dieser Verfahren verbunden. Nachteilig ist hierbei der hohe Fertigungsaufwand zum Herstellen eines kompletten Schaltkontaktes. So müssen beispielsweise für einen doppelunterbrechenden Schaltkontakt mit zwei gegenüberliegenden Kontaktstücken fünf Komponenten miteinander verbunden werden, wobei ein hoher Aufwand zur Vermeidung von Lageabweichungen getrieben wird. Ebenso ist zu berücksichtigen, dass nicht alle gewünschten Materialkombinationen zwischen Kontaktträger und Kontaktstück geschweißt und/oder gelötet werden können.Switching contacts consist essentially of a contact carrier and at least one contact piece. The contact piece is subject to high demands regarding the material properties. The requirements include, for example, a low contact resistance and a high arc erosion resistance. Contact carriers and contact pieces are usually connected by soldering and / or welding and / or riveting and / or screwing and / or shrinking or by combining these methods. The disadvantage here is the high production costs for producing a complete switching contact. Thus, for example, for a double-breaking switching contact with two opposing contact pieces five components must be connected to each other, with a high effort to avoid positional deviations is driven. It should also be noted that not all desired combinations of materials between contact carrier and contact piece can be welded and / or soldered.
Elektrische Schaltstücke werden zum Öffnen und Schließen von Stromkreisen verwendet. Bei qualitativ anspruchsvollen Kontakten wie sie beispielsweise in Relais, Schaltschützen oder Leistungsschaltern der Niederspannungstechnik Anwendung finden, bestehen die Schaltstücke aus Kontaktauflagen aus hoch silberhaltigen Werkstoffen, die mit Trägerwerkstoffen verbunden sind. Funktions- und herstellungsbedingt bestehen die Schaltstücke aus einer Nutzschicht aus Kontaktwerkstoff, einer Reinsilberschicht, die als duktiler Puffer wirkt, einer Lotschicht und dem Trägerwerkstoff.Electrical contacts are used to open and close circuits. In the case of high-quality contacts, such as those used in relays, contactors or low-voltage circuit breakers, for example, the contact pieces consist of contact pads made of highly silver-containing materials that are bonded to carrier materials. Due to their function and manufacture, the contact pieces consist of a wear layer of contact material, a pure silver layer, which acts as a ductile buffer, a solder layer and the carrier material.
Wesentliche Schritte bei der Herstellung von Schaltstücken sind das Herstellen des Kontaktmaterials, das Aufbringen der Reinsilberschicht, das Aufbringen einer Lotschicht und das Löten der Kontaktauflagen auf den Träger. Die Reinsilberschicht wird durch Verbindungsstrangpressen, Walzplatieren oder im Sinterprozess des Kontaktmaterials aufgebracht. Die Lotschicht wird durch Platieren oder Flüssigbelotung erzeugt. Das Löten erfolgt dabei durch Hartlöten bei Temperaturen oberhalb von 600°C.Essential steps in the production of contact pieces are the production of the contact material, the application of the pure silver layer, the application of a solder layer and the soldering of the contact pads on the support. The pure silver layer is applied by compound extrusion, rolling or by sintering the contact material. The solder layer is produced by plating or Flüssigbelotung. The brazing is done by brazing at temperatures above 600 ° C.
Die Nachteile der aus dem Stand der Technik bekannten Herstellungsverfahren für elektrische Schaltkontakte bestehen zum Einen im aufwändigen Prozessablauf und zum Anderen in der hohen Prozesstemperatur.The disadvantages of the known from the prior art manufacturing method for electrical switching contacts consist on the one hand in the complex process flow and on the other hand in the high process temperature.
Demgemäß besteht die Aufgabe der vorliegenden Erfindung darin, einen elektrischen Schaltkontakt zu schaffen, der mit einem reduzierten Prozessaufwand herzustellen ist, sowie ein Verfahren zur Herstellung des elektrischen Schaltkontakts anzugeben.Accordingly, the object of the present invention is to provide an electrical switching contact, which is to produce with a reduced process cost, and to provide a method for producing the electrical switch contact.
Diese Aufgabe wird erfindungsgemäß durch einen elektrischen Schaltkontakt mit den Merkmalen des Patentanspruchs 1 sowie durch ein Verfahren gemäß Patentanspruch 7 gelöst. Vorteilhafte Aus- und Weiterbildungen, welche einzeln oder in Kombination miteinander eingesetzt werden können, sind der Gegenstand der abhängigen Ansprüche.This object is achieved by an electrical switching contact with the features of
Erfindungsgemäß wird diese Aufgabe durch einen elektrischen Schaltkontakt mit einem Kontaktträger und einer Kontaktauflage gelöst, welche einen Kontaktwerkstoff aufweist. Die Erfindung zeichnet sich dabei dadurch aus, dass zur Verbindung des Kontaktwerkstoffs mit dem Kontaktträger eine sinterfähige Schicht zwischen dem Kontaktwerkstoff und dem Kontaktträger angeordnet ist.According to the invention this object is achieved by an electrical switching contact with a contact carrier and a contact pad, which has a contact material. The invention is characterized in that for the connection of the contact material with the contact carrier, a sinterable layer between the contact material and the contact carrier is arranged.
Diese sinterfähige Schicht führt dazu, dass keine eigene Lotschicht mehr verwendet werden muss. Das Kontaktmaterial wird über eine gesinterte Schicht mit dem Träger direkt verbunden, d.h., es gibt nur noch drei Schichten, wobei die sinterfähige Schicht direkt am Kontaktwerkstoff bzw. direkt am Kontaktträger positioniert ist. Der Prozessablauf besteht im Wesentlichen im Aufbringen einer Schicht aus sinterfähigem Material zwischen Kontaktauflage und Träger mit anschließendem Sintern des Aufbaus unter Einwirkung von Druck und Temperatur. Dabei hat sich Silberpulver als sinterfähiges Material als besonders vorteilhaft erwiesen. Silber hat die Eigenschaft bereits bei Temperaturen, die deutlich niedriger liegen als bei Hartlötprozessen zu sintern. Daher können im beschriebenen Prozess bei Temperaturen im Bereich zwischen 250 und 300°C und Drücken von 0 bis 30 MPa sehr gut leitfähige und mechanisch haltbare Verbindungen hergestellt werden.This sinterable layer means that no own solder layer has to be used anymore. The contact material is directly connected to the carrier via a sintered layer, that is, there are only three layers left, wherein the sinterable layer is positioned directly on the contact material or directly on the contact carrier. The process consists essentially in the application of a layer of sinterable material between contact support and carrier with subsequent sintering of the structure under the action of pressure and temperature. Silver powder has proven to be particularly advantageous as a sinterable material. Silver has the property even at temperatures that are significantly lower than sintering in brazing processes. Therefore, in the described process at temperatures in the range between 250 and 300 ° C and pressures of 0 to 30 MPa very good conductive and mechanically durable compounds can be produced.
In einer besonders vorteilhaften Ausgestaltung der Erfindung kann es vorgesehen sein, dass die sinterfähige Schicht Silber enthält. Silber weist die Eigenschaft auf, bereits bei Temperaturen, die deutlich niedriger liegen als bei Hartlötprozessen zu sintern. Die Prozesstemperatur für die Verbindung des Kontaktwerkstoffs mit dem Kontaktträger kann hier zwischen 250 und 500°C, vorzugsweise 250 und 300°C gewählt werden.In a particularly advantageous embodiment of the invention, it may be provided that the sinterable layer contains silver. Silver has the property to sinter at temperatures that are significantly lower than brazing processes. The process temperature for the connection of the contact material with the contact carrier can be selected here between 250 and 500 ° C, preferably 250 and 300 ° C.
Eine erfindungsgemäße Weiterführung dieses Konzepts kann darin bestehen, dass die sinterfähige Schicht pulverförmig ausgebildet ist. Das Sintern bezeichnet ein Verfahren zur Herstellung oder Veränderungen von Werkstoffen. Dabei werden im Wesentlichen feinkörnige keramische oder metallische Stoffe unter erhöhtem Druck erhitzt, wobei die Temperaturen jedoch unterhalb der Schmelztemperatur der Hauptkomponenten bleiben, so dass die Gestalt des Werkstücks erhalten bleibt. Dabei kommt es in der Regelung zu einer Schwindung, weil sich die Partikel des Ausgangsmaterials verdichten und Porenräume aufgefüllt werden. Durch die Temperaturbehandlung wird aus einem fein- oder grobkörnigen Grundkörper, der in einem vorangegangen Prozessschritt geformt wurde, ein festes Werkstück. Das Sintererzeugnis erhält erst durch die Temperaturbehandlung seine endgültigen Eigenschaften wie Härte, Festigkeit oder Temperaturleitfähigkeit, die im jeweiligen Einsatz erforderlich sind.An inventive continuation of this concept may consist in that the sinterable layer is formed powdery. Sintering refers to a process for the production or modification of materials. In this case, substantially fine-grained ceramic or metallic substances are heated under elevated pressure, but the temperatures remain below the melting temperature of the main components, so that the shape of the workpiece is maintained. It comes in the regulation to a shrinkage, because the particles of the starting material compress and pore spaces are filled. As a result of the temperature treatment, a solid or coarse-grained basic body, which has been formed in a preceding process step, becomes a solid workpiece. The Sintered product only obtains its final properties such as hardness, strength or thermal diffusivity, which are required in the respective application by the temperature treatment.
In einer weiteren speziellen Fortführung des erfindungsgemäßen Konzepts kann es vorgesehen sein, dass der Sinterprozess in einem Temperaturbereich von 250 bis 300°C durchführbar ist. Die beim Herstellungsprozess verwendeten Temperaturen sind somit deutlich niedriger als beim Schweißen oder Hartlöten. Der geringere Wärmeeintrag während des Prozesses führt zu einer geringeren Materialentfestigung des Trägers.In a further special continuation of the inventive concept, it can be provided that the sintering process can be carried out in a temperature range of 250 to 300 ° C. The temperatures used in the manufacturing process are thus significantly lower than in welding or brazing. The lower heat input during the process leads to a lower material hardening of the carrier.
In einer weiteren speziellen Fortführung des erfindungsgemäßen Konzepts kann es vorgesehen sein, dass der Sinterprozess in einem Druckbereich von 0 bis 30 MPa durchführbar ist. Durch die Druckerhöhung kommt es zu einer Schwindung, bei welcher die Partikel des Ausgangsmaterials verdichtet werden und Porenräume aufgefüllt werden.In a further specific continuation of the inventive concept, it can be provided that the sintering process can be carried out in a pressure range of 0 to 30 MPa. The increase in pressure leads to a shrinkage, in which the particles of the starting material are compressed and pore spaces are filled.
Eine erfindungsgemäße Weiterführung des Konzepts kann darin bestehen, dass die Wärmeerzeugung im elektrischen Kontakt mittels Widerstandsschweißen und/oder Induktionslöten und/oder Ultraschallschweißen und/oder eines Heizstempels und/oder heißen Gases und/oder Strahlungswärme oder einer Kombination dieser Verfahren zur Wärmeeinbringung einzubringen ist. Durch die neue Verbindungstechnik mittels Silbersintertechnik ist es nun nicht mehr erforderlich, bei einer Temperatur oberhalb von 600°C hart zu löten.An inventive continuation of the concept may consist in that the heat generation in the electrical contact by means of resistance welding and / or induction brazing and / or ultrasonic welding and / or a Heizstempels and / or hot gas and / or radiant heat or a combination of these methods is to bring heat input. Due to the new joining technique using silver sintering technology, it is no longer necessary to braze hard at a temperature above 600 ° C.
Die erfindungsgemäße Aufgabe der vorliegenden Erfindung wird außerdem durch ein Verfahren zur Herstellung eines elektrischen Schaltkontaktes mit einem Kontaktträger und einer Kontaktauflage mit einem Kontaktwerkstoff gelöst, wobei der Kontaktwerkstoff mit dem Kontaktträger über eine sinterfähige Schicht zwischen dem Kontaktwerkstoff und dem Kontaktträger verbunden wird. Eine eigene Lotschicht ist somit nicht mehr erforderlich. Das Kontaktmaterial wird über eine gesinterte Schicht, insbesondere einer Silberschicht mit dem Träger verbunden. Der Prozessablauf besteht im Wesentlichen dabei durch Aufbringen einer Schicht aus sinterfähigem Material zwischen Kontaktauflage und Träger mit anschließendem Sintern des Aufbaus unter Einwirkung von Druck und Temperatur.The object of the present invention is also achieved by a method for producing an electrical switching contact with a contact carrier and a contact pad with a contact material, wherein the contact material is connected to the contact carrier via a sinterable layer between the contact material and the contact carrier. A separate solder layer is therefore no longer required. The contact material is sintered over a Layer, in particular a silver layer connected to the carrier. Essentially, the process consists of applying a layer of sinterable material between the contact support and the carrier, followed by sintering of the structure under the action of pressure and temperature.
Es hat sich dabei als vorteilhaft erwiesen, dass die Wärmeerzeugung im elektrischen Schaltkontakt mittels Widerstandsschweißen und/oder Induktionslöten und/oder Ultraschallschweißen und/oder mittels Heizstempel und/oder mittels heißen Gases und/oder mittels Strahlungswärme oder einer Kombination dieser Verfahren zur Wärmeeinbringung durchgeführt wird.It has proved to be advantageous that the heat generation in the electrical switching contact by means of resistance welding and / or induction soldering and / or ultrasonic welding and / or by means of hot stamp and / or by means of hot gas and / or by means of radiant heat or a combination of these methods for heat input is performed.
Eine erfindungsgemäße Weiterführung dieses Konzepts kann vorsehen, dass der Sinterprozess in einem Temperaturbereich von 250 bis 300°C durchgeführt wird. Dieser Temperaturbereich liegt deutlich unterhalb der Temperaturen, die beim Hartlöten erreicht werden.An inventive continuation of this concept may provide that the sintering process is carried out in a temperature range of 250 to 300 ° C. This temperature range is well below the temperatures achieved in brazing.
Das erfindungsgemäße Verfahren kann außerdem vorsehen, dass der Sinterprozess in einem Druckbereich von 0 bis 30 MPa durchgeführt wird.The inventive method may also provide that the sintering process is carried out in a pressure range of 0 to 30 MPa.
Zudem entspricht es einer Fortführung des erfindungsgemäßen Konzepts, wenn die nach dem obigen Verfahren beschriebenen elektrischen Schaltkontakte in einem Schaltgerät, insbesondere einem Schütz oder einem Leistungsschalter Anwendung finden.In addition, it corresponds to a continuation of the inventive concept when the electrical switching contacts described in the above method find application in a switching device, in particular a contactor or a circuit breaker.
Der erfindungsgemäße elektrische Schaltkontakt weist einen Kontaktträger und eine Kontaktauflage auf, wobei die Kontaktauflage einen Kontaktwerkstoff beinhaltet, der über eine sinterfähige Schicht, insbesondere eine Silberschicht, vom Kontaktträger getrennt ist. Die sinterfähige Schicht ist somit zwischen dem Kontaktwerkstoff und dem Kontaktträger angeordnet. Auf die übliche Lotschicht zwischen dem Kontaktträger und einer Silberschicht wird somit verzichtet.The electrical switching contact according to the invention has a contact carrier and a contact pad, wherein the contact pad includes a contact material which is separated from the contact carrier via a sinterable layer, in particular a silver layer. The sinterable layer is thus arranged between the contact material and the contact carrier. The usual solder layer between the contact carrier and a silver layer is thus omitted.
Der erfindungsgemäße elektrische Schaltkontakt zeichnet sich durch einen vereinfachten Schichtaufbau aus, da die Lotschicht nicht mehr erforderlich ist. Dies reduziert den Prozessablauf dahingehend, dass das Aufbringen der sinterfähigen Schicht gleichzeitig auch als Verbindungsprozess mit dem Träger genutzt werden kann. Vorteilhaft ist außerdem, dass die insgesamt verwendete Silbermenge durch Reduzierung der Schichtdicken verringert werden kann. Der Prozess kann bei deutlich niedrigeren Temperaturen als beim Verschweißen oder Hartlöten ablaufen. Der geringere Wärmeeintrag in das Bauteil führt zu einer geringeren Materialentfestigung des Trägers. Die Verbindungschicht weist zudem eine höhere elektrische Leitfähigkeit auf als eine vergleichbare Lotschicht. Es kommt abschließend hinzu, dass der Reinigungsprozess der Teile nach dem Verbindungsprozess reduziert wird.The electrical switching contact according to the invention is characterized by a simplified layer structure, since the solder layer is no longer required. This reduces the process flow to the effect that the application of the sinterable layer can be used simultaneously as a connection process with the carrier. It is also advantageous that the total amount of silver used can be reduced by reducing the layer thicknesses. The process can run at significantly lower temperatures than welding or brazing. The lower heat input into the component leads to a lower material hardening of the carrier. The compound layer also has a higher electrical conductivity than a comparable solder layer. It concludes that the cleaning process of the parts is reduced after the bonding process.
Weitere Vorteile und Ausführungen der Erfindung werden nachfolgend anhand eines Ausführungsbeispiels sowie anhand der Zeichnung näher erläutert.Further advantages and embodiments of the invention will be explained in more detail using an exemplary embodiment and with reference to the drawing.
Dabei zeigen:
-
Fig. 1 in einer perspektivischen Darstellung einen elektrischen Schaltkontakt; -
Fig. 2 in einer schematischen Darstellung den Aufbau eines elektrischen Schaltkontakts aus dem Stand der Technik; -
Fig. 3 in einer schematischen Darstellung den Aufbau eines erfindungsgemäßen elektrischen Schaltkontakts; -
Fig. 4 in einer schematischen Darstellung den erfindungsgemäßen Sinterprozess für einen elektrischen Schaltkontakt; -
Fig. 5 in einer schematischen Darstellung die direkte Widerstandserwärmung durch Stromfluss im elektrischen Schaltkontakt; -
Fig. 6 in einer schematischen Darstellung die indirekte Widerstandserwärmung durch Stromfluss im elektrischen Schaltkontakt; -
Fig. 7 in einer schematischen Darstellung die induktive Erwärmung durch Stromfluss im elektrischen Schaltkontakt.
-
Fig. 1 in a perspective view of an electrical switching contact; -
Fig. 2 in a schematic representation of the structure of an electrical switch contact of the prior art; -
Fig. 3 in a schematic representation of the structure of an electrical switch contact according to the invention; -
Fig. 4 in a schematic representation of the sintering process according to the invention for an electrical switching contact; -
Fig. 5 in a schematic representation of the direct resistance heating by current flow in the electrical switching contact; -
Fig. 6 in a schematic representation of the indirect resistance heating by current flow in the electrical switching contact; -
Fig. 7 in a schematic representation of the inductive heating by current flow in the electrical switching contact.
In
In
In
In
Der erfindungsgemäße elektrische Schaltkontakt zeichnet sich durch einen vereinfachten Schichtaufbau aus, da die Lotschicht nicht mehr erforderlich ist. Dies reduziert den Prozessablauf dahingehend, dass das Aufbringen der sinterfähigen Schicht gleichzeitig auch als Verbindungsprozess mit dem Träger genutzt werden kann. Vorteilhaft ist außerdem, dass die insgesamt verwendete Silbermenge durch Reduzierung der Schichtdicken verringert werden kann. Der Prozess kann bei deutlich niedrigeren Temperaturen als beim Verschweißen oder Hartlöten ablaufen. Der geringere Wärmeeintrag in das Bauteil führt zu einer geringeren Materialentfestigung des Trägers. Die Verbindungschicht weist zudem eine höhere elektrische Leitfähigkeit auf als eine vergleichbare Lotschicht. Es kommt abschließend hinzu, dass der Reinigungsprozess der Teile nach dem Verbindungsprozess reduziert wird.The electrical switching contact according to the invention is characterized by a simplified layer structure, since the solder layer is no longer required. This reduces the process flow to the effect that the application of the sinterable layer can be used simultaneously as a connection process with the carrier. It is also advantageous that the total amount of silver used can be reduced by reducing the layer thicknesses. The process can run at significantly lower temperatures than welding or brazing. The lower heat input into the component leads to a lower material hardening of the carrier. The compound layer also has a higher electrical conductivity than a comparable solder layer. It concludes that the cleaning process of the parts is reduced after the bonding process.
- 11
- Kontaktträgercontact support
- 22
- Kontaktauflagecontact support
- 33
- SilberlotschichtSilver solder layer
- 44
- Silberschichtsilver layer
- 55
- KontaktwerkstoffContact material
- 66
- sinterfähige Schichtsinterable layer
- 77
- WerkzeugTool
- 88th
- Druckprint
- 99
- Wärmewarmth
Claims (11)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP15175612.9A EP3116009B1 (en) | 2015-07-07 | 2015-07-07 | Process for making an electric switch contact |
US15/741,858 US20180197695A1 (en) | 2015-07-07 | 2016-05-19 | Electrical switching contact |
BR112018000173-2A BR112018000173A2 (en) | 2015-07-07 | 2016-05-19 | Electrical switching contact, method for manufacturing an electrical switching contact, and switching apparatus |
PCT/EP2016/061279 WO2017005401A1 (en) | 2015-07-07 | 2016-05-19 | Electrical switching contact |
CN201680039681.XA CN107851529B (en) | 2015-07-07 | 2016-05-19 | Electric switch contact |
Applications Claiming Priority (1)
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---|---|---|---|
EP15175612.9A EP3116009B1 (en) | 2015-07-07 | 2015-07-07 | Process for making an electric switch contact |
Publications (2)
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EP3116009A1 true EP3116009A1 (en) | 2017-01-11 |
EP3116009B1 EP3116009B1 (en) | 2019-08-28 |
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EP15175612.9A Active EP3116009B1 (en) | 2015-07-07 | 2015-07-07 | Process for making an electric switch contact |
Country Status (5)
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US (1) | US20180197695A1 (en) |
EP (1) | EP3116009B1 (en) |
CN (1) | CN107851529B (en) |
BR (1) | BR112018000173A2 (en) |
WO (1) | WO2017005401A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023134896A1 (en) * | 2022-01-11 | 2023-07-20 | Siemens Aktiengesellschaft | Contact carrier, contact-carrier arrangement and low-voltage protective switching device |
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US10241972B2 (en) | 2017-03-16 | 2019-03-26 | International Business Machines Corporation | Matrix multiplication on a systolic array |
US11347517B2 (en) | 2019-06-20 | 2022-05-31 | International Business Machines Corporation | Reduced precision based programmable and SIMD dataflow architecture |
CN112768279B (en) * | 2020-12-30 | 2024-01-02 | 浙江福达合金材料科技有限公司 | Manufacturing device for electric contact assembly |
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GB991433A (en) * | 1961-09-23 | 1965-05-05 | Siemens Ag | A three-layer electric contact body and a process for the production thereof |
US3226517A (en) * | 1961-09-26 | 1965-12-28 | Siemens Ag | Electrical contact device |
DE3304637A1 (en) * | 1983-02-10 | 1984-08-16 | Siemens AG, 1000 Berlin und 8000 München | SINTER CONTACT MATERIAL FOR LOW VOLTAGE SWITCHGEAR |
FR2933541A1 (en) * | 2008-07-07 | 2010-01-08 | Schneider Electric Ind Sas | Metal support and contact material assembling method for e.g. circuit breaker, involves applying current and compressive force, where sub-layer agent conductivity is increased irreversibly during current and force application time interval |
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DE2718975C3 (en) * | 1977-04-28 | 1981-11-26 | SIEMENS AG AAAAA, 1000 Berlin und 8000 München | Method for producing a contact bridge |
CN100481292C (en) * | 2007-01-24 | 2009-04-22 | 西安理工大学 | A preparation method for connecting tungsten copper alloy and whole electrical contact of the copper end |
DE102012222416A1 (en) * | 2012-12-06 | 2014-06-12 | Robert Bosch Gmbh | Method for joining at least two components using a sintering process |
EP3069811A4 (en) * | 2013-11-11 | 2017-11-29 | Nippon Steel & Sumitomo Metal Corporation | Metal bonding structure, metal bonding method, and metal bonding material using metal nanoparticles |
-
2015
- 2015-07-07 EP EP15175612.9A patent/EP3116009B1/en active Active
-
2016
- 2016-05-19 WO PCT/EP2016/061279 patent/WO2017005401A1/en active Application Filing
- 2016-05-19 US US15/741,858 patent/US20180197695A1/en not_active Abandoned
- 2016-05-19 BR BR112018000173-2A patent/BR112018000173A2/en not_active Application Discontinuation
- 2016-05-19 CN CN201680039681.XA patent/CN107851529B/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB991433A (en) * | 1961-09-23 | 1965-05-05 | Siemens Ag | A three-layer electric contact body and a process for the production thereof |
US3226517A (en) * | 1961-09-26 | 1965-12-28 | Siemens Ag | Electrical contact device |
DE3304637A1 (en) * | 1983-02-10 | 1984-08-16 | Siemens AG, 1000 Berlin und 8000 München | SINTER CONTACT MATERIAL FOR LOW VOLTAGE SWITCHGEAR |
FR2933541A1 (en) * | 2008-07-07 | 2010-01-08 | Schneider Electric Ind Sas | Metal support and contact material assembling method for e.g. circuit breaker, involves applying current and compressive force, where sub-layer agent conductivity is increased irreversibly during current and force application time interval |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2023134896A1 (en) * | 2022-01-11 | 2023-07-20 | Siemens Aktiengesellschaft | Contact carrier, contact-carrier arrangement and low-voltage protective switching device |
Also Published As
Publication number | Publication date |
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CN107851529A (en) | 2018-03-27 |
EP3116009B1 (en) | 2019-08-28 |
US20180197695A1 (en) | 2018-07-12 |
BR112018000173A2 (en) | 2018-09-11 |
WO2017005401A1 (en) | 2017-01-12 |
CN107851529B (en) | 2020-07-28 |
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