WO2019170211A1 - Procédé de fabrication d'un ensemble sandwich - Google Patents

Procédé de fabrication d'un ensemble sandwich Download PDF

Info

Publication number
WO2019170211A1
WO2019170211A1 PCT/EP2018/055246 EP2018055246W WO2019170211A1 WO 2019170211 A1 WO2019170211 A1 WO 2019170211A1 EP 2018055246 W EP2018055246 W EP 2018055246W WO 2019170211 A1 WO2019170211 A1 WO 2019170211A1
Authority
WO
WIPO (PCT)
Prior art keywords
solder
contact surface
contact
fixing agent
contact surfaces
Prior art date
Application number
PCT/EP2018/055246
Other languages
German (de)
English (en)
Inventor
Michael Schäfer
Nadja Pelshaw
Yvonne LÖWER
Anton-Zoran Miric
Original Assignee
Heraeus Deutschland GmbH & Co. KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Deutschland GmbH & Co. KG filed Critical Heraeus Deutschland GmbH & Co. KG
Priority to PCT/EP2018/055246 priority Critical patent/WO2019170211A1/fr
Publication of WO2019170211A1 publication Critical patent/WO2019170211A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0405—Solder foil, tape or wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to a method for producing a sandwich assembly comprising a first component connected via solder to a second component.
  • soldering as a method for integrally joining components is known to the person skilled in the art. In particular, it is a method to connect components used in electronics via a respective contact surface mechanically and thermally and electrically conductive with each other.
  • the solder material used may be a solder paste or placed solder preform located between the components to be connected, which is melted into molten solder in an oven and, after leaving the furnace, cooling and solidification, results in the desired connection of the components.
  • a solder paste applied to a component or placed solder preform can first be converted into a solder deposit connected to a contact surface of the component.
  • organic compound and “organic polymer” as used herein may also include substances having organic and inorganic moieties; purely inorganic substances are not included in the terms.
  • polymers used herein also includes oligomers; both should not be confused with non-polymeric compounds. The boundary between oligomers and polymers is defined herein by the weight average molecular weight determinable by GPC (gel permeation chromatography, polystyrene standards, polystyrene gel as the stationary phase, tetrahydrofuran as the mobile phase).
  • Contact area D distinguished.
  • components with a contact surface can not be distinguished from one another only if they are identical, when viewed as free components, or if they are arranged symmetrically with respect to one another. Do not lie in each other more symmetrical Arrangement before, so identical components can be distinguished from each other.
  • Contact area D may be of the same type, i.
  • they can be substrates, or they can be active or passive components or an active and a passive component.
  • the component with a contact surface A is a substrate and the component with a contact surface D is an active or passive component, or vice versa.
  • the substrates, the active and the passive components are in particular parts that are used in electronics.
  • active components are diodes, LEDs (light emitting diodes,
  • the thickness of the solder preform may be, for example, in the range of 10 to 750 pm.
  • Applying may be followed by a thermal and / or photochemical during and / or subsequent to the actual application
  • Fixierstoffzusammen includes the term "applying" in each case, a subsequent to the actual application subsequent removal of solvent,
  • solvent-free fixer compositions are, when applied, solid to sticky fixer compositions, for example in the form of film, strand, powder, droplet, flotmelt material, oily or resinous material.
  • Fixer compositions may be solutions, suspensions or dispersions, the rheological behavior of which may range widely from the liquid to the pasty state. Accordingly, non-aqueous organic solvents containing Fixing agent compositions are applied in different ways to a contact surface A, B, C, D, X and Y, for example, by jetting, dispensing,
  • Cellulose ethers and esters act. Particularly preferred are (meth) acrylic copolymers and cellulose derivatives such as methylcellulose or ethylcellulose.
  • the meltable in the range of 30 to 180 ° C thermoplastic organic polymers may have acid groups corresponding to an acid number in the range of 0 to 50 mg KOH / g, preferably below 25 mg KOH / g; more preferably, they have no acidic groups and have no acid number.
  • the determination of the acid number for example the carboxyl number of organic polymers, is known to the person skilled in the art, for example the determination according to DIN EN ISO 2114.
  • the fixer composition contains from 0 to 30% by weight of one or more inorganic solid fillers.
  • inorganic solid fillers are silica and alumina.
  • the sum of the provided with the fixing surface portions of the free contact surface of the solder deposit a common overlap surface forming contact surface A or D is in the presence of one or more components of type (i) in at least one material M1 1500 pm 2 to 50 area%, preferably 1500 miti 2 to 20 area%, in particular 1500 miti 2 to 10 area% of the common overlap area.
  • said sum is 1500 pm 2 to 100 area%, preferably 1500 miti 2 to 50 area%, in particular 1500 pm 2 to 20 area% or even only 1500 pm 2 to 10 area% of the common overlap area.
  • the applied fixing agent may differ in its composition qualitatively and / or quantitatively from that of the fixative composition. This may be the result, for example, of its application and / or removal of solvent or drying and / or thermal and / or photochemical treatment deliberately carried out as part of its application.
  • a fixing agent applied from a solvent-containing fixative its solvent content is reduced relative to that of the fixer composition by> 50 to 100% by weight, preferably by> 80 to 100% by weight.
  • more than half, preferably more than 80,% by weight of the solvent originally contained in the solvent-containing fixative composition is removed in the applied fixative.
  • Each method includes placing a Lotvorform, for example, placing the Lotvorform on a device or vice versa.
  • the hanging up takes place in the sense of a mutually facing arrangement of
  • the solder deposit has a free contact surface Y.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'invention concerne un procédé de fabrication d'un ensemble sandwich constitué d'un premier élément présentant une surface de contact A, d'un deuxième élément présentant une surface de contact D et d'une brasure se trouvant entre les surfaces de contact A et D, la brasure étant produite par fusion d'un dépôt de brasure lié à un des éléments au niveau de la surface de contact A ou D, puis refroidissement de la brasure fondue à une température inférieure à sa température de solidification. Un agent de fixation est appliqué au préalable à partir d'une composition d'agent de fixation sur la surface de contact A ou D non liée au dépôt de brasure et/ou sur la surface de contact libre du dépôt de brasure. La surface de contact libre du dépôt de brasure est orientée vers la surface de contact A ou D non liée au dépôt de brasure. La composition d'agent de fixation se compose de 0 à 97 % en poids d'au moins un solvant choisi dans le groupe constitué par l'eau et les solvants organiques dont la température d'ébullition est inférieure ou égale à 285 °C, de 3 à 100 % en poids d'au moins une matière M1 choisie dans le groupe constitué par (i) des polymères organiques thermoplastiques fusibles dans une plage de 30 à 180 °C et (ii) des composés organiques non polymères fusibles dans une plage de 30 à 180 °C et dépourvus de groupes acides, de 0 à 20 % en poids d'au moins une matière M2 choisie dans le groupe constitué par (iii) des polymères organiques non fusibles dans une plage de 30 à 180 °C et (iv) des composés organiques non polymères non fusibles dans une plage de 30 à 180 °C, dépourvus de groupes acides et sans point d'ébullition ou avec un point d'ébullition supérieur à 285 °C, et de 0 à 30 % en poids d'une ou de plusieurs charges solides inorganiques. La somme des parties de la surface de contact A ou D qui sont pourvues de l'agent de fixation, ladite surface de contact formant avec la surface de contact libre du dépôt de brasure une surface de chevauchement commune, représente de 1500 µm2 à 50 % en surface de la surface de chevauchement commune en présence d'un ou de plusieurs constituants (i) dans au moins une matière M1, tandis que ladite somme représente 1500 µm2 à 100 % en surface de la surface de chevauchement commune en présence exclusivement d'un ou de plusieurs constituants (ii) dans au moins une matière M1.
PCT/EP2018/055246 2018-03-05 2018-03-05 Procédé de fabrication d'un ensemble sandwich WO2019170211A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/EP2018/055246 WO2019170211A1 (fr) 2018-03-05 2018-03-05 Procédé de fabrication d'un ensemble sandwich

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2018/055246 WO2019170211A1 (fr) 2018-03-05 2018-03-05 Procédé de fabrication d'un ensemble sandwich

Publications (1)

Publication Number Publication Date
WO2019170211A1 true WO2019170211A1 (fr) 2019-09-12

Family

ID=61569266

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2018/055246 WO2019170211A1 (fr) 2018-03-05 2018-03-05 Procédé de fabrication d'un ensemble sandwich

Country Status (1)

Country Link
WO (1) WO2019170211A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5152451A (en) 1991-04-01 1992-10-06 Motorola, Inc. Controlled solder oxidation process
US5177134A (en) 1990-12-03 1993-01-05 Motorola, Inc. Tacking agent
US5865365A (en) * 1991-02-19 1999-02-02 Hitachi, Ltd. Method of fabricating an electronic circuit device
US20040152238A1 (en) 2001-03-28 2004-08-05 Michihisa Maeda Flip chip interconnection using no-clean flux
US20100313416A1 (en) 2008-02-29 2010-12-16 Sumitomo Bakelite Co., Ltd Method for providing solder connection, electronic equipment and method for manufacturing same
WO2017057649A1 (fr) * 2015-09-30 2017-04-06 オリジン電気株式会社 Procédé de fabrication de produit brasé

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5177134A (en) 1990-12-03 1993-01-05 Motorola, Inc. Tacking agent
US5865365A (en) * 1991-02-19 1999-02-02 Hitachi, Ltd. Method of fabricating an electronic circuit device
US5152451A (en) 1991-04-01 1992-10-06 Motorola, Inc. Controlled solder oxidation process
US20040152238A1 (en) 2001-03-28 2004-08-05 Michihisa Maeda Flip chip interconnection using no-clean flux
US20100313416A1 (en) 2008-02-29 2010-12-16 Sumitomo Bakelite Co., Ltd Method for providing solder connection, electronic equipment and method for manufacturing same
WO2017057649A1 (fr) * 2015-09-30 2017-04-06 オリジン電気株式会社 Procédé de fabrication de produit brasé
EP3358918A1 (fr) * 2015-09-30 2018-08-08 Origin Electric Company, Limited Procédé de fabrication de produit brasé

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