EP2924334B1 - Lampadaire à technologie LED - Google Patents

Lampadaire à technologie LED Download PDF

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Publication number
EP2924334B1
EP2924334B1 EP14162435.3A EP14162435A EP2924334B1 EP 2924334 B1 EP2924334 B1 EP 2924334B1 EP 14162435 A EP14162435 A EP 14162435A EP 2924334 B1 EP2924334 B1 EP 2924334B1
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EP
European Patent Office
Prior art keywords
housing
led lamp
lens plate
circuit board
lamp according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP14162435.3A
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German (de)
English (en)
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EP2924334A1 (fr
Inventor
Alexander Otto
Michael Schuch
Andreas Tulacs
Claus Ruprechter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Swarco Futurit Verkehrssignalsysteme Ges mbH
Swarco Futurit Verkehrssignalsysteme GmbH
Original Assignee
Swarco Futurit Verkehrssignalsysteme Ges mbH
Swarco Futurit Verkehrssignalsysteme GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to EP14162435.3A priority Critical patent/EP2924334B1/fr
Publication of EP2924334A1 publication Critical patent/EP2924334A1/fr
Application granted granted Critical
Publication of EP2924334B1 publication Critical patent/EP2924334B1/fr
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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00Lighting devices intended for fixed installation
    • F21S8/08Lighting devices intended for fixed installation with a standard
    • F21S8/085Lighting devices intended for fixed installation with a standard of high-built type, e.g. street light
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/101Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/12Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00Refractors for light sources
    • F21V5/007Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/005Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages with keying means, i.e. for enabling the assembling of component parts in distinctive positions, e.g. for preventing wrong mounting
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21WINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/10Outdoor lighting
    • F21W2131/103Outdoor lighting of streets or roads
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00Planar light sources
    • F21Y2105/10Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Definitions

  • the invention relates to a LED street lamp made of plastic according to the preamble of claim 1 and the EP2 489 930 ,
  • a lamp according to this document is designed to cope with the waste heat as follows: On an LED plate, the LEDs are arranged in front of this plate, an optical disc is mounted, which is in contact only with the LED plate in its edge region. Behind the LED plate, in operation above, a metal plate is provided, which keeps a small distance to the LED plate. With this metal plate, the lamp is mounted on a heat conductor, which is provided with cooling fins and housed with electronics in an outer housing. This outer housing has openings for circulating the air, sensitive components are protected by a separate water protection cap. The structure of the entire lamp is complex and therefore expensive, the risk of penetration of dirt and moisture in sensitive areas is great.
  • the change to LED lights is taken as an opportunity to increase the quality of lighting by the latest findings of lighting technology are incorporated, such as glare reduction, reduction of light pollution, photobiological compatibility, more precise light control at low Anrainerbelat Trent, color quality of the Light, brightness controls for energy saving, monitoring of brightness and failures, etc., which directly affects the connection and control of the lights, but also in the design and orientation of the light sources and optics.
  • Plastic is not only much lighter and cheaper than aluminum, but also available in many colors, but above all, electrically insulating, resulting in further simplifications in the internal structure. But the corrosion resistance of plastic parts is also superior to aluminum, which must be protected by additional coating or anodizing and also colored. In addition, optics for LEDs have long been made of transparent plastics. A disadvantage, however, is the low thermal conductivity and lower resistance to aluminum, which must be compensated by a suitable concept.
  • plastic housings often represent only a design panel of conventional technology EP 2487406A1 (Innotec) a lamp that proposes parts of the frame and the upper perforated cover also made of plastic.
  • the US 2009 / 0310381A1 (Chang ) uses heat pipes and aluminum heatsinks for heat dissipation, but this fixture also has a split plastic housing, which is also not involved in heat dissipation.
  • the light sources sit on ribbed aluminum die castings or extruded aluminum profiles to quickly distribute the waste heat and dissipate it into the ambient air.
  • the US 2012 / 0281404A1 shows a housing that is also used as a heat sink, but actually protects the precise attachment of the light source and lens plate to a flat bearing surface of this housing, so that no closer disclosures on the heat balance are available. From the figures, however, it can be concluded that because of the massive cooling fins and the large wall thicknesses, it is an aluminum die-cast part which first distributes the waste heat of the very compact light source over the entire housing and then discharges it directly into the air.
  • a flat, arbitrarily large, good heat conducting circuit board is equipped with LEDs in a uniform distribution, that on the side of the LEDs, a lens plate made of transparent material is arranged, which at least at each LED position a recess for receiving the same and has an optical system for light distribution, with its flat rear side fully rests against the circuit board and borders with its front to the free, and that a plate-shaped housing rests with its flat inner surface over the entire surface of the circuit board and its outer side adjoins the free.
  • Housing and lens plate are made of plastic and close the circuit board for protection Environmental influences tight. Housing and lens plate can optionally be stabilized by ribs or gluing or welding and then form a receiving cavity for the electrical and mechanical connection means of the lamp to the circuit board, or at least have fastening means for a connection unit.
  • Fig. 1 is a street lamp shown in the inventive design.
  • the light source area is drawn in section.
  • the light source is formed by the printed circuit board 1 with LEDs soldered on one side 2, which are usually of the same design and arranged at some distance from each other in a regular grid.
  • the underside equipped with the LEDs is provided with a so-called lens plate 3, which has depressions 4 with optically designed lens surfaces 5 at the positions of the LEDs and otherwise rests against the printed circuit board 1 over its entire surface.
  • On the bottom are located at the LED positions convex lens surfaces 6, which in cooperation with the inner lens surfaces. 5 provide the desired light distribution.
  • the lens plate 3 is directly adjacent to the outside and is therefore made of UV and weather-resistant plastic, in particular made of Plexiglas or polycarbonate, by injection molding.
  • the circuit board 1 is located with its back over the entire surface of a housing 7, which is also made of plastic and stiffened if necessary by ribs 8 and directly adjacent to the free. It protrudes on all sides beyond the printed circuit board 1 and forms an edge 9, which on the one hand shields scattered light 10 radiating beyond the horizon, on the other hand forms a drip edge, so that traces of dirt are largely kept away from the lens plate 3.
  • the housing 7 but also protrudes on one side far beyond the lens plate 3 and forms a roof over a spacious container 11, which receives the electrical connections, the ballast, fuses, communication equipment and sensors and also the cable connections. Furthermore, it also has an adjustable mechanical mount 12 for mast or boom integrated.
  • the container 11 is sealed to the housing 7 in a manner not shown, any manner, but releasably connected for maintenance purposes via connection means 13, indicated here by a labyrinth seal.
  • connection means 13 indicated here by a labyrinth seal.
  • covered polycarbonate has been proven for decades, which has an excellent combination of UV resistance, toughness and strength.
  • the printed circuit board 1 is also heated uniformly because of the uniform distribution of the LEDs and conducts the heat, on the one hand, directly via the adjacent lens plate 3, on the other hand directly to the outside via the adjacent housing 7. Because the heat transfer resistance into the environment is much higher than the thermal resistance through the wall of the lens plate 3 or the housing 7, enclosing the printed circuit board 1 in plastic parts scarcely represents a significant deterioration in heat dissipation. Even the use of thermally conductive modified plastics brings little improvement, in most cases even outweigh the disadvantages of higher costs or poor mechanical strength values, because such modifications are usually made by adding metal powder or ceramic or fibrous particles, which significantly change the property spectrum of the base material.
  • the ribs 8 extend here in the longitudinal direction over the entire lamp and are designed only according to static requirements. Because they are mitgeformt from the housing plastic, they have no relevant cooling ability. Therefore, they may have such distances to each other that a possible cleaning shows no problems, if this is necessary at all.
  • the longitudinal extent together with a flat, or as shown here slightly curved upwards housing wall in any case allows a permanent rainwater drain, even with tilted light.
  • ribs could also extend exclusively across the housing.
  • ribs on the lens plate can have a disturbing effect on the light distribution and must be examined and designed accordingly. Thermally, they act like housing ribs 8. It is recommended instead especially a reinforced training of the housing edge.
  • Fig. 2 shows a possibility of light source design in detail section.
  • the printed circuit board 1 with the LEDs 2 in the recesses 4 is located between the lens plate 3 and the housing 7. It is aligned by means of holes and pin 14 precisely with the optics 5 + 6 of the lens plate 3.
  • the lens plate 3 has circumferentially a rib 15, which is welded together with the pin 14 with the housing 7.
  • the air 16 around the weld areas serves to discharge the material from the melt. After heating the welding zones, the lens plate 3 is pressed together with the inserted printed circuit board 1 and the housing 7 until the printed circuit board abuts both sides, wherein the molten material connects to each other and excess material exits into the free spaces 16.
  • the centering pins 14 and the rib 15 before welding a suitable oversize.
  • the heating of the welding zones can be carried out by means of different proven technologies, be it heating element welding, vibration welding, infrared welding, Ultrasonic welding or laser welding.
  • the circuit board 1 must be protected with the LEDs 2 from excessive heating.
  • any components 17, such as a light or temperature sensor or cable plug, can be accommodated on the rear side of the printed circuit board or in the front side in clearances 18. If these are kept small enough, there is no deterioration of the heat dissipation.
  • Single ribs 8 serve to easily stiffen the housing in one direction or serve a design-oriented design and are only optional. They do not affect the heat dissipation, because the heat pulls up a little bit in the ribs and the ribs increase the outer surface.
  • a glued light source is shown in detail, namely upside down in Verklebungslage.
  • the circuit board has here not only the pin hole centering 14 to the lens plate 3, but more holes 19 for bonding.
  • the housing 7 is placed horizontally in the tub position and a defined amount of a low-viscosity adhesive, such as an epoxy resin 20, filled.
  • the lens plate 3 is inserted with the circuit board 1, whereby the adhesive 20 is distributed over the entire housing, rises through the holes 19 and glued by capillary action also equal to the lens plate 3 with the circuit board 1.
  • the adhesive can not rise in the recesses 4, since an air cushion is formed.
  • the optical and lighting effect remains unaffected.
  • a compact, very stiff composite element is obtained, so that no ribs are required even with larger luminaires, with the best thermal performance and heat dissipation because of the full-surface bonding.
  • the relatively symmetrical construction made of the same materials prevents distortion.
  • the manufacturing process results in an air-free light source unit, except for the sealed LED recesses 4, without problems in the event of air pressure fluctuations, tightness or ingress of moisture.
  • a circumferential sealing cord or sprayed seal 21 is used.
  • the lens plate 3 is tightened to the housing 7 by means of screws 22 until it comes again to bilateral investment of the circuit board.
  • the countersunk screws themselves are sufficiently tight in the lens plate 3.
  • more stable ribs 8a are required, which are made hollow. This doubles the stiffening effect compared to single-walled execution.
  • the cavity can in this case be used to receive the screws 22, but also to guide connection cables for components over the entire lamp. Again, there is no noticeable impairment of heat dissipation given low rib width.
  • the recesses 4 and lens surfaces 6 of the lens plate 3 can be regarded as low ribs with small width and height. They also act in their entirety stiffening, without affecting the heat dissipation.
  • a criterion for good heat dissipation is the even distribution of heat loss over the PCB. Because even a single hotspot can lead to premature failure of an LED and thus to the exchange of the lamp.
  • the lighting concept allows either relatively few high-power LED with large distances to each other and thus greater heat distribution costs, which usually requires expensive metal core boards, or relatively many LEDs in the midrange with reduced distances and drastically lower local heat input at much lower distribution costs and thus more uniform temperature, for which a conventional cost FR4 printed circuit board material with thicker copper layer is sufficient.
  • a good heat distribution also depends on the layout of the PCB and the footprint of the LED used.
  • Fig. 6 shows the well-known so-called matrix interconnection of the LED, here for example in 4x4 arrangement, which provides some compensation in case of LED failure and emergency operation to replacement and can be advantageously used for larger LED quantities.
  • LEDs 23 are used with only one anode pad and one cathode pad, mostly so-called midrange LEDs, the result is a very simple and efficient layout with regard to the heat distribution, which in Fig. 7 for the 4x4 circuit Fig. 6 is shown.
  • It is a sequence of substantially rectangular copper surfaces 24 whose gap spacing 25 is bridged by the parallel-connected LEDs.
  • the copper surfaces are optimally able to distribute the LED heat evenly, and at the same time the same formed correct interconnection.
  • This design is therefore primarily suitable for FR4 printed circuit boards, both in single-sided and double-sided copper plating, connected by numerous vias as known in the art.
  • a plurality of printed circuit boards and lens plates can be installed adjoining one another in order to design a modular system with different sized lights and different light distributions.
  • the LEDs can also be arranged in arbitrary arrangements, curves or symbol formations, as long as the specific surface load due to heat remains approximately the same. It is possible to use high-power LEDs with greater distances from one another or even higher-numbered midrange LEDs with small distances between them. Of course, LEDs with colored light can be used, also separately switchable.
  • the LED positions relative to the lens plate can be variable in order to be able to adjust the light distribution.
  • Multiple LEDs can also be placed under one optic for more light output and enhanced, blurrier light distribution.
  • the brightness and thermal load of a luminaire can be set inexpensively by means of various operating currents, but also partial equipping of the printed circuit boards.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Claims (22)

  1. Lampe LED, destinée principalement à un éclairage public, comprenant une unité d'éclairage plate dotée d'une fenêtre de sortie de lumière horizontale orientée vers le bas, constituée d'au moins une carte de circuit imprimé (1) équipée de LEDs, d'une plaque de lentilles (3) et d'un boîtier (7), et comprenant une unité de raccordement (11) adjacente, sachant qu'une carte de circuit imprimé (1) plane, bonne conductrice de la chaleur, de taille quelconque, est équipée de LEDs (2) avec une répartition régulière, et que côté LEDs (2), il est prévu une plaque de lentilles (3) en matériau transparent qui présente un creux (4), au moins à chaque position de LED, aux fins d'accueillir celle-ci, ainsi qu'un dispositif optique (5,6) destiné à la distribution de la lumière, et qui est appliquée avec sa face arrière plane, sur toute la surface, contre la carte de circuit imprimé (1), et dont la face avant est tournée vers l'extérieur, et que le boîtier (7) en forme de plaque est appliqué avec sa face intérieure plane également sur toute la surface contre la carte de circuit imprimé (1) et est tourné vers l'extérieur avec sa face avant, caractérisée en ce que le boîtier (7) est fabriqué à partir de matière plastique, notamment de polycarbonate, qui peut être teintée à volonté et est résistante aux intempéries, électriquement isolante et solide, et que la chaleur dissipée des LEDs est répartie uniformément par la carte de circuit imprimé (1) et est évacuée directement à l'extérieur, d'une part directement à travers la paroi du boîtier plastique (7) appliquée à l'arrière, et d'autre part directement à travers la paroi de la plaque de lentilles (3) appliquée à l'avant.
  2. Lampe LED selon la revendication 1, caractérisée en ce que la plaque de lentilles (3) est fabriquée à partir d'une matière plastique transparente, électriquement isolante et résistante aux intempéries, en particulier à partir de plexiglas ou de polycarbonate.
  3. Lampe LED selon la revendication 1 ou 2, caractérisée en ce que la carte de circuit imprimé (1) thermoconductrice se compose d'un matériau standard, tel que FR4 à épaisseur de cuivre accrue, ou est réalisée sous forme de platine à noyau métallique.
  4. Lampe LED selon au moins une des revendications 1 à 3, caractérisée en ce que les LEDs (2) sont des LEDs dites de moyenne ou haute puissance de type SMD, de préférence avec émission de lumière blanche.
  5. Lampe LED selon au moins une des revendications 1 à 4, caractérisée en ce que les positions des LEDs coïncident avec des positions de lentilles de la plaque de lentilles (3) et que la carte de circuit imprimé (1) est positionnée au moins en direction de la plaque de lentilles (3), à l'aide de moyens mécaniques tels que des trous et des broches.
  6. Lampe LED selon au moins une des revendications 1 à 5, caractérisée en ce que le boîtier (7) et la plaque de lentilles (3) dépassent sur tous les côtés par rapport à la carte de circuit imprimé (1) et sont rendus étanches l'un par rapport à l'autre à ces emplacements.
  7. Lampe LED selon au moins une des revendications 1 à 6, caractérisée en ce que le boîtier (7) et/ou la plaque de lentilles (3) se poursuivent sur au moins une face de la carte de circuit imprimé (1) et forment un logement (11) pour accueillir l'alimentation en tension, les connecteurs, les capteurs et la communication, ou présentent au moins des moyens de raccordement (13) pour une unité de raccordement.
  8. Lampe LED selon au moins une des revendications 1 à 7, caractérisée en ce que le boîtier (7) dépasse par rapport à la plaque de lentilles (3) et présente un bord (9) qui masque toute émission de lumière ou toute lumière dissipée (10) vers le haut et forme un bord d'égouttement pour l'eau de pluie.
  9. Lampe LED selon au moins une des revendications 1 à 8, caractérisée en ce que la face externe du boîtier (7) est lisse et plane et la stabilité est obtenue par une liaison rigide entre le boîtier (7), la plaque de lentilles (3) et la carte de circuit imprimé (1).
  10. Lampe LED selon au moins une des revendications 1 à 8, caractérisée en ce que la face externe du boîtier (7) présente des nervures (8) destinées à la stabilisation mécanique et disposées seulement dans une direction préférée, de sorte que l'eau de pluie et les salissures peuvent s'écouler même en l'absence de pente ou avec une faible inclinaison.
  11. Lampe LED selon la revendication 10, caractérisée en ce que des nervures (8a) sur le boîtier (7) sont réalisées sous une forme creuse.
  12. Lampe LED selon au moins une des revendications 1 à 11, caractérisée en ce que la plaque de lentilles (3) présente des nervures destinées à la stabilisation mécanique, qui s'étendent de préférence transversalement aux nervures (8) du boîtier (7).
  13. Lampe LED selon la revendication 12, caractérisée en ce que des nervures sur la plaque de lentilles (3) sont réalisées sous une forme creuse.
  14. Lampe LED selon au moins une des revendications 1 à 13, caractérisée en ce que la plaque de lentilles (3) ou le boîtier (7) présentent des cavités (18) destinées à recevoir des composants (17) de la carte de circuit imprimé (1), tels que des capteurs, des circuits de protection ou des câbles et des fiches de raccordement.
  15. Lampe LED selon au moins une des revendications 1 à 14, caractérisée en ce que le boîtier (7), la carte de circuit imprimé (1) et la plaque de lentilles (3) sont reliés de façon amovible les uns aux autres à l'aide de vis (22), de clips ou de liaisons par encliquetage, avec utilisation d'éléments d'étanchéité (21).
  16. Lampe LED selon au moins une des revendications 1 à 14, caractérisée en ce que le boîtier (7), la carte de circuit imprimé (1) et la plaque de lentilles (3) sont reliés de façon inséparable et étanche les uns aux autres par collage ou soudage.
  17. Lampe LED selon la revendication 16, caractérisée en ce que le collage du boîtier (7), de la carte de circuit imprimé (1) et de la plaque de lentilles (3) est réalisé sur toute la surface et en établissant l'étanchéité sur la périphérie.
  18. Lampe LED selon la revendication 16, caractérisée en ce que le soudage du boîtier (7) et de la plaque de lentilles (3) est réalisé par soudage par élément chauffant, soudage par vibration, soudage par infrarouge, soudage par ultrason ou soudage laser, sachant que des points de soudure peuvent également être disposés à l'intérieur du contour de la carte de circuit imprimé.
  19. Lampe LED selon la revendication 16, caractérisée en ce que le boîtier (7), la carte de circuit imprimé (1) et la plaque de lentilles (3) sont maintenus ensemble par rivetage à chaud à l'aide de tiges de boîtier (26) qui sont réparties à intervalles réguliers sur la source lumineuse.
  20. Lampe LED selon au moins une des revendications 1 à 19, caractérisée en ce que le boîtier (7) et la plaque de lentilles (3) présentent le même matériau de base, en particulier du polycarbonate.
  21. Lampe LED selon au moins une des revendications 1 à 20, caractérisée en ce que le matériau du boîtier est modifié de façon à conduire la chaleur.
  22. Lampe LED selon au moins une des revendications 1 à 21, caractérisée en ce que les LEDs (2) sont interconnectées respectivement avec une seule plaque de cathode et d'anode (23) pour former un réseau matriciel (fig. 6), que chaque liaison transversale des faisceaux parallèles dans l'agencement de la carte de circuit imprimé est réalisée sous forme de surface continue en cuivre, et que les LEDs (23) enjambent les interstices entre les surfaces en cuivre.
EP14162435.3A 2014-03-28 2014-03-28 Lampadaire à technologie LED Active EP2924334B1 (fr)

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EP2924334A1 EP2924334A1 (fr) 2015-09-30
EP2924334B1 true EP2924334B1 (fr) 2019-07-24

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019101398A1 (de) 2019-01-21 2020-07-23 HELLA GmbH & Co. KGaA Fügeverfahren sowie Bauteilanordnung für Signalleuchten
CN112082105B (zh) * 2019-06-12 2024-03-19 杭州华普永明光电股份有限公司 照明模组及其制作方法、照明装置
US11869358B2 (en) 2021-10-29 2024-01-09 Nortak Software Ltd. System and method for warning of a presence of a mobile target
WO2024039359A1 (fr) * 2022-08-17 2024-02-22 Bilous Nazar Dispositif d'éclairage

Citations (3)

* Cited by examiner, † Cited by third party
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EP2107295A2 (fr) * 2008-04-03 2009-10-07 Steinel GmbH Dispositif d'éclairage avec LED
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