EP2897767A4 - INTEGRATION OF ADDITIONS IN FIXED SLOPES FOR IMPROVED CMP PERFORMANCE - Google Patents

INTEGRATION OF ADDITIONS IN FIXED SLOPES FOR IMPROVED CMP PERFORMANCE

Info

Publication number
EP2897767A4
EP2897767A4 EP13838975.4A EP13838975A EP2897767A4 EP 2897767 A4 EP2897767 A4 EP 2897767A4 EP 13838975 A EP13838975 A EP 13838975A EP 2897767 A4 EP2897767 A4 EP 2897767A4
Authority
EP
European Patent Office
Prior art keywords
fixed abrasive
incorporating additives
cmp performance
improved cmp
abrasive webs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP13838975.4A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP2897767A1 (en
Inventor
Julie Y Qian
William D Joseph
Stephen C Loper
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of EP2897767A1 publication Critical patent/EP2897767A1/en
Publication of EP2897767A4 publication Critical patent/EP2897767A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
    • B24D3/342—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent
    • B24D3/344—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent the bonding agent being organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/31051—Planarisation of the insulating layers
    • H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
EP13838975.4A 2012-09-21 2013-09-17 INTEGRATION OF ADDITIONS IN FIXED SLOPES FOR IMPROVED CMP PERFORMANCE Withdrawn EP2897767A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261703815P 2012-09-21 2012-09-21
PCT/US2013/060022 WO2014047014A1 (en) 2012-09-21 2013-09-17 Incorporating additives into fixed abrasive webs for improved cmp performance

Publications (2)

Publication Number Publication Date
EP2897767A1 EP2897767A1 (en) 2015-07-29
EP2897767A4 true EP2897767A4 (en) 2016-07-27

Family

ID=50341881

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13838975.4A Withdrawn EP2897767A4 (en) 2012-09-21 2013-09-17 INTEGRATION OF ADDITIONS IN FIXED SLOPES FOR IMPROVED CMP PERFORMANCE

Country Status (8)

Country Link
US (1) US20150217424A1 (ja)
EP (1) EP2897767A4 (ja)
JP (1) JP2015532895A (ja)
KR (1) KR20150058302A (ja)
CN (1) CN104822495A (ja)
SG (1) SG11201502225XA (ja)
TW (1) TW201420706A (ja)
WO (1) WO2014047014A1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9649741B2 (en) * 2014-07-07 2017-05-16 Jh Rhodes Company, Inc. Polishing material for polishing hard surfaces, media including the material, and methods of forming and using same
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US10456886B2 (en) * 2016-01-19 2019-10-29 Applied Materials, Inc. Porous chemical mechanical polishing pads
CN106947396B (zh) * 2017-03-23 2019-02-26 河南联合精密材料股份有限公司 研磨液用悬浮体系、研磨液及其制备方法
CN109251678A (zh) * 2017-07-13 2019-01-22 安集微电子科技（上海）股份有限公司 一种化学机械抛光液
CN108747876B (zh) * 2018-06-11 2021-03-19 河北思瑞恩新材料科技有限公司 一种漆面研磨砂碟的制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090176443A1 (en) * 2006-12-22 2009-07-09 Kollodge Jeffrey S Structured fixed abrasive articles including surface treated nano-ceria filler, and method for making and using the same
US20120094487A1 (en) * 1997-04-30 2012-04-19 3M Innovative Properties Company Compositions and methods for modifying a surface suited for semiconductor fabrication

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW479285B (en) * 1997-04-30 2002-03-11 Minnesota Mining & Mfg Method of modifying a wafer suited for semiconductor fabrication
US6121143A (en) * 1997-09-19 2000-09-19 3M Innovative Properties Company Abrasive articles comprising a fluorochemical agent for wafer surface modification
US20030176151A1 (en) * 2002-02-12 2003-09-18 Applied Materials, Inc. STI polish enhancement using fixed abrasives with amino acid additives
JP2007514553A (ja) * 2003-11-26 2007-06-07 スリーエム イノベイティブ プロパティズ カンパニー 工作物の研磨方法
US7435162B2 (en) * 2005-10-24 2008-10-14 3M Innovative Properties Company Polishing fluids and methods for CMP
US8591764B2 (en) * 2006-12-20 2013-11-26 3M Innovative Properties Company Chemical mechanical planarization composition, system, and method of use
WO2009058463A1 (en) * 2007-10-31 2009-05-07 3M Innovative Properties Company Composition, method and process for polishing a wafer
JP5351967B2 (ja) * 2008-08-28 2013-11-27 スリーエム イノベイティブ プロパティズ カンパニー 構造化研磨物品、その製造方法、及びウエハの平坦化における使用
SG10201401549SA (en) * 2009-06-22 2014-06-27 Cabot Microelectronics Corp CMP Compositions And Methods For Suppressing Polysilicon Removal Rates
US8348723B2 (en) * 2009-09-16 2013-01-08 3M Innovative Properties Company Structured abrasive article and method of using the same
US20130059506A1 (en) * 2010-05-11 2013-03-07 3M Innovative Properties Company Fixed abrasive pad with surfactant for chemical mechanical planarization
CN102947781B (zh) * 2010-06-22 2016-03-09 日本写真印刷株式会社 具有防锈性的窄边框触摸输入薄片及其制造方法
JP5903502B2 (ja) * 2011-12-30 2016-04-13 サン−ゴバン セラミックス アンド プラスティクス，インコーポレイティド 成形研磨粒子を備える粒子材料

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120094487A1 (en) * 1997-04-30 2012-04-19 3M Innovative Properties Company Compositions and methods for modifying a surface suited for semiconductor fabrication
US20090176443A1 (en) * 2006-12-22 2009-07-09 Kollodge Jeffrey S Structured fixed abrasive articles including surface treated nano-ceria filler, and method for making and using the same

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2014047014A1 *

Also Published As

Publication number Publication date
US20150217424A1 (en) 2015-08-06
TW201420706A (zh) 2014-06-01
KR20150058302A (ko) 2015-05-28
WO2014047014A1 (en) 2014-03-27
SG11201502225XA (en) 2015-05-28
JP2015532895A (ja) 2015-11-16
EP2897767A1 (en) 2015-07-29
CN104822495A (zh) 2015-08-05

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