EP2839209B1 - Beleuchtungseinrichtung - Google Patents

Beleuchtungseinrichtung Download PDF

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Publication number
EP2839209B1
EP2839209B1 EP13725083.3A EP13725083A EP2839209B1 EP 2839209 B1 EP2839209 B1 EP 2839209B1 EP 13725083 A EP13725083 A EP 13725083A EP 2839209 B1 EP2839209 B1 EP 2839209B1
Authority
EP
European Patent Office
Prior art keywords
semiconductor light
light source
carrier
source arrangement
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP13725083.3A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP2839209A1 (de
Inventor
Philipp Helbig
Stephan Schwaiger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Publication of EP2839209A1 publication Critical patent/EP2839209A1/de
Application granted granted Critical
Publication of EP2839209B1 publication Critical patent/EP2839209B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/004—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by deformation of parts or snap action mountings, e.g. using clips
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0035—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources the fastening means being capable of simultaneously attaching of an other part, e.g. a housing portion or an optical component
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/005—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • Such a lighting device is for example in the WO 2006/097067 A1 disclosed.
  • This publication describes a lighting device with a semiconductor light source arrangement which is fixed by means of a press fit on a support designed as a heat sink.
  • the illumination device has at least one semiconductor light source arrangement which is fixed at several locations by means of a press fit on a carrier.
  • press-fit here refers to a relationship between two mutually matched fastening elements of the at least one semiconductor light source arrangement and the carrier, wherein the first fastening element a hole and the second fastener is a rod-like fastener disposed in the hole, such as a land, a pin, a rivet, a screw or the like, and wherein in at least one spatial direction the dimension of the hole is smaller than the corresponding dimension of the rod-like fastener such that the rod-like fastener is press-fitted into the hole.
  • the interference fit is also referred to as interference fit.
  • the first fastening element of the press-fit that is, the hole
  • the second, rod-like fastening element is arranged on the carrier.
  • the first fastening element of the interference fit namely the hole
  • the second rod-like fastening element can be arranged on a holding part of the at least one semiconductor light source arrangement.
  • holes may be arranged both in the carrier and in the at least one semiconductor light source arrangement, the holes in the carrier and in the at least one semiconductor light source arrangement corresponding to each other, so that a rod-like fastening element both in a hole of the carrier and in a hole of at least a semiconductor light source arrangement can be introduced and is arranged with a press fit or in the hole of the carrier and the corresponding hole in the semiconductor light source arrangement to fix the carrier and semiconductor light source arrangement by means of the rod-like fastener to each other.
  • the at least one semiconductor light source arrangement By fixing the at least one semiconductor light source arrangement by means of press-fitting at a plurality of locations on the carrier, precise positioning and alignment of the at least one semiconductor light source arrangement on the carrier is possible.
  • tolerances in the dimensions for the at least one semiconductor light source arrangement and the carrier can be compensated by the mechanical stress of the press fit, and a backlash-free attachment of the at least one semiconductor light source arrangement to the carrier can be ensured.
  • the interference fit allows a good thermal coupling between the at least one semiconductor light source arrangement and its carrier.
  • the at least one semiconductor light source arrangement is fixed to the support in each case by an interference fit at at least three locations. This ensures a backlash-free attachment of the at least one semiconductor light source arrangement on the carrier in the desired position and orientation.
  • the press fits are formed as bracket-type holders at at least two of the three abovementioned locations on the carrier.
  • the effects of different coefficients of thermal expansion of the at least one semiconductor light source arrangement and of the carrier on the relative position and orientation of the semiconductor light source arrangement and carrier are compensated and a backlash-free arrangement of semiconductor light source arrangement and carrier also in the operating state, that is ensured in the strongly heated state of the semiconductor light source arrangement.
  • the at the different thermal expansion of semiconductor light source arrangement and carrier, acting on the semiconductor light source assembly mechanical stresses are absorbed by the clip-like brackets.
  • the clip-type brackets also compensate for mechanical stresses caused by inaccurate alignment of the press-fit fasteners disposed on the semiconductor light source array with respect to the press-fit fasteners disposed on the carrier.
  • the interference fits of holes are formed in a support part of the at least one semiconductor light source arrangement and in the holes arranged, rod-like and fixed to the carrier or in the carrier fasteners.
  • the rod-like fastening elements can additionally be used for fixing an optical system on the carrier, which is arranged downstream of the at least one semiconductor light source arrangement.
  • rod-like fasteners preferably serve fasteners from the group of web, pin, rivet and screw or the like.
  • the rod-like fastening elements are preferably made of metal for the purpose of good heat conduction and are preferably each arranged in a borehole of the carrier.
  • the holes in the carrier can therefore be used as a reference for the alignment and mounting of the at least one semiconductor light source arrangement and optionally an additional optics are used on the carrier.
  • the above-mentioned holding part of the at least one semiconductor light source arrangement is preferably made of plastic.
  • the semiconductor light sources of the at least one semiconductor light source arrangement can be provided in a simple manner by means of injection molding with a housing or a mounting frame for further mounting on a heat sink.
  • the clip-like brackets are each formed by the support member and a hole in the support member which extends to an outer edge of the support member, as well as arranged therein a rod-like fastener which is fixed in the carrier or on the carrier.
  • a clamping effect is achieved in a simple manner. That is, the rod-like fastener disposed in the hole is supported in the hole as by a clamp.
  • the mounting part of the at least one semiconductor light source arrangement clings to the rod-like fastening element, which is pressed in, for example, in the carrier or is formed as part of the carrier.
  • the illumination device preferably has at least one optical system arranged downstream of the at least one semiconductor light source arrangement, so that light emitted by the at least one semiconductor light source arrangement hits the at least one optical system.
  • This optic is preferably in the same places as the at least one semiconductor light source arrangement fixed by means of a press fit on the carrier.
  • the system efficiency is increased because a common press fit is used for the at least one semiconductor light source arrangement and the at least one optical system for fixing on the carrier and thus no additional tolerance for the position and orientation of the at least one optic is caused when it is mounted on the carrier.
  • the at least one optic has a base portion provided with holes for the interference fits, wherein at least some of the holes in the base portion of the at least one optic correspond to the holes in the support portion of the at least one semiconductor light source assembly.
  • the holes in a base section of the at least one optical system it is ensured that the holes do not influence the optical properties of the at least one optical system. Since at least some of the holes in the base portion of the at least one optic correspond to the holes in the support portion of the at least one semiconductor light source array, the at least one optic and the at least one semiconductor light source array can be fixed to the locations of these holes by a common interference fit on the support.
  • the base portion of the at least one optic preferably has at least two bracket-like support members, each formed by the base portion and a hole extending to an outer edge of the base portion.
  • fixed or rod-like fastening elements are provided on or in the carrier, which are arranged both in a hole in the holding part of the at least one semiconductor light source arrangement and in a hole in the base part of the at least one optical system.
  • a common press fit of semiconductor light source arrangement and optics on the carrier can be realized in a simple manner.
  • the at least one semiconductor light source arrangement and the at least one optical system can be mounted on the carrier in one production step by the common press fit.
  • the holes in the base portion of the at least one optic and the drill holes in the support portion of the formed at least one semiconductor light source arrangement similar.
  • the holes of the press fits are advantageously designed as boreholes whose diameter is smaller than the diameter of the section of the rod-like fastening element arranged in the corresponding hole, the holes each having at least one slot at its edge.
  • the slot at the edge of the borehole absorbs the forces caused by the excess of the rod-like fastening element arranged in the borehole.
  • the slot advantageously extends from the edge of the respective borehole to an outer edge of the mounting part of the semiconductor light source arrangement or up to an outer edge of the base section of the optics.
  • this borehole acts like a clamp which clasps the rod-shaped fastening element and makes it possible to absorb mechanical forces which are caused, for example, by the different thermal expansion of the semiconductor light source arrangement, the base section of the optics and supports or by inaccurate placement of the boreholes.
  • the tolerance of the adjustment of the at least one semiconductor light source arrangement is on the carrier very low.
  • the joint interference fit of the at least one semiconductor light source array and the at least one optic on the carrier does not cause any additional tolerance for the at least one optic which would reduce the accuracy of adjusting the entire system of carrier, semiconductor light source array and optics.
  • the carrier, the at least one semiconductor light source arrangement and the at least one optical system are always under mechanical tension, whereby a play-free seating of the at least one semiconductor light source arrangement and the at least one optical system on the carrier is ensured.
  • the carrier itself is designed as a heat sink or heat sink and therefore preferably consists of metal.
  • FIG. 1 a lighting device according to the first embodiment of the invention is shown schematically.
  • This illumination device has a semiconductor light source arrangement 1 and a carrier 2, on which the semiconductor light source arrangement 1 is fixed by means of a press fit.
  • the semiconductor light source arrangement 1 has five light-emitting diode chips 11 arranged in a row are arranged on a substrate 12, and a support member 10 made of plastic, in which the substrate 12 is embedded with the LED chips 11 by means of plastic injection molding.
  • the substrate 12 with the light-emitting diode chips 11 is arranged in a window of the holding part 10, so that the light emission of the light-emitting diode chips 11 is hardly hindered by the holding part 10.
  • the semiconductor light source arrangement 1 also has metallic contact springs 14, which serve for the electrical connection between the contacts of the five light-emitting diode chips 11 and the contacts of the operating device 13. Furthermore, the semiconductor light source arrangement 1 has electrical connections 15, which are connected to electrical connection cables 16 for the power supply and control of the light-emitting diode chips 11 and their operating device 13.
  • a tab 17, 18, 19 is arranged on each side of the holder part 10 of the semiconductor light source arrangement 1. These tabs 17, 18, 19 are each provided with a borehole 170, 180, 190, which serves in each case for producing a press fit with the carrier 2.
  • a rivet 21, 22, 23 is arranged to produce the interference fit with the carrier 2, the diameter of the portion of the rivets 21, 22, 23 arranged in the respective borehole 170, 180 and 190, respectively, being slight greater than the diameter of the respective borehole 170, 180 and 190, respectively.
  • FIG. 4 The shape and arrangement of the bores 170, 180, 190 in the plastic housing 10 of the semiconductor light source device 1 is shown in FIG FIG. 4 shown.
  • the holes 170, 180, 190 form the corners of a fictitious triangle.
  • Two opposing bores 170, 180 are each provided with a slot 171, 181 extending from the edge of the corresponding borehole 170, 180, respectively, to an outer edge of the associated tab 17, 18, respectively. That is, through the slots 171, 181, the borehole 170, 180 extends to the outer edge of the tab 17, 18.
  • these tabs 17, 18 get the effect of a clip, the respective, with excess with respect to the corresponding borehole 170 and 180 equipped rivet 21 and 22 clasped.
  • the third borehole 190 arranged in the tab 19 has two slots 191, 192 which are diametrically opposed to one another and are each arranged on the edge of the borehole 190, but do not extend as far as an outer edge of the third tab 19.
  • the two diametrically opposed slots 191, 192 and the borehole 190 give the third tab 19 the effect of a clamp.
  • the third tab 19 fixes the third, with excess with respect to the borehole 190 equipped rivet 23 in the manner of a terminal.
  • the borehole 190 provided in the third tab 19 with the slots 191, 192 enables the semiconductor light source arrangement 1 to be accurately positioned on the carrier 2, the mechanical forces caused by the excess of the third rivet 23 being compensated by the two slots 191, 192.
  • the other two, clip-like tabs 17, 18 with the associated bores 170, 180 and the corresponding slots 171, 181 allow the compensation of mechanical forces caused by differential thermal expansion of the semiconductor light source assembly 1 and support 2 or by inaccurate placement of the rivets 21, 22, 23 with respect to the bores 170, 180, 190. Even with very accurate positioning of the rivets 21, 22, 23 with respect to the holes 170, 180, 190 and in the cold state (at room temperature of 22 ° C) by the interference fit by means of the aforementioned holes and rivets play-free attachment of the semiconductor light source assembly 1 on the Carrier 2 guaranteed.
  • the carrier 2 is designed as a heat sink and consists of a material with high thermal conductivity, for example, aluminum or copper.
  • the rivets 21, 22, 23 are each arranged in a borehole 200 of the carrier 2 with a press fit.
  • the three drill holes 200 for the rivets 21, 22, 23 are arranged in a fictitious triangle on a flat surface of the carrier 2 and form a reference for the spatial position and orientation of the semiconductor light source arrangement 1.
  • the illumination device according to the second embodiment of the invention is shown.
  • the illumination device according to the second embodiment of the invention is largely identical to the illumination device according to the first embodiment of the invention described above. It differs from the illumination device according to the above-described first embodiment of the invention only in that the illumination device according to the second embodiment of the invention additionally to the semiconductor light source arrangement 1 and the carrier 2 still has an optical system 3 which is arranged downstream of the semiconductor light source arrangement 1.
  • the semiconductor light source arrangement 1 and the carrier 2 are identical in both embodiments of the invention. Therefore, for the description of the semiconductor light source device 1 and the carrier 2 according to the second embodiment of the invention, reference is made to the corresponding description of the semiconductor light source device 1 and the carrier 2 according to the first embodiment of the invention.
  • the optic 3 is made of transparent plastic material and has a frusto-conical portion 31 and a flat base portion 30.
  • the carrier 2, the semiconductor light source arrangement 1 and the optics 3 are arranged one above the other in the manner of a sandwich, the semiconductor light source arrangement 1 being arranged between the carrier 2 and the optic 3 in such a way that the light emitted by the light-emitting diode chips 11 enters the frustoconical portion 31 of the optic 3 is coupled.
  • the base section 30 of the optics 3 is provided with three boreholes 32, 33, 34, which correspond to the boreholes 170, 180, 190 in the plastic housing 10 of the semiconductor light source arrangement 1.
  • the boreholes 32, 33, 34 in the base portion 30 of the optic 3 have the same shape and orientation as the bores 170, 180, 190 in the plastic housing 10 of the semiconductor light source assembly 1.
  • the boreholes 32, 33, 34 in the base portion 30 of the optic 3 with identically formed slots 321, 331, 341 and 342 as the holes 170, 180, 190 in the plastic housing 10 of the semiconductor light source assembly 1 equipped.
  • the rivets 21 ', 22', 23 'in the illumination device according to the second embodiment of the invention in each case with a press fit both in a borehole 170, 180 and 190 of the support member 10 of the semiconductor light source assembly 1 and in a borehole 32, 33 and 34 arranged in the base portion 30 of the optical system 3.
  • the diameter of the portion of the rivet 21 ', 22', 23 'stuck in the bores 170, 180 or 190 of the semiconductor light source arrangement 1 and in the boreholes 32, 33 and 34, respectively, of the optics 3 is slightly larger than the diameter of these bores 170, 180 , 190, 32, 33 and 34, respectively. In this way, a common interference fit of the semiconductor light source arrangement 1 and the optical system 3 on the carrier 2 is achieved.
  • optics 3 Details of the optics 3, in particular the shape and arrangement of the boreholes 32, 33, 34 are in the FIG. 5 shown schematically.
  • the holes 32, 33, 34 form the corners of a fictitious triangle.
  • Two opposing boreholes 32, 33 are each provided with a slot 321, 331 extending from the edge of the corresponding borehole 32, 33, respectively, to an outer edge of the base portion 30 of the optic 3. That is, through the slots 321, 331, the borehole 32, 33 extends to the outer edge of the of the base portion 30 of the optic 3.
  • these portions of the base portion 30 provided with the bores and slots receive the effect of a staple clasping the respective rivet 21 'and 22' respectively, which are oversized with respect to the corresponding borehole 31 and 32, respectively.
  • the third borehole 34 arranged in the base portion 30 of the optic 3 has two slots 341, 342 which are diametrically opposed to one another and respectively arranged at the edge of the borehole 34, but do not extend to an outer edge of the base portion 30.
  • the two diametrically opposed slots 341, 342 and the borehole 34 provide this, provided with the third borehole and the two slots portion of the base portion 30 of the optics 3 the action of a clamp for fixing the excessively with respect to the borehole 34 equipped rivet 23 '.
  • the borehole 34 provided with the slots 341, 342 in the base section 30 of the optic 3 enables an exact positioning of the optic 3 on the support 2, wherein the mechanical forces caused by the excess of the third rivet 23 'on the optic 3 from the two slots 341, 342 be compensated.
  • the other two holes 32, 33 and the corresponding slots 321, 331 allow the compensation of mechanical forces caused by differential thermal expansion of the optics 3, semiconductor light source assembly 1 and support 2 or by inaccurate placement of the rivets 21 ', 22', 23 'respect the boreholes 32, 33, 34 are caused. Even with very accurate positioning of the rivet 21 ', 22', 23 'with respect to the holes 32, 33, 34 and in the cold state (at room temperature of 22 ° C) by means of the press fit the aforementioned holes and rivets ensures a backlash-free attachment of the optics 3 on the support 2.
  • the boreholes 32, 33, 34 and the slots 321, 331, 341, 342 in the base portion 30 of the optic 3 are placed just above the bores 170, 180, 190 and the slots 171, 181, 191, 192 and the rivets 21 ' , 22 ', 23' are each press-fitted both in a borehole 32, 33 and 34 in the base portion 30 of the optic 3 and in a borehole 170, 180 and 190 in the plastic housing 10 of the semiconductor light source assembly 1.
  • the rivets 21, 22, 23 and 21 ', 22', 23 ' are made in both embodiments of metal, such as copper or aluminum.
  • the excess of the rivets 21, 22, 23 or 21 ', 22', 23 'with respect to the bores 170, 180, 190 or 32, 33, 34 in the semiconductor light source arrangement 1 or in the optics 3 is in the range of 0, 02 mm to 0.06 mm. That is, the diameter of the portion of the rivet inserted in the aforesaid bores is 0.02 mm to 0.06 mm larger than the diameter of the aforementioned bores.
  • the rivets 21, 22, 23 and 21 ', 22', 23 ' are tapered at one end, to better introduce them into the holes can. In Figure 6, this fact is shown schematically with reference to the rivet 23 '.
  • the semiconductor light source arrangement 1 comprises not only light-emitting diode chips 11, but also any desired ones other semiconductor light sources, such as any type of light-emitting diodes and laser diodes, which optionally emit white or colored light with the aid of phosphor during their operation, as well as organic light-emitting diodes (OLED).
  • a plurality of semiconductor light source arrangements can be mounted on the carrier 2.
  • the optics 3 includes any other embodiments, such as optical lenses, total reflection optics (TIR optics), optical fibers and reflectors.
  • the optic 3 may be made of transparent material such as glass, sapphire and plastic, or may be metallic or dichroic in the case of a reflector. Furthermore, the optics may have at a light entrance surface or light exit surface or at a light reflection surface phosphor which causes a wavelength conversion of the light.
  • the optics 3 may be arranged downstream of one or more semiconductor light source arrangements 1.
  • the support 2 need not necessarily be made of copper or aluminum, but may be made of another good heat conductive metal or of a ceramic having good thermal conductivity, such as alumina or aluminum nitride ceramic.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
EP13725083.3A 2012-04-17 2013-04-12 Beleuchtungseinrichtung Active EP2839209B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012206332A DE102012206332A1 (de) 2012-04-17 2012-04-17 Beleuchtungseinrichtung
PCT/EP2013/057723 WO2013156411A1 (de) 2012-04-17 2013-04-12 Beleuchtungseinrichtung

Publications (2)

Publication Number Publication Date
EP2839209A1 EP2839209A1 (de) 2015-02-25
EP2839209B1 true EP2839209B1 (de) 2017-02-01

Family

ID=48520901

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13725083.3A Active EP2839209B1 (de) 2012-04-17 2013-04-12 Beleuchtungseinrichtung

Country Status (5)

Country Link
US (1) US9739459B2 (zh)
EP (1) EP2839209B1 (zh)
CN (1) CN104246362B (zh)
DE (1) DE102012206332A1 (zh)
WO (1) WO2013156411A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107620871A (zh) * 2017-10-30 2018-01-23 赛尔富电子有限公司 一种led光源模块及其制造方法

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DE102010031312A1 (de) 2010-07-14 2012-01-19 Osram Ag Befestigungselement, Leuchtmodul und Leuchtvorrichtung
DE102010039120A1 (de) * 2010-08-10 2012-02-16 Osram Ag Leiterplatte mit mindestens einer Halbleiterlichtquelle, Auflage für die Leiterplatte, System aus der Leiterplatte und der Auflage sowie Verfahren zum Befestigen der Leiterplatte an der Auflage
DE102011102550A1 (de) * 2010-11-18 2012-05-24 Osram Ag Gehäuse zur Aufnahme mindestens einer Lichtquelle
WO2012095905A1 (ja) 2011-01-14 2012-07-19 パナソニック株式会社 照明用光源
US8807793B2 (en) * 2011-09-26 2014-08-19 IDEAL, Industries, Inc. Device for securing a source of LED light to a heat sink surface
DE202012101344U1 (de) * 2012-04-12 2012-06-12 Up Consulting Gbr ( Vertreten Durch Den Gesellschafter: Bohumir Opatril, 59262 Nedvedice, Cz) Beleuchtungseinrichtung und LED-Beleuchtungssystem
JP5614732B2 (ja) * 2012-12-26 2014-10-29 Smk株式会社 Ｌｅｄモジュール基板用コネクタ

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WO2013156411A1 (de) 2013-10-24
US20150077988A1 (en) 2015-03-19
DE102012206332A1 (de) 2013-10-17
CN104246362B (zh) 2017-11-03
US9739459B2 (en) 2017-08-22
EP2839209A1 (de) 2015-02-25

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