CN107620871A - 一种led光源模块及其制造方法 - Google Patents

一种led光源模块及其制造方法 Download PDF

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Publication number
CN107620871A
CN107620871A CN201711041838.5A CN201711041838A CN107620871A CN 107620871 A CN107620871 A CN 107620871A CN 201711041838 A CN201711041838 A CN 201711041838A CN 107620871 A CN107620871 A CN 107620871A
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China
Prior art keywords
light source
source module
led light
rivet
wire
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Pending
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CN201711041838.5A
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Inventor
刘小云
董建国
赵文展
黄铜华
童立洪
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Ningbo Self Electronics Co Ltd
Self Electronics Co Ltd
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Self Electronics Co Ltd
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Priority to CN201711041838.5A priority Critical patent/CN107620871A/zh
Publication of CN107620871A publication Critical patent/CN107620871A/zh
Priority to EP18197269.6A priority patent/EP3478036B1/en
Priority to US16/151,646 priority patent/US20190132916A1/en
Pending legal-status Critical Current

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Abstract

一种LED光源模块及其制造方法，所述LED光源模块包括一个双面电路板，以及两个电性连通所述双面电路板的两侧的铆钉。所述铆钉包括一个钉头，一个钉杆，以及一个连接所述钉头与钉杆的过渡段。在沿所述电路基板厚度方向的截面上所述钉头的长度大于所述钉杆的宽度，且所述过渡段为一梯形。所述梯形的短边与所述钉杆连接，所述梯形的长边的长度小于所述钉头的长度。所述钉头与所述第一导线布图电线连接，所述钉杆通过焊锡与所述第二导线布图电性连接。通过所述铆钉来电性连接所述第一、第二导线布图，不使用污染较严重的沉铜工艺，从而可以降低在污染治理上的费用，同时可以使用较低级材料的电路基板，进而可以提高所述具有该LED光源模块的灯具的竞争力。

Description

一种LED光源模块及其制造方法
技术领域
本发明涉及一种照明系统，特别是一种可以提供特定照明效果的LED光源模块及其制造方法。
背景技术
在一般的日常生活中，随处都可见到各种照明设备，例如，日光灯、路灯、台灯、艺术灯等。在上述的照明设备中，传统上大部分是以钨丝灯泡作为发光光源。近年来，由于科技日新月异，已利用发光二极管(LED)作为发光来源。甚者，除照明设备外，对于一般交通号志、广告牌、车灯等，亦都改为使用发光二极管作为发光光源。如前所述，使用发光二极管作为发光光源，其好处在于省电，且亮度更大，故于使用上已逐渐普通化。
随着照明技术的发展，人们对光源的要求越来越高，特别是条形灯具。条形灯具是将多个LED芯片电性连接设置在一条条形电路板上。然而，为了提高电源的适用性，比如电源的输出为36伏，但是条形灯具的额定电压是12伏，或24伏等等，此时该条形灯具上则需要设置一些电子元器件来将该36伏的输入电压轮换为12伏或24伏，而这些电子元器件与LED芯片将分别电性连接设置在电路板的两侧面，即双面板。该双面电路板的连接方法通常使用沉铜工艺，即在电路板的两侧之间开设一个通孔，然后在该通孔中沉积作为导线的铜，从而将电路格的两侧面上的电子元件电性连接起来。
然后，随着环境保护的要求越来越严，沉铜工艺这种污染较严重的工艺方法使得所制造出的电路板价格很高，同时由于在沉铜工艺中，所需要的温度较高，适用于该沉铜工艺的电路板的制作材料最少也要玻纤布等材料较为昂贵的基材，而不可以是复合板等价格较便宜的基板。这也使得现有的双面板价格较高，不利用降低成本，提高产品竞争力。
发明内容
有鉴于此，有必要提供一种有利于降低成本的LED光源模块及其制造方法，以克服上述不足。
一种LED光源模块，其包括一个双面电路板，以及两个电性连通所述双面电路板的两侧的铆钉。所述双面电路板包括一个电路基板，至少一条设置在所述电路基板一侧的第一导线布图，至少一个设置在所述电路基板另一侧的第二导线布图，至少一个开设在所述第一导线布图与第二导线布图之间的穿孔。所述铆钉穿设在所述穿孔中以电性连通所述第一、第二导线布图。所述铆钉包括一个钉头，一个钉杆，以及一个连接所述钉头与钉杆的过渡段。在沿所述电路基板厚度方向的截面上所述钉头的长度大于所述钉杆的宽度，且所述过渡段为一梯形。所述梯形的短边与所述钉杆连接，所述梯形的长边的长度小于所述钉头的长度。所述钉头与所述第一导线布图电线连接，所述钉杆通过焊锡与所述第二导线布图电性连接。
进一步地，所述电路基板由复合板制成，该复合板由纸质材料与纤维材料复合而成。
进一步地，所述钉杆的长度大于所述电路基板的厚度。
进一步地，所述钉杆的宽度小于所述穿孔的直径。
进一步地，所述钉杆的自由端为锥形。
进一步地，所述铆钉由金属制成。
进一步地，所述LED光源模块还包括多个电性连接在所述双面电路板一侧的LED芯片，以及多个电性连接在所述双面电路板另一侧的电子元器件，该LED芯片与第一导线布图电性连接，该电子元器件与第二导线布图电性连接。
一种LED光源模块的制造方法，其包括如下步骤：
提供一个如上所述LED光源模块的双面电路板；
提供一台贴片机，该贴片机包括至少一个吸嘴安装装置，至少一个安装在所述吸嘴安装装置上的吸嘴，以及一个电路板放置台，所述吸嘴包括一个中空筒体，以及设置在所述中空筒体的自由端上的台阶部，在沿所述中空筒体的轴线的截面上，所述台阶部的长度与所述钉头的长度相当；
提供需要焊接到所述双面电路板上的电子元器件、铆钉、LED芯片，以及焊接所述电子元器件、铆钉、LED芯片与第一、第二导线布图的锡膏；
将所述双面电路板放置在所述电路板放置台上；
由所述贴片机为所述双面电路板的设置有第二导线布图的一侧铺设锡膏，并贴设电子元器件；
进行回流焊以使所述电子元器件与所述第二导线布图电性连接；
由所述贴片机为所述双面电路板的设置有第一导线布图的一侧铺设锡膏，并贴设LED芯片，同时合适所述吸嘴吸取所述铆钉并将该铆钉插入所述穿孔中；
进行回流焊以使所述LED芯片与所述第一导线布图电性连接，并使所述铆钉的钉头与第一导线布图电性连接并固定；
对伸出设置有第二导线布图的一侧的所述铆钉的钉杆进行补焊以电性连接所述铆钉与所述第二导线布图以完成所述LED光源模块的组装。
进一步地，所述补焊由手工完成。
进一步地，所述台阶部沿所述中空筒体的轴线方向上的高度与所述钉头的高度相当。
与现有技术相比，本发明的LED光源模块的双面电路板通过所述铆钉来电性连接所述第一、第二导线布图，不使用污染较严重的沉铜工艺，从而可以降低在污染治理上的费用，同时在组装所述的铆钉时，不需要像沉铜工艺的高温，从而可以使用较低级材料的电路基板，如含有纸基的复合基板，从而可以在材料方面降低成本，进而可以降低所述LED光源模块的综合成本，以提高所述具有该LED光源模块的灯具的竞争力。
附图说明
以下结合附图描述本发明的实施例，其中：
图1为本发明所提供的一种LED光源模块的结构示意图。
图2为图1的LED光源模块沿A-A线的剖面结构示意图。
图3为使用贴片机组装所述图1的LED光源模块的结构示意图。
图4为所述贴片机所使用的吸嘴的剖面结构示意图。
图5为图1的LED光源模块的制造流程图。
具体实施方式
以下基于附图对本发明的具体实施例进行进一步详细说明。应当理解，此处所描述的具体实施例仅作为实施例，并不用于限定本发明的保护范围。
请参阅图1至图2，其为本发明所提供的一种LED光源模块100的结构示意图。所述LED光源模块100包括一个双面电路板10，以及至少一个电性连通所述双面电路板10的两侧的铆钉20，多个电性连接在所述双面电路板10一侧的LED芯片30，以及多个电性连接在所述双面电路板10另一侧的电子元器件40。可以想到的是，所述LED光源模块100还包括其他功能模块，如接插组件，串联组件等等，其为本领域技术人员所习知的技术，在此不再一一详细说明。
所述双面电路板10包括一个电路基板11，至少一条设置在所述电路基板11一侧的第一导线布图12，至少一个设置在所述电路基板11另一侧的第二导线布图13，以及至少一个开设在所述第一导线布图12与第二导线布图13之间的穿孔14。所述电路基板11可以是由复合板制成，该复合板可以由纸质材料与纤维材料复合而成，如环氧玻璃布纸基板材系列。所述纤维材料可以为玻璃布，以及合成纤维等等。当然所述电路基板11还可以为更高级的不掺杂纸基的玻璃布基板等等。所述第一导线布图12与所述第二导线布图13具有相同的结构及工作原理，在此仅以第一导线布图12为例来说明。所述第一导线布图12首先通过压延铜箔工艺或电解铜箔工艺将一层铜设置在所述电路基板11上。然后再通过蚀该工艺做出所要的电路连接线路，最后在该设置有铜箔的电路基板的表面上涂覆一层绝缘层，而将需要设置电子元件的位置露出来，以让后续工序将电子元件设置在该第一导线布图12上，以达到电性连接的目的。所述第一、第二导线布图12、13可以有相同的布图设计，也可以有不同的布图设计。在本实施例中，所述第一、第二导线布图12、13具有不同的布图设计，以电性连接不同的电子元件。当然可以理解的是，根据需要，所述第一、第二导线布图12、13可以具有一条，也可以设置多条。在本实施例中，所述双面电路板10在电路基板11的两侧分别设置有两条第一导线布图12和两个第二导线布图13，以形成正、负极回路。所述穿孔14开设在所述第一、第二导线布图12、13之间，即该穿孔14依次穿过所述第一导线布图12、电路基板11，以及第二导线布图13。可以想到的是，所述穿孔14不能开设在没有所述第一、第二导线布图12、13的位置上。所述穿孔14的位置可以根据实际的需要来设置，具体在本实施例中，所述穿孔14设置在所述第一、第二导线布图12、13的自由端。所述穿孔14的数量由所述第一、第二导线布图12、13的数量决定。在本实施例中，由于所述第一、第二导线布图12、13各有两条，因此所述穿孔14也具有两个。
所述铆钉20包括一个钉头21，一个钉杆22，以及一个连接所述钉头21与钉杆22的过渡段23。所述铆钉20的结构大小很重要，因此其结构大小不仅影响电性连接的可靠性，也将影响生产过程的可靠性与自动化性能。因为所述铆钉20起电性连接的作用，因此该铆钉20应由金属制成。在本实施例中，所述铆钉20由铜制成。在沿所述电路基板11的厚度方向的截面上所述钉头21的长度大于所述钉杆22的宽度，且所述过渡段23为一梯形。所述梯形的短边与所述钉杆22连接。所述梯形的长边的长度小于所述钉头21的长度。所述钉头21与所述第一导线布图12电线连接，所述钉杆22通过焊锡与所述第二导线布图13电性连接。为了可以通过焊锡焊接所述钉杆22与第二导线布图13，所述钉杆22的长度大于所述电路基板11的厚度。在垂直于所述电路基板11的厚度方向的截面上，所述钉头21在本实施例中为圆形。可以想到的是，所述钉头的形状还可以为其他形状，如方形等。但可以理解的是圆形钉头21最有利于产业化。
为了产业化，所述铆钉20被组装到所述双面电路板10的穿孔14中，其一般是通过贴片机，以及贴片机上的吸嘴将铆钉20吸拾起来并插设入所述穿孔14中。所述贴片机为一种现有技术，为本领域技术人员所习知，在此不再赘述。因此所述钉杆20的宽度要小于所述穿孔14的直径，以便兼容一定范围内所述贴片机的误差，即在当贴片机的误差位于所述钉杆20的宽度与穿孔14的直径的差的范围内，所述钉杆20皆可插入所述穿孔14中。设置所述过渡段23的目的在于加强所述钉头21与钉杆22的连接强度，同时在重力以及双面电路板10在贴片机工作时所具有的不可避免的抖动的作用下，有利于所述钉杆22的轴线与所述穿孔14的轴线相重合，从而有利于保证所述铆钉20的钉头21与第一导线布图12的电连接可靠性。进一步地，为了顺利将所述铆钉20插入所述穿孔14中，所述钉杆22的自由端为锥形。
所述LED芯片30为一种现有技术，其也通过贴片机与所述铆机20一起放置在所述双面电路板10的第一导线布图12上，然后再通过回流焊即可将该LED芯片30焊接在所述第一导线布图12上。
所述电子元器件40设置在所述电路基板11的另一侧，并与所述第二导线布图13电性连接。可以想到的是，为了达到某种降压分流的目的，所述电子元器件40可以包括诸如电阻、电容、三极管、二极管等等元器件，其结构及工作原理，以及连接方法应当为本领域技术人员所习知，在此不再一一详细说明。
如图5所示，其为所述LED光源模块100的制造方法的流程图。所述LED光源模块100的制造方法包括如下步骤：
Step101：提供一个如上所述LED光源模块100的双面电路板10；
Step102：提供一台贴片机50，如图3所示，该贴片机50包括至少一个吸嘴安装装置51，至少一个安装在所述吸嘴安装装置51上的吸嘴52，以及一个电路板放置台53。请结合图4，所述吸嘴52包括一个中空筒体521，以及设置在所述中空筒体521的自由端上的台阶部522，在沿所述中空筒体521的轴线的截面上，所述台阶部522的长度与所述钉头21的长度相当；
Step103：提供需要焊接到所述双面电路板10上的电子元器件40、铆钉20、LED芯片30，以及焊接所述电子元器件、铆钉、LED芯片与第一、第二导线布图12、13的锡膏(图未示)；
Step104：将所述双面电路板10放置在所述电路板放置台53上；
Step105：由所述贴片机50为所述双面电路板10的设置有第二导线布图13的一侧铺设锡膏，并贴设电子元器件40；
Step106：进行回流焊以使所述电子元器件40与所述第二导线布图13电性连接；
Step107：由所述贴片机50为所述双面电路板10的设置有第一导线布图12的一侧铺设锡膏，并贴设LED芯片30，同时通过所述吸嘴52吸取所述铆钉20并将该铆钉20插入所述穿孔14中；
Step108：进行回流焊以使所述LED芯片30与所述第一导线布图12电性连接，并使所述铆钉20的钉头21与第一导线布图12电性连接并固定；
Step109：对伸出设置有第二导线布图13的一侧的所述铆钉20的钉杆22进行补焊以电性连接所述铆钉20与所述第二导线布图13以完成所述LED光源模块100的组装。
在步骤Step109中，所述补焊可以由手工完成，也可以由机器完成。
在步骤Step102中，所述台阶部522沿所述中空筒体521的轴线方向上的高度与所述钉头21的高度相当。贴片机50的行进方式主要有两种，一种为平行移动式，一种环形移动式。无论哪一种行进方式，吸嘴52都会带动被吸取的元件进行移动，而此移动速度较快，且从静止到移动，在惯性的作用下，被吸取的元件很容易掉落，特别是当所述铆钉20的体积很小时。在本实施例中，所述铆钉20的钉头21的直径只有1.0mm，而钉杆22的直径只有0.5mm。因此所述吸嘴52的自由端部设置所述台阶部522。当所述钉头21嵌入到该台阶部52中时，可以防止贴片机50的吸嘴安装装置51在行进过程中掉落所述铆钉20，从而可以保证加工的可靠性。
与现有技术相比，本发明的LED光源模块100的双面电路板10通过所述铆钉20来电性连接所述第一、第二导线布图12、13，不使用污染较严重的沉铜工艺，从而可以降低在污染治理上的费用，同时在组装所述的铆钉时，不需要像沉铜工艺的高温，从而可以使用较低级材料的电路基板11，如含有纸基的复合基板，从而可以在材料方面降低成本，进而可以降低所述LED光源模块100的综合成本，以提高所述具有该LED光源模块100的灯具的竞争力。
以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则的内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围的内。

Claims (10)

1.一种LED光源模块，其特征在于，所述LED光源模块包括一个双面电路板，以及两个电性连通所述双面电路板的两侧的铆钉，所述双面电路板包括一个电路基板，至少一条设置在所述电路基板一侧的第一导线布图，至少一个设置在所述电路基板另一侧的第二导线布图，至少一个开设在所述第一导线布图与第二导线布图之间的穿孔，所述铆钉穿设在所述穿孔中以电性连通所述第一、第二导线布图，所述铆钉包括一个钉头，一个钉杆，以及一个连接所述钉头与钉杆的过渡段，在沿所述电路基板厚度方向的截面上所述钉头的长度大于所述钉杆的宽度，且所述过渡段为一梯形，所述梯形的短边与所述钉杆连接，所述梯形的长边的长度小于所述钉头的长度，所述钉头与所述第一导线布图电线连接，所述钉杆通过焊锡与所述第二导线布图电性连接。
2.如权利要求1所述的LED光源模块，其特征在于：所述电路基板由复合板制成，该复合板由纸质材料与纤维材料复合而成。
3.如权利要求1所述的LED光源模块，其特征在于：所述钉杆的长度大于所述电路基板的厚度。
4.如权利要求1所述的LED光源模块，其特征在于：所述钉杆的宽度小于所述穿孔的直径。
5.如权利要求1所述的LED光源模块，其特征在于：所述钉杆的自由端为锥形。
6.如权利要求1所述的LED光源模块，其特征在于：所述铆钉由金属制成。
7.如权利要求1所述的LED光源模块，其特征在于：所述LED光源模块还包括多个电性连接在所述双面电路板一侧的LED芯片，以及多个电性连接在所述双面电路板另一侧的电子元器件，该LED芯片与第一导线布图电性连接，该电子元器件与第二导线布图电性连接。
8.一种LED光源模块的制造方法，其包括如下步骤：
提供一个如权利要求1至7任一项所述LED光源模块的双面电路板；
提供一台贴片机，该贴片机包括至少一个吸嘴安装装置，至少一个安装在所述吸嘴安装装置上的吸嘴，以及一个电路板放置台，所述吸嘴包括一个中空筒体，以及设置在所述中空筒体的自由端上的台阶部，在沿所述中空筒体的轴线的截面上，所述台阶部的长度与所述钉头的长度相当；
提供需要焊接到所述双面电路板上的电子元器件、铆钉、LED芯片，以及焊接所述电子元器件、铆钉、LED芯片与第一、第二导线布图的锡膏；
将所述双面电路板放置在所述电路板放置台上；
由所述贴片机为所述双面电路板的设置有第二导线布图的一侧铺设锡膏，并贴设电子元器件；
进行回流焊以使所述电子元器件与所述第二导线布图电性连接；
由所述贴片机为所述双面电路板的设置有第一导线布图的一侧铺设锡膏，并贴设LED芯片，同时合适所述吸嘴吸取所述铆钉并将该铆钉插入所述穿孔中；
进行回流焊以使所述LED芯片与所述第一导线布图电性连接，并使所述铆钉的钉头与第一导线布图电性连接并固定；
对伸出设置有第二导线布图的一侧的所述铆钉的钉杆进行补焊以电性连接所述铆钉与所述第二导线布图以完成所述LED光源模块的组装。
9.如权利要求8所述的LED光源模块的制造方法，其特征在于：所述补焊由手工完成。
10.如权利要求8所述的LED光源模块的制造方法，其特征在于：所述台阶部沿所述中空筒体的轴线方向上的高度与所述钉头的高度相当。
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