Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
  • H01L31/042—PV modules or arrays of single PV cells
  • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
  • H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
  • H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
  • H01L31/0264—Inorganic materials
  • H01L31/0296—Inorganic materials including, apart from doping material or other impurities, only AIIBVI compounds, e.g. CdS, ZnS, HgCdTe
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
  • H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
  • H01L31/0264—Inorganic materials
  • H01L31/032—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312
  • H01L31/0322—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312 comprising only AIBIIICVI chalcopyrite compounds, e.g. Cu In Se2, Cu Ga Se2, Cu In Ga Se2
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
  • H01L31/042—PV modules or arrays of single PV cells
  • H01L31/0445—PV modules or arrays of single PV cells including thin film solar cells, e.g. single thin film a-Si, CIS or CdTe solar cells
  • H01L31/046—PV modules composed of a plurality of thin film solar cells deposited on the same substrate
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
  • H01L31/042—PV modules or arrays of single PV cells
  • H01L31/0445—PV modules or arrays of single PV cells including thin film solar cells, e.g. single thin film a-Si, CIS or CdTe solar cells
  • H01L31/046—PV modules composed of a plurality of thin film solar cells deposited on the same substrate
  • H01L31/0465—PV modules composed of a plurality of thin film solar cells deposited on the same substrate comprising particular structures for the electrical interconnection of adjacent PV cells in the module
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
  • H01L31/1828—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIBVI compounds, e.g. CdS, ZnS, CdTe
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
  • Y02E10/00—Energy generation through renewable energy sources
  • Y02E10/50—Photovoltaic [PV] energy
  • Y02E10/541—CuInSe2 material PV cells
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
  • Y02E10/00—Energy generation through renewable energy sources
  • Y02E10/50—Photovoltaic [PV] energy
  • Y02E10/543—Solar cells from Group II-VI materials

Definitions

• the invention relates to the field of photovoltaic solar energy and more particularly to thin-film photovoltaic modules.
• a “thin layer” will be a layer having a thickness of less than 5 mm.
• a photovoltaic module comprises several solar cells placed in series. Indeed, the voltage generated at the terminals of a single solar cell, less than 1 volt, is generally too low for many devices. Serialization of many cells is therefore necessary. Thus, the voltage delivered by a photovoltaic module is of the order of 100 volts, for a hundred cells connected in series.
• the monolithic interconnection process for thin-film solar cells requires three etching steps, conventionally known as P1, P2, P3.
• the first step (P1) provides electrical isolation of two adjacent cells at the back-side electrode of the solar cells.
• the second step (P2) makes it possible to connect the electrode on the front face of a given cell to the electrode on the rear face of the adjacent cell.
• the third step (P3) consists of electrically isolating two adjacent cells at the electrode on the front face.
• Various techniques are implemented to achieve this monolithic interconnection process.
• etching techniques have the advantage that they can be used for a wide variety of materials deposited in thin layers, for example CdTe, a-Si, CZTS (of general formula Cu 2 ZnSn (S, Se) 4 ) or CIGS ( of general formula Cu (In, Ga) (Se, S) 2 ).
• the mechanical etching leads to the damage of the materials due to the presence of mechanical stresses on the layers, to the formation of debris on the surface of the layers near the etching line which can lead to short-term problems. circuit, as well as the wear of the etching tips.
• the quality of the mechanical etching is very sensitive to many parameters such as the morphology or the properties of the thin layers, as well as to the operating parameters of the etching tips.
• laser ablation is not easy to implement. Indeed, it can be seen that the removed material can melt and partially reseal the groove made by laser ablation. Thus, this technique does not provide a clean surface necessary to achieve a good quality electrical contact. It is also possible to use chemical etching methods. However, these methods are more complicated and more expensive to implement than conventional methods of mechanical etching or laser ablation.
• FIGS. 1a to 1f All these figures are sectional views and represent different stages of implementation of this method.
• Figure 1a shows a substrate 1 which can be made of various materials, including glass, or plastic or metal (eg steel, aluminum, or titanium), flexible or rigid.
• a substrate 1 which can be made of various materials, including glass, or plastic or metal (eg steel, aluminum, or titanium), flexible or rigid.
• this substrate is made of soda-lime glass whose thickness is a few millimeters and typically between 1 and 3 mm.
• a molybdenum layer 11 On this substrate 1 is deposited a molybdenum layer 11 whose thickness is generally between 100 nm and 2 ⁇ , and preferably of the order of 1 pm.
• This layer of molybdenum will be used to constitute the electrode on the back of the various cells forming the photovoltaic module.
• FIG. 1a shows that an etching step is performed after the deposition of the Mo layer. As indicated above, this etching is generally carried out, either mechanically or by laser ablation. It leads to the formation of a groove 110, devoid of molybdenum.
• This groove 110 makes it possible to define the rear face electrodes 11a and 11b of the adjacent cells 2 and 3 illustrated in FIG. 1f.
• This etching step corresponds to the step P1 mentioned above.
• the width of the groove 110 is generally between 10 m and 100 pm, and it is preferably of the order of 50 pm.
• FIG. 1b illustrates another step of the process in which a photovoltaic layer is produced and, for example, a crystallized CIGS layer. This layer has a function of light absorber.
• This step consists firstly in providing, on the rear face electrode 11, metal precursors of Cu, In, Ga, and elements of the Se and / or S type, used for the growth of the CIGS layer, p-type semiconductor material.
• They may be vacuum processes, such as evaporation or sputtering, or processes carried out at atmospheric pressure, such as electrodeposition, screen printing, doctor-blading, inkjet slit-coating.
• precursors of Cu, In and Ga can be deposited by cathodic sputtering.
• a layer of Se and / or S can then be deposited on the stack obtained by a vacuum method or a method implemented at atmospheric pressure.
• the chalcogen S or Se can be provided in the form of an elemental gas, in the form of gas (H 2 S or H 2 Se) or in the form of a layer of S or Evaporated, deposited on the surface of the layer metal precursors.
• H 2 S and H 2 Se gases are highly toxic, which greatly complicates their use on an industrial scale.
• the thickness of this layer of metal precursors is generally between 300 nm and 1 ⁇ m.
• the conversion of the constituents into a layer 12 of crystallized CIGS is carried out by high temperature annealing, referred to as selenization / sulfurization annealing, using a ramp for increasing the temperature between 1 ° C./s and 10 ° C./s.
• high temperature annealing referred to as selenization / sulfurization annealing
• a ramp for increasing the temperature between 1 ° C./s and 10 ° C./s Reference may in particular be made to US-5,578,503, which describes a method for obtaining a CuXY 2 type semiconductor in which X is In and / or Ga and Y is Se or S.
• This method comprises an annealing with a rapid heating step with a temperature ramp of at least 10 ° C / s to reach a temperature greater than or equal to 350 ° C, this temperature then being maintained for a duration of between 10 seconds and 1 hour.
• the temperature is generally between 400 and 600 ° C and preferably equal to about 500 ° C.
• the layer of constituents may be covered with a cover, preferably made of graphite.
• This cover makes it possible to ensure a partial pressure of Se and / or S that is greater during annealing, which leads to increasing the diffusion of Se and / or S in the metal precursors.
• a first indium and / or gallium deposition step at a temperature of between 350 and 500 ° C
• a second copper deposition step in which the temperature is increased to reach a higher recrystallization temperature of between 500 and 600; ° C
• a third indium and / or gallium deposition step in which this higher temperature is maintained. It should be noted that the entire process is carried out in an atmosphere of selenium and / or sulfur.
• FIG. 1c shows another step of implementing the method, in which an n-type semiconductor layer 13 is deposited on the CIGS layer, in order to form the pn junction.
• This layer may be deposited by chemical bath, by sputtering or by evaporation.
• It may for example be composed of CdS and deposited by chemical bath, the layer 13 having a thickness of a few tens of nm.
• Figure 1c also illustrates another process step which is optional. This step consists of depositing a layer 14 of intrinsic ZnO, the function of which will be explained later.
• This layer 14 is highly transparent in the solar spectrum and highly resistive. It is generally deposited by sputtering and has a thickness of a few tens of nm.
• the layer 13 prevents reactions between the ZnO and the CIGS and thus protects the layer 12 during the deposition of the layer 14.
• FIG. 1d illustrates a step of implementing the method in which another etching is performed, either mechanically or by laser ablation.
• This etching corresponding to step P2 mentioned above, consists of removing all the layers previously deposited on the 1 1 layer of molybdenum. This etching thus makes it possible to make an opening referenced 111 in FIG. 1d. It will make it possible to carry out a portion (P2) of the electrical interconnection between two adjacent cells.
• the width of the aperture 11 1 is generally between 50 ⁇ m and 150 ⁇ m and is preferably about 100 ⁇ m.
• the distance between the openings 110 and 11 is generally between 50 pm and 150 pm and is preferably equal to about 100 pm.
• FIG. 1e illustrates yet another step of implementing the method, in which a layer of a transparent conductive oxide 15 is deposited.
• This layer may be deposited by sputtering and have a thickness of a few hundred nm.
• It may especially be Al doped ZnO having a thickness of about 500 nm.
• This Al doped ZnO layer will be used to form a conductive transparent electrode referenced 15a for the front face electrode of the cell 2 and 15b for the front face electrode of the cell 3 (see FIG. 1f). It is generally accepted that the n-type semiconductor layer 13 may have discontinuities.
• the ZnO layer 14 then has the function of providing electrical insulation between the transparent conductive layer 15 and the layer 12 of CIGS.
• ITO tin-doped indium oxide
• silver nanowires silver nanowires
• carbon nanotubes could also be used to make this transparent conductive electrode.
• other deposit techniques could also be used.
• the distance between the openings 110 and 1 1 must be large enough to avoid too much interconnection resistance between the front face electrode 15a of the cell 2 and the rear face electrode 11b of the cell 3.
• FIG. 1f illustrates a last step of the method, in which another etching is performed in the stack of layers, in order to definitively isolate the cell 2 from the cell 3.
• This etching step corresponds to the step P3 mentioned above. It can be performed mechanically or by laser ablation and consists in removing all the layers deposited on the rear face electrode 11b.
• the opening 112 obtained makes it possible to electrically isolate the two cells 2 and 3 at their front face electrodes 15a and 15b.
• the opening 112 more generally has a width of between 10 ⁇ m and 200 ⁇ m, and is preferably of the order of 100 ⁇ m.
• Figure 1f also illustrates the path of the charges between the two adjacent cells 2 and 3.
• the front face electrode 15a of the first cell 2 makes it possible to collect on the front face the electric charges generated in this cell 2 and to route them towards the rear face electrode 11b of the adjacent cell 3.
• solutions have been proposed in the state of the art.
• Their object is to locally increase the conductivity of the CIGS material in order to conduct the conduction of the charges from the front face electrode of a given cell to the back-face electrode of the adjacent cell.
• the invention therefore aims to overcome the drawbacks of this type of etching by proposing another method for electrically isolating two adjacent solar cells at their backside electrodes, avoiding the achievement of mechanical etching, laser or chemical.
• the invention firstly relates to a method for producing an intermediate product for obtaining a photovoltaic module comprising a plurality of solar cells, this method comprising the following steps:
• step (b) depositing, on this localized layer, a layer of conductive material, this layer coating the localized layer.
• a layer of metal is also deposited locally on the substrate, so as to cover at least a portion of the substrate, distinct from the said at least one portion covered with a material of the type Se or S.
• the invention also relates to a method for obtaining a photovoltaic module comprising a plurality of solar cells in a thin-film structure, which successively comprises a substrate, an electrode on the rear face, a photovoltaic layer obtained by annealing from precursors. metal and a semiconductor layer, wherein:
• an annealing step is performed, which modifies said localized layer of material of the Se or S type so as to form, in the electrode on the rear face, a zone having a greater resistivity than the rest of the electrode on the rear face, this zone providing electrical insulation between two adjacent cells of the photovoltaic module.
• This method thus makes it possible to avoid the implementation of a type P1 etching step.
• the annealing step is carried out before obtaining the photovoltaic layer, with a temperature ramp of less than or equal to 1 ° C./s and at a temperature of between 225 and 300 ° C., for a period of time. between 1 and 5 minutes, said area of the electrode at the rear face being formed of a material resulting from the reaction of the conductive material with Se or S.
• the annealing step is carried out when the photovoltaic layer is obtained, at a temperature of between 400 and 650 ° C., with temperature ramps strictly greater than TC / s and up to at 15 ° C / s.
• said zone is formed of photovoltaic material.
• said zone is a groove.
• the process according to the invention consists in producing the intermediate product according to the variant according to the invention, according to which, during step (a), is also deposited locally on the substrate, a layer of a metal, so as to cover at least a portion of the substrate, separate from said at least a portion covered with a material of the Se or S type.
• the obtaining of the photovoltaic layer further leads to the formation, in this layer, of a zone of a conductive material, this zone providing the electrical connection between the front face electrode of a cell and the the backside electrode of an adjacent cell of the photovoltaic module.
• the method according to the invention also makes it possible to avoid the implementation of a type P2 etching step.
• the invention also relates to a photovoltaic module comprising a plurality of solar cells connected in series on a common substrate, each cell comprising a light-transparent front face electrode and a back-face electrode spaced from the front electrode. before by a photovoltaic layer and another semiconductor layer, for creating a pn junction with the photovoltaic layer, wherein the back-face electrodes of two adjacent cells are electrically isolated by an area of the back-face electrode which is located between the two cells and has a higher resistivity than the rest of the electrode on the back.
• said zone is formed of a material resulting from the reaction of the conductive material of the rear-face electrode with an element taken between Se and S.
• this zone is formed of the same material as the photovoltaic layer.
• this zone is a groove.
• the photovoltaic module according to the invention also comprises, in the photovoltaic layer and between two adjacent cells, an area of conductive material that makes the electrical connection between the electrode on the front of a cell and the electrode on the back of an adjacent cell.
• the invention also relates to an intermediate product for obtaining a photovoltaic module according to the invention, comprising successively on a substrate, a localized layer of Se or S and a layer of conductive material encapsulating this localized layer.
• the intermediate product making it possible to obtain the other embodiment of the photovoltaic module according to the invention also comprises, on the substrate, a localized layer of a metal, distinct from the localized layer of Se or S.
• FIGS. 2a to 2h show different stages of implementation of the method according to the invention
• FIGS. 3 and 4 illustrate variants of a step of the method according to the invention, corresponding to FIG. 2d,
• FIGS. 5a to 5f show different stages of implementation of another method according to the invention.
• Figure 6 shows a variant of the method illustrated in Figures 5a to 5f.
• Figure 2a shows a substrate 4 which can be made of various materials, typically glass, plastic or metal.
• this substrate is made of soda-lime glass whose thickness is a few millimeters and, for example, 3 mm.
• a layer 7 of selenium or sulfur is deposited in a localized manner.
• FIG. 2a shows only one part 400 of the substrate 4 covered with a material of the Se or S type.
• the substrate may be covered with a material of the Se or S type, insofar as a plurality of photovoltaic cells are intended to be made on the substrate 4.
• this layer can be deposited by evaporation under vacuum through a mechanical mask.
• it may be an electroplated nickel mask having a number of slots which is a function of the number of cells of the photovoltaic module to be produced.
• Each slot may have a width of between 50 and 150 ⁇ m, and preferably equal to 100 ⁇ m.
• the layer 7 may also be obtained by a printing method, of the slit-coating, screen-printing or ink-jet type, for example using an ink based on nanoparticles of Se or S, dispersed in an organic solvent.
• Such a printing method is preferably used because its implementation entails lower costs than a vacuum implementation method.
• FIG. 2b illustrates another step of the method in which a metal layer 41 forming a rear-face electrode is deposited on the substrate 4 for the different cells of the photovoltaic module that will be obtained by the method according to the invention.
• This layer 41 is continuous; it thus covers the substrate 4 in a uniform manner.
• This layer is for example made of molybdenum and its thickness is between 100 nm and 2 pm and in particular equal to 500 nm.
• the deposition of the molybdenum layer may in particular be carried out by sputtering.
• the metal layer 41 coats the localized layer 7 of Se or S.
• the stack illustrated in Figure 2b is an intermediate product that can be achieved independently of the process steps that are implemented later.
• this intermediate product can be produced by the manufacturer of the substrate 4.
• FIG. 2c illustrates a process step in which, in the form of a layer 42, the precursors which lead to the formation of the photovoltaic layer are provided.
• the ratios of the elements Cu, In and Ga are conventionally chosen so that:
• This layer 42 may comprise essentially metal precursors.
• the sulfur or selenium is then supplied in gaseous form. They can also be provided in the form of a layer deposited on the layer of metal precursors.
• the layer 42 may comprise both metal precursors and selenium or sulfur.
• Figure 2d illustrates another process step in which both the localized layer 7 and the layer 42 are transformed.
• an annealing step at a moderate temperature comprises a rise in temperature with ramps less than or equal to 1 ° C./s and preferably of the order of 0.1 ° C./s, to reach a temperature of between 225 and 300 ° C. and of Preferably, the order of 250 ° C.
• the stack is subjected to this temperature for a period of between 1 and 5 min.
• This annealing step can be carried out under vacuum or in a neutral atmosphere.
• MoSe2 grows in a compact hexagonal structure whose axis c is parallel to the surface of the layer 41.
• it is the sulfur present in layer 7 which reacts with the molybdenum layer 41 to form MoS 2 .
• the thickness of the molybdenum layer and the amount of selenium or sulfur, provided by the layer 7, will be adjusted so that the molybdenum is converted into MoSe 2 or MoS 2 over the entire thickness of the layer 41.
• a zone 71 formed of MoSe 2 or MoS 2 is formed in the molybdenum layer 41.
• the thickness of the selenium layer 7 will be between 1 and 2 ⁇ m with a width of between 50 and 150 ⁇ m and preferably equal to 100 ⁇ m, depending on the porosity of the molybdenum layer, to correspond to the theoretical stoichiometry of MoSe 2 .
• the thickness of the selenium layer 7 will be about 1.8 ⁇ m. This thickness will be about 1 pm when the layer 7 is sulfur.
• the resistivity of MoSe 2 or MoS 2 in the direction parallel to the c axis is much greater than that of molybdenum. Indeed, the resistivity ratio is greater than 10.
• the zone 71 of the layer 41 therefore has a higher resistivity than the rest of the layer 41 which will constitute the electrode on the rear face of the cells of the photovoltaic module.
• This zone 71 will thus make it possible to define the rear face electrodes 41a and 41b of two adjacent cells, referenced 5 and 6 in FIG. 2h, and to isolate them electrically.
• the formation of this region 71 of the electrode on the rear face having a higher resistivity makes it possible to avoid the etching step P1 and thus to eliminate the disadvantages associated with this etching step.
• FIG. 2d illustrates an embodiment of the method in which the annealing step leading to the formation of the zone 71 of higher resistivity is integrated in the annealing process by which the metal precursors present in the layer 42 are converted.
• a layer 46 of photovoltaic material for example CIGS or CZTS, thanks to the contribution of selenium or sulfur.
• a material of the CZTS type may in particular consist of Cu 2 ZnSnSe 4 , Cu 2 ZnSnS 4 or Cu 2 ZnSn (S, Se) 4 , depending on whether selenium, sulfur or a mixture of the two components is provided.
• the conversion of the metal precursors begins during the annealing step at moderate temperature.
• various compounds based on Cu, Ga and Se are formed.
• complete conversion to CIGS or CZTS is not performed.
• the temperature of the substrate 4 is further increased to achieve annealing at a higher temperature for crystallization (transformation) of the metal precursors in CIGS or CZTS.
• the latter is typically between 400 and 650 ° C and preferably equal to 550 ° C.
• the range of values for the temperature rise ramp is between 1 ° C / s and 15 ° C / s.
• the selenium or sulfur can be supplied during annealing in gaseous form or, before annealing, during the deposition of a layer of selenium or sulfur on the metal precursor layer or during deposition of the layer of metal precursors. In the latter case, the annealing is carried out under a neutral atmosphere.
• the annealing time is between 30 seconds and 30 minutes and is preferably of about 1 minute duration.
• the annealing step at moderate temperature, leading to the formation of the zone 71 in the layer 41, is well carried out after the deposition of the layer 42 comprising metal precursors.
• This annealing step is then performed after the process step illustrated in Figure 2c.
• the annealing step leading to the formation of the zone 71 in the layer 41 is carried out before the deposition of the layer 42.
• this annealing step is then performed between the process steps illustrated in FIGS. 2b and 2c.
• FIGs 2e to 2h describe the other steps of the method according to the invention, which are similar to those described with reference to Figures 1c to 1f.
• FIG. 2e shows an implementation step in which an n-type semiconductor layer 43 is deposited on the layer 46, in order to form the pn junction.
• the material used may be CdS, ZnS or Zn (O, S).
• FIG. 2e illustrates another step of the method which is optional and which consists in depositing a layer 44 of a transparent material on the layer 43.
• the material used may be ZnO.
• FIG. 2f illustrates an etching step corresponding to step P2 mentioned previously (FIG. 1d).
• This etching step corresponds to step P2 (FIG. 1d).
• the zone 71 and the opening 411 are located at a minimum distance of between 50 ⁇ m and 150 ⁇ m, and in particular of the order of 100 ⁇ .
• FIG. 2g illustrates another implementation step, in which a layer of a transparent and conductive oxide 45 is deposited on the layer 44 or directly on the layer 43 when the layer 44 is omitted.
• the thickness of the layer 45 is between 100 and 800 nm and preferably equal to about 500 nm.
• FIG. 2h illustrates a last step of the method, in which another etching is performed in the stack of layers.
• This etching step corresponds to step P3 (FIG. 1f).
• the opening 412 obtained is further removed from the zone 71 than the opening 411. It makes it possible to electrically isolate the two cells 5 and 6, at their front face electrodes 45a and 45b.
• the two cells 5 and 6 are spaced from each other by the zone 71 and the openings 411 and 412. This space is the interconnection zone.
• Figure 2h also illustrates the path of charges between two adjacent cells 5 and 6.
• the front face electrode 45a of the first cell 5 makes it possible to collect, on the front face, the electric charges generated in this cell 5 and to route them towards the rear face electrode 41b of the adjacent cell 6.
• the method which has just been described has the advantage of eliminating one of the etching steps conventionally provided for in the monolithic interconnection processes, in this case the step P1, and thus of being able to overcome the disadvantages associated with it. at this stage of engraving.
• no annealing is carried out at moderate temperature (225 ° C.-300 ° C.) enabling the constituent material of the layer 41 to react with the selenium or sulfur of the layer 7 to create an area 71 of MoSe 2 or MoS 2 .
• the material constituting the layer 41 is not necessarily molybdenum.
• the annealing is carried out so as to directly convert the metallic constituents present in the layer 42 into photovoltaic material, by means of the addition of Se or S.
• the annealing is typically carried out at a temperature between 400 and 650 ° C, this temperature being reached with a temperature ramp strictly greater than C / s and up to 15 ° C / s.
• the temperature rise ramp is of the order of 10 ° C./s and the temperature is of the order of 550 ° C.
• the high temperature annealing step is performed during the deposition of the layer 42 comprising metal precursors.
• this alternative implementation of the method also leads to the formation, in the layer 41, of a zone 410 having a greater resistivity than the remainder of the layer 41.
• This zone 410 will also perform electrical isolation between two adjacent cells of the photovoltaic module obtained by the method according to the invention.
• the high temperature annealing step is performed after the deposition of the layer 42 comprising metal precursors.
• metal layer 41 may be used to make the metal layer 41. It may especially be Ni or Pt.
• FIGS. 5a to 5f represent different stages of implementation of another method according to the invention.
• a layer 8 of metal As shown in Figure 5a, in this embodiment, is also deposited locally on the substrate 4, a layer 8 of metal.
• metal include copper, or an alloy based on Cu and Se or Cu and S.
• At least a portion 401 of the substrate is covered with a metal.
• the substrate may be covered with a metal, insofar as a plurality of photovoltaic cells are intended to be made on the substrate 4.
• the portions 401 of the substrate covered with a metal are distinct from the parts 400 coated with selenium or sulfur.
• the layer 8 may be deposited by various deposition processes and in particular those mentioned for layer 7, with regard to FIG. 2a.
• FIG. 5b illustrates a step of the method similar to that illustrated with reference to FIG. 2b and in which a metal layer 41, in particular molybdenum, is deposited on the substrate.
• This metal layer uniformly covers the substrate and coats both the localized Se or S layer and the localized metal layer.
• the stack illustrated in Figure 5b is an intermediate product that can be achieved independently of the process steps that will be implemented later.
• FIG. 5c illustrates a step of the method similar to that illustrated in FIG. 2c and in which are provided, in the form of a layer 42, the precursors which will lead to the formation of the photovoltaic layer.
• Figure 5d illustrates another process step in which both the localized layers 7 and 8 and the layer 42 are transformed.
• an annealing step at a moderate temperature is performed. This annealing step has been described with reference to Figure 2d and will not be described again in detail.
• a zone 71 formed of MoSe 2 or MoS 2 is formed in the molybdenum layer 41.
• This zone 71 has a higher resistivity than the rest of the layer 41 and thus makes it possible to define the rear face electrodes 41a and 41b of two adjacent cells and to isolate them electrically.
• the temperature of the substrate is further increased to achieve high temperature annealing, as described with reference to FIG. 2d, to convert the layer 42 in a layer 46 of photovoltaic material.
• the layer 46 because of the diffusion of copper in the layer 46, it locally has a percentage of copper greater than that present in the rest of the photovoltaic layer.
• the ratio Cu / (ln + Ga) o is greater than 1, this leads to the formation of compounds based on Cu and Se or S, known to be conductive. It may especially be compounds of the Cu 2 Se or Cui 8 Se type or of the Cu 2 S or Cui 8 S type.
• the thickness of the layer 42 and the amount of copper provided by the layer 8 will be adjusted so that, in the photovoltaic layer 46, the Cu / (ln + Ga) ratio is greater than 1.
• the thickness of the CIGS layer 46 is about 1.4 ⁇ m with a stoichiometry such that the Cu / (ln + Ga) ratio is about 0.8
• the thickness of the layer 8 is about 50 nm, with a width of between 50 and 150 ⁇ m and preferably equal to 100 ⁇ m, so that the ratio Cu / (ln + Ga) is greater than 1 in the zone 460.
• the thickness and the width of the layer 8 will be chosen as a function of the thickness of the layer 46 and the value of the Cu / (ln + Ga) ratio in the layer 46.
• the diffusion of the copper through the layer 41 begins, in practice, during the annealing step leading to the formation of the zone 71.
• this diffusion is relatively weak for temperatures below 400 ° C. and becomes greater when the annealing temperature is between 400 and 650 ° C.
• the annealing step leading to the formation of the zone 71 in the layer 41 can be carried out between the process steps illustrated in FIGS. 4b and 4c, that is to say before the deposit of the layer 42.
• the method can be implemented without annealing, allowing the molybdenum of layer 41 to react with the selenium or sulfur of layer 7 to obtain a zone 71 in MoSe 2 or in MoS 2 .
• the annealing is carried out so as to directly convert the metallic constituents present in the layer 42 into a photovoltaic material, thanks to the addition of Se or S.
• this annealing will lead to the formation of a zone 410 made of photovoltaic material (FIG. 3) or to the formation of a groove 461 devoid of conductive material and photovoltaic material (FIG. 4).
• This annealing at high temperature again leads to the diffusion of the copper present in the localized layer 8, through the layer 41, to form, inside the photovoltaic layer, a zone 460 of conductive material.
• the diffusion of the copper through the layer 41 is facilitated when the porosity of the layer 41 is important. This can be adjusted by changing the conditions under which spraying is performed.
• the spray pressure is a parameter of the porosity obtained.
• pressure ranges between 2 mTorr and 15 mTorr can advantageously be used to form the layer 41 by sputtering.
• the pressure will preferably be of the order of 10 mTorr.
• part of the copper of the localized layer 8 may still be present in the layer 41.
• the presence of copper in the layer 41 does not modify the behavior of this layer, since the copper is a conductive material, like the rest of the layer 41.
• this conductive zone 460 makes it possible to connect the electrode on the front face of a given cell to the electrode on the rear face of the adjacent cell and thus to eliminate the step of P2 etching, conventionally provided in the monolithic interconnection methods.
• FIGs 5e and 5f describe process steps similar to those described with reference to Figures 2e, 2f and 2g.
• FIG. 5e shows that three layers are deposited on the layer 46: an n-type semiconductor layer 43, an optional layer 44 of a transparent material and finally, a layer 45 of a transparent and conductive oxide.
• FIG. 5f illustrates a last step of the method, in which an etching step corresponding to step P3 is performed and leading to obtaining an opening 412.
• Figure 5f illustrates the path of the charges between two adjacent cells 5 and 6.
• the front-face electrode 45a of the first cell 5 makes it possible to collect, on the front face, the electric charges generated in this cell 5 and to route them towards the rear-face electrode 41b of the adjacent cell 6, through the conductive zone 460 of the layer 46.
• this mode of implementation of the method according to the invention makes it possible to avoid both the production of a type P1 etching and a type P2 etching.
• FIG. 6 illustrates a variant of another step of the method according to the invention, corresponding to FIG. 5e.
• FIG. 6 shows that the semiconductor layer 43 is not continuously deposited on the photovoltaic layer 46. On the contrary, the layer 43 has discontinuities 430 at the zones 460 of the photovoltaic layer 46.
• the localized deposition of the layer 43 may for example be carried out by ink jet. It has the advantage, compared to the embodiment illustrated in Figure 5e, to avoid the addition of a resistance that would come from the presence of the layer 43 between the electrode 45a and the area 460.
• germanium can also be integrated into the CZTS mesh to form a Cu 2 Zn (Sn, Ge) material (S, Se) 4, when a selenium mixture is added. and sulfur.
• the metallic constituents forming the layer 42 may also be of the Cu, Al and In type.
• the method according to the invention then leads to obtaining solar cells whose photovoltaic layer is made of a material of the Cu (ln, Al) (S, Se) 2 type .

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