EP2814311B1 - Ensemble de boîtier de protection et dispositif électronique le comprenant - Google Patents

Ensemble de boîtier de protection et dispositif électronique le comprenant Download PDF

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Publication number
EP2814311B1
EP2814311B1 EP14169710.2A EP14169710A EP2814311B1 EP 2814311 B1 EP2814311 B1 EP 2814311B1 EP 14169710 A EP14169710 A EP 14169710A EP 2814311 B1 EP2814311 B1 EP 2814311B1
Authority
EP
European Patent Office
Prior art keywords
cover
ground line
region
portions
shield
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP14169710.2A
Other languages
German (de)
English (en)
Other versions
EP2814311A2 (fr
EP2814311A3 (fr
Inventor
Ki-Youn Jang
Jeong-Ung Kim
Jung-Je Bang
Sang-Hyun An
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Priority to EP18157446.8A priority Critical patent/EP3358927B1/fr
Publication of EP2814311A2 publication Critical patent/EP2814311A2/fr
Publication of EP2814311A3 publication Critical patent/EP2814311A3/fr
Application granted granted Critical
Publication of EP2814311B1 publication Critical patent/EP2814311B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0052—Shielding other than Faraday cages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H05K9/0035—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids with retainers mounted beforehand on the PCB, e.g. clips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances

Definitions

  • the present disclosure relates generally to a shield can assembly. More particularly, the present disclosure relates to an electronic device including a shield can assembly.
  • an electronic device can include a printed circuit board (PCB) of various types as the electronic device's main board.
  • PCB printed circuit board
  • Diverse electronic function groups can be mounted on the PCB for various functions of the electronic device.
  • the electronic function group When the electronic function group operates, it can emit a harmful wave. Hence, an electromagnetic wave emitted by the electronic device is severely restricted.
  • the electromagnetic wave of the harmful wave is most common, and an electromagnetic compatibility (EMC) test is conducted to test whether the electromagnetic wave is acceptable in the environment.
  • EMC electromagnetic compatibility
  • the EMC test is divided into an electromagnetic interference (EMI) test and an electromagnetic susceptibility (EMS) test, which are strictly regulated due to its harmfulness to the human body. Accordingly, many devices are suggested to prevent in advance the electromagnetic wave in the electronic function group according to the strict regulation of the EMI test.
  • EMI electromagnetic interference
  • EMS electromagnetic susceptibility
  • a paint is spread using an EMI spray or vacuum deposition or one or more shield cans are mounted to shield one or more electronic function groups on the PCB.
  • the shield can is indispensable.
  • Various methods are suggested to mount the shield can on the PCB, which is largely divided into a mechanical coupling method, a clip-type coupling method, and a frame-type coupling method.
  • the mechanical coupling method fastens the shield can and the PCB using a plurality of screws.
  • the clip-type coupling method mounts a clip along an outer rim of the shield can to electrically connect with a ground line of the PCB and then secures the shield can to the clip.
  • the frame-type coupling method installs a separate frame to surround the components of the PCB and secures the shield can to the frame.
  • the electronic device adds more various functions in response to user's wants, the electronic device's size is miniaturized and slimmed.
  • the structure for securing the shield can which is indispensible to shield the harmful wave from the electronic function groups is under discussion in many aspects in view of efficient space usage.
  • US 2011/0211327 A1 discloses an interlocking EMI shield system.
  • This system comprises a first frame and a first cover that together constitute a first EMI shield, and a second frame and a second cover that together constitute a second EMI shield, which second shield is arranged adjacent to the first shield.
  • Each of the first and second cover comprises snaps that extend vertically from the cover surface towards the printed circuit board to which the corresponding frame is coupled.
  • the snaps of the shields may be offset or staggered such that a snap of the first EMI shield extends into an indentation of the second EMI shield, while a snap of the second EMI shield extends into an indentation of the first EMI shield.
  • a further shielding assembly is known from US 2010/0149780A1 .
  • the present invention provides an electronic device as defined in claim 1.
  • FIGURES 1 through 6 discussed below, and the various embodiments used to describe the principles of the present disclosure in this patent document are by way of illustration only and should not be construed in any way to limit the scope of the disclosure. Those skilled in the art will understand that the principles of the present disclosure may be implemented in any suitably arranged system or device.
  • the following description with reference to the accompanying drawings is provided to assist in a comprehensive understanding of exemplary embodiments of the disclosure as defined by the claims and their equivalents. It includes various specific details to assist in that understanding but these are to be regarded as merely exemplary. Accordingly, those of ordinary skill in the art will recognize that various changes and modifications of the embodiments described herein can be made without departing from the scope of the disclosure. In addition, descriptions of well-known functions and constructions may be omitted for clarity and conciseness.
  • an electronic device can be applied to various devices including a Printed Circuit Board (PCB) for mounting a plurality of electronic function groups.
  • the electronic device can employ various devices including a touch screen, that is, various devices such as Personal Digital Assistant (PDA), laptop computer, mobile phone, smart phone, netbook, Mobile Internet Device (MID), Ultra Mobile PC (UMPC), tablet PC, a navigation, and MP3 player.
  • PDA Personal Digital Assistant
  • MID Mobile Internet Device
  • UMPC Ultra Mobile PC
  • tablet PC a navigation, and MP3 player.
  • the PCB can be of, but not limited to, a rigid type or a flexible type. Even when the PCB is not included in the electronic device, the present disclosure is applicable to shield cans for shielding the electronic function group.
  • FIG. 1 illustrates an exploded view of a shield can assembly according to various exemplary embodiments of the present disclosure. While two shielding covers are depicted in FIG. 1 , two or more shielding covers may be applied to a single PCB.
  • the shield can assembly 1 can include a PCB 4 including a ground line 41, two covers 2 and 3 electrically connected to the ground line 41 to shield electronic function groups 42 mounted on the PCB 4, and a fixing means for fixing the covers 2 and 3 on the PCB 4.
  • the ground line 41 formed or mounted on the PCB 4 is disposed to be exposed on a top surface of the PCB 4, and can be electrically connected to a ground portion of the PCB 4.
  • the ground line 41 can include an enclosed portion corresponding to a rim of the two covers 2 and 3 disposed on the ground line 41.
  • the ground line 41 can include a first region A for accommodating the electronic function group 42 in a closed shape, and a second region B for accommodating the electronic function group 42 in a closed shape.
  • the first region A can be formed by a first ground line 411
  • the second region B can be formed by a second ground line 412.
  • the first ground line 411 and the second ground line 412 can be divided into the first region A and the second region B based on a boundary ground line 413.
  • the covers 2 and 3 can include the first cover 2 and the second cover 3.
  • the two covers 2 and 3 can be used to split and shield the electronic function groups 42 mounted on the PCB 4.
  • the first cover 2 can be secured to shield the first region A of the PCB 4.
  • the first cover 2 can be fixed to electrically connect to the first ground line 411 of the PCB 4 which defines the first region A with the first cover's 2 rim.
  • the second cover 3 can be secured to shield the second region B of the PCB 4.
  • the second cover 3 can be fixed to electrically connect to the second ground line 412 which defines the second region B with the second cover's 3 rim.
  • the first cover 2 can include a top surface 21 formed in at least the same size as the first region A, and a side surface 22 bending along the rim of the top surface 21 to a certain height. Hence, a space formed by the side surface 22 of the certain height from the top surface 21 can be used as an accommodation space for receiving the electronic function groups 42 when the first cover 2 is secured to the PCB 4.
  • the second cover 3 can include a top surface 31 formed in at least the same size as the second region B, and a side surface 32 bending along the rim of the top surface 31 to a certain height. Hence, a space formed by the side surface 32 of the certain height from the top surface 31 can be used as an accommodation space for receiving the electronic function groups 42 when the second cover 3 is secured to the PCB 4.
  • the first cover 2 and the second cover 3 can be formed of a metal material.
  • the first cover 2 and the second cover 3 can be formed of a conductive metal material such as SUS and aluminum.
  • the top surfaces 21 and 31, the side surfaces 22 and 32, a tension protrusion 321, to be explained, can be formed integrally using pressing or injection molding.
  • the fixing means can employ a fixing clip 8 for tightly receiving the side surfaces 21 and 31 of the covers 2 and 3.
  • the fixing clip 8 can be formed by bending a metal plate several times, and be fixed to the ground line 41 of the PCB 4.
  • the fixing clip 8 can include a side insertion portion 81 with an open upper surface to tightly receive the side surfaces 21 and 31 of the covers 2 and 3.
  • at least one tension protrusion 321 formed in the side surface 32 of the covers 2 and 3 is press-fitted to a tension hole 82 of the side insertion portion 81 of the fixing clip 8, to thus securely fix the covers 2 and 3 to the PCB 4 without separation.
  • the fixing clip 8 can be formed of a metal material and secured to the ground line 411 of the PCB 4 using soldering or bonding.
  • the fixing clip 8 may be mounted to the boundary ground line 413 which is the boundary of the first region A and the second region B.
  • the fixing clip 8 can be applied to protrusion portions 23 and 33 including a closed end of the first cover 2 and the second cover 3.
  • the fixing clip 8 may be applied to the corresponding recess portion.
  • the fixing clip 8 may be disposed to accommodate both of the first cover 2 and the second cover 3.
  • the boundary ground line 413 of the PCB 4 can accommodate both of the two covers 2 and 3.
  • the corresponding side surfaces 22 and 32 of the first cover 2 and the second cover 3 can face each other, and the facing portion can be received in the single boundary ground line 413.
  • Such a structure is very advantageous to the space usage.
  • the mounting space of the electronic function group can be extended or the total volume of the shield can assembly 1 can be reduced compared to the related art which applies the individual ground line corresponding to the covers 2 and 3 respectively.
  • the device can be slimmed.
  • the facing portion of the covers has the boundary portion to a thickness corresponding to the sides of the two covers.
  • the present disclosure has the boundary portion to the thickness corresponding to the single cover side, which is greatly advantageous.
  • the facing boundary portion of the first cover 2 and the second cover 3 can be formed by alternating the protrusion portions 23 and 33 and the recess portions 24 and 34.
  • the first cover 2 and the second cover 3 can be tightly coupled by facing and engaging each other at the same time.
  • the second cover 3 can alternate the corresponding recess portion 34 and the corresponding protrusion portion 33.
  • the protrusion portion 33 of the second cover 3 is inserted to the recess portion 24 of the first cover 2 and the protrusion portion 23 of the first cover 2 is inserted to the recess portion 34 of the second cover 3 so that the first cover 2 and the second cover 3 tightly face each other without any separation.
  • the single cover thickness can realize the width of the boundary ground line 413.
  • the protrusion portions 23 and 33 and the recess portions 24 and 34 of the first cover 2 and the second cover 3 face each other, at least one corresponding portion can be formed as a closed end to easily separate the first region A and the second B 2. Since the protrusion portions 23 and 33 and the recess portions 24 and 34 of the first cover 2 and the second cover 3 clearly separate the first region A and the second region B, the separate boundary ground line 413 may not be formed.
  • FIG. 2 illustrates a perspective view of the covers of FIG. 1 according to an exemplary embodiment of the present disclosure
  • FIG. 3 illustrates a perspective view of the first cover of FIG. 1 , which is taken from a different angle, according to an exemplary embodiment of the present disclosure.
  • the first cover 2 can include a pair of the protrusion portions 23 spaced from each other at a certain distance, and a pair of the recess portions 24 between the protrusion portions 23.
  • the second cover 3 can include a pair of the recess portions 34 spaced from each other at a certain distance, and a pair of the protrusion portions 33 between the recess portions 33.
  • the protrusion portion 23 of the first cover 2 can correspond to the recess portion 34 of the second cover 3 and the recess portion 24 of the first cover 2 can correspond to the protrusion portion 33 of the second cover 3.
  • the protrusion portion 23 of the first cover 2 and the protrusion portion 33 of the second cover 3 can bend and protrude to have the closed end.
  • the recess portion 24 of the first cover 2 and the recess portion 34 of the second cover 3 can form an open end.
  • the closed end of the protrusion portions 23 and 33 of the first cover 2 and the second cover 3 can shield and separate the electronic function group receiving space of the first cover 2 and the electronic function group receiving space of the second cover 3.
  • the recess portions 24 and 34 of the first cover 2 and the second cover 3 may include the closed end, and the corresponding protrusion portions 23 and 33 of the first cover 2 and the second cover 3 may include the closed end.
  • both of the recess portion 24 and the protrusion portion 23 of the first cover 2 may include the closed end, and both of the recess portion 34 and the protrusion portion 33 of the second cover 3 may include the open end.
  • FIG. 4 illustrates a plane view of the shield can assembly of FIG. 1 fastened to the PCB according to an exemplary embodiment of the present disclosure.
  • the first cover 2 and the second cover 3 for the shielding can be applied.
  • the PCB 4 can be divided by the ground line 41 into two regions, and the electronic function groups 42 can be mounted in the regions A and B.
  • the ground line 41 includes the first ground line 411 for closing along the side surface of the first cover 2, the second ground line 412 for closing along the side surface of the second cover 3, and the boundary ground line 413 for separating the first region A and the second region B.
  • the boundary ground line 413 can be formed along the facing portion of the first cover 2 and the second cover 3.
  • the protrusion portions 23 of the first cover 2 and the protrusion portions 33 of the second cover 3 can engage and face each other. In so doing, since the protrusion portions 23 and 33 of the covers 2 and 3 are the closed ends, the closed ends of the protrusion portions 23 and 33 can be connected along the boundary ground line 413 without ceasing as shown in FIG. 4 . Thus, the first region A and the second region B can be completely separated along the boundary ground line 413.
  • the facing portion of the first cover 2 and the second cover 33 can realize the thickness of the single cover by virtue of their engaging structure.
  • FIG. 5 illustrates an exploded view of an exemplary shield can assembly.
  • the shield can assembly may be realized as a frame fixing type.
  • the PCB including the ground line is substantially the same as in FIG. 1 and thus shall be omitted here.
  • the shield can assembly 6 can include a frame 7 fixed on the PCB at a certain height, and a first cover 5 and a second cover 6 secured on the frame 7. It is advantageous that the frame 7 is formed of a metal material in the same shape as the ground line of the PCB, and secured to the ground line. The frame 7 can be secured to electrically connect with the ground line of the PCB using the bonding or the soldering.
  • the frame 7 can include a first frame 71 including a first region C for accommodating the electronic function groups, a second frame 72 including a second region D for accommodating the electronic function groups, and a boundary frame 73 for separating the first region C and the second region D.
  • the frames 71, 72, and 73 can be integrally formed.
  • the first frame 71 and the second frame 72 may be separated from each other.
  • the boundary frame 73 may be separated at an adequate position and integrally formed with the first frame 71 and the second frame 72.
  • the first and second frames 71 and 72 and the first and second covers 5 and 6 may be mounted on the PCB all together after spreading a resin.
  • the boundary frame 73 can alternate, but not limited to, a receiving groove for receiving protrusion portions 53 and 63 of the first cover 5 and the second cover 6 at regular intervals.
  • the boundary frame 73 may be formed in a straight-line shape.
  • the first cover 5 can include a top surface 51, and a plurality of tension ribs 52 bending from the top surface 51 and formed in a certain height at regular intervals along a rim of the top surface 51.
  • the tension rib 52 can secure the first cover 5 by contacting an outer side surface of the first frame 71.
  • the tension rib 52 includes a protrusion (not shown) and the first frame 71 includes a protrusion receiving groove (not shown) at a corresponding position. Hence, the protrusion is inserted to the protrusion receiving groove so that the first cover 5 is supported and secured by the first frame 71.
  • the second cover 6 can include a top surface 61, and a plurality of tension ribs 62 bending from the top surface 61 and formed in a certain height at regular intervals along a rim of the top surface 61.
  • the tension rib 62 can secure the second cover 6 by contacting an outer side surface of the second frame 72.
  • the tension rib 62 includes a protrusion (not shown) and the second frame 72 includes a protrusion receiving groove (not shown) at a corresponding position. Hence, the protrusion is inserted to the protrusion receiving groove so that the second cover 6 is supported and secured by the second frame 72.
  • the first cover 5 and the second cover 6 can be disposed to face each other.
  • the protrusion portion 53 and the recess portion 54 can be alternated in the portion of the first cover 5 facing the second cover 6, and the protrusion portion 63 and the recess portion 64 can be alternated in the portion of the second cover 6 facing the first cover 5.
  • the protrusion portions 53 and 63 and the recess portions 54 and 64 of the first cover 5 and the second cover 6 can be disposed and engaged at the corresponding positions. That is, the protrusion portion 63 can be formed at the position of the second cover 6 corresponding to the recess portion 54 of the first cover 5, and the recess portion 54 of the first cover 5 and the protrusion portion 63 of the second cover 6 can be engaged.
  • the recess portion 64 can be formed at the position of the second cover 6 corresponding to the protrusion portion 53 of the first cover 5, and the protrusion portion 53 of the first cover 5 and the recess portion 64 of the second cover 6 can be engaged.
  • the protrusion portions 53 and 63 of the first cover 5 and the second cover 6 can be formed as a plurality of tension ribs spaced at regular intervals.
  • the protrusion portions 53 and 63 of the first cover 5 and the second cover 6 can bend in the same fashion as the tension ribs 52 and 62 formed on the side surface of the first cover 5 and the second cover 6.
  • FIG. 6 illustrates a cross-sectional view of the covers of FIG. 5 fastened to the PCB using a frame.
  • the frame 7 of the certain height can be mounted on the PCB.
  • the frame 7 includes the first frame 71 for creating the first region C to mount the electronic function groups and to receive the first cover 5, and the second region D for mounting the electronic function groups and receiving the second cover 6.
  • the boundary frame 73 can be formed to isolate the first region C and the second region D.
  • the first cover 5 can be disposed on the first frame 71 and then secured to the first frame 5 with a certain pressure.
  • the tension ribs 52 serving as the side surface of the first cover 5 can be tightly contacted and secured to the outer surface of the first frame 5.
  • the second cover 6 can be disposed on the second frame 72 and then secured to the second frame 72 with a certain pressure.
  • the tension ribs 62 serving as the side surface of the second cover 6 can be tightly contacted and secured to the outer surface of the second frame 6.
  • the protrusion portions 53 and 63 of the first cover 5 and the second cover 6 can be engaged with the corresponding recess portions 54 and 64 to face each other.
  • the protrusion portion 53 of the first cover 5 can be secured toward the second region being the outer surface of the boundary frame 73
  • the protrusion portion 63 of the second cover 6 can be secured toward the first region being the outer surface of the boundary frame 73.
  • the tension ribs 52 and 62 of the covers 5 and 6 and the protrusion portions 53 and 63 of the first and second covers 5 and 6 include the tension ribs
  • the side surface of each region is shielded already by the frame 7 due to the certain height.
  • the first region C and the second region D can function as the complete shielding space thanks to the top surfaces of the first cover 5 and the second cover 6.
  • the component mounting region of the PCB can be efficiently utilized to thus contribute to the slimness of the electronic device.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Power Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Claims (5)

  1. Dispositif électronique comprenant :
    une carte de circuit imprimé (4) présentant une première région (A) et une seconde région (B),
    ladite seconde région (B) étant contiguë à la première région (A),
    un premier élément électronique (42) disposé dans la première région (A),
    un second élément électronique (42) disposé dans la seconde région (B),
    un premier capot (2) conçu pour protéger le premier élément électronique (42), le premier capot (2) présentant une surface supérieure (21) d'une taille correspondant à la première région (A) et une surface latérale (22) suivant le tracé d'un rebord de la surface supérieure (21) selon une certaine hauteur, ledit premier capot (2) possédant en outre une partie limite de coopération formée par une alternance de parties en saillie (23) et de parties évidées (24), et
    un second capot (3) conçu pour protéger le second élément électronique (42), le second capot (3) présentant une surface supérieure (31) d'une taille correspondant à la seconde région (B) et une surface latérale (32) suivant le tracé d'un rebord de la surface supérieure (31) selon une certaine hauteur, ledit second capot (3) possédant en outre une partie limite de coopération formée par une alternance de parties en saillie (33) et de parties évidées (34),
    une ligne de masse (41) constituée ou montée sur la carte de circuit imprimé (4) et exposée sur une surface supérieure de la carte de circuit imprimé (4), ladite ligne de masse (41) étant électriquement connectée à une partie de masse de la carte de circuit imprimé (4), ladite ligne de masse (41) présentant une première ligne de masse (411) destinée à venir au contact de la surface latérale (22) du premier capot (2), une seconde ligne de masse (412) destinée à venir au contact de la surface latérale (32) du second capot (3), et une ligne de masse limite (413) qui sépare la première région (A) et la seconde région (B), ladite ligne de masse limite (413) étant constituée le long des parties limites de coopération du premier capot (2) et du second capot (3) ;
    le premier capot (2) étant fixé de manière à se connecter électriquement à la première ligne de masse (411) et le second capot (3) étant fixé de manière à se connecter électriquement à la seconde ligne de masse (412) ;
    les parties en saillie (33) du second capot (3) s'emboitant dans les parties évidées (24) respectives du premier capot (2), et les parties en saillie (23) du premier capot (2) s'emboitant dans les parties évidées (34) respectives du second capot (3) de manière que le premier capot (2) et le second capot (3) coopèrent intimement l'un avec l'autre ;
    les parties en saillie et/ou les parties évidées du premier capot et du second capot étant constituées pour présenter une extrémité fermée ; et
    la partie limite de coopération du premier capot (2) et la partie limite de coopération du second capot (3) étant reçues dans l'unique ligne de masse limite (413).
  2. Dispositif électronique selon la revendication 1, dans lequel les parties en saillie (33) et les parties évidées (34) du second capot (3) présentent une taille et une forme correspondant à la taille et à la forme des parties en saillie (23) et des parties évidées (24) du premier capot (2).
  3. Dispositif électronique selon la revendication 1, dans lequel la ligne de masse (41) présente une largeur permettant de constituer une délimitation correspondant aux bords des première et seconde régions.
  4. Dispositif électronique selon la revendication 3, comprenant en outre :
    un moyen de fixation présent sur la ligne de masse (41) et assurant la fixation du premier capot (2) et du second capot (3).
  5. Dispositif électronique selon la revendication 4, dans lequel le moyen de fixation est une attache de fixation (8), plusieurs attaches étant situées à intervalles réguliers dans la ligne de masse (41) et comprenant une partie d'introduction latérale (81) permettant de recevoir les surfaces latérales (22, 32) du premier capot (2) et du second capot (3) par emmanchement à force.
EP14169710.2A 2013-06-11 2014-05-23 Ensemble de boîtier de protection et dispositif électronique le comprenant Active EP2814311B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP18157446.8A EP3358927B1 (fr) 2013-06-11 2014-05-23 Ensemble de boîtier de protection et dispositif électronique le comprenant

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130066249A KR101608796B1 (ko) 2013-06-11 2013-06-11 쉴드 캔 조립체 및 그것을 갖는 전자 장치

Related Child Applications (1)

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EP18157446.8A Division EP3358927B1 (fr) 2013-06-11 2014-05-23 Ensemble de boîtier de protection et dispositif électronique le comprenant

Publications (3)

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EP2814311A2 EP2814311A2 (fr) 2014-12-17
EP2814311A3 EP2814311A3 (fr) 2015-07-08
EP2814311B1 true EP2814311B1 (fr) 2018-02-21

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EP18157446.8A Active EP3358927B1 (fr) 2013-06-11 2014-05-23 Ensemble de boîtier de protection et dispositif électronique le comprenant
EP14169710.2A Active EP2814311B1 (fr) 2013-06-11 2014-05-23 Ensemble de boîtier de protection et dispositif électronique le comprenant

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Application Number Title Priority Date Filing Date
EP18157446.8A Active EP3358927B1 (fr) 2013-06-11 2014-05-23 Ensemble de boîtier de protection et dispositif électronique le comprenant

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US (2) US10842057B2 (fr)
EP (2) EP3358927B1 (fr)
KR (1) KR101608796B1 (fr)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9736925B2 (en) 2014-01-31 2017-08-15 Stmicroelectronics S.R.L. Packaged semiconductor device having a shielding against electromagnetic interference and manufacturing process thereof
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US10842057B2 (en) 2020-11-17
US10064318B2 (en) 2018-08-28
US20150264844A1 (en) 2015-09-17
EP3358927B1 (fr) 2022-01-05
EP2814311A2 (fr) 2014-12-17
KR101608796B1 (ko) 2016-04-04
EP2814311A3 (fr) 2015-07-08
KR20140144405A (ko) 2014-12-19
EP3358927A1 (fr) 2018-08-08
US20140362543A1 (en) 2014-12-11

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