EP2812754A1

EP2812754A1 - Modular device for a camera system, retaining spring device and corresponding camera system

Info

Publication number: EP2812754A1
Application number: EP13700916.3A
Authority: EP
Inventors: Ulrich Seger; Nikolai Bauer
Original assignee: Robert Bosch GmbH
Current assignee: Robert Bosch GmbH
Priority date: 2012-02-10
Filing date: 2013-01-23
Publication date: 2014-12-17
Also published as: DE102013200966B4; CN104106004A; US20150146094A1; JP2015511327A; WO2013117430A1; DE102013200966A1; JP6101291B2; US9756229B2; CN104106004B

Abstract

The invention relates to a modular device (100) for a camera system having: a housing device (140) that has an inner opening (140a) designed to enable an adjustment of an installation position of the modular device in a motor vehicle; a sensor holding device (130) that has an upper region (130a) and a base region (130b) and is coupled to the housing device (140) via at least one support element (131a - 131c) and is designed to accommodate an image sensor (150); an object lens device (120) which is coupled to the sensor holding device (130) on the upper region (130a) via at least one connecting element (132a, 132b) and is designed to generate an optical image on the image sensor (150); and a retaining spring device (170) that is coupled to the housing device (140) and the base region (130b) of the sensor holding device (130) and is designed to press the image sensor (150) onto the sensor holding device (130).

Description

Description title

Modular device for a camera system, retaining spring device and corresponding camera system

The invention relates to a modular device for a camera system, a

Holding spring device and a corresponding camera system.

State of the art

DE 10 2009 056 200 A1 describes a camera module for a vehicle with a camera, in particular a video camera, by means of which at least moving images of the environment of the camera module can be detected, and with a housing in which the camera is at least partially recorded and which one

Passage opening has, through which the moving images are detected by the camera, wherein on an environmental facing end face of the housing in the region of the passage opening a passage opening surrounding the sealing element is provided, which is connected to the housing, and a mounting arrangement of such a camera module to a holding module of a vehicle.

DE 10 2008 001 675 A1 describes a camera module for recording image data, in particular for use in the motor vehicle sector. The camera module comprises at least one image sensor chip, in particular a non-encapsulated image sensor chip. Furthermore, the camera module comprises at least one Peltier element with at least one cooling surface. The image sensor chip is connected to the cooling surface by at least one heat collecting element, in particular at least one

Wärmesammeifolie, connected.

DE 10 2007 017 238 A1 describes a camera module, in particular for a vehicle, which has at least: a housing with a housing interior and a

Optics module which is arranged in the housing interior and a circuit carrier having an image pickup chip and electrical contacts, wherein the optical module is directed by an optical outlet on an Au ßenraum au ßerhalb the housing, wherein the electrical contacts of the optical module through

Bushings in the housing outward Shen are for contacting the

Camera module, wherein the bushings are sealed by glass seals with electrical insulation of the contacts, wherein the housing interior is hermetically sealed from the outside and wherein the housing has at least two housing parts, which in a hermetically sealed connection, for. B. a welded joint or solder joint, are interconnected.

FIG. 6 shows by way of example a housing module 40 for a camera module 10.

Module devices for camera systems are constructed from individual subsystems.

The housing module 40 of the camera module 10 shown by way of example in FIG. 6 can be coupled to support elements 31 a-31 b of an image sensor module 30 via locking devices 41 a-41 b. The image sensor module 30 is designed to receive an image sensor 50 and allows in an inner opening 30a the receptacle of an objective module 20, which has a plurality of optical lenses 61, 62, 63, 64 and which is a real optical image of an object or an object on the Image sensor 50 generated.

Disclosure of the invention

The present invention provides a modular device for a camera system with the features of claim 1, a camera system for a motor vehicle according to claim 9 and a retaining spring device with the features of

Patent claim 1 1.

Accordingly, according to the invention a module device for a camera system is provided with a housing device which has an inner opening and which is adapted to an adjustment of an installation position of the module device in a

To allow motor vehicle; a sensor mount having an upper portion and a pedestal portion and coupled to the housing via at least one support member and configured to receive an image sensor; with a lens device, which with the

Sensor mounting device at the top of at least one Coupling element is coupled and which is adapted to produce an optical image on the image sensor, and with a retaining spring means, which is coupled to the base region of the sensor mounting device and which is adapted to the image sensor with the heat-conductive intermediate layer to the

Press sensor mounting device by means of spring force while a

Forming heat conduction path over the heat-conducting intermediate layer.

The invention further provides a camera system for a motor vehicle, with a

Module device according to one of claims 1 to 8, with a camera electronics for signal conversion, wherein the camera electronics is integrated on a motherboard and is coupled to the image sensor of the module device and which is adapted to convert signals received from the image sensor into image information; and with one

Camera housing, which is designed to receive the module device and the motherboard and having a Justierausnehmung, which for receiving the

Holding spring means and for fixing the module device is designed in the camera body.

Furthermore, the present invention provides a retaining spring device which can be coupled to a base region of a sensor mounting device and which is designed to connect an image sensor with a thermally conductive intermediate layer to a

To press sensor mounting device while forming a heat conduction path over the heat-conducting intermediate layer.

The idea according to the invention lies in an improvement of the heat transfer between an image sensor and a radiating surface serving as a heat sink

Heatsink. In this case, a pressing of the sensor mounting device to the image sensor by a holder spring means by means of a spring force of

Retaining spring device. The pressing is thereby formed by the heat-conducting retaining spring

Achieved holding spring means, wherein by the heat-conducting retaining spring and an additional heat conduction path to the housing means is formed, wherein the housing means and the retaining spring device itself as a cooling body and / or

Heat sink are provided. A further advantage of the invention is that the image sensor with the heat-conducting intermediate layer is pressed against the sensor mounting device by means of spring force and a heat conduction path is thereby formed via the heat-conducting intermediate layer. This allows a permanent fixation of a heat coupling element at the same time existing flexibility for reducing any occurring mechanical stress, which is induced due to temperature-induced change in length of the components of the camera system.

This allows a reduction of the mechanical tolerance chain between the optical axis of the lens and camera system and the driving axis of the motor vehicle. This also results in an advantageous coupling of the camera system via appropriately designed support points.

Advantageous embodiments and developments emerge from the

Subclaims and from the description with reference to the figures.

According to an advantageous embodiment of the invention it is provided that the

Holding spring means is designed as a flat spring, as a leaf spring, as a shape spring or as a wire bending part. As a result, the spring force applied by the retaining spring device can advantageously be adapted to press the image sensor with the heat-conducting intermediate layer against the sensor mounting device with a predetermined spring force.

According to a further advantageous embodiment of the invention it is provided that the retaining spring means steel, spring steel, stainless steel, non-ferrous metal, a

Has fiber composite material or a glass fiber reinforced plastic. This advantageously allows a cost-effective production of the retaining spring device.

According to a further advantageous embodiment of the invention it is provided that a three-point support between the sensor mounting device and the housing device is formed by three support elements. As a result, the module device can be stored without play.

According to a further advantageous embodiment of the invention it is provided that the image sensor comprises photosensitive electronic components and is designed as a CCD image sensor. According to a further advantageous embodiment of the invention it is provided that the at least one connecting element of the sensor mounting device is designed as a precisely fitting opening. This allows the module device and the

Camera system can be easily mounted.

According to a further advantageous embodiment of the invention it is provided that the retaining spring means for forming a heat conduction path of the

Image sensor is provided to the housing device. According to a further advantageous embodiment of the invention, it is provided that the retaining spring device is provided as a heat sink for heat radiation of the waste heat of the heat-producing image sensor.

According to a further advantageous embodiment of the invention it is provided that the camera system further comprises a disc holder, which is coupled to the camera body and which is adapted to connect the camera system with the motor vehicle.

The above embodiments and developments can, if appropriate, combine with each other as desired.

Further possible refinements, developments and implementations of the invention also include combinations of features of the invention which have not been explicitly mentioned above or described below with regard to the exemplary embodiments. In particular, the person skilled in the art will also add individual aspects as improvements or additions to the respective basic form of the present invention.

Further features and advantages of embodiments of the invention will become apparent from the following description with reference to the accompanying drawings.

Brief Description of the Drawings Fig. 1 is a schematic representation of a modular device for a

Camera system according to an embodiment of the invention; FIG. 2 shows a schematic representation of a camera system according to a further embodiment of the invention; FIG.

Fig. 3a-3c three schematic representations of adjusting devices and associated

Support elements according to three further embodiments of

Invention;

Fig. 4 is a schematic representation of adjusting devices and an inner

Opening of a sensor mounting device according to another

Embodiment of the invention;

Fig. 5a is a schematic representation of a modular device for a

Camera system according to another embodiment of the invention;

5b is a schematic representation of a sensor mounting device according to another embodiment of the invention;

5c is a schematic representation of a holding spring device according to another embodiment of the invention;

5d is a schematic representation of a modular device for a

Camera system according to another embodiment of the invention; and

Fig. 6 is an exemplary illustration of a camera module according to the prior

Technology.

Embodiments of the invention

In the figures of the drawing are identical and functionally identical elements, features and components - unless otherwise stated - each provided with the same reference numerals.

It is also understood that components and elements in the drawings are not necessarily for clarity and clarity

are reproduced to scale to each other.

FIG. 1 shows a schematic representation of a modular device for a

Camera system according to an embodiment of the invention. A module device 100 for a camera system comprises a housing device 140, a sensor mounting device 130, an objective device 120 and a

Retaining spring device 170.

The housing device 140 has, for example, an inner opening 140a and is designed to allow an adjustment of an installation position of the modular device 100 in a motor vehicle. The sensor mounting device 130 has, for example, an upper region 130a and a base region 130b and is coupled to the housing device 140 via at least one support element 131a-131c. Furthermore, the

Sensor mounting device 130, for example, adapted to receive an image sensor 150.

Furthermore, the housing device 140 comprises at least one adjusting device 141 a- 141 c for receiving the at least one support element 131 a-131 c.

The image sensor 150 is designed, for example, as a sensor for taking two-dimensional images by a light-induced electrical signal generation,

For example, as a CCD sensor or CCD image sensors or as a CMOS sensor with adjacent or superimposed color-sensitive sensors. In this case, CCD designates "charge-coupled device." For example, the objective device 120 is coupled to the sensor mounting device 130 at the upper region 130a via at least one connecting element 132a, 132b and is further configured to form an optical image on the image sensor The lens device 120 includes, for example, a plurality of optical lenses 161, 162, 163, 164, 165. The lenses 161, 162, 163, 164, 165 form

For example, an objective in the form of an optical lens system with an optical axis OA.

The retaining spring device 170 is, for example, attached to the base region 130b of FIG

Sensor mounting device 130 coupled and adapted to press the image sensor 150 to the sensor mounting device 130. In this case, the retaining spring device 170 may be configured to bear against the base portion 130b of FIG

Sensor mounting device 130 to be pressed.

For example, between the retaining spring device 170 and the image sensor 150, a thermally conductive intermediate layer 151 is formed, which allows a thermally conductive contacting of the image sensor 150 with low mechanical stress of the surface of the image sensor 150.

The retaining spring device 170 may be connected to the base region 130b of FIG

Sensor holding device 130 can be coupled by means of at least one connecting device 145a, 145b. For this purpose, the base region 130b can have corresponding notch elements 146a, 146b.

The at least one connecting device 145a, 145b is designed, for example, as a screw connection. Likewise, the at least one

Connecting means 145a, 145b may be formed as a rivet or clamping connection or as another fastening means.

FIG. 2 shows a schematic illustration of a camera system according to a further embodiment of the invention.

The camera system for a motor vehicle comprises a modular device 100, a camera electronics 200 and a camera housing 300. The modular device 100 comprises the housing device 140, which

Sensor holding device 130, the lens device 120 and the

Retaining spring device 170.

The sensor mounting device 130 is made, for example, from a thermoplastic or from another plastic that can be deformed in a specific temperature range, and is provided, for example, with a structured metallization, by means of which the image sensor 150 can be contacted by bond wiring.

The camera electronics 200 is designed for signal conversion, wherein the camera electronics 200 is integrated on a motherboard 210 and connected to the image sensor 150 of the Module device 100 is coupled and adapted to convert signals received from the image sensor 150 in image information.

The camera body 300 is for receiving the module device 100 and the

Motherboard 210 and has a latching holder, which is designed for mounting the camera system.

The module device 100 is anchored, for example, by the disk holder 320 on the windshield of the motor vehicle. By adjusting mandrels 320a resting in bearing seats 300a, the camera body 300 is adjusted with respect to the motor vehicle. By the retaining spring means 170, the module device is compared to the

Camera body 300 adjusted.

The housing device 140 of the module device 100 can be fixed to the

Camera body 300 are connected.

The electrical contacting of the image sensor 150 via bond wiring to the motherboard 210. The mechanical coupling of the camera body 300 with the disc holder 320 can be done via clips, adhesive, clamping, or screw. A

Location determination is made via the adjusting device 141 a-141 c in conjunction with the support elements 131 a-131 c, which are designed for example as a 3-point support.

Figures 3a, 3b and 3c show three schematic representations of

Justiereinrichtungen and associated support elements according to three others

Embodiments of the invention. The adjusting devices 141 a-141 c, as shown in Figure 3a, are for example formed as spherical recesses and for receiving the at least one conical bearing element 131 a-131 c provided.

The adjusting devices 141 a-141 c, as shown in the figure 3b, for example, are formed as recesses in the form of a notch and for receiving the at least a spherical surface having support member 131 a-131 c provided.

The adjusting device 141 a, as shown in the figure 3c, for example, is formed as a spherical recess and provided for receiving the at least one conical bearing element 131 a.

It is shown in Figure 3c, at which point of the sensor support means 130, the holding spring 170 a contact force F on the conical support member 131 a of the sensor support means 130 exerts to press the conical support member 131 a to the spherical adjusting device 141 a.

By using the correspondingly shaped receiving elements 131 a-131 c and the associated adjusting devices 141 a-141 c can by means of a through the

Holding spring 170 generated contact pressure F self-adjustment of

Module device 100, in particular a self-adjustment of the position of

Sensor holding device 130 relative to the position of the housing device 140 can be achieved. This allows the sensor support device 130 and the housing device 140 thus generated to be displaced into the position which permits maximum extension of the retaining spring device 170 by the contact force F, thus generated.

4 shows a schematic representation of adjusting devices 141 a-141 c and an inner opening 143 of a sensor mounting device 130 according to another embodiment of the invention.

In the embodiment of the sensor mounting device 130 shown in FIG. 4, the alignment devices 141 a-141 c are formed by a V-trench structure. An inner opening 143 of the sensor mounting device 130 allows the reception of the

Lens device 120.

FIG. 5a shows a schematic representation of a modular device for a

Camera system according to another embodiment of the invention. The module device comprises the sensor mounting device 130, the housing device 140, as well as the retaining spring device 170.

The sensor mounting device 130, the housing device 140, the

Objective device 120 are further designed, for example, as a spatial injection-molded circuit carrier, Molded Interconnect Device, MID.

FIG. 5b shows a schematic representation of a sensor mounting device according to a further embodiment of the invention.

The sensor mounting device 130 is formed, for example, in one piece. The sensor device 130 can also be constructed from several parts.

FIG. 5c shows a schematic representation of a holding spring device according to a further embodiment of the invention.

The retaining spring means 170 is designed, for example, as a leaf spring and is formed from a flat metal band which is biased arcuately. The

Retaining spring means 170 may comprise steel, spring steel, stainless steel, non-ferrous metal, a fiber composite material or a glass fiber reinforced plastic.

FIG. 5d shows a schematic representation of a modular device for a

Camera system according to another embodiment of the invention.

For example, the housing device 140 is designed as a spatially injection-molded part.

Although the present invention has been described above with reference to preferred embodiments, it is not limited thereto, but modifiable in a variety of ways.

Claims

claims

1 . Modular device (100) for a camera system with:

- A housing device (140) having an inner opening (140 a) and which is adapted to allow an adjustment of an installation position of the module device in a motor vehicle;

- A sensor holder means (130) having an upper portion (130 a) and a base portion (130 b) and which is coupled to the housing means (140) via at least one support element (131 a-131 c) and which is adapted to an image sensor To record (150);

- an objective device (120) which is coupled to the sensor mounting device (130) at the upper region (130a) via at least one connecting element (132a, 132b) and which is adapted to generate an optical image on the image sensor (150); and

a retaining spring device (170), which is coupled to the base region (130b) of the sensor mounting device (130) and which is adapted to connect the image sensor (150) with the heat-conducting intermediate layer (151) to the

To press sensor mounting device (130) by spring force and thereby form a heat conduction path over the heat-conducting intermediate layer (151).

2. Modular device (100) according to claim 1, wherein the retaining spring means (170) is designed as a flat spring, as a leaf spring, as a shaped spring or as a wire bending part.

3. Modular device (100) according to claim 1 or 2, wherein the retaining spring means (170) steel, spring steel, stainless steel, non-ferrous metal, a fiber composite material or a glass fiber reinforced plastic.

4. Module device (100) according to one of the preceding claims, wherein a three-point support between the sensor mounting device (130) and the

Housing device (140) by three support elements (131 a-131 c) is formed.

5. Module device (100) according to one of the preceding claims, wherein the image sensor (150) comprises photosensitive electronic components and is designed as a CCD image sensor.

6. Module device (100) according to one of the preceding claims, wherein the at least one connecting element (132a, 132b) of the sensor mounting device (130) is designed as a precisely fitting opening.

7. Modular device (100) according to one of the preceding claims, wherein the retaining spring means (170) for forming a heat conduction path from the image sensor (150) to the housing means (140) is provided.

8. Modular device (100) according to any one of the preceding claims, wherein the retaining spring means (170) is provided as a heat sink for heat dissipation of the waste heat of the heat-producing image sensor (150).

9. Camera system for a motor vehicle, comprising: - a module device (100) according to one of claims 1 to 8;

- Camera electronics (200) for signal conversion, wherein the camera electronics (200) is integrated on a motherboard (210) and with the image sensor (150) of the module device (100) is coupled and adapted to the image sensor (150) received signals in To transform image information; and

a camera housing (300) adapted to receive the module device (100) and the motherboard (210) and having an adjustment recess (305) for receiving the retainer spring means (170) and fixing the retainer

Module device (100) is designed in the camera body.

10. The camera system of claim 9, further comprising:

a disk mount (320) coupled to the camera body (300) and configured to connect the camera system to the motor vehicle.

1 1. Retaining spring means (170) which on a base portion (130b) of a

Sensor support means (130) can be coupled and which is adapted to an image sensor (150) having a heat-conductive intermediate layer (151) to a To press sensor mounting device (130) and thereby form a heat conduction path over the heat-conductive intermediate layer (151).

12. Haltefedereinnchtung according to claim 1 1, wherein the retaining spring means (170) is designed as a flat spring, as a leaf spring, as a shape spring or as a wire bending part.