EP1665391A1 - Optical module and optical system - Google Patents

Optical module and optical system

Info

Publication number
EP1665391A1
EP1665391A1 EP04741544A EP04741544A EP1665391A1 EP 1665391 A1 EP1665391 A1 EP 1665391A1 EP 04741544 A EP04741544 A EP 04741544A EP 04741544 A EP04741544 A EP 04741544A EP 1665391 A1 EP1665391 A1 EP 1665391A1
Authority
EP
European Patent Office
Prior art keywords
optical module
circuit carrier
lens
lens holder
module according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04741544A
Other languages
German (de)
French (fr)
Inventor
Henryk Frenzel
Harald Schmidt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Continental Automotive GmbH
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP1665391A1 publication Critical patent/EP1665391A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/022—Mountings, adjusting means, or light-tight connections, for optical elements for lenses lens and mount having complementary engagement means, e.g. screw/thread
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to an optical module with a rigid circuit carrier comprising an assembly surface; an unhoused semiconductor element arranged by means of flip-chip technology on the assembly surface of the circuit carrier; and a lens unit which is arranged on the side of the circuit carrier facing away from the component surface; wherein the circuit carrier has an opening through which electromagnetic radiation is projected from the lens unit onto the semiconductor element; and wherein the lens unit comprises a lens holder and a lens arrangement with at least one lens.
  • Generic optical modules are known for example from DE 196 51 260 AI.
  • the invention further relates to an optical system with such an optical module.
  • Motor vehicles such as LD (lane departure warning) lane departure warning, BSD (blind spot detection) blind spot detection, or rear view cameras (rear view cameras) work, in particular the infrared radiation which is invisible to people in applications in the interior of a motor vehicle such as OOP (out of Position Detection) position-leaving detection or with additional external lighting of a night vision system is preferred.
  • Applications in the interior or exterior of a vehicle are subject to high demands due to external influences such as temperature, humidity, pollution and vibration.
  • the typical lifespan for systems in the vehicle is 10 to 15 years, whereby only extremely low failure rates are tolerated, so that the components of an optical system of the type mentioned at the outset may also only show very slow aging.
  • the optics have their exact focus at the point of conversion of light into information (e.g. film plane, optical surface CCD or CMOS sensor). Therefore, the distance between the camera chip and the optics must either be set and fixed once during production or the focus is reset for each image (focusing on the object, non-blurring rays). This leads to a considerable manufacturing effort. This also poses a quality risk.
  • Cameras for specific low-cost applications such as automotive, industry, digital cameras, cell phones, toys, etc. should, however, be possible from cost and quality assurance aspects can be produced without any adjustment processes between the optics and the camera chip, i.e. without adjusting the focus to the optical surface of the CMOS or CCD sensor. This is fundamentally contrary to the requirements mentioned.
  • One possibility of developing a focus-free system is to reduce the sum of the possible tolerances and elements, so that the module or system, due to the design, works without adjustment, at least in a certain distance and temperature range.
  • sharp images should be taken at distances of e.g. 15 cm to 130 cm and at temperatures of e.g. - 40 ° C to + 105 ° C can be guaranteed.
  • This is all the more realizable, the fewer elements are included in the tolerance chain.
  • the circuit carrier for the camera chip e.g. CCD or CMOS
  • the circuit carrier for the camera chip has a large share in the tolerance chain.
  • the necessary soldered and possibly adhesive connections or the like between the chip and the circuit carrier have a large proportion in the tolerance chain.
  • the lens holder itself which is preferably made of plastic, can be connected to the lens arrangement in various ways, so that an exact optical alignment of the lens arrangement and the semiconductor element with respect to the lens holder or the lens arrangement can always be ensured.
  • the camera chip being unhoused as a so-called flip chip on a suitable circuit carrier, it is difficult to avoid the problems mentioned in their entirety and at the same time to meet the quality requirements mentioned fulfill.
  • the lens itself must be adjusted to the camera chip and have a defined focus.
  • the object of the invention is to provide an optical module and an optical system with an unhoused semiconductor element arranged on a rigid circuit carrier
  • the invention builds on the generic optical module in that at least one permanently elastic or resilient element is arranged between the lens holder and circuit carrier, which presses the mounting surface of the circuit carrier away from the lens holder against at least one stop element which is positively related to the lens unit.
  • the present invention takes a new route in that the circuit carrier by means of a permanently elastic element in the opposite direction, i.e. is pressed away from the lens holder, and there a stop is positively related to the optics.
  • the entire tolerance of the circuit carrier and possibly. Adhesives not largely, but completely eliminated in an advantageous manner.
  • the present invention thus enables production technology with particularly small tolerances between an unhoused semiconductor element and a lens unit.
  • the form fit is realized by a form fit surface formed on the stop element.
  • this can be part of a snap connection.
  • the stop element is preferably realized by hooks formed on the lens holder. This not only makes assembly, but also subsequent recycling, especially the separation of optics and electronics, particularly environmentally friendly and easy.
  • the stop element is part of a screw or rivet connection or the like, where in the case of the stop element is preferably realized by spacer bolts or screw holes arranged on the lens holder, which interact with a screw, for example a plastic rivet or the like.
  • the permanently elastic or resilient element is preferably rectangular, ring-shaped or the like, preferably as a stamped part. This advantageously allows mass production.
  • the optical module according to the invention can be further developed in that a ventilation channel is provided in the connection area between the rigid printed circuit board and the permanently elastic or resilient element. In this way, a sealed module can “breathe”, particularly in the case of strong temperature fluctuations.
  • they are porous, in particular foam rubber-like, formed permanently elastic or resilient E elements of advantage by means of which the lens can be "breathed".
  • the invention consists of an optical system with an optical module of the type mentioned above.
  • the advantages of the optical module also come into play in the context of an overall system.
  • the invention is based on the knowledge that, contrary to the previous approaches, it is possible to use a permanently elastic or resilient element to move the circuit carrier in the opposite direction, i.e. away from the lens holder, pressing against a stop that is positively related to the optics, that a compact, highly integrated module solution with small dimensions is available, which is equally easy to assemble and disassemble and is therefore particularly cost-effective.
  • the optical module and the optical system are practically maintenance-free.
  • it is also not necessary to adjust the optical module optically since this is in any case due to the geometric design of the stop elements, the tolerance chain being shortened by a further measure by eliminating the circuit carrier and adhesive tolerance.
  • the tolerance of the stop element alone remains in the tolerance chain.
  • this dimension is tool-related.
  • the optical module or optical system according to the invention is thus significantly less tolerant than previously known.
  • the invention can be particularly useful in the implementation of video systems, possibly in combination with a radar system men, ultrasound systems or the like in the automotive field.
  • FIG. 1 shows a perspective, partially sectioned illustration of an optical module according to the invention
  • FIG. 2 shows the optical module according to the invention according to FIG. 1 in a sectional view
  • FIG 3 shows the lens holder of an optical module according to the invention with screw holes
  • FIG. 4 shows the lens holder according to FIG. 3 with the permanently elastic or resilient ring element placed or molded on;
  • FIG. 5 shows the lens holder according to FIGS. 3 and 4 with a prepositioned circuit carrier
  • FIG. 6 shows the lens holder according to FIG. 5 with a fixed circuit carrier
  • FIG. 7 shows an illustration of an optical module according to the invention, sectioned through the optical axis.
  • Fig. 8 is a sectional view of the fixation of an optical module according to the invention.
  • identical reference symbols designate identical or comparable components.
  • a lens unit 14; 16, 18, 20; 21 and a rigid circuit board 10, comprising an assembly area 10a can be seen.
  • the presently rigid printed circuit board 10 forms the circuit carrier 10 for an unhoused semiconductor element 12 which is sensitive to electromagnetic radiation and which is applied here as a so-called flip chip 12, which has the advantage that no additional tolerances within the sensor or component (eg carrier chip,
  • the presently rigid printed circuit board 10 is in operative contact with a ribbon cable or a flexible printed circuit board 27, at the opposite end of which it is provided with soldering pads 28, so that electrical contact between the optical module and a circuit board (not shown), for example by iron soldering Use of the solder pads 28 can be made.
  • the semiconductor element 12 is arranged on the circuit carrier 10 via solder bumps 30.
  • the semiconductor element 12 is arranged on the circuit carrier 10 using flip-chip technology. So that electromagnetic radiation from the lens arrangement 16, 18, 20; arranged on the side 10b facing away from the mounting surface 10a of the circuit carrier 10; 21 can reach the semiconductor element 12, the rigid circuit carrier 10 has an opening 24. This also has between the lens holder 14 and circuit carrier 10 or its second surface Before 10b, permanently elastic or resilient element 22 has an opening 32. Through these openings, electromagnetic radiation can reach a surface 34 of the semiconductor element 12 that is sensitive to electromagnetic radiation.
  • the semiconductor element 12 can, for example, be designed as CMOS or CCD.
  • an adhesive connection can also be provided.
  • An underfill (not shown) can be applied for reinforcement.
  • a glob top 26 is provided.
  • a groove for ventilation (not shown) can be provided in the flexible element 22, for example. It is also possible to arrange an adhesive DAE (adhesive pressure compensation element) on an opening (not shown) in the flexible element 22 or in the lens holder 14.
  • the optical quality can be improved by a lens with a plurality of lenses, which is also possible within the scope of the present invention, in particular since it is possible to work with small tolerances.
  • the lenses 16, 18, 20 and the diaphragm 21 are shaped such that they assume a defined position within the lens holder 14 relative to one another.
  • one of the lenses is Any artwork least 20 configured so that these 20 (play, as shown in Fig. 7 and 8 cooperating with ⁇ via locking means 38 with the lens holder 14 and with respect to the lens holder 14 and ultimately be as well a defined position takes on the semiconductor element 12. In this way, all lenses 16, 18, 20 or diaphragms 21 are adjusted with respect to the semiconductor element 12.
  • circuit carrier 10 and lens unit 14; 16, 18, 20; 21 takes place according to the invention via the at least one permanently elastic or resilient element 22 which is arranged between the lens holder 14 and the circuit carrier 10 and which moves the mounting surface 10a of the circuit carrier 10 away from the lens holder 14 against at least one stop element 13; 35 presses, which positively to the lens unit 14; 16, 18, 20; 21 related.
  • the stop element 33; 35 a positive locking surface 37 is formed.
  • the stop element 13 is, for example, part of a snap connection, which is realized by hooks arranged on the lens holder 14. Said positive-locking surface 37 is formed on the hook 13 in such a way that the mounting surface 10a flies against it 37.
  • Fig. 3 shows an alternative embodiment according to the invention.
  • the stop element 35 is part of a screw or rivet connection, with spacer elements 35 designed as screw holes 35 being arranged on the lens holder 14.
  • FIG. 4 shows the lens holder 14 according to FIG. 3 with a permanently elastic or resilient ring element 22 placed thereon.
  • the element 22 can also be molded onto the lens holder 14, for example by means of a two-component injection molding process or the like. It can be clearly seen how the shape at the end of the screw holes 35 facing away from the lens unit end faces 37 are formed, the mode of operation of which is described below.
  • FIG. 5 shows the lens holder 14 according to FIGS. 3 and 4 with a pre-positioned rigid PCB circuit carrier 10, this 10 not yet forming a surface connection with the form-fitting surfaces 37 of the spacer elements 35. In other words - the circuit carrier 10 has not yet been pressed down over the contact with the permanently elastic element 22.
  • FIG. 6 shows the lens holder 14 according to FIG. 5 with a fixed PCB circuit carrier 10. Fixing elements such as screws 33, plastic rivets or similar elements are introduced into the spacer elements 35 until they 33 rest against the form-fitting surface 37. As a result, the flip-chip surface or mounting surface 10a of the PCB circuit carrier 10 is aligned in a defined manner with respect to the lens unit.
  • FIG. 7 shows this in a representation cut through the optical axis
  • FIG. 8 in a representation cut through the fixation of an optical module according to the invention.
  • the permanently elastic or resilient element 22 presses the mounting surface 10a of the circuit carrier 10 against the fixing elements 33.
  • the circuit carrier has so far been pressed against a lens holder.
  • the present invention now goes a new way in that the circuit carrier is pressed in the opposite direction, ie away from the lens holder 14, by means of a permanently elastic or resilient element 22 and there a stop 13; 33, 35 is positively related to the optics. This completely eliminates the entire tolerance of the circuit carrier 10 and any adhesives.
  • the present invention is based on an optical module with a lens unit, which comprises a lens holder 14, in which a lens arrangement comprising, for example, three lenses 16, 18, 20 and a diaphragm 21 is inserted.
  • the lenses 16, 18, 20 and the diaphragm 21 are preferably clearly aligned with one another and with respect to the lens holder 14 due to their geometric design, so that no further optical adjustment of the optical module is required.
  • the lens holder 14 also stands over at least one stop element 13 formed on the lens holder 14; 35 with the mounting surface 10a of a rigid printed circuit board 10, which at the same time serves as a circuit carrier for an unhoused semiconductor element 12 sensitive to electromagnetic radiation, in such a way that for the first time the thickness tolerance of the circuit carrier 10 and any adhesive connections advantageously not in the tolerance chain of generic optical modules or systems.
  • the semiconductor element 12 is arranged at a defined position with respect to the other optical elements, ie in particular the lenses 16, 18, 20 or the diaphragm 21, the type of circuit carrier 10, for example FR4, CEM, etc., needs previously customary, can no longer be committed. Rather, "normal”, uncritical and therefore less expensive circuit carriers can be used.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Optics & Photonics (AREA)
  • Lens Barrels (AREA)
  • Studio Devices (AREA)

Abstract

Disclosed is an optical module comprising a lens holder (14) into which a lens array consisting of three lenses (16, 18, 20) and a diaphragm (21), for example, is inserted. Preferably, the lenses (16, 18, 20) and the diaphragm (21) are clearly oriented by means of the geometrical shape thereof such that no further optical adjustment is required. Moreover, the circuit carrier (10) and the lens unit (14; 16, 18, 20; 21) are adjusted via at least one permanently flexible or springy element (22) which is disposed between the lens holder (14) and the circuit carrier (10) and presses the component-equipped area (10a) of the circuit carrier (10) away from the lens holder (14) and against at least one stop element (13; 35) that is in positive (37) contact with the lens unit (14; 16, 18, 20; 21). For the first time, the inventive design of an optical module or optical system advantageously dispenses with the need to take into account the thickness tolerance of the circuit carrier (10) and possible adhesives in the tolerance chain of generic optical modules or systems. The invention is particularly suitable for applications in the interior or exterior zone of a motor vehicle.

Description

Beschreibungdescription
Optisches Modul und optisches SystemOptical module and optical system
Die Erfindung betrifft ein optisches Modul mit einem starren Schaltungsträger umfassend eine Bestückfläche; einem mittels Flip-Chip-Technik auf der Bestückungsfläche des Schaltungsträger angeordneten ungehäusten Halbleiterelement; und einer Linseneinheit, welche auf der der Bestückfläche abgewandten Seite des Schaltungsträgers angeordnet ist; wobei der Schaltungsträger eine Öffnung aufweist, durch die elektromagnetische Strahlung von der Linseneinheit auf das Halbleiterelement projiziert wird; und wobei die Linseneinheit einen Linsenhalter und eine Linsenanordnung mit mindestens einer Linse umfasst. Gattungsgemäße optische Module sind beispielsweise aus der DE 196 51 260 AI bekannt.The invention relates to an optical module with a rigid circuit carrier comprising an assembly surface; an unhoused semiconductor element arranged by means of flip-chip technology on the assembly surface of the circuit carrier; and a lens unit which is arranged on the side of the circuit carrier facing away from the component surface; wherein the circuit carrier has an opening through which electromagnetic radiation is projected from the lens unit onto the semiconductor element; and wherein the lens unit comprises a lens holder and a lens arrangement with at least one lens. Generic optical modules are known for example from DE 196 51 260 AI.
Die Erfindung betrifft weiterhin ein optisches System mit einem derartigen optischen Modul.The invention further relates to an optical system with such an optical module.
Gattungsgemäße optische Module und Systeme kommen insbesondere in der Kraftfahrzeugtechnik zum Einsatz. Dabei kann mit e- lektromagnetischer Strahlung aus verschiedenen Frequenzbereichen gearbeitet werden, wobei kumulativ zum sichtbaren Licht, mit welchem typischerweise Anwendungen im Außenraum einesGeneric optical modules and systems are used in particular in automotive engineering. It is possible to work with electromagnetic radiation from different frequency ranges, cumulative to the visible light, with which applications are typically used outdoors
Kraftfahrzeuges wie LD - (Lane Departure Warning) Fahrspur- verlassenswarnung, BSD- (Blind Spot Detection) Totwinkelde- tektion, oder Rückraumkameras (Rear View Cameras) arbeiten, insbesondere die für Menschen unsichtbare Infrarotstrahlung bei Anwendungen im Innenraum eines Kraftfahrzeuges wie OOP- (Out of Position Detection) Positionverlassensdetektion oder bei zusätzlichen Außenbeleuchtungen eines Nachtsichtsystems (Night Vision Systems) bevorzugt wird. Bei Anwendungen im Innen- oder Außenbereich eines Fahrzeugs bestehen hohe Anforderungen aufgrund von äußeren Einflüssen wie Temperatur, Feuchtigkeit, Verschmutzung und Vibration. Die typische Lebensdauer für Systeme im Fahrzeug liegt bei 10 bis 15 Jahren, wobei nur extrem geringe Ausfallraten toleriert werden, so dass auch die Komponenten eines optischen Systems der eingangs genannten Art eine nur sehr langsame Alterung zeigen dürfen.Motor vehicles such as LD (lane departure warning) lane departure warning, BSD (blind spot detection) blind spot detection, or rear view cameras (rear view cameras) work, in particular the infrared radiation which is invisible to people in applications in the interior of a motor vehicle such as OOP (out of Position Detection) position-leaving detection or with additional external lighting of a night vision system is preferred. Applications in the interior or exterior of a vehicle are subject to high demands due to external influences such as temperature, humidity, pollution and vibration. The typical lifespan for systems in the vehicle is 10 to 15 years, whereby only extremely low failure rates are tolerated, so that the components of an optical system of the type mentioned at the outset may also only show very slow aging.
Da in vielen Fällen der Einbauraum von optischen Modulen bzw. optischen Systemen sehr begrenzt ist, existieren zusätzliche Schwierigkeiten bei der Realisierung der optischen Systeme. Mit herkömmlichen Mitteln ist es daher extrem schwierig, eine hermetisch abgedichtete zuverlässige Einheit aus einem Kamerachip (derzeit CCD- oder CMOS-Sensor) und einer Optik aufzubauen .Since the installation space of optical modules or optical systems is very limited in many cases, there are additional difficulties in realizing the optical systems. With conventional means, it is extremely difficult to build a hermetically sealed, reliable unit from a camera chip (currently CCD or CMOS sensor) and optics.
So ist bei derartigen Systemen, mit denen Bilder oder ähnli- ehe Informationen aufgenommen werden, es bekanntlich nötig, dass die Optik am Punkt der Umwandlung Licht in Information (z.B. Filmebene, optische Fläche CCD- oder CMOS-Sensor) Ihren genauen Fokus hat. Daher muss der Abstand zwischen dem Kamerachip und der Optik entweder während der Fertigung einmal grundlegend eingestellt und fixiert werden oder der Focus wird bei jedem Bild neu eingestellt (Scharfstellen auf Objekt, nicht verwaschende Strahlen) . Dies führt zu einem erheblichen Fertigungsaufwand. Ferner besteht hierdurch ein Qualitätsrisiko .In systems of this type, with which images or similar information are recorded, it is known that the optics have their exact focus at the point of conversion of light into information (e.g. film plane, optical surface CCD or CMOS sensor). Therefore, the distance between the camera chip and the optics must either be set and fixed once during production or the focus is reset for each image (focusing on the object, non-blurring rays). This leads to a considerable manufacturing effort. This also poses a quality risk.
Kameras für spezifische Low Cost Anwendungen wie z.B. Automotive, Industrie, Digitalkamera, Handy, Spielzeug etc., sollen jedoch aus Kosten- und Aspekten der Qualitätssicherung mög liehst ohne Justagevorgänge zwischen Optik und Kamerachip herstellbar sein, also ohne Einstellungen des Focus auf die optische Fläche des CMOS- oder CCD-Sensors. Dies steht den genannten Anforderungen grundsätzlich entgegen.Cameras for specific low-cost applications such as automotive, industry, digital cameras, cell phones, toys, etc. should, however, be possible from cost and quality assurance aspects can be produced without any adjustment processes between the optics and the camera chip, i.e. without adjusting the focus to the optical surface of the CMOS or CCD sensor. This is fundamentally contrary to the requirements mentioned.
Eine Möglichkeit ein fokusfreies System zu entwickeln ist die Summen der möglichen Toleranzen und Elemente zu verkleinern, so dass das Modul bzw. System designbedingt ohne Justage zumindest in einem bestimmten Entfernungs- und Temperaturbe- reich funktioniert. Bei Verwendung der Erfindung beispielsweise im Rahmen eines Insassenschutzsystems eines Kraftfahrzeuges, auf welches die vorliegende Erfindung jedoch nicht beschränkt ist, sollten scharfe Bilder bei Entfernungen von z.B. 15 cm bis 130 cm sowie bei Temperaturen von z.B. - 40°C bis + 105 °C gewährleistbar sein. Dies ist um so eher realisierbar, je weniger Elemente in die Toleranzkette mit eingehen. Einen großen Anteil in der Toleranzkette besitzt der Schaltungsträger für den Kamerachip (z.B. CCD oder CMOS). So wird beispielsweise durch Einsatz von sehr dünnen, sog. fle- xiblen, Leiterplatten versucht, nur eine geringe Dickentoleranz einzubringen. Darüber hinaus besitzen insb. die notwendigen Löt- und ggf. Klebeverbindungen oder dergleichen zwischen Chip und Schaltungsträger einen großen Anteil in der Toleranzkette .One possibility of developing a focus-free system is to reduce the sum of the possible tolerances and elements, so that the module or system, due to the design, works without adjustment, at least in a certain distance and temperature range. When using the invention, for example in the context of an occupant protection system of a motor vehicle, to which the present invention is not limited, however, sharp images should be taken at distances of e.g. 15 cm to 130 cm and at temperatures of e.g. - 40 ° C to + 105 ° C can be guaranteed. This is all the more realizable, the fewer elements are included in the tolerance chain. The circuit carrier for the camera chip (e.g. CCD or CMOS) has a large share in the tolerance chain. For example, by using very thin, so-called flexible, printed circuit boards, an attempt is made to introduce only a small thickness tolerance. In addition, the necessary soldered and possibly adhesive connections or the like between the chip and the circuit carrier have a large proportion in the tolerance chain.
Bei Verwendung von nur einer Linse wird vermieden, dass zusätzliche optische Toleranzen durch einen komplizierten Linsenaufbau bewirkt werden. Der, vorzugsweise aus Kunststoff bestehende, Linsenhalter selbst kann in verschiedener Weise mit der Linsenanordnung verbunden werden, so dass stets eine exakte optische Ausrichtung der Linsenanordnung und des Halbleiterelementes in Bezug auf den Linsenhalter beziehungsweise die Linsenanordnung sichergestellt werden kann. Dennoch ist bei Systemen, die weitgehend einen klassischen Aufbau aus Objektiv und Kamerachip aufweisen, wobei der Kamerachip ungehäust als sog. Flip-Chip auf einem geeigneten Schaltungsträger aufgebracht ist, es schwierig, die genannten Probleme in ihrer Gesamtschau zu umgehen und gleichzeitig die genannten Qualitätsanforderungen zu erfüllen. Das Objektiv selbst muss jedoch zum Kamerachip justiert sein und eine definierte Fokussierung aufweisen. Dies erfolgt durch geeignete Feststellmöglichkeiten, beispielsweise durch eine Verschrau- bung, Verklebung oder dergleichen, mittels welcher das Objektiv relativ zum Kamerachip an der der Bestückfläche gegenüberliegenden Seite des Schaltungsträger an diesem letztlich so fixiert wird, dass in die Toleranzkette nachteilig der Schaltungsträger sowie der Klebstoff bzw. die Schraubverbindung oder dergleichen mit eingehen.When using only one lens, it is avoided that additional optical tolerances are caused by a complicated lens structure. The lens holder itself, which is preferably made of plastic, can be connected to the lens arrangement in various ways, so that an exact optical alignment of the lens arrangement and the semiconductor element with respect to the lens holder or the lens arrangement can always be ensured. Nevertheless, in systems that largely have a classic design consisting of a lens and camera chip, the camera chip being unhoused as a so-called flip chip on a suitable circuit carrier, it is difficult to avoid the problems mentioned in their entirety and at the same time to meet the quality requirements mentioned fulfill. However, the lens itself must be adjusted to the camera chip and have a defined focus. This is done by means of suitable locking options, for example by screwing, gluing or the like, by means of which the lens is ultimately fixed to the circuit chip relative to the camera chip on the side of the circuit carrier opposite the mounting surface in such a way that the circuit carrier and the adhesive or adhesive are disadvantageously included in the tolerance chain enter into the screw connection or the like.
Der Erfindung liegt die Aufgabe zugrunde, ein optisches Modul und ein optisches System mit einem auf einen starren Schal- tungsträger angeordneten ungehäusten Halbleiterelement zurThe object of the invention is to provide an optical module and an optical system with an unhoused semiconductor element arranged on a rigid circuit carrier
Verfügung zu stellen, bei dem die Dickentoleranz des notwendigen Schaltungsträgers und evtl. nötige Klebeverbindungen o- der dergleichen weitgehendst so eliminiert sind, dass bei einfacher und kostengünstiger Montage eine zuverlässige opti- sehe Qualität ohne Justier- und insbesondere Fokussieraufwand zur Verfügung gestellt werden kann und über die Lebensdauer des Moduls bzw. Systems gehalten wird.To be made available, in which the thickness tolerance of the necessary circuit carrier and possibly necessary adhesive connections or the like are largely eliminated in such a way that with simple and inexpensive installation a reliable optical quality can be provided without adjustment and, in particular, focusing effort and above the lifespan of the module or system is maintained.
Diese Aufgabe wird mit den Merkmalen der unabhängigen Patent- ansprüche gelöst. Vorteilhafte Ausführungsformen der Erfindung, welche einzeln oder in Kombination miteinander einsetzbar sind, sind in den abhängigen Ansprüchen angegeben. Die Erfindung baut auf dem gattungsgemäßen optischen Modul dadurch auf, dass zwischen Linsenhalter und Schaltungsträger wenigstens ein dauerelastisches oder federndes Element angeordnet ist, welches die Bestückfläche des Schaltungsträgers vom Linsenhalter weg gegen wenigstens ein Anschlagselement presst, welches formschlüssig zur Linseneinheit in Beziehung steht .This object is achieved with the features of the independent patent claims. Advantageous embodiments of the invention, which can be used individually or in combination with one another, are specified in the dependent claims. The invention builds on the generic optical module in that at least one permanently elastic or resilient element is arranged between the lens holder and circuit carrier, which presses the mounting surface of the circuit carrier away from the lens holder against at least one stop element which is positively related to the lens unit.
Anders als bei den aus dem Stand der Technik bekannten Lösun- gen, bei denen der Schaltungsträger gegen einen Linsenhalter gepresst wird, geht die vorliegende Erfindung einen neuen Weg, indem der Schaltungsträger mittels eines dauerelastischen Elements in die entgegengesetzte Richtung, d.h. vom Linsenhalter weg, gepresst wird und dort ein Anschlag form- schlüssig zur Optik in Beziehung steht. Dadurch wird die gesamte Toleranz des Schaltungsträgers und evtl . Klebstoffe nicht weitgehend sondern in vorteilhafter Weise vollständig eliminiert. Somit wird mit vorliegender Erfindung eine Fertigungstechnologie mit besonders geringen Toleranzen zwischen einem ungehäusten Halbleiterelement und einer Linseneinheit ermöglicht .In contrast to the solutions known from the prior art, in which the circuit carrier is pressed against a lens holder, the present invention takes a new route in that the circuit carrier by means of a permanently elastic element in the opposite direction, i.e. is pressed away from the lens holder, and there a stop is positively related to the optics. As a result, the entire tolerance of the circuit carrier and possibly. Adhesives not largely, but completely eliminated in an advantageous manner. The present invention thus enables production technology with particularly small tolerances between an unhoused semiconductor element and a lens unit.
Beispielsweise ist der Formschluss durch eine am Anschlagelement ausgebildete Formschlussfläche realisiert. Diese kann in einer ersten Weiterbildung Teil einer Schnappverbindung sein. Dazu ist das Anschlagselement vorzugsweise durch am Linsenhalter ausgebildete Haken realisiert. Dies macht nicht nur schon die Montage sondern auch ein späteres Recycling, insb. die Trennung von Optik und Elektronik, besonders umwelt- freundlich und einfach.For example, the form fit is realized by a form fit surface formed on the stop element. In a first development, this can be part of a snap connection. For this purpose, the stop element is preferably realized by hooks formed on the lens holder. This not only makes assembly, but also subsequent recycling, especially the separation of optics and electronics, particularly environmentally friendly and easy.
In einer alternativen Weiterbildung ist das Anschlagelement Teil einer Schraub- oder Nietverbindung oder dergleichen, wo bei bevorzugt das Anschlagelement durch am Linsenhalter angeordnete Abstandsbolzen bzw. Schraublöcher realisiert ist, welche mit einer Schraube, einem z.B. Kunststoff-Niet oder dergleichen zusammenwirken.In an alternative development, the stop element is part of a screw or rivet connection or the like, where in the case of the stop element is preferably realized by spacer bolts or screw holes arranged on the lens holder, which interact with a screw, for example a plastic rivet or the like.
Erfindungsgemäß bevorzugt ist das dauerelastische bzw. federnde Element rechteckförmig, ringförmig oder dergleichen, vorzugsweise als Stanzteil, ausgebildet. Dies erlaubt in vorteilhafter Weise eine Massenfertigung.According to the invention, the permanently elastic or resilient element is preferably rectangular, ring-shaped or the like, preferably as a stamped part. This advantageously allows mass production.
Beispielsweise haben sich dauerelastische bzw. federnde Elemente aus thermoplastischer Elastomere (TPE) , Silikon oder dergleichen bewährt, welche bevorzugt zugleich die Linseneinheit, insb. zum Schutz vor Feuchtigkeit und/oder Staub etc., gegen den Schaltungsträger abdichten. In einer besonders vorteilhafter Weise kann das erfindungsgemäße optische Modul dadurch weitergebildet sein, dass im Verbindungsbereich zwischen der starren Leiterplatte und dem dauerelastischen bzw. federnden Element ein Entlüftungskanal vorgesehen ist. Auf diese Weise kann ein abgedichtete Modul, insbesondere bei starken TemperaturSchwankungen, „atmen" . Bei der Ausführung der vorliegenden Erfindung mit einem dauerelastischen bzw. flexiblen Element ist es in einfacher Weise möglich, beispielsweise in das Element selbst einen Entlüftungskanal ein- zubringen. Soll das optische Modul bei größeren Temperaturschwankungen eingesetzt werden, kann es sich als sinnvoll erweisen, eine Klebe-DAE (Druckausgleichselement) bzw. DAE- Folie über eine im flexiblen Element, ggf. auch im Linsenhalter selbst, ausgebildete Öffnung zu kleben.For example, permanently elastic or resilient elements made of thermoplastic elastomers (TPE), silicone or the like have proven themselves, which preferably also seal the lens unit, in particular for protection against moisture and / or dust etc., against the circuit carrier. In a particularly advantageous manner, the optical module according to the invention can be further developed in that a ventilation channel is provided in the connection area between the rigid printed circuit board and the permanently elastic or resilient element. In this way, a sealed module can “breathe”, particularly in the case of strong temperature fluctuations. In the embodiment of the present invention with a permanently elastic or flexible element, it is possible in a simple manner, for example to introduce a ventilation channel into the element itself optical module are used for larger temperature fluctuations, it can be useful to glue an adhesive DAE (pressure compensation element) or DAE film over an opening formed in the flexible element, possibly also in the lens holder itself.
Alternativ oder kumulativ hierzu sind porös, insbesondere moosgummiartig, ausgebildete dauerelastische bzw. federnde E lemente von Vorteil, mittels welchen ein „atmen" des Objektivs realisierbar ist.Alternatively or cumulatively, they are porous, in particular foam rubber-like, formed permanently elastic or resilient E elements of advantage by means of which the lens can be "breathed".
Die Erfindung besteht schließlich in einem optischen System mit einem optischen Modul der vorstehend genannten Art. Auf diese Weise kommen die Vorteile des optischen Moduls auch im Rahmen eines Gesamtsystems zur Geltung.Finally, the invention consists of an optical system with an optical module of the type mentioned above. In this way, the advantages of the optical module also come into play in the context of an overall system.
Der Erfindung liegt die Erkenntnis zugrunde, dass entgegen den bisherigen Lösungsansätzen es möglich ist, den Schaltungsträger mittels eines dauerelastischen oder federnden E- lements so in die entgegengesetzte Richtung, d.h. vom Linsenhalter weg, gegen einen ein Anschlag, welcher formschlüssig zur Optik in Beziehung steht, zu pressen, dass eine kompakte hochintegrierte Modullösung mit geringen Abmaßen zur Verfügung zu steht, die gleichermaßen einfach zu montieren sowie zu demontieren und hierdurch besonders kostengünstig ist.The invention is based on the knowledge that, contrary to the previous approaches, it is possible to use a permanently elastic or resilient element to move the circuit carrier in the opposite direction, i.e. away from the lens holder, pressing against a stop that is positively related to the optics, that a compact, highly integrated module solution with small dimensions is available, which is equally easy to assemble and disassemble and is therefore particularly cost-effective.
Das optische Modul und das optische System sind praktisch wartungsfrei. Besonders im Sinne der Kosteneinsparung ist auch, dass keine optische Justierung des optischen Moduls erforderlich ist, da diese durch die geometrische Gestaltung der Anschlagselemente ohnehin vorliegt, wobei die Toleranzkette durch Eliminierung der Schaltungsträger- und Klebstoff- toleranz um ein weitere Maße verkürzt ist. Allein die Toleranz des Anschlagselements verbleibt in der Toleranzkette. Dieses Maß ist aber werkzeuggebunden. Das erfindungsgemäße optische Modul bzw. optische System ist somit deutlich toleranzgünstiger als bisher bekannte.The optical module and the optical system are practically maintenance-free. In particular, in terms of cost savings, it is also not necessary to adjust the optical module optically, since this is in any case due to the geometric design of the stop elements, the tolerance chain being shortened by a further measure by eliminating the circuit carrier and adhesive tolerance. The tolerance of the stop element alone remains in the tolerance chain. However, this dimension is tool-related. The optical module or optical system according to the invention is thus significantly less tolerant than previously known.
Die Erfindung lässt sich besonders nützlich bei der Realisierung von Videosystemen, ggf. in Kombination mit Radarsyste men, Ultraschallsystemen oder dergleichen im Kraftfahrzeugbereich verwenden.The invention can be particularly useful in the implementation of video systems, possibly in combination with a radar system men, ultrasound systems or the like in the automotive field.
Die Erfindung wird nun mit Bezug auf die begleitenden Zeich- nungen anhand bevorzugter Ausführungsformen beispielhaft erläutert .The invention will now be explained by way of example with reference to the accompanying drawings using preferred embodiments.
Es zeigen schematisch:They show schematically:
Fig. 1 eine perspektivische, teilweise geschnittene Darstellung eines erfindungsgemäßen optischen Moduls;1 shows a perspective, partially sectioned illustration of an optical module according to the invention;
Fig. 2 das erfindungsgemäße optische Modul nach Fig. 1 in einer Schnittansicht;FIG. 2 shows the optical module according to the invention according to FIG. 1 in a sectional view;
Fig. 3 den Linsenhalter eines optischen Moduls nach der Erfindung mit Schraublöchern;3 shows the lens holder of an optical module according to the invention with screw holes;
Fig. 4 den Linsenhalter nach Fig. 3 mit aufgelegten bzw. angeformten dauerelastischen bzw. federnden Ringelement;4 shows the lens holder according to FIG. 3 with the permanently elastic or resilient ring element placed or molded on;
Fig. 5 den Linsenhalter nach Fig. 3 bzw. 4 mit einem vorpositionierten Schaltungsträger;5 shows the lens holder according to FIGS. 3 and 4 with a prepositioned circuit carrier;
Fig. 6 den Linsenhalter nach Fig. 5 mit einem fixierten Schaltungsträger;6 shows the lens holder according to FIG. 5 with a fixed circuit carrier;
Fig. 7 eine durch die optische Achse geschnittene Darstel- lung eines optischen Moduls nach der Erfindung; und7 shows an illustration of an optical module according to the invention, sectioned through the optical axis; and
Fig. 8 eine durch die Fixierung geschnitten Darstellung eines optischen Moduls nach der Erfindung. Bei der nachfolgenden Beschreibung der bevorzugten Ausfüh- rungsformen der vorliegenden Erfindung bezeichnen gleiche Bezugszeichen gleiche oder vergleichbare Komponenten.Fig. 8 is a sectional view of the fixation of an optical module according to the invention. In the following description of the preferred embodiments of the present invention, identical reference symbols designate identical or comparable components.
In dem in Fig. 1 und 2 dargestellten zusammengebauten Zustand des optischen Moduls sind eine Linseneinheit 14; 16, 18, 20; 21 und eine starre Leiterplatte 10, umfassend eine Bestück- fläche 10a, erkennbar. Die vorliegend starr ausgebildete Leiterplatte 10 bildet den Schaltungsträger 10 für ein auf e- lektromagnetische Strahlung empfindliches ungehäusten Halbleiterelement 12, das hier als sog. Flip-Chip 12 aufgebracht ist, was den Vorteil hat, dass keine zusätzlichen Toleranzen innerhalb des Sensors bzw. Bauelements (z.B. Träger Chip,In the assembled state of the optical module shown in FIGS. 1 and 2, a lens unit 14; 16, 18, 20; 21 and a rigid circuit board 10, comprising an assembly area 10a, can be seen. The presently rigid printed circuit board 10 forms the circuit carrier 10 for an unhoused semiconductor element 12 which is sensitive to electromagnetic radiation and which is applied here as a so-called flip chip 12, which has the advantage that no additional tolerances within the sensor or component ( eg carrier chip,
Klebstoff, etc.) dazu kommen. Die vorliegend starr ausgebildete Leiterplatte 10 steht mit einem Flachbandkabel oder einer flexiblen Leiterplatte 27 in Wirkkontakt, an dessen entgegengesetztem Ende dieses mit Lötpads 28 versehen ist, so dass ein elektrischer Kontakt zwischen dem optischen Modul und einer Schaltungsplatine (nicht dargestellt) , beispielsweise durch Bügellöten unter Verwendung der Lötpads 28, hergestellt werden kann.Glue, etc.). The presently rigid printed circuit board 10 is in operative contact with a ribbon cable or a flexible printed circuit board 27, at the opposite end of which it is provided with soldering pads 28, so that electrical contact between the optical module and a circuit board (not shown), for example by iron soldering Use of the solder pads 28 can be made.
Auf dem Schaltungsträger 10 ist über Löt-Bumps 30 das Halbleiterelement 12 angeordnet. Das Halbleiterelement 12 wird durch Flip-Chip-Technik auf dem Schaltungsträger 10 angeordnet. Damit elektromagnetische Strahlung von der auf der zur Bestückfläche 10a des Schaltungsträgers 10 abgewandten Seite 10b angeordneten Linsenanordnung 16, 18, 20; 21 zum Halbleiterelement 12 gelangen kann, weist der starre Schaltungsträger 10 eine Öffnung 24 auf. Ebenfalls hat das zwischen Linsenhalter 14 und Schaltungsträger 10 bzw. dessen zweiten Flä ehe 10b angeordnete dauerelastische bzw. federnde Element 22 eine Öffnung 32. Durch diese Öffnungen kann elektromagnetische Strahlung zu einer auf elektromagnetische Strahlung empfindlichen Fläche 34 des Halbleiterelementes 12 gelangen.The semiconductor element 12 is arranged on the circuit carrier 10 via solder bumps 30. The semiconductor element 12 is arranged on the circuit carrier 10 using flip-chip technology. So that electromagnetic radiation from the lens arrangement 16, 18, 20; arranged on the side 10b facing away from the mounting surface 10a of the circuit carrier 10; 21 can reach the semiconductor element 12, the rigid circuit carrier 10 has an opening 24. This also has between the lens holder 14 and circuit carrier 10 or its second surface Before 10b, permanently elastic or resilient element 22 has an opening 32. Through these openings, electromagnetic radiation can reach a surface 34 of the semiconductor element 12 that is sensitive to electromagnetic radiation.
Das Halbleiterelement 12 kann nach heutigem Stand z.B. als CMOS oder CCD ausgelegt sein. Es kann zusätzlich oder neben der Lötverbindung 30 auch eine Klebeverbindung vorgesehen sein. Zur Verstärkung kann ein Underfill (nicht dargestellt) appliziert werden. Um das teure Halbleiterelement 12 gegen Fremdlichtstrahlung und/oder Umwelteinflüsse von hinten zu schützen, wird ein Globtop 26 vorgesehen. Um bei, insbesondere starken, Temperaturschwankungen eine Entlüftung des optischen Moduls zu gestatten, kann beispielsweise in dem flexib- len Element 22 eine Nut zum Entlüften (nicht dargestellt) vorgesehen sein. Ebenfalls ist es möglich, ein Klebe-DAE (Klebe-Druckausgleichselement) auf einer Öffnung (nicht dargestellt) im flexiblen Element 22 oder im Linsenhalter 14 anzuordnen .The semiconductor element 12 can, for example, be designed as CMOS or CCD. In addition or in addition to the soldered connection 30, an adhesive connection can also be provided. An underfill (not shown) can be applied for reinforcement. In order to protect the expensive semiconductor element 12 against extraneous light radiation and / or environmental influences from behind, a glob top 26 is provided. In order to permit ventilation of the optical module in the event of, in particular, strong temperature fluctuations, a groove for ventilation (not shown) can be provided in the flexible element 22, for example. It is also possible to arrange an adhesive DAE (adhesive pressure compensation element) on an opening (not shown) in the flexible element 22 or in the lens holder 14.
Vorzugsweise ist eine Linsenanordnung 14; 16, 18, 20; 21 mit mehreren Linsen 16, 18, 20 und ggf. wenigstens einer Blende 21 in Form eines Pakets vorgesehen. Die optische Qualität kann durch ein Objektiv mit mehreren Linsen verbessert wer- den, was auch im Rahmen der vorliegenden Erfindung möglich ist, insbesondere da mit geringen Toleranzen gearbeitet werden kann. Die Linsen 16, 18, 20 sowie die Blende 21 sind so geformt, dass sie relativ zueinander eine definierte Lage innerhalb des Linsenhalters 14 annehmen. Weiterhin ist mindes- tens eine der Linsen 20 so ausgestaltet, dass diese 20 (bei¬ spielweise wie in Fig. 7 und 8 dargestellt über Rastmittel 38 mit dem Linsenhalter 14 zusammenwirkt und so auch eine definierte Lage bezüglich des Linsenhalters 14 und letztlich be züglich des Halbleiterelementes 12 einnimmt. Auf diese Weise sind alle Linsen 16, 18, 20 bzw. Blenden 21 bezüglich des Halbleiterelementes 12 justiert.A lens arrangement 14; 16, 18, 20; 21 with a plurality of lenses 16, 18, 20 and possibly at least one diaphragm 21 in the form of a package. The optical quality can be improved by a lens with a plurality of lenses, which is also possible within the scope of the present invention, in particular since it is possible to work with small tolerances. The lenses 16, 18, 20 and the diaphragm 21 are shaped such that they assume a defined position within the lens holder 14 relative to one another. Furthermore, one of the lenses is Any artwork least 20 configured so that these 20 (play, as shown in Fig. 7 and 8 cooperating with ¬ via locking means 38 with the lens holder 14 and with respect to the lens holder 14 and ultimately be as well a defined position takes on the semiconductor element 12. In this way, all lenses 16, 18, 20 or diaphragms 21 are adjusted with respect to the semiconductor element 12.
Die Justierung von Schaltungsträger 10 und Linseneinheit 14; 16, 18, 20; 21 erfolgt erfindungsgemäß über das wenigstens eine zwischen Linsenhalter 14 und Schaltungsträger 10 angeordnete dauerelastische oder federnde Element 22, welches die Bestückfläche 10a des Schaltungsträgers 10 vom Linsenhalter 14 weg gegen wenigstens ein Anschlagselement 13; 35 presst, welches formschlüssig zur Linseneinheit 14; 16, 18, 20; 21 in Beziehung steht. Vorzugsweise ist dazu am Anschlagelement 33; 35 eine Formschlussfläche 37 ausgebildet.The adjustment of circuit carrier 10 and lens unit 14; 16, 18, 20; 21 takes place according to the invention via the at least one permanently elastic or resilient element 22 which is arranged between the lens holder 14 and the circuit carrier 10 and which moves the mounting surface 10a of the circuit carrier 10 away from the lens holder 14 against at least one stop element 13; 35 presses, which positively to the lens unit 14; 16, 18, 20; 21 related. For this purpose, the stop element 33; 35 a positive locking surface 37 is formed.
In dem Ausführungsbeispiel gemäß Fig. 1 und 2 ist das Anschlagelement 13 beispielsweise Teil einer Schnappverbindung, welches durch am Linsenhalter 14 angeordnete Haken realisiert ist. An den Haken 13 ist besagte Formschlussfläche 37 dergestalt ausgebildet, dass die Bestückfläche 10a auf dieser 37 anfliegt.In the exemplary embodiment according to FIGS. 1 and 2, the stop element 13 is, for example, part of a snap connection, which is realized by hooks arranged on the lens holder 14. Said positive-locking surface 37 is formed on the hook 13 in such a way that the mounting surface 10a flies against it 37.
Fig. 3 zeigt ein alternatives Ausführungsbeispiel nach der Erfindung. Hierbei ist das Anschlagselement 35 Teil einer Schraub- oder Nietverbindung, wobei am Linsenhalter 14 als Schraubloch 35 ausgebildete Abstandselemente 35 angeordnet sind.Fig. 3 shows an alternative embodiment according to the invention. Here, the stop element 35 is part of a screw or rivet connection, with spacer elements 35 designed as screw holes 35 being arranged on the lens holder 14.
Fig. 4 zeigt den Linsenhalter 14 gemäß Fig. 3 mit einem aufgelegten dauerelastischen bzw. federnden Ringelement 22. Je nach Materialwahl kann das Element 22 auch z.B. mittels eines Zweikomponenten-Spritzverfahrens oder dergleichen am Linsenhalter 14 angeformt sein. Deutlich erkennbar ist, wie an dem der Linseneinheit abgewandten Ende der Schraublöcher 35 Form schlussflächen 37 ausgebildet sind, deren Wirkweise nachfolgend beschrieben ist.FIG. 4 shows the lens holder 14 according to FIG. 3 with a permanently elastic or resilient ring element 22 placed thereon. Depending on the choice of material, the element 22 can also be molded onto the lens holder 14, for example by means of a two-component injection molding process or the like. It can be clearly seen how the shape at the end of the screw holes 35 facing away from the lens unit end faces 37 are formed, the mode of operation of which is described below.
Fig. 5 zeigt den Linsenhalter 14 nach Fig. 3 bzw. 4 mit einem vorpositionierten starren PCB-Schaltungsträger 10, wobei dieser 10 noch nicht Flächenschluss mit den Formschlussflächen 37 der Abstandselemente 35 bildet. Mit anderen Worten - der Schaltungsträger 10 ist noch nicht bis über die Anlage an dem dauerelastischen Element 22 nach unten gedrückt.FIG. 5 shows the lens holder 14 according to FIGS. 3 and 4 with a pre-positioned rigid PCB circuit carrier 10, this 10 not yet forming a surface connection with the form-fitting surfaces 37 of the spacer elements 35. In other words - the circuit carrier 10 has not yet been pressed down over the contact with the permanently elastic element 22.
Fig. 6 zeigt den Linsenhalter 14 nach Fig. 5 mit einem fixierten PCB-Schaltungsträger 10. Fixierelemente wie Schrauben 33, Kunststoffniete oder dergleichen Elemente werden soweit in die Abstandselemente 35 eingebracht, bis diese 33 an den Formschlussfläche 37 anliegen. Dadurch ist die Flip-Chip- Fläche bzw. Bestückfläche 10a des PCB-Schaltungsträgers 10 definiert zur Linseneinheit ausgerichtet.FIG. 6 shows the lens holder 14 according to FIG. 5 with a fixed PCB circuit carrier 10. Fixing elements such as screws 33, plastic rivets or similar elements are introduced into the spacer elements 35 until they 33 rest against the form-fitting surface 37. As a result, the flip-chip surface or mounting surface 10a of the PCB circuit carrier 10 is aligned in a defined manner with respect to the lens unit.
Dies zeigt Fig. 7 in einer durch die optische Achse geschnit- tenen Darstellung und Fig. 8 in einer durch die Fixierung geschnitten Darstellung eines optischen Moduls nach der Erfindung. Deutlich erkennbar ist, wie das dauerelastische bzw. federnde Element 22 die Bestückfläche 10a des Schaltungsträgers 10 gegen die Fixierelemente 33 drückt. Im Stand der Technik wird bislang der Schaltungsträger gegen einen Linsenhalter gepresst. Die vorliegende Erfindung geht nun einen neuen Weg, indem der Schaltungsträger mittels eines dauerelastischen bzw. federnden Elements 22 in die entgegengesetzte Richtung, d.h. vom Linsenhalter 14 weg, gepresst wird und dort ein Anschlag 13; 33, 35 formschlüssig zur Optik in Beziehung steht. Dadurch wird die gesamte Toleranz des Schaltungsträgers 10 und evtl. Klebstoffe vollständig eliminiert. Die vorliegende Erfindung geht von einem optischen Modul mit einer Linseneinheit aus, welche einen Linsenhalter 14 umfasst, in welchem eine Linsenanordnung aus beispielsweise drei Linsen 16, 18, 20 und einer Blende 21 eingesetzt ist. Vorzugsweise sind die Linsen 16, 18, 20 und die Blende 21 zueinander und bezüglich des Linsenhalters 14 durch ihre geometrische Gestaltung eindeutig ausgerichtet, so dass keine weitere optische Justierung des optischen Moduls erforderlich ist. Der Linsenhalter 14 steht weiterhin über wenigstens ein am Linsenhalter 14 ausgebildetes Anschlagelement 13; 35 mit der Bestückfläche 10a einer starr ausgebildeten Leiterplatte 10, welche gleichzeitig als Schaltungsträger für ein auf e- lektromagnetische Strahlung empfindliches ungehäustes Halbleiterelement 12 dient, so in Verbindung, dass erstmals die Dickentoleranz des Schaltungsträgers 10 und etwaiger Klebverbindungen vorteilhaft nicht in die Toleranzkette gattungsgemäßer optischer Moduln bzw. Systeme einfließt. Weil erfindungsgemäß das Halbleiterelement 12 an definierter Position bezüglich den anderen optischen Elementen, d.h. insbesondere den Linsen 16, 18, 20 bzw. der Blende 21, angeordnet ist, braucht die Art des Schaltungsträgers 10, z.B. FR4, CEM, etc..., wie bislang üblich, nicht mehr festgeschrieben werden. Vielmehr können „normale", unkritische und damit kostengünstigere Schaltungsträger eingesetzt werden.FIG. 7 shows this in a representation cut through the optical axis and FIG. 8 in a representation cut through the fixation of an optical module according to the invention. It can be clearly seen how the permanently elastic or resilient element 22 presses the mounting surface 10a of the circuit carrier 10 against the fixing elements 33. In the prior art, the circuit carrier has so far been pressed against a lens holder. The present invention now goes a new way in that the circuit carrier is pressed in the opposite direction, ie away from the lens holder 14, by means of a permanently elastic or resilient element 22 and there a stop 13; 33, 35 is positively related to the optics. This completely eliminates the entire tolerance of the circuit carrier 10 and any adhesives. The present invention is based on an optical module with a lens unit, which comprises a lens holder 14, in which a lens arrangement comprising, for example, three lenses 16, 18, 20 and a diaphragm 21 is inserted. The lenses 16, 18, 20 and the diaphragm 21 are preferably clearly aligned with one another and with respect to the lens holder 14 due to their geometric design, so that no further optical adjustment of the optical module is required. The lens holder 14 also stands over at least one stop element 13 formed on the lens holder 14; 35 with the mounting surface 10a of a rigid printed circuit board 10, which at the same time serves as a circuit carrier for an unhoused semiconductor element 12 sensitive to electromagnetic radiation, in such a way that for the first time the thickness tolerance of the circuit carrier 10 and any adhesive connections advantageously not in the tolerance chain of generic optical modules or systems. Because, according to the invention, the semiconductor element 12 is arranged at a defined position with respect to the other optical elements, ie in particular the lenses 16, 18, 20 or the diaphragm 21, the type of circuit carrier 10, for example FR4, CEM, etc., needs previously customary, can no longer be committed. Rather, "normal", uncritical and therefore less expensive circuit carriers can be used.
Die in der vorstehenden Beschreibung, in den Zeichnungen sowie in den Ansprüchen offenbarten Merkmale der Erfindung können sowohl einzeln als auch in beliebiger Kombination für die Verwirklichung der Erfindung wesentlich sein. Sie eignet sich insbesondere bei Anwendungen im Innen- oder Außenbereich eines Kraftfahrzeugs . The features of the invention disclosed in the above description, in the drawings and in the claims can be essential both individually and in any combination for realizing the invention. It is particularly suitable for applications in the interior or exterior of a motor vehicle.

Claims

Patentansprüche claims
1. Optisches Modul mit einem starren Schaltungsträger (10) umfassend eine Bestückfläche (10a); einem mittels Flip-Chip-Technik auf der Bestückfläche (10a) angeordneten ungehäusten Halbleiterelement (12) ; und einer Linseneinheit (14; 16, 18, 20; 21), welche auf der der Bestückfläche (10a) abgewandten Seite (10b) des Schaltungsträgers (10) angeordnet ist; wobei der Schaltungsträger (10) eine Öffnung (24) aufweist, durch die elektromagnetische Strahlung von der Linseneinheit (14; 16, 18, 20; 21) auf das Halbleiterelement (12) projiziert wird; und wobei die Linseneinheit (14; 16, 18, 20; 21) einen Linsenhalter (14) und eine Linsenanordnung (16, 18, 20; 21) mit mindestens einer Linse umfasst, d a d u r c h g e k e n n z e i c h n e t , dass zwischen Linsenhalter (14) und Schaltungsträger (10) wenigstens ein dauerelastisches oder federndes Element (22) angeordnet ist, welches die Bestückfläche (10a) des Schaltungsträgers (10) vom Linsenhalter (14) weg gegen wenigstens ein Anschlagselement (13; 35) presst, welches formschlüssig (37) zur Linseneinheit (14; 16, 18, 20; 21) in Beziehung steht.1. Optical module with a rigid circuit carrier (10) comprising a mounting surface (10a); an unhoused semiconductor element (12) arranged on the assembly surface (10a) by means of flip-chip technology; and a lens unit (14; 16, 18, 20; 21) which is arranged on the side (10b) of the circuit carrier (10) facing away from the mounting surface (10a); wherein the circuit carrier (10) has an opening (24) through which electromagnetic radiation from the lens unit (14; 16, 18, 20; 21) is projected onto the semiconductor element (12); and wherein the lens unit (14; 16, 18, 20; 21) comprises a lens holder (14) and a lens arrangement (16, 18, 20; 21) with at least one lens, characterized in that between the lens holder (14) and circuit carrier (10 ) at least one permanently elastic or resilient element (22) is arranged, which presses the mounting surface (10a) of the circuit carrier (10) away from the lens holder (14) against at least one stop element (13; 35), which positively (37) to the lens unit (14 ; 16, 18, 20; 21) is related.
2. Optisches Modul nach Anspruch 1, d a d u r c h g e k e n n z e i c h n e t , dass der Formschluss durch eine am Anschlagelement (13; 35) ausgebildete Formschlussfläche (37) realisiert ist. 2. Optical module according to claim 1, so that the positive locking is realized by a positive locking surface (37) formed on the stop element (13; 35).
Optisches Modul nach Anspruch 1 oder 2, d a d u r c h g e k e n n z e i c h n e t , dass das Anschlagelement (13) Teil einer Schnappverbindung ist. Optical module according to claim 1 or 2, characterized in that the stop element (13) is part of a snap connection.
Optisches Modul nach Anspruch 3, d a d u r c h g e k e n n z e i c h n e t , dass das Anschlagelement (13) durch am Linsenhalter (14) angeordnete Haken (13) realisiert ist.Optical module according to claim 3, so that the stop element (13) is realized by hooks (13) arranged on the lens holder (14).
Optisches Modul nach Anspruch 1, d a d u r c h g e k e n n z e i c h n e t , dass das Anschlagelement (35) Teil einer Schraub- oder Nietverbindung (33) ist.Optical module according to claim 1, so that the stop element (35) is part of a screw or rivet connection (33).
6. Optisches Modul nach Anspruch 5, d a d u r c h g e k e n n z e i c h n e t , dass das Anschlagelement (35) durch am Linsenhalter (14) angeordnete Abstandsbolzen bzw. Schraublöcher (35) rea- lisiert ist.6. Optical module according to claim 5, so that the stop element (35) is realized by spacing bolts or screw holes (35) arranged on the lens holder (14).
7. Optisches Modul nach einem der vorherigen Ansprüche, d a d u r c h g e k e n n z e i c h n e t , dass das dauerelastische bzw. federnde Element (22) rechteckförmig oder ringförmig, vorzugsweise als Stanzteil, ausgebildet ist.7. Optical module according to one of the preceding claims, so that the permanently elastic or resilient element (22) is rectangular or ring-shaped, preferably as a stamped part.
8. Optisches Modul nach einem der vorherigen Ansprüche, d a d u r c h g e k e n n z e i c h n e t , dass das dauerelastische bzw. federnde Element (22) thermoplastische Elastomere (TPE) oder Silikon enthält. 8. Optical module according to one of the preceding claims, characterized in that the permanently elastic or resilient element (22) contains thermoplastic elastomers (TPE) or silicone.
9. Optisches Modul nach einem der vorherigen Ansprüche, d a d u r c h g e k e n n z e i c h n e t , dass das dauerelastische bzw. federnde Element (22) die Linseneinheit (14; 16, 18, 20; 21) gegen den Schaltungs- träger (10) abdichtet.9. Optical module according to one of the preceding claims, that the permanently elastic or resilient element (22) seals the lens unit (14; 16, 18, 20; 21) against the circuit carrier (10).
10. Optisches Modul nach einem der vorherigen Ansprüche, d a d u r c h g e k e n n z e i c h n e t , dass das dauerelastische bzw. federnde Element (22) po- rös ausgebildet ist, insbesondere moosgummiartig.10. Optical module according to one of the preceding claims, ie that the permanently elastic or resilient element (22) is designed to be porous, in particular foam rubber-like.
11. Optisches System mit einem optischen Modul nach einem der vorherigen Ansprüche. 11. Optical system with an optical module according to one of the preceding claims.
EP04741544A 2003-09-26 2004-05-11 Optical module and optical system Withdrawn EP1665391A1 (en)

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DE10344768A DE10344768B3 (en) 2003-09-26 2003-09-26 Optical module with resilient element between lens holder and circuit carrier and optical system
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WO2005031878A1 (en) 2005-04-07
JP2007506148A (en) 2007-03-15

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