WO2013046951A1

WO2013046951A1 - Sensor holder

Info

Publication number: WO2013046951A1
Application number: PCT/JP2012/070326
Authority: WO
Inventors: 大悟合場; 西本　直樹
Original assignee: 富士フイルム株式会社
Priority date: 2011-09-28
Filing date: 2012-08-09
Publication date: 2013-04-04

Abstract

Provided is a sensor holder (10) that is capable of meeting a demand for a tilt adjustment of a sensor substrate (70) and a demand which does not require the tilt adjustment. Bosses (20, 30, 40) are formed on the sensor holder (10). Position control sections (22, 32, 42) are formed on the outer sides of these bosses (20, etc.). The sensor substrate (70), on which through-holes (71, 72, 73) larger than the size of the bosses (20, etc.) are created, is attached to the sensor holder (10). The bosses (20, 30, 40) run through the through-holes (71, 72, 73) in the sensor substrate (70) until prohibited by the position control sections (22, 32, 42), and secured with screws (91, 92, 93). The sensor substrate (70) can be tilted rearward by loosening the screws (91, 92, 93), whereby the tilt adjustment is enabled. When the through-holes (71, etc.) are small, the apical surfaces of the bosses (20) hit against the front surface of the sensor substrate (70), whereby the tilt adjustment is disabled.

Description

Sensor holder

This invention relates to a sensor holder to which a sensor substrate on which a solid-state electronic image sensor is mounted is attached.

With the increase in the number of pixels in a solid-state electronic image sensor, there is a need to perform so-called tilt adjustment by tilting the solid-state electronic image sensor so that the imaging surface coincides with the light-receiving surface of the solid-state electronic image sensor. This tilt adjustment can reduce one-sided blur of the image. After the sensor board on which the solid-state electronic image sensor is mounted is attached to the sensor holder and the tilt adjustment is performed, the position of the sensor board is determined. In addition, in order to reduce the cost, there is a demand to attach the sensor board to the sensor holder without performing the tilt adjustment.

In addition, an image sensor unit (Patent Document 1) in which the rubber packing can simultaneously exhibit a high light shielding function for the image sensor and an appropriate pressing function for the low-pass filter, and fixing the image sensor to the main unit without causing stress on the image sensor (Patent Document 2).

JP 2011-160365 A JP 2005-175924 A

As described above, since there are different requirements, it is necessary to design a different sensor holder for each customer, resulting in an increase in cost. In Patent Documents 1 and 2, it is not considered at all to design a sensor holder according to different requirements.

An object of the present invention is to provide a sensor holder that can satisfy different requirements for a request that requires tilt adjustment and a request that does not require tilt adjustment.

The present invention relates to a sensor holder to which a sensor substrate on which a solid-state electronic image pickup device is mounted is attached, in order to attach the sensor substrate to the sensor holder, a plurality of bosses erected so as to surround the solid-state electronic image pickup device, And a position restricting member formed in the vicinity of the boss and having a height lower than the height of the boss.

When adjusting the tilt and attaching the sensor board to the sensor holder, a compression spring having a height higher than the height of the position restricting portion is fitted into the boss. A sensor substrate having a screw hole having a diameter larger than the outer diameter of the boss is screwed to the boss. Since the sensor substrate is biased by a compression spring, the sensor substrate does not rattle. Since the screw hole of the sensor board is larger than the outer diameter of the boss, the position of the sensor board with respect to the height of the boss can be changed by the amount of screw turning. Thereby, inclination adjustment can be performed. Since the screw hole of the sensor board is larger than the outer diameter of the boss, the sensor board enters the lower position of the boss. However, since the position restricting member is provided, the sensor board can be prevented from entering the lower position. When the sensor substrate is attached to the sensor holder without adjusting the tilt, the sensor substrate having a screw hole having a diameter smaller than the outer diameter of the boss is screwed to the boss. The sensor substrate is attached at the height of the boss without being tilted. It is possible to satisfy a different requirement between a request that requires tilt adjustment and a request that does not require tilt adjustment.

The difference between the height of the boss and the height of the position regulating member is, for example, less than the thickness of the sensor substrate.

As described above, when the tilt adjustment is performed, the sensor board on which the screw hole having a diameter larger than the outer diameter of the boss is formed is screwed to the boss, and is higher than the height of the position restricting portion. A compression spring having a high height and fitted on the boss may be further provided.

In addition, when the tilt adjustment is not performed, a sensor substrate having a screw hole having a diameter smaller than the outer diameter of the boss may be screwed to the boss.

It is a disassembled perspective view of a sensor holder unit. It is a rear view of a sensor holder unit. It is a rear view of a sensor holder unit. It is the perspective view which looked at the sensor holder unit from the back. It is sectional drawing of the 3rd boss periphery. It is a disassembled perspective view of a sensor holder unit. It is sectional drawing of the 3rd boss periphery. It is a perspective view around the 2nd boss.

FIG. 1 shows an embodiment of the present invention. FIG. 2 is an exploded perspective view of a sensor holder unit, FIG. 2 is a rear view of the sensor holder unit, and FIG. FIG. 4 is a rear view of the holder unit, and FIG. 4 is a perspective view of the sensor holder unit.

Referring mainly to FIG. 1, the sensor holder 10 is fixed to the lens barrel 1. A sensor substrate 70 on which a CCD 80 is mounted is attached to the sensor holder 10.

Referring to FIGS. 1 and 2, the sensor holder 10 has an outer frame 11 formed thereon. In addition, an opening 13 through which the light beam condensed by the lens barrel 1 passes is formed in the center of the sensor holder 10. The light beam that has passed through the opening 13 enters the light receiving surface of the CCD 80 formed on the sensor substrate 70. A light shielding wall 12 is erected around the opening 13 so as to surround the CCD 80 when the opening 13 and the sensor substrate 70 are attached to the sensor holder 10.

At the four corners of the sensor holder 10, a cylindrical first boss 20, a second boss 30, a third boss 40, and a fourth boss 50 are erected in order from the upper right when viewed from the back. is doing. Screw

holes

21, 31, 41 and 51 are formed in the first boss 20, the second boss 30, the third boss 40 and the fourth boss 50, respectively. The heights of the first boss 20, the second boss 30, the third boss 40, and the fourth boss 50 are equal, but the fourth boss 50 is not screwed. But you can. The fourth boss 50 may not have the screw hole 51 formed therein.

Further, on the inner wall of the outer frame 11 away from the first boss 20, the second boss 30, the third boss 40, and the fourth boss 50,

position restricting portions

22, 32, 42, and 52 are provided. Is standing. The heights of these

position restricting portions

22, 32, 42 and 52 are lower than the heights of the first boss 20, the second boss 30, the third boss 40 and the fourth boss 50. The difference between the heights of the

position restricting portions

22, 32, 42 and 52 and the heights of the first boss 20, the second boss 30, the third boss 40 and the fourth boss 50 is, for example, that of the sensor substrate 70. Less than thickness, but not necessarily.

Referring mainly to FIG. 1, the CCD 80 at the center of the front surface of the sensor substrate 70 is mounted. There are

positioning holes

74 and 75 under the CCD 80.

A first through hole 71, a second through hole 72, and a third through hole 73 are formed in the upper right corner, the lower right corner, and the lower left corner as viewed from the back of the sensor substrate 70. No through hole is formed in the upper left corner when viewed from the back of the sensor substrate 70. These through

holes

71, 72, and 73 are larger in size than the first boss 20, the second boss 30, and the third boss 40 erected on the sensor holder 10.

The compression springs 61, 62, and 63 are fitted to the first boss 20, the second boss 30, and the third boss 40. The heights of the

compression springs

61, 62 and 63 are higher than the heights of the first boss 20, the second boss 30 and the third boss 40, and the first boss 20, the second boss 30 and the third boss 40 are higher. When the compression springs 61, 62 and 63 are fitted to the boss 40, the tip ends (upper parts) of the

compression springs

61, 62 and 63 are the first boss 20, the second boss 30 and the third boss 40. Pops out from the tip. However, the tip portions (upper portions) of the

compression springs

61, 62, and 63 only have to protrude beyond the tip surfaces of the first boss 20, the second boss 30, and the third boss 40, and the first boss 20, A base is formed around the outer peripheral surface of the second boss 30 and the third boss 40, and the

compression springs

61, 62 and 63 are placed on the base, and the tip ends (upper parts) of the

compression springs

61, 62 and 63 are placed. The heights of the compression springs 61, 62, and 63 may be higher than the front end surfaces of the first boss 20, the second boss 30, and the third boss 40. Therefore, the overall lengths of the compression springs 61, 62 and 63 do not have to be longer than the heights of the first boss 20, the second boss 30 and the third boss 40.

With the compression springs 61, 62, and 63 being fitted to the first boss 20, the second boss 30, and the third boss 40, the first boss 20, the second boss 30, and the third boss 40 A first through hole 71, a second through hole 72, and a third through hole 73 are passed through each of the first screw 91, the second screw 92, and the third screw 93, respectively. The boss 20, the second boss 30 and the third boss 40 are screwed (see FIGS. 3 and 4). Needless to say, the heads of the first screw 91, the second screw 92, and the third screw 93 are larger than the through

holes

71, 72, and 73, respectively. A sensor substrate 70 is attached to the sensor holder 10. When the sensor substrate 70 is attached to the sensor holder 10, the CCD 80 is surrounded by the first boss 20, the second boss 30 and the third boss 40 erected on the sensor substrate 10. The position of the sensor substrate 70 in the optical axis direction changes depending on the tightening amount of the CCD screws 91, 92, and 93, and the sensor substrate 70 can be tilted at a desired angle with respect to the optical axis. You can adjust the fall.

FIG. 5 is a sectional view taken along line VV in FIG.

As described above, the compression spring 63 is fitted to the third boss 40 (the same applies to the first boss 20 and the second boss 30), and the third screw 93 is connected to the third through hole. It is screwed into the screw hole 41 of the third boss 40 through 73. The sensor board 70 is screwed by the third screw 93.

As described above, the size of the third through hole 73 (the first through hole 71 and the second through hole 72 are the same) is larger than the size of the third boss 40. If the force generated by tightening the third screw 93 is greater than the force of the compression spring 63, the sensor board third boss 40 passes through the third through hole 73, and the sensor board 70 passes through the third boss 40. Enter in the direction of the root of. However, since the position restricting portion 42 is formed on the inner wall of the outer frame 11 outside the third boss 40 as described above, the front surface of the sensor substrate 70 hits the position restricting portion 42, and beyond that, I cannot enter. In this way, the position restricting portion 42 restricts the entry of the sensor substrate 70. Similarly, with respect to the first boss 20 and the second boss 30, the entry of the sensor substrate 70 is restricted by the

position restricting portions

22 and 32.

The sensor substrate 70 is pushed in until it comes into contact with the position restricting portion 42, and the third screw 93 is loosened, whereby the sensor substrate 70 gradually moves backward. In this way, the tilt adjustment can be executed. Similarly for the first boss 20 and the second boss 30, by loosening the first screw 91 and the second screw 92, the sensor substrate 70 gradually moves backward and can be tilted.

6 and 7 show a sensor substrate 100 in which through

holes

101, 102, and 103 having inner diameters smaller than the outer diameters of the first boss 20, the second boss 30, and the third boss 40 are formed. -It is attached to the holder 10.

FIG. 6 is an exploded perspective view of the sensor holder unit. In FIG. 6, components corresponding to those in FIG. 1 to FIG.

As described above, the sensor substrate 100 has inner diameters smaller than the outer diameters of the first boss 20, the second boss 30, and the third boss 40 at the upper right corner, lower right corner, and lower left corner when viewed from the back. A first through hole 101, a second through hole 102, and a third through hole 103 are formed. The first screw 111, the second screw 112, and the third screw 113 of each of the through

holes

101, 102, and 103 are passed, so that the sensor board 100 is connected to the first boss 20, the second boss 30, and the second screw 113. Screwed to the 3 bosses 40.

Also, holes 104 and 105 are formed in the sensor substrate 100 below the CCD 80.

FIG. 7 corresponds to FIG. 5 and is a cross-sectional view of the vicinity of the third boss 40 to which the sensor substrate 100 is attached.

As described above, since the third through hole 103 formed in the sensor substrate 100 is smaller than the third boss 40, the sensor substrate 100 is thirdly connected by the third screw 113 unlike the sensor substrate 70 described above. When the boss 40 is screwed, the front surface of the sensor substrate 100 hits the tip surface of the third boss 40 and does not enter further. The same applies to the first boss 20 and the second boss 30. As described above, when the tilt adjustment is unnecessary, the sensor substrate 100 can be attached to the sensor holder 10 simply by screwing.

FIG. 8 shows a modification and is a perspective view showing a portion of the second boss 30A formed on the sensor holder 10. As shown in FIG.

Position restricting portions 34 having the same height as the above-described position restricting portion 32 are formed at three places (not three places, but may be a plurality of places other than 1 or 3) on the outer peripheral surface of the second boss 30A. . Although the above-described position restricting portion 32 is formed on the inner wall of the outer frame 11, the one restricting portion 34 may be formed on the outer peripheral surface of the second boss 30A in this way. The same applies to bosses other than the second boss 30A.

10

Sensor holder

20, 30, 40

Boss

22, 32, 42

Position restricting part

61, 62, 63

Compression spring

70, 100

Sensor board

71, 72, 73, 101, 102, 103 Through hole

Claims

In a sensor holder to which a sensor board mounted with a solid-state electronic image sensor is mounted,
A plurality of bosses erected so as to surround the solid-state electronic image sensor for attaching the sensor substrate to the sensor holder, and a position regulating member formed in the vicinity of the boss and having a height lower than the height of the boss ,
Sensor holder with
The difference between the height of the boss and the height of the position restricting member is equal to or less than the thickness of the sensor substrate.
The sensor holder according to claim 1.
A sensor board having a screw hole having a diameter larger than the outer diameter of the boss is screwed to the boss.
A compression spring having a height higher than that of the position restricting portion and fitted to the boss;
The sensor holder according to claim 1 or 2, further comprising:
A sensor board having a screw hole having a diameter smaller than the outer diameter of the boss is screwed to the boss.
The sensor holder according to claim 1 or 2.