Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B38/00—Ancillary operations in connection with laminating processes
  • B32B38/18—Handling of layers or the laminate
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/67005—Apparatus not specifically provided for elsewhere
  • H01L21/67011—Apparatus for manufacture or treatment
  • H01L21/67092—Apparatus for mechanical treatment
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
  • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
  • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
  • B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
  • B32B37/187—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only the layers being placed in a carrier before going through the lamination process
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
  • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
  • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
  • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
  • Y10T156/10—Methods of surface bonding and/or assembly therefor
  • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
  • Y10T156/1092—All laminae planar and face to face
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
  • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
  • Y10T156/1702—For plural parts or plural areas of single part
  • Y10T156/1744—Means bringing discrete articles into assembled relationship

Definitions

• the present invention relates to a device for bonding first substrates with second substrates according to claim 1 and a corresponding method according to claim 7.
• the present invention is based on the basic idea, in particular using a standard bonding chamber, of bonding a plurality of substrate stacks arranged side by side on a carrier substrate in parallel or simultaneously from at least one first and one second substrate.
• An independent invention therefore provides an apparatus for bonding first substrates to second substrates having the following features:
• a receptacle for receiving one or in particular a plurality of carrier substrate / carrier substrates
• a placement device for placing a plurality of first substrates on a side of the substrate facing away from the receptacle
• Carrier substrate and a fixing device for fixing each of the first substrates on the substrate side to at least one fixing section of each first substrate.
• the fixation or prefixing thus serves primarily to transport the carrier substrate produced according to the invention, in particular to a separately provided bonding chamber.
• the fixing device is set up for the temporary fixing of each first substrate or that the first substrates are arranged on the first substrate
• the temporary fixation is also known by the term "tearing", with polymers, adhesives or the formation of eutectic alloys being available for temporary fixation according to the invention Alternatively, van der Waals connections between two polished surfaces can also be used are known in the art and are often produced and used for example between silicon oxide surfaces.
• the temporary fixation takes place in particular in such a way that the fixation is so strong that the carrier substrate with the substrate stacks temporarily fixed on it can be transported, without that on the
• the first substrates are prior to placement
• Aligned alignment marks which device according to a
• a placement device (or a separate placement device) is arranged for aligning and placing the first substrates on alignment marks. In this way, the placement of further (in each case second, possibly even further, ie third, fourth, etc.) substrates on the first substrates is accelerated.
• the second substrates in particular after alignment with alignment marks of the first substrates, are placed on the first substrates and / or, in particular temporarily, fixed.
• the second substrates are in each case bonded simultaneously with the first substrates, in particular permanently, in particular in a bonding chamber designed as a separate bonding module.
• FIG. 1 shows a plan view of a carrier substrate in a first
• Figure 2 is a plan view of the carrier substrate with placed first
• Figure 3 is a cross-sectional view taken along section line A-A of Figure 2 and
• Figure 4 is a cross-sectional view taken along section line A-A of Figure 2 after
• the alignment marks 3 can be detected by a placement device for placing a plurality of first substrates 2 on the substrate side ls such that the first substrates 2 can each be placed on an alignment mark 3 on the carrier substrate 1 (see FIG. 2).
• the first substrates 2 have one, in particular less than half the diameter D i, preferably less than one third of the diameter D i, more preferably less than one quarter of the diameter D i
• Embodiment 14 first substrates 2 on the substrate side l s
• the diameter of the first substrates deviates less than 50%, better still less than 25%, advantageously less than 15% or most preferably less than 5% of the diameter of the carrier substrates.
• the receptacle of the carrier substrates is designed so that it can simultaneously receive and fix a plurality of carrier substrates.
• Suitable fixatives are known in the art.
• vacuum fixation can be used. All other features and
• Method steps behave analogously to the exemplary embodiment with only a single carrier substrate having a diameter which is larger than that of the first substrates.
• a single carrier substrate having a diameter which is larger than that of the first substrates.
• Carrier substrates on the side facing away from the receiving device side ls provided one or more registration marks for alignment of the first substrates.
• the temporary fixation takes place in each case at least in a fixing section 2a of each first substrate 2, that is to say at least at one, in particular punctiform, fixing point.
• Fixing force the fixing of each j edes first substrate 2 at two or three fixing sections 2a, wherein in the case of a single fixing section 2a of the fixing 2a is arranged in the center of each first substrate 2 (see embodiment of Figure 2).
• the first substrates 2 of each row of first substrates 2, in particular equidistant from each other, are arranged distributed on the substrate side l s.
• each first substrate 2 has at least two
• Alignment marks 5 so that not only a translationally correct alignment of the first substrates 2 with the second substrates 2 'can take place, but also a rotationally correct orientation.
• Substrate stack 4 (in the embodiment shown 14 substrate stack 4) to the carrier substrate 1 prefixed such that the carrier substrate 1 can be transported with the substrate stacks 4 to a bonding chamber, not shown, where the substrate stacks 4 are permanently bonded simultaneously.
• an alignment accuracy when aligning the first and second substrates 2, 2 'as well as in aligning other substrates of in particular less than 100 ⁇ , preferably less than 50 ⁇ , more preferably less than 10 ⁇ , more preferably less than 2 ⁇ , feasible ,
• the temporary bond in particular automatically by the permanent bonding, preferably by temperature exposure, dissolved.
• these are gassed during bonding, in particular residue-free.
• prefixing and / or bonding is preferably a
• Carrier substrate 1 made of a material with a thermal
• Expansion coefficient which does not deviate more than 5% from the thermal expansion coefficient of the first and / or second substrates 2, 2 ', in particular of the same material.

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• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Applications Claiming Priority (1)

Publications (1)

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Family Applications (1)

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• 2011
  • 2011-12-28 KR KR1020147018021A patent/KR20140107343A/ko not_active Application Discontinuation
  • 2011-12-28 CN CN201180076126.1A patent/CN104247000A/zh active Pending
  • 2011-12-28 US US14/368,827 patent/US20140360666A1/en not_active Abandoned
  • 2011-12-28 WO PCT/EP2011/074166 patent/WO2013097894A1/de active Application Filing
  • 2011-12-28 JP JP2014549370A patent/JP2015509284A/ja active Pending
  • 2011-12-28 SG SG2014009963A patent/SG2014009963A/en unknown
  • 2011-12-28 EP EP11805881.7A patent/EP2798670A1/de not_active Withdrawn
• 2012
  • 2012-11-29 TW TW101144847A patent/TW201330052A/zh unknown

Non-Patent Citations (1)

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