CN104247000A - 衬底的粘合方法和装置 - Google Patents

衬底的粘合方法和装置 Download PDF

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CN104247000A
CN104247000A CN201180076126.1A CN201180076126A CN104247000A CN 104247000 A CN104247000 A CN 104247000A CN 201180076126 A CN201180076126 A CN 201180076126A CN 104247000 A CN104247000 A CN 104247000A
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J·布格拉夫
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EV Group E Thallner GmbH
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/18Handling of layers or the laminate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/18Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
    • B32B37/187Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only the layers being placed in a carrier before going through the lamination process
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10Methods of surface bonding and/or assembly therefor
    • Y10T156/1089Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092All laminae planar and face to face
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702For plural parts or plural areas of single part
    • Y10T156/1744Means bringing discrete articles into assembled relationship

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Abstract

本发明涉及一种用于粘合第一衬底(2)与第二衬底(2’)的装置,其具有下述特征:用于容纳载体衬底(1)的容器,用于将多个第一衬底(2)放置在载体衬底(1)的背向容器的衬底侧(1s)上的放置装置和用于将每个第一衬底(2)通过衬底侧(1s)固定在每个第一衬底(2)的至少一个固定段(2a)上的固定装置。本发明此外还涉及用于粘合第一衬底(2)与第二衬底(2’)的方法,其具有下述步骤,尤其是下述流程:将多个第一衬底(2)放置在在容器上容纳的载体衬底(1)的衬底侧(1s)上和将每个第一衬底(2)在衬底侧(1s)上固定在每个第一衬底(2)的至少一个固定段(2a)上。

Description

衬底的粘合方法和装置
本发明涉及按照权利要求1的用于粘合第一衬底与第二衬底的装置以及按照权利要求7的对应的方法。
制造由至少两个衬底组成的晶片堆(堆栈)是在采购费用很高的粘合设备上进行,其中粘合过程会尤其涉及高温并且通常很耗时。与此相对应地在半导体加工技术方面存在生产能力低,相应单件成本高以及高能耗的问题。所述问题在很大程度出现在要处理相当小的衬底的应用场合中。按照现今的观点直径<=6“,尤其<=4“和在极端情况下<=2“的衬底都被视作是小的。
因此本发明的任务是,对一种用于粘合或预先固定衬底的方法和装置进行说明,通过所述装置和方法能够在粘合衬底过程中使高的生产能力,较低的单件成本以及节能成为可能。
该任务将通过权利要求1和7的特征解决。优选的本发明的改进方案在从属权利要求中进行说明。全部由至少两个在说明书,权利要求和/或附图中说明的特征形成的组合也属于本发明范围。处于所述极限范围内的数值也应将所说明的值域公示为极限值并且能够以任何组合方式要求保护。
本发明基于下述基本思路,尤其是通过使用标准-粘合室并行地或同时地粘合多个,并排地布设在载体衬底上的分别由至少一个第一衬底和第二衬底组成的衬底堆。
由此将具有下述特征的用于粘合第一衬底与第二衬底的装置被视作独立发明:
-用于容纳一个或尤其多个载体衬底的容器,
-用于将多个第一衬底放置在载体衬底的背向容器的衬底侧上的放置装置和
-用于将每个第一衬底在衬底侧上固定在每个第一衬底的至少一个固定段上的固定装置。
此外具有下述步骤,尤其是下述流程的用于粘合第一衬底与第二衬底的方法被视作独立发明:
-将多个第一衬底放置在在容器上容纳的载体衬底的衬底侧上和
-将每个第一衬底在衬底侧上固定在每个第一衬底的至少一个固定段上。
通过所述的预先固定多个分别由至少一个第一衬底和第二衬底组成的衬底堆(stacks),其中分别有多个衬底分布地布设在衬底侧上,可以使同时粘合多个衬底堆成为可能。由此固定或预先固定首选用于将按照本发明制造的载体衬底运送至尤其单独设置的粘合室。
按照本发明的一个优选的实施方式规定,设置固定装置,以便临时固定每一个衬底或第一衬底临时固定在衬底侧上。已知临时固定也通常使用“紧钉(Tacken),,这一术语,其中为了临时固定可以选择使用聚合物,粘接剂或按照本发明形成低共熔合金。备选地也可以在两个抛光的表面之间使用范德瓦尔斯连接。所述连接在现有技术中是已知的并且经常例如在二氧化硅-表面之间生成和使用。临时固定尤其是这样的方式进行:固定很牢固,使得能够运输载体衬底以及临时固定在其上的衬底堆,并且放置在载体衬底上的衬底不会滑动或掉落。
有利地在放置之前将第一衬底对齐到对齐标记上,其中按照装置设置放置装置(或单独的放置装置)用于对齐或放置第一衬底到对齐标记上。通过这种方法可以加速将其它的(分别是第二个,必要时还更多,例如第三个,第四个等)衬底放置在第一衬底上。
与此相应按照本发明的另一个有利的实施方式规定,第二衬底,尤其是在按照第一衬底的对齐标记对齐之后被放置和/或,尤其是临时地固定在第一衬底上。为此按照装置设置放置装置和/或单独的放置装置用于尤其按照第一衬底的对齐标记对齐地将多个第二衬底放置在第一衬底上面。通过设置对齐标记能够使各衬底彼此顺利地和精确地定位,尤其是当设置固定装置用于尤其临时固定每一个放置在第一衬底上的第二衬底时。
在本发明的一个特别有利的实施方式中规定,第二衬底分别同时与第一衬底尤其是永久地粘合,尤其是在构造单独的粘合模块的粘合室内进行。由此将上述的预固定与耗费时间的粘合步骤断开,使得高的生产能力成为可能,其中通过设置仅限于单纯的粘合的粘合室也可以同时实现节能。
只要描述按照装置的特征,它们也可以适合作为按照方法的特征公示。
本发明的其它优势,特征和细节从下面的附图说明得到。附图分别以示意图的形式显示:
附图1示出在第一按照本发明的方法步骤中载体衬底的俯视图,
附图2示出按照第二按照本发明的方法步骤和切线A-A具有已放置的第一衬底的载体衬底的俯视图,
附图3示出按照在附图2中示出的切线A-A的横截面图,和
附图4示出在将第二衬底放置在第一衬底上之后按照在附图2中示出的切线A-A的横截面图。
在附图中本发明的特征和优势分别用按照本发明的实施方式的识别的参考标记表示,其中具有相同的或相同作用的功能的元件或特征用相同的参考标记表示。
按照附图1在直径为D1的载体晶片1上,尤其在载体晶片的衬底侧1s上均匀分布地设置多个对齐标记3。所述对齐标记3是可以由用于将多个第一衬底2放置在衬底侧1s上的放置装置以这样的方式探测的:能够按照对齐标记3分别将第一衬底2放置在载体晶片1上面(见附图2)。
第一衬底2具有直径D2,其尤其小于直径D1的一半,优选小于直径D1的1/3,更加优选小于D1的1/4。由此在所示的实施例14中可以将第一衬底2放置在衬底侧1s上面并且临时地固定。
在备选的实施方式中载体衬底具有大体上与第一衬底一样的直径。尤其是第一衬底的直径与载体衬底的直径相差低于50%,优选低于25%,有利地低于15%,或最优选地低于5%。在这种实施情况中载体衬底的容器是这样地设计:所述容器能够同时接收和固定多个载体衬底。适当的固定装置专业人士已经熟悉。例如可以使用真空固定。全部其它的特征和方法步骤与只有一个唯一的,直径大于第一衬底的直径的载体衬底的实施例类似。尤其是在单个载体衬底上面在背向容纳装置的一侧1s上面设置有一个或多个基准符号用于对第一衬底进行对齐。
临时固定分别至少在每个第一衬底2的固定段2a内,即至少在尤其是点状的固定位置上进行。在具有较大固定力的实施方式中实现将每个第一衬底2固定在两个或三个固定段2a上,其中在只有一个唯一的固定段2a的情况下固定段2a被布设在每个第一衬底2的中心(见按照附图2的实施方式)。
在穿过第一衬底2的横截面(见附图3)中每行的第一衬底2与第一衬底2彼此尤其等距分布地布设在衬底侧1s上面。
在附图4所示的方法步骤中第二衬底2′尤其分别单个地被放置在第一衬底2上面,其中为了放置在第一衬底2上面设置了对齐标记5。尤其是每个第一衬底2具有至少两个对齐标记5,由此不仅能够实现平移地正确对齐第一衬底2和第二衬底2’而且还能够转动地正确地对齐。
在将第二衬底2’对齐并放置在第一衬底2上面之后在载体衬底1上面若干分别由第一衬底2和第二衬底2’形成的衬底堆(在所示的实施例14中是衬底堆4)以这样的方式被预固定在载体衬底1上:可以将具有衬底堆4的载体衬底1运送至没有显示的粘合室,在那里衬底堆4同时被永久地粘合。
按照本发明在没有显示的实施方式上也可以考虑,在第一衬底2’上面分别再堆叠其它的衬底并对应地临时固定,以便产生具有超过两个衬底的衬底堆。
在此按照本发明在第一衬底2和第二衬底2′的对齐时以及还在其它的尤其小于100μm,优选小于50μm,更加优选小于10μm和还要优选小于2μm的衬底的对齐时中对齐精确度是可以实现的。
在粘合室中粘合期间临时粘合尤其是自动地通过永久粘合,优选通过加载温度解开。只要使用聚合物和/或粘接剂用于临时粘合,则所述聚合物和/或粘接剂在粘合时尤其不会留下残渣地气化。
对于预固定和/或粘合优选使用所谓的倒装贴片机(Flip-Chip-Bonder)。
在本发明的有利的实施方式中载体衬底1由具有热膨胀系数的材料制成,所述热膨胀系数与第一和/或第二衬底2,2’的热膨胀系数之差不会大于5%,优选它们由相同的材料制成。例如可以使用玻璃晶片或硅晶片作为载体衬底1和/或第一/第二衬底2,2’。
附图标记列表
1 载体衬底
1s 衬底侧
2  第一衬底
2a 固定段
2’ 第二衬底
3   对齐标记
4   衬底堆
5 对齐标记
D1 直径
D2 直径

Claims (11)

1.用于粘合第一衬底(2)与第二衬底(2’)的装置,其具有下述特征:
-用于容纳一个载体衬底(1)或多个载体衬底(1)的容器,
-用于将多个第一衬底(2)放置在一个载体衬底(1)或多个载体衬底(1)的背向容器的衬底侧(1s)上的放置装置以及
-用于将每个第一衬底(2)在衬底侧(1s)上固定在每个第一衬底(2)的至少一个固定段(2a)上的固定装置。
2.根据权利要求1所述的装置,在所述装置中设置固定装置以便临时固定每个第一衬底(2)。
3.根据权利要求1或2所述的装置,在所述装置中设置放置装置用于对齐或放置第一衬底(2)到对齐标记(3)上。
4.根据前述权利要求中任一项或多项所述的装置,在所述装置中设置放置装置用于尤其按照第一衬底(2)的对齐标记(5)对齐地将多个第二衬底(2’)放置在第一衬底上面。
5.根据权利要求4所述的装置,在所述装置中设置固定装置用于尤其临时固定每一个放置在第一衬底(2)上的第二衬底(2’)。
6.根据权利要求4或5所述的装置,其中设置尤其设置为单独的粘合模块的粘合室来同时地,尤其是永久地粘合第一与第二衬底(2,2’)。
7.用于粘合第一衬底(2)与第二衬底(2’)的方法,其具有下述步骤,尤其是下述流程:
-将多个第一衬底(2)放置在在容器上容纳的载体衬底(1)的衬底侧(1s)上和
-将每个第一衬底(2)在衬底侧(1s)上固定在每个第一衬底(2)的至少一个固定段(2a)上。
8.根据权利要求7所述的方法,在所述方法中第一衬底(2)被临时固定在衬底侧(1s)上。
9.根据权利要求7或8所述的方法,在所述方法中在放置之前按对第一衬底(2)对齐到对齐标记(3)上。
10.根据权利要求7-9中任一项或多项所述的方法,其中第二衬底(2’),尤其是在按照第一衬底(2)的对齐标记(5)对齐之后被放置和/或,尤其是临时地固定在第一衬底(2)上。
11.根据权利要求10所述的方法,在所述方法中第二衬底(2’)分别同时与第一衬底(2)尤其是永久地粘合,尤其是在构造为单独的粘合模块的粘合室内进行。
CN201180076126.1A 2011-12-28 2011-12-28 衬底的粘合方法和装置 Pending CN104247000A (zh)

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US4342090A (en) * 1980-06-27 1982-07-27 International Business Machines Corp. Batch chip placement system
US5236118A (en) * 1992-05-12 1993-08-17 The Regents Of The University Of California Aligned wafer bonding
US5348611A (en) * 1992-05-20 1994-09-20 General Signal Corporation Die paste transfer system and method
US6423613B1 (en) * 1998-11-10 2002-07-23 Micron Technology, Inc. Low temperature silicon wafer bond process with bulk material bond strength
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WO2006078631A2 (en) * 2005-01-18 2006-07-27 Suss Micro Tec Inc. High-throughput bond tool
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