EP2791588B1 - Unité de pompe à chaleur à hautes performances - Google Patents

Unité de pompe à chaleur à hautes performances Download PDF

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Publication number
EP2791588B1
EP2791588B1 EP12815833.4A EP12815833A EP2791588B1 EP 2791588 B1 EP2791588 B1 EP 2791588B1 EP 12815833 A EP12815833 A EP 12815833A EP 2791588 B1 EP2791588 B1 EP 2791588B1
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Prior art keywords
heat pump
heat
main
circuit
pump cycle
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German (de)
English (en)
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EP2791588A1 (fr
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Gianfranco Pellegrini
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Teon Srl
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Teon Srl
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D11/00—Central heating systems using heat accumulated in storage masses
    • F24D11/02—Central heating systems using heat accumulated in storage masses using heat pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D17/00—Domestic hot-water supply systems
    • F24D17/02—Domestic hot-water supply systems using heat pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B6/00—Compression machines, plants or systems, with several condenser circuits
    • F25B6/02—Compression machines, plants or systems, with several condenser circuits arranged in parallel
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B7/00—Compression machines, plants or systems, with cascade operation, i.e. with two or more circuits, the heat from the condenser of one circuit being absorbed by the evaporator of the next circuit
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D2200/00—Heat sources or energy sources
    • F24D2200/12—Heat pump

Definitions

  • the present invention relates to the field of heat pumps.
  • the invention relates to a heat pump unit adapted to be used for heating/cooling environments and for producing sanitary hot water with high performance in terms of energy efficiency and use flexibility.
  • Heat pumps are an increasingly widespread technical solution for meeting the requirements of heating/cooling environments and/or fluids.
  • the reasons for such a success are mainly to be ascribed to the high energy efficiencies, to the possibility of using a single device for both heating and cooling (so-called "reversible” heat pumps), to the flexibility in managing thermal users with different requirements and to the possibility, in case of use for heating, of considerably reducing the use of fossil fuels and thus the output of harmful carbon harmful to the environment.
  • a known method for improving the COP consists in performing an undercooling of the operating fluid after the condensation thereof and in using the undercooling heat power thus obtained for preheating the heat carrier fluid coming from a heat sink before sending it to the evaporator for determining the evaporation of the operating fluid.
  • an additional heat exchanger connected downstream of the condenser and upstream of the expansion means in the circuit of each stage.
  • the additional heat exchangers are further connected to a delivery line of a heat carrier fluid of a heat sink, upstream of the evaporator of the lower temperature stage. Therefore, the heat carrier fluid coming from the heat sink can be preheated before sending it to the evaporator of the lower temperature heat pump cycle through the heat power resulting from the undercooling of the operating fluids that perform the higher and lower temperature heat pump cycles. Due to such a configuration, COP can be obtained so as to be equal to or higher than 3 even in two stage heat pumps.
  • the documents JPH04103571U and JP62077554A both disclose heat pump units with a main and a secondary circuit and an external circuit.
  • the technical problem at the basis of the present invention consists in providing a heat pump having improved performance as compared to the heat pumps having the same power and type of the prior art.
  • a heat pump is desired which is capable of ensuring a high energy efficiency, with COP in case of heating or EER (Energy Efficiency Ratio) in case of cooling equal to or higher than 3, in a wide range of operating conditions, also in the presence of thermal users with different requirements in terms of heating/cooling power and/or operating temperatures required.
  • the invention therefore relates to a heat pump unit comprising at least one main circuit adapted to perform a main heat pump cycle with a respective operating fluid, said at least one main circuit comprising:
  • the heat power released during the undercooling of the operating fluid of the main heat pump cycle can be advantageously brought substantially to the same temperature at which the condensation heat power in the main condenser is released.
  • the undercooling heat power of the main operating fluid may be transferred to the thermal user plant served by the main heat pump cycle or to another thermal user plant operating at similar temperatures, increasing the overall useful heat power that can be provided by the heat pump unit.
  • the overheating degree obtainable on the operating fluid of the secondary heat pump cycle which is stronger as the thermal gradient of the operating fluid of the main heat pump cycle is wider during the undercooling, has two important effects that contribute to a considerable reduction of the electrical compression power in the secondary heat pump cycle.
  • the overheating distances the operating fluid of the secondary heat pump cycle from the saturation conditions and therefore allows the use of compressors with higher isentropic yields, without the risk of intersecting the higher limit curve (i.e. saturation curve in vapor conditions) during the compression.
  • the heat pump unit of the invention with the above features, moreover, provides a considerable use flexibility. In fact, if no additional heat power at the higher temperature is required, or in case of cooling operation when this option is provided, the secondary heat pump cycle can be easily deactivated and the heat power resulting from the undercooling of the main operating fluid can be released to the external environment or used for other purposes.
  • the use of the secondary heat pump cycle in the heat pump unit of the invention is compatible and easily integrated with other technical solutions aimed to use the undercooling heat power of the main operating fluid, such as for example the preheating of the heat carrier fluid of the heat sink carried out in the prior art devices.
  • both said main condenser and said secondary condenser are intended to be connected to the external circuit of said first thermal user plant and are connected to one another so as to be in series in said external circuit of said first thermal user plant.
  • This embodiment advantageously allows the use of both the condensation heat power and of the undercooling heat power of the main operating fluid for the same thermal user plant.
  • a situation of interest for the use of this embodiment therefore is in combination with high temperature heating plants which envision high temperature differences between delivery and backflow of the respective heat carrier fluid.
  • said main circuit comprises a first sub-circuit adapted to perform a higher temperature main heat pump cycle with a respective operating fluid and a second sub-circuit adapted to perform a lower temperature main heat pump cycle with a respective operating fluid, in which said first and second sub-circuits are in cascading heat exchange relationship with each other to perform globally a two-stage main heat pump cycle, and in which said main condenser and said first heat exchanger are connected in said first sub-circuit and said main evaporator is connected in said second sub-circuit.
  • the heat pump unit of the invention can be advantageously used with thermal user plants operating at a high temperature (for example radiator heating plants which normally require delivery temperatures around 80 °C) also when a heat sink is available which consists of water or environmental fluids at low temperature (for example groundwater or running water on the surface or in depth, seawater or lake water, waterworks water, wastewaters, etc., with average temperatures typically not lower than about 7 °C).
  • a high temperature for example radiator heating plants which normally require delivery temperatures around 80 °C
  • a heat sink which consists of water or environmental fluids at low temperature (for example groundwater or running water on the surface or in depth, seawater or lake water, waterworks water, wastewaters, etc., with average temperatures typically not lower than about 7 °C).
  • said first sub-circuit comprises a second heat exchanger connected downstream of said first heat exchanger and upstream of expansion means of said first sub-circuit, said second heat exchanger being adapted to perform an undercooling of the operating fluid of said higher temperature main heat pump cycle after the condensation thereof and being selectively connectable to the external circuit of said heat sink so as to perform a preheating of a heat carrier fluid coming from said heat sink by means of heat power released during said undercooling by the operating fluid of said higher temperature main heat pump cycle.
  • said second heat exchanger is further selectively connectable to an external circuit of a third thermal user plant.
  • the heat power resulting from the undercooling of the operating fluid of the higher temperature main heat pump cycle may be used for serving a further medium/low temperature thermal user, for example a heating plant with floor or ceiling radiating panels, fan coils, etc.
  • a further medium/low temperature thermal user for example a heating plant with floor or ceiling radiating panels, fan coils, etc.
  • said second sub-circuit comprises a third heat exchanger connected downstream of said first heat exchanger and upstream of expansion means of said second sub-circuit, said third heat exchanger being adapted to perform an undercooling of the operating fluid of said lower temperature main heat pump cycle after the condensation thereof and being selectively connectable to the external circuit of said heat sink so as to perform, preferably independently of said second heat exchanger, a preheating of a heat carrier fluid coming from said heat sink by means of heat power released during said undercooling by the operating fluid of said lower temperature main heat pump cycle.
  • said third heat exchanger is further selectively connectable to the external circuit of said third thermal user plant.
  • said first sub-circuit comprises a fourth heat exchanger connected downstream of said main condenser and upstream of said first heat exchanger, said fourth heat exchanger being adapted to perform an undercooling of the operating fluid of said higher temperature main heat pump cycle after the condensation of the same and being selectively connectable to the external circuit of said first thermal user plant so as to be in series with said main condenser in said external circuit of said first user plant.
  • This embodiment advantageously allows the use of heat power resulting from an undercooling of the operating fluid of the main heat pump cycle (i.e. of the higher temperature main heat pump cycle in the case of two-stage main heat pump cycle) for preheating the heat carrier fluid of the first thermal user plant before it reaches the main condenser, with a positive effect on the overall COP of the heat pump unit.
  • the above embodiment is especially advantageous for an operation of the heat pump unit in all those operating conditions in which a drop of the temperature level in the thermal user plant is acceptable with the same heat power transferred thereto. Such a situation occurs, for example, in high temperature heating plants in autumn and spring.
  • this embodiment finds an advantageous use in combination with high temperature heating plants which provide for the possibility of changing the backflow temperature of the heat carrier fluid in order to optimize the operation of the heating plant.
  • the heat pump unit comprises switching means, adapted to allow an exchange of connections of the external circuits of at least said first thermal user plant and said heat sink respectively with at least said main condenser and with said main evaporator.
  • the operating fluid of said main heat pump cycle, or the operating fluids of said higher temperature main heat pump cycle and said lower temperature main heat pump cycle respectively, and the operating fluid of said secondary heat pump cycle are selected from the group consisting of: (E)-2-butene, (Z)-2-butene, 1-butylene, dimethyl ketone, methylacetylene, methyl alcohol, methylpentane, methylpropene, n-hexane, R1270, R290, R600, R600a, R601, R601a, RE-170, tetramethylmethane or RC-270.
  • the above cooling fluids are characterized by limit curves in diagram h - p (specific enthalpy - pressure) strongly inclined towards the increasing enthalpies, with increasing inclination as pressure increases. This advantageously allows even strong undercooling to be performed which, as already explained, allows all the advantageous effects on the overall energy efficiency that can be obtained by the above embodiments of the heat pump unit to be enhanced.
  • the invention also relates to a system for heating/cooling environments and/or for producing sanitary hot water comprising a heat pump unit having the features described above
  • a heat pump unit according to the invention is globally indicated with reference numeral 1.
  • the heat pump unit 1 is shown as a part of a system 100 for heating/cooling environments and/or for producing sanitary hot water, comprising at least one external circuit of a thermal user plant 10 and an external circuit of a heat sink 20, which are only schematically shown.
  • the heat sink 20 may therefore be replaced by a further thermal user plant capable of using the cooling or heating power otherwise disposed of through such a heat sink.
  • Fig. 1 shows a first preferred embodiment of the heat pump unit 1, in particular for heating, comprising a main circuit 2 and a secondary circuit 3 adapted to perform respective heat pump cycles in heat exchange relationship with each other, with respective operating fluids.
  • the main circuit 2 for performing a main heat pump cycle HPCM comprises: a main condenser S4 adapted to perform the condensation of the operating fluid at a higher pressure of the main heat pump cycle HPCM and intended to be connected to the external circuit of the thermal user plant 10 in a heating operating mode of the heat pump unit 1; a main evaporator S8 adapted to perform the evaporation of the operating fluid at a lower pressure of the main heat pump cycle HPCM and intended to be connected to the external circuit of the heat sink 20 in a heating operating mode of the heat pump unit 1; a compressor C2 adapted to bring the evaporated operating fluid from the lower pressure to the higher pressure of the main heat pump cycle HPCM, and expansion means L2 - for example a lamination valve or other functionally equivalent known device - adapted to perform the expansion of the operating fluid from the higher pressure to the lower pressure of the main heat pump cycle HPCM.
  • a main condenser S4 adapted to perform the condensation of the operating fluid at a higher pressure of the main heat pump cycle HPCM and
  • the main circuit 2 further comprises a heat exchanger connected downstream of the main condenser S4 and upstream of the expansion means L2, adapted to perform an undercooling of the operating fluid after the condensation of the same in the main condenser S4 and in heat exchange relationship with the secondary circuit 3.
  • upstream and downstream are to be understood with reference to the directions of fluid circulation indicated in the figures by arrows and in general determined by the compressors, in the case of circuits for performing heat pump cycles, and by the circulation pumps in the case of the external circuits of the thermal user plants and of the heat sink, respectively.
  • the secondary circuit 3 for performing a secondary heat pump cycle HPCS comprises: a secondary condenser S1 adapted to perform the condensation of the operating fluid at a higher pressure of the secondary heat pump cycle HPCS and intended to be connected to the external circuit of the thermal user plant 10; a secondary evaporator adapted to perform at least the evaporation of the operating fluid at a lower pressure of the secondary heat pump cycle HPCS and in heat exchange relationship with said heat exchanger of the main circuit 2 for transferring heat power released by the operating fluid of the main heat pump cycle HPCM during said undercooling to the operating fluid of the secondary heat pump cycle HPCS; a compressor C3 adapted to bring the evaporated operating fluid from the lower pressure to the higher pressure of the secondary heat pump cycle HPCS, and expansion means L3 - for example a lamination valve or another functionally equivalent known device - adapted to allow the expansion of the operating fluid from the higher pressure to the lower pressure of the secondary heat pump cycle HPCS.
  • a secondary condenser S1 adapted to perform the condensation of the operating fluid at
  • said heat exchanger of the main circuit 2 and the secondary evaporator of the secondary circuit 3 are integrated in a single heat exchanger device S2 for greater construction compactness and a better heat exchange efficiency.
  • embodiments in which such components are separate and placed in thermal exchange relationship by an intermediate circuit for the circulation of a suitable heat carrier fluid are not excluded.
  • Compressor C3 preferably is a variable flow rate compressor, for example a cut-off or step or inverter compressor. This allows the extent of the operating fluid undercooling in the main heat pump cycle HPCM at the heat exchanger device S2 and accordingly, the heat power that can be provided at the secondary condenser S1 to be controlled without stressing the compressor with an excessive repetition of on-off cycles.
  • Fig. 1A schematically shows a diagram h - p (specific enthalpy - pressure) of the main HPCM and secondary HPCS heat pump cycles that may be performed in the heat pump unit 1 in Fig. 1 .
  • the heat powers released during the condensation step C'-D' in the main heat pump cycle HPCM at the main condenser S4 and during the condensation step C"-D" in the secondary heat pump cycle HPCS at the secondary condenser S1, respectively, as said, may both be transferred to the same thermal user plant.
  • both the main condenser S4 and the secondary condenser S1 serve the same thermal user plant, they are reciprocally connected in series, with the secondary condenser S1 upstream, in a line FL1 arranged in the heat pump unit 1 for the connection to the external circuit of such a thermal user plant.
  • the secondary condenser S1 can be used for performing a preheating of the heat carrier fluid of the thermal user plant, and the main condenser S4 for completing the heating up to reaching the required delivery temperature.
  • the secondary condenser S1 since in this case the secondary condenser S1 must only contribute to a part of the heating, the heat power to transfer to the thermal user plant being equal, it is possible to decrease the condensation temperature in the secondary heat pump cycle HPCS, obtaining a simultaneous decrease of the compression work required in such a cycle and thus, a further improvement of the overall COP of the heat pump unit 1.
  • the embodiment of the heat pump unit 1 shown in Fig. 1 may be used with low/mean or high temperature thermal user plants.
  • a heat sink 20 is available with a mean temperature of no less than 7 °C, as it happens for example in the case of groundwater or running water on the surface or in depth, seawater or lake water, waterworks water, wastewaters, etc., it is possible to serve thermal user plants that require temperatures up to 60-65 °C, for example heating plants operating at low/mean temperature, such as plants with floor or ceiling radiating panels, fan coils, etc., or plants for the production of sanitary hot water.
  • a heat sink 20 is available with a higher mean temperature (at least 30-35 °C), for example waste/cooling heat from industrial processes, hot spring, etc.
  • a heat sink 20 is available with a higher mean temperature (at least 30-35 °C), for example waste/cooling heat from industrial processes, hot spring, etc.
  • thermal user plants which require temperatures even higher than 60-65 °C, for example heating plants operating at high temperature, such as plants with radiators, fan heaters, etc. which typically require delivery temperatures of 80 °C or higher, or plants for the production of sanitary hot water in all those situations where the hot water must be produced at temperatures considerably higher than 60° to prevent the possible occurrence of legionella (hospitals, swimming pools and sports centers, barracks, etc.).
  • the Applicant has therefore noted that through the heat pump unit according to the invention, the "useless" enthalpy of the operating fluid is advantageously changed into “useful” enthalpy.
  • the same operating fluid at the output from compressor C2 has an overall enthalpy given by the sum of a "useful" enthalpy, obtainable by the de-overheating followed by the condensation of the operating fluid through the main condenser S4, and by the "useful" enthalpy obtainable by the undercooling of the operating fluid through the first heat exchanger S2.
  • the term "useful” indicates the possibility of transferring high temperature heat power (i.e.
  • the "useless" enthalpy is used to evaporate an operating fluid circulating in the secondary cycle HPSC which, by means of a secondary compressor C3, is able to condensate at a temperature corresponding to the useful enthalpy.
  • the operating fluid circulating in the main circuit is strongly undercooled, i.e. so as to bring the same fluid from an initial temperature close to the condensation temperature up to a temperature close to the evaporation one.
  • Fig. 2 shows a second preferred embodiment of the heat pump unit 1, which differs from that in Fig. 1 in the type of main circuit 2.
  • the main circuit 2 comprises a first sub-circuit 2a adapted to perform a higher temperature main heat pump cycle HPCM_HT with a respective operating fluid and a second sub-circuit 2b adapted to perform a lower temperature main heat pump cycle HPCM_LT with a respective operating fluid.
  • the first and second sub-circuits 2a, 2b are in cascading heat exchange relationship with each other to perform globally a two-stage main heat pump cycle HPCM.
  • the first sub-circuit 2a comprises the main condenser S4, the heat exchanger device S2, the expansion means L2 and compressor C2 described above with reference to the embodiment in Fig. 1 , and an evaporator.
  • the second sub-circuit 2b comprises the main evaporator S8, already described above as well with reference to the embodiment in Fig. 1 , a compressor C1, a condenser in heat exchange relationship with the evaporator of the first sub-circuit 2b and the expansion means L1.
  • the condenser of the second sub-circuit 2b and the evaporator of the first sub-circuit 2a are integrated in a single heat exchanger device S7 for greater construction compactness and a better heat exchange efficiency.
  • embodiments where such components are separate and placed in thermal exchange relationship by an intermediate circuit for the circulation of a suitable heat carrier fluid are not excluded.
  • the embodiment of the heat pump unit 1 with two-stage main heat pump cycle HPCM finds an advantageous use in all those situations in which it is necessary to serve thermal user plants operating at a high temperature but having a low temperature heat sink available.
  • Fig. 3 schematically shows a diagram h - p of the main HPCM and secondary HPCS heat pump cycles that may be performed in the heat pump unit 1 in Fig. 2 .
  • the main heat pump cycle HPCM consists of the two main heat pump cycles at higher temperature HPCM_HT and at lower temperature HPCM_LT, respectively, in cascading heat exchange relationship with each other.
  • the heat power released during condensation C-D of the operating fluid of the lower temperature main heat pump cycle HPCM_LT is transferred to the operating fluid of the higher temperature main heat pump cycle HPCM_HT for performing the evaporation (and optional overheating) A'-B' thereof.
  • the "useless" enthalpy resulting from the undercooling of the operating fluid is advantageously converted into enthalpy useful for heating the heat carrier fluid of the external circuit of the first user plant 10.
  • a "cascading" cycle like that in Fig.
  • the operating fluid of the main circuit has an enthalpy useful for the main condenser S4 capable of transferring a power of 100 thermal KW at 80 °C to the heat carrier fluid of the external circuit.
  • the same operating fluid also has an enthalpy "useless" for the first heat exchanger S2 capable of transferring a heat power of 38 thermal KW at 40 °C to evaporator S1 of the secondary cycle 3.
  • Compressor C3 of the secondary cycle 3, against the 8 electrical KW used, is capable of transferring an additional heat power of 46 thermal KW at 80 °C to the heat carrier fluid circulating in the external circuit that adds up to the 100 thermal KW of enthalpy useful for the main exchanger S4 of the main circuit 2.
  • the heat carrier fluid receives 146 thermal KW at 80 °C against a use of 42 KW.
  • the option may be to increase the mass flows rate of the operating fluids related to the dual cascading cycle by 46%.
  • the electrical power used by the compressors would increase proportionally and the COP would remain unchanged (equal to 2.94).
  • the heat pump unit allows 46% of the electrical power used and 46% of the flow rate of cold fluid to the evaporator of the second sub-circuit 2b to be saved, the yielded heat power at 80 °C being the same.
  • Fig. 4 shows a third preferred embodiment of the heat pump unit 1 which differs from that in Fig. 2 essentially by the provision, in the first sub-circuit 2a for performing the higher temperature main heat pump cycle HPCM_H, of a further heat exchanger S5 connected downstream of the heat exchanger device S2 and upstream of the expansion means L2.
  • Heat exchanger S5 is adapted to perform an undercooling of the operating fluid of the higher temperature main heat pump cycle HPCM_HT after the condensation thereof in the main condenser S4, and optionally after a first undercooling in the heat exchanger device S2, and is selectively connectable to the external circuit of the heat sink 20 so as to perform a preheating of the heat carrier fluid coming from the latter by means of the heat power released during said undercooling.
  • a first end of the heat exchanger S5 is connected in the first sub-circuit 2a as described above and a second end of the heat exchanger S5 is connected upstream of the main evaporator S8 in a line FL2 arranged in the heat pump unit 1 for the connection to the external circuit of the heat sink 20.
  • a valve V7 preferably a modulating solenoid valve, for adjusting the flow rate of heat carrier fluid of the heat sink 20 which crosses the heat exchanger S5, and thus the extent of the undercooling of the operating fluid in the higher temperature main heat pump cycle HPCM_HT.
  • Line FL2 preferably also comprises a first manifold M1 connected upstream of the heat exchanger S5 and a second manifold M2 connected upstream of the main evaporator S8 and downstream of valve V7.
  • manifolds M1 and M2 are also connected by a bypass line BPL for bypassing the heat exchanger S5, provided with a valve V5, also preferably a modulating solenoid valve.
  • This further embodiment of the heat pump 1 therefore allows the heat power obtained with the undercooling of the operating cycle of the higher temperature main heat pump cycle HPCM_HT to be used for preheating the heat carrier fluid of the heat sink 20, in addition or as an alternative to the use through the secondary heat pump cycle HPCS that may be performed in the secondary circuit 3 described above.
  • compressor C3 of the secondary circuit 3 when compressor C3 of the secondary circuit 3 is off, the undercooling is carried out only in heat exchanger S5.
  • compressor C3 is cut off or operates at a reduced number of revolutions, the undercooling is partly carried out in the heat exchanger device S2 and partly in heat exchanger S5.
  • valve V7 is correspondingly cut off.
  • compressor C3 operates at full load, preferably all the undercooling heat power available is used in the heat exchanger device S2 and heat exchanger S5 is disabled by closing valve V7.
  • valve V7 is compensated through a corresponding modulation or opening of valve V5.
  • compressors C1 and C2 are variable flow rate compressors, for example cut-off step or inverter compressors. This ensures higher adaptability of the heat pump unit 1 to the possible unbalances in the thermal power exchange between higher temperature main heat pump cycle HPCM_HT and lower temperature main heat pump cycle HPCM_HT which may happen due to the undercooling. Such a higher adaptability has a positive influence on the overall energy efficiency of the heat pump unit 1, all the other conditions being equal.
  • Fig. 5 shows a fourth preferred embodiment of the heat pump unit 1 which differs from that in Fig. 4 by the provision, in the second sub-circuit 2b for performing the lower temperature main heat pump cycle HPCM_LT, of a further heat exchanger S6 connected downstream of the heat exchanger device S7 and upstream of the expansion means L1.
  • heat exchanger S6 is adapted to perform an undercooling of the operating fluid of the lower temperature main heat pump cycle HPCM_LT after the condensation thereof in the heat exchanger device S7, and is selectively connectable to the external circuit of the heat sink 20 so as to perform a preheating of the heat carrier fluid coming from the latter by means of the heat power released during said undercooling.
  • heat exchanger S5 and heat exchanger S6 are arranged so as to perform the preheating of the heat carrier fluid of the heat sink 20 independently of one another, i.e. operating in parallel on two separate flows of such a heat carrier fluid.
  • the heat exchanger S5 and valve V7 are connected in a first branch FL2' of line FL2 for the connection to the external circuit of the heat sink 20 and heat exchanger S6 is connected in a second branch FL2", in parallel with the first branch FL2', of line FL2.
  • a valve V6 preferably a modulating solenoid valve, for adjusting the flow rate of heat carrier fluid of the heat sink 20 which crosses the heat exchanger S6.
  • valve V6 Similar to what mentioned with reference to valve V7, also the modulation or closing of valve V6 may be compensated through a corresponding intervention on valve V5 in the bypass line BPL in order to keep a constant flow rate of the heat sink 20 heat carrier fluid in the main evaporator S8.
  • This embodiment of the heat pump 1 allows an undercooling of the operating fluid to be performed also in the lower temperature main heat pump cycle HPCM_LT after the condensation thereof and the heat power thus released to be used for preheating the heat carrier fluid of the heat sink 20.
  • Fig. 6 shows a fifth preferred embodiment of the heat pump unit 1 which differs from that in Fig. 5 in that the heat exchangers S5 and S6 are further selectively connectable to an external circuit of a further thermal user plant 12, in particular a thermal user plant operating at mean/low temperature, for example a heating plant with floor or ceiling radiating panels, a plant for the production of sanitary hot water, etc.
  • a further thermal user plant operating at mean/low temperature, for example a heating plant with floor or ceiling radiating panels, a plant for the production of sanitary hot water, etc.
  • a three-way valve V8 preferably a solenoid valve, and two valves V9 and V12, preferably modulating solenoid valves, arranged so as to allow the connection of the second end of heat exchangers S5 and S6 alternately to the external circuit of the heat sink 20 or to the external circuit of the thermal user plant 12.
  • valves V6 and V7 are fully closed and valves V9 and V12 are fully or partly open.
  • An adjustment of the opening degree of valves V9 and V12 allows the heat power transferred to the thermal user plant 12 to be adjusted.
  • valves V9 and V12 are fully closed and valves V6 and V7 are fully or partly open.
  • each of such pairs may be replaced by a three-way valve arranged so as to perform the functions described above of the corresponding two-way valves.
  • Figs. 7A and 7B show a sixth preferred embodiment of the heat pump unit 1 adapted to operate for both heating and cooling, i.e. of the reversible type.
  • switching means adapted to allow an exchange of connections of the external circuits of the thermal user plant 10 and of the heat sink 20 respectively with the main condenser S4 and with the main evaporator S8.
  • switching means comprise two four-way valves V1 and V2, preferably solenoid valves, suitably arranged in the lines for the connection of the above external circuits to the main condenser S4 and the main evaporator S8.
  • the external circuit of the thermal user plant 10 is connected to the main condenser S4 (and to the secondary condenser S1), whereas the external circuit of the heat sink 20 is connected to the main evaporator S8 in a manner totally similar to the embodiments described above.
  • the external circuit of the thermal user plant 10 is connected to the main evaporator S8 so as to provide such a plant with the required cooling power whereas the external circuit of the heat sink 20 is connected to the main condenser S8.
  • the undercooling heat power released in this operating configuration at the heat exchangers S5 and S6 may advantageously be used for example for the production of sanitary hot water in a dedicated plant (schematized in Fig. 7B by the thermal user plant 12). If the undercooling heat power cannot be used, this shall be suitably disposed to the external environment.
  • the secondary circuit 3 for performing the secondary heat pump cycle HPCS typically is not active (compressor C3 off).
  • compressor C3 off the secondary circuit 3 for performing the secondary heat pump cycle HPCS typically is not active (compressor C3 off).
  • Figs. 8A and 8B show a seventh preferred embodiment of the heat pump unit 1 which differs from that of Figs. 7A and 7B in that it can also serve, in a dedicated manner, both in a heating operating configuration ( Fig. 8A ), and in a cooling operating configuration ( Fig. 8B ), a thermal user plant 13 for the production of sanitary hot water, in addition to the thermal user plants 10 and 12 and optionally 11, already mentioned.
  • This embodiment in particular allows a thermal user plant for the production of high temperature (higher than 60 °C to prevent the possible occurrence of legionella) sanitary hot water to be served.
  • Figs. 8A and 8B by way of an example, envisions that the heat exchange with the thermal user plant 13 indirectly takes place at a heat accumulator (boiler) 13a, but other solutions known by the man skilled in the art are also possible for connecting the heat pump unit 1 to the external circuit of such a thermal user plant.
  • connections are further provided in this case for an external circuit of the thermal user plant 13 and two three-way valves V3 and V11, preferably solenoid valves.
  • the three-way valve V3 is arranged so as to allow, in the heating operating configuration ( Fig. 8A ), the connection of line FL1, in which the main condenser S4 and the secondary condenser S1 are connected, alternately to the external circuit of the thermal user plant 10 or to the external circuit of the thermal user plant 13.
  • the heat power released at the main condenser S4 (and at the secondary condenser S1 when the secondary circuit 3 is active) can be alternately used for heating or producing high temperature sanitary hot water.
  • the three-way valve V11 is arranged so as to allow, in the cooling operating configuration ( Fig. 8B ), the connection of line FL1 alternately to the external circuit of the thermal user plant 13.
  • the heat power released by the main condenser S4 (and of the secondary condenser S1 when the secondary circuit 3 is active, a condition which may also occur during the cooling operation to meet a high hot water requirement) can be used for producing high temperature sanitary hot water rather than dispersing such a power at the heat sink 20.
  • Figs. 9A and 9B show an eighth preferred embodiment of the heat pump unit 1 which, as compared to the embodiment of Figs. 8A and 8B , in addition allows also low temperature sanitary hot water requirements to be met through the thermal user plant 13 for the production of sanitary hot water already mentioned.
  • the embodiment of Figs. 9A and 9B differs from that of Figs. 8A and 8B in particular by the presence of a further three-way valve V4, preferably a solenoid valve.
  • the three-way valve V4 is arranged so as to allow the selective connection of lines FL2' and FL2", in which the heat exchangers S5 and S6 are connected, also to the external circuit of the thermal user plant 13 for the production of sanitary hot water, so as to create a closed circuit therewith.
  • the heat power released at the two heat exchangers S5 and S6 can be alternately used for producing sanitary hot water both in the heating operating configuration ( Fig. 9A ) and in the cooling operating configuration ( Fig. 9B ), or for preheating the heat sink 20 heat carrier fluid in the heating operating configuration.
  • Such means preferably comprise a three-way valve V13, preferably a solenoid valve, arranged between the external circuit of the thermal user plant 10 and the external circuit of the thermal user plant 13.
  • the external three-way valve V13 together with the already described three-way valve V11 of the heat pump unit 1, allows line FL1 to be connected to the external circuit of the thermal user plant 13 bypassing the external circuit of the thermal user plant 10.
  • the three-way valve V11 connects line FL1 to the external circuit of the thermal user plant 13 whereas the external there-way valve V13 allows the external circuit of the thermal user plant 10 to be bypassed.
  • the heat power released by the main condenser S4 (and by the secondary condenser S1 when the secondary circuit 3 is active, a condition which may also occur during the cooling operation to meet a high hot water requirement) can be used for producing high temperature sanitary hot water rather than dispersing such a power at the heat sink 20.
  • This operating mode requires circuit FL1 to be a closed circuit.
  • Figs. 10A and 10B show a ninth preferred embodiment of the heat pump unit 1 which differs from that of Figs. 9A and 9B mainly in that it comprises a further heat exchanger S3 in the first sub-circuit 2a for performing the higher temperature main heat pump cycle HPCM_HT.
  • the heat exchanger S3 is connected downstream of the first sub-circuit 2a so as to be downstream of the main condenser S4 and upstream of the heat exchanger device S2 and of the heat exchanger S5 and is adapted, as the latter, to perform an undercooling of the operating fluid of the higher temperature main heat pump cycle HPCM_HT after the condensation of the same in the main condenser S4.
  • the heat exchanger S3 is further selectively connectable in line FL1 for the connection to the external circuit of the thermal user plant 10, in which the main condenser S4 and the secondary condenser S1 are also connected.
  • This is preferably obtained by means of a three-way valve V10, preferably a modulating solenoid valve, arranged in line FL1 so as to allow the connection in such a line alternately of the heat exchanger S3 or of the secondary condenser S1.
  • the heat exchanger S3, in the heating operating configuration allows the use of the heat power resulting from an undercooling of the operating fluid of the higher temperature main heat pump cycle HPCM_HT for preheating the heat carrier fluid of the first thermal user plant 10 before it reaches the main condenser S4.
  • this leads to a significant improvement of the overall COP of the heat pump unit 1 in particular in operating conditions in which a decrease in the temperature level of the thermal user plant 10 is acceptable, the heat power transferred thereto being equal, as it may happen for example in a high temperature heating plant in spring and autumn.
  • the three-way valve V10 is preferably diverted so as to connect the secondary condenser S1 in line FL1 and exclude the heat exchanger S3.
  • the heat power provided by the undercooling of the operating fluid of the higher temperature main heat pump cycle HPCM_HT can thus be transferred to the thermal user plant 10 at a higher temperature, due to the secondary heat pump cycle HPCS performed in the secondary circuit 3 (active compressor C3), as already described with reference to the above embodiments.
  • the backflow of heat carrier fluid from the thermal user plant is partly or totally diverted towards the heat exchanger S3 through the three-way valve V10.
  • the secondary circuit 3 may be deactivated or not (compressor C3 cut off or off), whereas in case of full diversion, the secondary circuit 3 is deactivated (compressor C3 off).
  • the heat power available from the undercooling of the operating fluid of the higher temperature main heat pump cycle HPCM_HT is transferred to the thermal user plant 10 directly, without heat increase, through the heat exchanger S3.
  • the adjustment of the delivery temperature for the thermal user plant 10 takes place through the modulation of the three-way valve V10.
  • a further advantage may be obtained by shutting or reducing the number of revolutions of compressors C1 and C2 in order to reduce the heat power delivered.
  • the use level of the heat exchanger S5 i.e. the fraction of undercooling heat power used therein with respect to the total available, depends on the corresponding use level of the heat exchanger device S2 and of heat exchanger S3.
  • the use level of heat exchanger S5 is maximum when the three-way valve V10 is diverted so as to exclude the heat exchanger S3 and the secondary circuit 3 is not active (compressor C3 off).
  • the use level is null when all the undercooling heat power is used in the heat exchanger device S2 (for example in full winter operating conditions) or in heat exchanger S3 (for example in autumn and spring operating conditions).
  • the heat exchanger S5 is excluded from line FL1 by closing valve V7.
  • the use level of the heat exchanger S5 is partial and valve V7 must modulate accordingly.
  • the cooling operating configuration ( Fig. 10B ) of the ninth preferred embodiment of the heat pump unit 1 the use of the heat exchanger S3 is not generally required and the three-way valve V10 is therefore diverted so as to exclude such a heat exchanger from line FL1.
  • the heat pump unit 1 preferably comprises also a programmable control unit not shown in the figures.
  • a control unit may be suitably programmed for controlling the opening/closing, the modulation or diverting of the valves as well as the switching on/off, the shutting degree or the number of revolutions of the compressors present in each embodiment of the heat pump unit 1.
  • the operating fluids used in the various heat pump cycles performed in the heat pump unit 1 may be equal to or different from, each other.
  • the first two features mentioned above are particularly important for embodiments or operating conditions that use strong undercooling whereas the third one is particularly important for all the embodiments or operating conditions that use strong overheating.
  • the following operating fluids have proven to be particularly advantageous: (E)-2-butene, (Z)-2-butene, 1-butylene, dimethyl ketone, methylacetylene, methyl alcohol, methylpentane, methylpropene, n-hexane, R1270, R290, R600, R600a, R601, R601a, RE-170, tetramethylmethane or RC-270.
  • these operating fluids have the advantage of being so-called "natural" cooling fluids, i.e. not harmful for the environment from the viewpoint of negative effects on the stratospheric ozone, or from the viewpoint of the greenhouse effect.
  • the type of operating fluid selected in particular for its hydrocarbon nature, poses safety issues (fire hazard) in the cases in which the heat pump unit 1 must be installed in underground or basement rooms, the latter is preferably provided also with means for the detection and evacuation of gas leaks.
  • Fig. 11 shows an embodiment of the heat pump unit 1 comprising a system for the detection and evacuation of gas leaks.
  • the configuration of the heat pump unit 1 shown corresponds to the first embodiment described above with reference to Fig. 1 .
  • the system for the detection and evacuation of gas comprises at least one gas detector 31, positioned as close as possible to the bottom of the heat pump unit 1 and ventilation means 32, which can be activated by the gas detector 31 and arranged so that the suction thereof is also close to the bottom of the heat pump unit 1, whereas the delivery thereof is connected to a gas evacuation conduit in communication with the external environment.
  • a dedicated control device 34 adapted to receive signals from the gas detector 31 and to control the ventilation means 32 accordingly.
  • the control device 34 may also control sound and/or light warning means 35, if provided, and/or be configured for sending alarm signals to an optional external monitoring/supervision system (not shown).
  • the functions of the control device 34 may also be carried out by the programmable control unit of the heat pump unit 1.
  • Table 1 shows the comparative results of simulations related to a single-stage configuration, in the case of the invention corresponding to the first preferred embodiment described above with reference to Figs. 1 and 1A .
  • Table 1 Single-stage heat pump unit Invention
  • Prior art HPCM useful heat power [kW] 100 138.1 mass flow rate [kg/s] 0.337 0.466 h [kJ/kg] Tin [°C] Tout [°C] h [kJ/kg] Tin [°C] Tout evaporation + overheating (S8) 347.5 40.0 45,0 247,7 40 45 compression (C2) 48.9 45.0 81,8 48,9 45 81,8 de-overheating + condensation (S4) 296.6 81.8 80,0 296,6 81,8 80 undercooling (S2) 99.9 80.0 43,0 -- -- -- HPCS useful heat power [kW] 38.1 -- mass flow rate [kg/s] 0.101 -- h [kJ/kg] Tin [°C] Tout [°C] h [kJ/kg
  • Table 2 shows the comparative results of simulations related to a two-stage configuration, in the case of the invention corresponding to the second preferred embodiment described above with reference to Figs. 2 and 3 .
  • the tables show, for each heat pump cycle performed in the specific heat pump unit (HPCM, i.e. HPCM_HT and HPCM_LT, HPCMS), the useful heat power, the mass flow rate and, for each cycle transformation, the specific enthalpy variation (h) and the operating fluid temperatures at the beginning (Tin) and at the end (Tout) of the transformation. Finally, the overall useful heat power, the electrical power and the COP of the heat pump unit considered are shown (overall cycle). With reference to the circuit diagram of Figs. 1 and 2 , for each transformation, the component at which it is performed is also shown in brackets.
  • R600 has been considered as operating fluid. In the configurations which provide for multiple heat pump cycles, the operating fluid was the same for all cycles.
  • the simulations were carried out with the same useful heat power of the heat pump unit (overall cycle), equal to 138.1 kW in the simulations related to single-stage configurations and to 136.4 kW in the simulations related to two-stage configurations, respectively.
  • the COP of the heat pump units of the invention is higher than that of the heat pump unit of the prior art having similar configuration.
  • the mass flow rates of operating fluid in the secondary heat pump cycles HPCS are substantially lower than the mass flow rates of operating fluid in the main heat pump cycles HPCM, i.e. HPCM_HT and HPCM_LT.
  • the ratio between the above flow rates is about 1:3.

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Claims (11)

  1. Unité de pompe à chaleur (1) comprenant au moins un circuit principal (2) conçu pour exécuter un cycle principal de pompe à chaleur (HPCM) avec un fluide de fonctionnement respectif, ledit au moins un circuit principal (2) comprenant :
    - un condensateur principal (S4) conçu pour exécuter la condensation du fluide de fonctionnement dudit cycle principal de pompe à chaleur (HPCM) et destiné à être raccordé à un circuit externe d'une première installation thermique d'utilisateur (10) dans un mode de fonctionnement de chauffage de ladite unité de pompe à chaleur (1) ;
    - un premier échangeur de chaleur (S2), raccordé en aval dudit condensateur principal (S4) et en amont du moyen de dilatation (L2) dudit au moins un circuit principal (2), conçu pour exécuter une surfusion du fluide de fonctionnement dudit cycle principal de pompe à chaleur (HPCM) après la condensation de celui-ci dans ledit condensateur principal (S4), et
    - un évaporateur principal (S8) conçu pour exécuter l'évaporation du fluide de fonctionnement dudit cycle principal de pompe à chaleur (HPCM) et destiné à être raccordé à un circuit externe d'un dissipateur thermique (20) dans un mode de fonctionnement de chauffage de ladite unité de pompe à chaleur (1),
    dans laquelle l'unité de pompe à chaleur (1) comprend en outre
    un circuit secondaire (3) conçu pour exécuter un cycle secondaire de pompe à chaleur (HPCS) avec un fluide de fonctionnement respectif, ledit circuit secondaire (3) comprenant :
    - un évaporateur secondaire (S2) conçu pour exécuter au moins l'évaporation du fluide de fonctionnement dudit cycle secondaire de pompe à chaleur (HPCS) et dans une relation d'échange de chaleur avec ledit premier échangeur de chaleur (S2), afin de transférer la puissance thermique émise par le fluide de fonctionnement dudit cycle principal de pompe à chaleur (HPCM) pendant ladite surfusion du fluide de fonctionnement dudit cycle secondaire de pompe à chaleur (HPCS), et
    - un condensateur secondaire (S1) conçu pour exécuter la condensation du fluide de fonctionnement dudit cycle secondaire de pompe à chaleur (HPCS) et destiné à être raccordé au circuit externe de ladite première installation thermique d'utilisateur (10), caractérisée en ce que
    ledit condensateur principal (S4) et ledit condensateur secondaire (S1) sont tous deux destinés à être raccordés au circuit externe de ladite première installation thermique d'utilisateur (10), et sont raccordés l'un à l'autre en série, le condensateur secondaire (S1) étant en amont, sur une ligne (FL1) agencée dans ladite unité de pompe à chaleur (1) pour le raccordement audit circuit externe de ladite première installation thermique d'utilisateur (10).
  2. Unité de pompe à chaleur (1) selon la revendication 1, dans laquelle ledit circuit principal (2) comprend un premier sous-circuit (2a) conçu pour exécuter un cycle principal de pompe à chaleur à température plus élevée (HPCM_HT) avec un fluide de fonctionnement respectif et un second sous-circuit (2b) conçu pour exécuter un cycle principal de pompe à chaleur à température moins élevée (HPCM_LT) avec un fluide de fonctionnement respectif, dans laquelle lesdits premier et second sous-circuits (2a, 2b) sont dans une relation d'échange de chaleur en cascade l'un avec l'autre afin d'exécuter ensemble un cycle principal de pompe à chaleur à deux étages (HPCM), et dans laquelle ledit condensateur principal (S4) et ledit premier échangeur de chaleur (S2) sont raccordés dans ledit premier sous-circuit (2a) et ledit évaporateur principal (S8) est raccordé dans ledit second sous-circuit (2b).
  3. Unité de pompe à chaleur (1) selon la revendication 2, dans laquelle ledit premier sous-circuit (2a) comprend un deuxième échangeur de chaleur (S5) raccordé en aval dudit premier échangeur de chaleur (S2) et en amont du moyen de dilatation (L2) dudit premier sous-circuit (2a), ledit deuxième échangeur de chaleur (S5) étant conçu pour exécuter une surfusion du fluide de fonctionnement dudit cycle principal de pompe à chaleur à température plus élevée (HPCM_HT) après la condensation de celui-ci et pouvant être raccordé sélectivement au circuit externe dudit dissipateur thermique (20) afin d'exécuter un préchauffage d'un fluide caloporteur provenant dudit dissipateur thermique (20) au moyen de la puissance thermique émise pendant ladite surfusion par le fluide de fonctionnement dudit cycle principal de pompe à chaleur à température plus élevée (HPCM_HT).
  4. Unité de pompe à chaleur (1) selon la revendication 3, dans laquelle ledit deuxième échangeur de chaleur (S5) est en outre raccordé de façon sélective à un circuit externe d'une troisième installation thermique d'utilisateur (12).
  5. Unité de pompe à chaleur (1) selon la revendication 3 ou 4, dans laquelle ledit second sous-circuit (2b) comprend un troisième échangeur de chaleur (S6) raccordé en aval d'un condensateur (S7) et en amont du moyen de dilatation (L1) dudit second sous-circuit (2b), ledit troisième échangeur de chaleur (S6) étant conçu pour exécuter une surfusion du fluide de fonctionnement dudit cycle principal de pompe à chaleur à température moins élevée (HPCM_LT) après la condensation de celui-ci et pouvant être raccordé sélectivement au circuit externe dudit dissipateur thermique (20) de façon à exécuter, de préférence de façon indépendante dudit deuxième échangeur de chaleur (S5), un préchauffage d'un fluide caloporteur provenant dudit dissipateur thermique (20) au moyen de la puissance thermique émise pendant ladite surfusion par le fluide de fonctionnement dudit cycle principal de pompe à chaleur à température moins élevée (HPCM_LT).
  6. Unité de pompe à chaleur (1) selon la revendication 5, dans laquelle ledit troisième échangeur de chaleur (S6) peut en outre être raccordé sélectivement au circuit externe de ladite troisième installation thermique d'utilisateur (12).
  7. Unité de pompe à chaleur (1) selon l'une quelconque des revendications 2 à 6, dans laquelle ledit premier sous-circuit (2a) comprend un quatrième échangeur de chaleur (S3) raccordé en aval dudit condensateur principal (S4) et en amont dudit premier échangeur de chaleur (S2), ledit quatrième échangeur de chaleur (S3) étant conçu pour exécuter une surfusion du fluide de fonctionnement dudit cycle principal de pompe à chaleur à température plus élevée (HPCM_HT) après la condensation de celui-ci et pouvant être raccordé sélectivement au circuit externe de ladite première installation thermique d'utilisateur (10) de façon à être raccordé en série avec ledit condensateur principal (S4) dans ledit circuit externe de ladite première installation d'utilisateur (10).
  8. Unité de pompe à chaleur (1) selon l'une quelconque des revendications précédentes, comprenant des moyens de commutation (V1, V2) conçus pour permettre un échange des raccords des circuits externes d'au moins ladite première installation thermique d'utilisateur (10) et dudit dissipateur thermique (20) avec respectivement au moins ledit condensateur principal (S4) et avec ledit évaporateur principal (S8).
  9. Pompe à chaleur (1) selon l'une quelconque des revendications précédentes, dans laquelle le fluide de fonctionnement dudit cycle principal de pompe à chaleur (HPCM) ou les fluides de fonctionnement dudit cycle principal de pompe à chaleur à température plus élevée (HPCM_HT) et dudit cycle principal de pompe à chaleur à température moins élevée (HPCM_LT) respectivement, et le fluide de fonctionnement dudit cycle secondaire de pompe à chaleur (HPCS) sont choisis parmi le groupe constitué par : (E)-2-butène, (Z)-2-butène, 1-butylène, diméthylcétone, méthylacétylène, alcool méthylique, méthyl pentane, méthyl propène, n-hexane, R1270, R290, R600, R600a, R601, R601a, RE-170, tétramethylméthane ou RC-270.
  10. Pompe à chaleur (1) selon l'une quelconque des revendications précédentes, comprenant des moyens (31, 32, 33, 34) de détection et d'évacuation des fuites de gaz.
  11. Système (100) de chauffage/refroidissement d'environnements et/ou de production d'eau chaude sanitaire comprenant une unité de pompe à chaleur (1) selon l'une quelconque des revendications précédentes.
EP12815833.4A 2011-12-12 2012-12-12 Unité de pompe à chaleur à hautes performances Active EP2791588B1 (fr)

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IT001132A ITTO20111132A1 (it) 2011-12-12 2011-12-12 Unita' a pompa di calore ad alte prestazioni
PCT/IB2012/057219 WO2013088356A1 (fr) 2011-12-12 2012-12-12 Unité de pompe à chaleur à hautes performances

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DE102016213679A1 (de) 2016-07-26 2018-02-01 Efficient Energy Gmbh Wärmepumpensystem mit eingangsseitig und ausgangsseitig gekoppelten Wärmepumpenanordnungen
DE102016213680A1 (de) 2016-07-26 2018-02-01 Efficient Energy Gmbh Wärmepumpensystem mit CO2 als erstem Wärmepumpenmedium und Wasser als zweitem Wärmepumpenmedium
CH712260B1 (de) * 2016-09-12 2017-09-29 W Schmid Projekte Ag Anlage zur Bereitstellung von Wärmeenergie und elektrischem Strom.
SE543989C2 (en) * 2018-04-06 2021-10-19 Adam Fjaestad An apparatus and a method for heat supply to buildings
IL260159B (en) * 2018-06-19 2022-02-01 N A M Tech Ltd A cooling system consisting of multiple cascades
CN109813005B (zh) * 2019-01-04 2023-09-22 北京四季通能源科技有限公司 一种双级热泵系统及其控制方法
CN111692628B (zh) * 2020-05-13 2021-12-07 同济大学 一种基于供暖管网的热泵供暖系统
US20220065503A1 (en) * 2020-09-02 2022-03-03 Lance Nist Efficient air conditioning in conjunction with pool filtration
CN114752358B (zh) * 2022-04-13 2023-07-04 华中科技大学 热泵锅炉用节能环保型工质
CN116415517A (zh) * 2023-02-27 2023-07-11 中国人民解放军战略支援部队航天工程大学士官学校 一种过冷系统冷却性能评价方法及优化方法

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EP2791588A1 (fr) 2014-10-22
WO2013088356A1 (fr) 2013-06-20

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