EP2786645A1 - Method of providing an electronic device structure and related electronic device structures - Google Patents
Method of providing an electronic device structure and related electronic device structuresInfo
- Publication number
- EP2786645A1 EP2786645A1 EP12854351.9A EP12854351A EP2786645A1 EP 2786645 A1 EP2786645 A1 EP 2786645A1 EP 12854351 A EP12854351 A EP 12854351A EP 2786645 A1 EP2786645 A1 EP 2786645A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- adhesive
- substrate
- substrate surface
- ruggedization
- flexible substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
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- 239000000758 substrate Substances 0.000 claims description 640
- 239000000853 adhesive Substances 0.000 claims description 186
- 230000001070 adhesive effect Effects 0.000 claims description 186
- 230000008878 coupling Effects 0.000 claims description 62
- 238000010168 coupling process Methods 0.000 claims description 62
- 238000005859 coupling reaction Methods 0.000 claims description 62
- 239000000463 material Substances 0.000 claims description 30
- -1 polyethylene naphthalate Polymers 0.000 claims description 12
- 239000004642 Polyimide Substances 0.000 claims description 9
- 229920001721 polyimide Polymers 0.000 claims description 9
- 238000004380 ashing Methods 0.000 claims description 7
- 238000004140 cleaning Methods 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims description 6
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 claims description 6
- 239000011112 polyethylene naphthalate Substances 0.000 claims description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 6
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 5
- 238000004513 sizing Methods 0.000 claims description 5
- 230000004888 barrier function Effects 0.000 claims description 4
- 150000004767 nitrides Chemical class 0.000 claims description 4
- 229910052594 sapphire Inorganic materials 0.000 claims description 4
- 239000010980 sapphire Substances 0.000 claims description 4
- 238000004528 spin coating Methods 0.000 claims description 4
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims description 3
- 239000004713 Cyclic olefin copolymer Substances 0.000 claims description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 3
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 3
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 3
- 239000004695 Polyether sulfone Substances 0.000 claims description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 229910052910 alkali metal silicate Inorganic materials 0.000 claims description 3
- 229910052788 barium Inorganic materials 0.000 claims description 3
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 claims description 3
- 238000007765 extrusion coating Methods 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 239000004417 polycarbonate Substances 0.000 claims description 3
- 229920006393 polyether sulfone Polymers 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 claims description 3
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- 239000010703 silicon Substances 0.000 claims description 3
- 238000007764 slot die coating Methods 0.000 claims description 3
- HUAUNKAZQWMVFY-UHFFFAOYSA-M sodium;oxocalcium;hydroxide Chemical compound [OH-].[Na+].[Ca]=O HUAUNKAZQWMVFY-UHFFFAOYSA-M 0.000 claims description 3
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- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000003599 detergent Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
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- 238000007605 air drying Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
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- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005224 laser annealing Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
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- 238000010943 off-gassing Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
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- 230000008439 repair process Effects 0.000 description 1
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/08—Dimensions, e.g. volume
- B32B2309/10—Dimensions, e.g. volume linear, e.g. length, distance, width
- B32B2309/105—Thickness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
Definitions
- This invention relates generally to methods of providing electronic device structures, and relates more particularly to such methods for coupling and decoupling flexible substrates from rigid substrates and related methods and electronic device structures.
- flexible electronic devices may be used in a variety of ways that rigid electronic devices may not, manufacturing flexible electronic devices can be difficult and/or expensive.
- the difficulty and/or expense of manufacturing flexible electronic devices can be reduced by coupling flexible substrates to rigid substrates such that electronic devices can be manufactured on the flexible substrates using conventional equipment and/or techniques for rigid electronic device manufacturing. Accordingly, a need or potential for benefit exists for a method of decoupling the flexible substrates from the rigid substrates after manufacturing the electronic devices and for methods and electronic device structures related thereto.
- FIG. 1 illustrates a flow chart for an embodiment of a method of providing one or more electronic devices
- FIG. 2 illustrates an exemplary procedure of providing a carrier substrate, according to the embodiment of FIG. 1;
- FIG. 3 illustrates an exemplary process of treating the carrier substrate, according to the embodiment of FIG. 1;
- FIG. 4 illustrates a partial cross-sectional view of an exemplary electronic device structure after providing a carrier substrate, according to the embodiment of FIG. 1;
- FIG. 5 illustrates an exemplary procedure of providing an intermediate substrate, according to the embodiment of FIG. 1;
- FIG. 6 illustrates a partial cross-sectional view of the electronic device structure of FIG. 4 after applying and/or depositing a first adhesive at a first carrier substrate surface of the carrier substrate of FIG. 4, according to the embodiment of FIG. 1 ;
- FIG. 7 illustrates an exemplary procedure of interposing the intermediate substrate of FIG. 5 between the carrier substrate of FIG. 2 and a flexible substrate in order to couple the flexible substrate to the carrier substrate, according to the embodiment of FIG. 1;
- FIG. 8 illustrates an exemplary process of coupling a first intermediate substrate surface of the intermediate substrate of FIG. 5 to the carrier substrate of FIG. 2 with a first adhesive, according to the embodiment of FIG. 1;
- FIG. 9 illustrates a partial cross-sectional view of electronic device structure of FIG. 4 after coupling a first intermediate substrate surface of an intermediate substrate to the first carrier substrate surface of the carrier substrate of FIG. 4 with the first adhesive of FIG. 6, according to the embodiment of FIG. 1;
- FIG. 10 illustrates an exemplary process of coupling a second intermediate substrate surface of the intermediate substrate of FIG. 5 to the first flexible substrate with a second adhesive, according to the embodiment of FIG. 1;
- FIG. 11 illustrates a partial cross-sectional view of the electronic device structure of FIG. 4 after applying and/or depositing a second adhesive at a second intermediate substrate surface of the intermediate substrate of FIG. 9 and after coupling the first intermediate substrate surface of the intermediate substrate of FIG. 9 to the first carrier substrate surface of the carrier substrate of FIG. 4 with the first adhesive of FIG. 6, according to the embodiment of FIG. 1;
- FIG. 12 illustrates a cross-sectional view of the electronic device structure of FIG. 4 after coupling the second intermediate substrate surface of FIG. 11 of the intermediate substrate of FIG. 9 to a first flexible substrate surface of a flexible substrate with the second adhesive of FIG. 11, after applying and/or depositing the second adhesive at the second intermediate substrate surface, and after coupling the first intermediate substrate surface of the intermediate substrate of FIG. 9 to the first carrier substrate surface of the carrier substrate of FIG. 4 with the first adhesive of FIG. 6, according to the embodiment of FIG. 1;
- FIG. 13 illustrates a cross-sectional view of the electronic device structure of FIG. 4 after interposing the intermediate substrate of FIG. 9 between the carrier substrate of FIG. 4 and the flexible substrate of FIG. 12 and after forming electronic device(s) over a second flexible substrate surface of the flexible substrate, according to the embodiment of FIG. 1;
- FIG. 14 illustrates a cross-sectional view of the electronic device structure of FIG. 4 after the forming electronic device(s) of FIG. 13 over the second fiexible substrate surface of FIG. 12 and after decoupling the first intermediate substrate surface of the intermediate substrate of FIG. 9 from the carrier substrate of FIG. 4, according to the embodiment of FIG. 1;
- FIG. 15 illustrates a cross-sectional view of the electronic device structure of FIG. 4 after forming the electronic device(s) of FIG. 13 over the second flexible substrate surface of FIG. 12, after decoupling the first intermediate substrate surface of intermediate substrate of FIG. 9 from the carrier substrate of FIG. 4, and after decoupling the second intermediate substrate surface of FIG. 11 from the first flexible substrate surface of the flexible substrate of FIG. 12, according to the embodiment of FIG. 1.
- Couple should be broadly understood and refer to connecting two or more elements or signals, electrically, mechanically and/or otherwise.
- Two or more electrical elements may be electrically coupled together, but not be mechanically or otherwise coupled together; two or more mechanical elements may be mechanically coupled together, but not be electrically or otherwise coupled together; two or more electrical elements may be mechanically coupled together, but not be electrically or otherwise coupled together.
- Coupling may be for any length of time, e.g., permanent or semi-permanent or only for an instant.
- Electrode coupling and the like should be broadly understood and include coupling involving any electrical signal, whether a power signal, a data signal, and/or other types or combinations of electrical signals.
- Mechanical coupling and the like should be broadly understood and include mechanical coupling of all types.
- CTE matched material means a material that has a coefficient of thermal expansion (CTE) which differs from the CTE of a reference material by less than about 20 percent (%). In some embodiments, the CTEs differ by less than about 10%, 5%, 3%, or 1%.
- Some embodiments include a method of providing one or more electronic devices.
- the method can comprise: providing a carrier substrate; providing an intermediate substrate comprising a first intermediate substrate surface and a second intermediate substrate surface opposite the first intermediate substrate surface; providing a flexible substrate comprising a first flexible substrate surface and a second flexible substrate surface opposite the first flexible substrate surface; coupling the first intermediate substrate surface to the carrier substrate with a first adhesive; and coupling the second intermediate substrate surface to the first flexible substrate surface with a second adhesive.
- Various embodiments include a method of providing one or more electronic devices.
- the method can comprise: providing a carrier substrate; providing a flexible substrate; and interposing a ruggedization film between the carrier substrate and the flexible substrate in order to couple the flexible substrate to the carrier substrate.
- the ruggedization film can be configured to substantially relieve stress formed at the flexible substrate when the flexible substrate is decoupled from the carrier substrate.
- the electronic device structure comprises an intermediate substrate.
- the substrate comprises a first intermediate substrate surface and a second intermediate substrate surface opposite the first intermediate substrate surface. Meanwhile, the first intermediate substrate surface can be configured to be coupled to a carrier substrate by a first adhesive.
- the electronic device structure further comprises a flexible substrate.
- the flexible substrate comprises a first flexible substrate surface and a second flexible substrate surface opposite the first flexible substrate surface.
- the first flexible substrate surface can be configured to be coupled to the second intermediate substrate surface by a second adhesive
- the second flexible substrate surface can be configured such that one or more electronic devices can be formed over the second flexible substrate surface when the first intermediate substrate surface is coupled to the carrier substrate and when the first flexible substrate surface is coupled to the second intermediate substrate surface.
- FIG. 1 illustrates a flow chart for an embodiment of method 100 of providing one or more electronic devices.
- Method 100 is merely exemplary and is not limited to the embodiments presented herein. Method 100 can be employed in many different embodiments or examples not specifically depicted or described herein.
- the procedures, the processes, and/or the activities of method 100 can be performed in the order presented. In other embodiments, the procedures, the processes, and/or the activities of method 100 can be performed in any other suitable order. In still other embodiments, one or more of the procedures, the processes, and/or the activities in method 100 can be combined or skipped.
- method 100 comprises procedure 101 of providing a carrier substrate.
- the carrier substrate can be a wafer or panel. Accordingly, the carrier substrate comprises a first carrier substrate surface and a second carrier substrate surface opposite the first carrier substrate surface.
- the carrier substrate can comprise any suitable geometry (e.g., round, rectangular, square, any other suitable polygon, etc.). Likewise, the carrier substrate can comprise any suitable dimensions (e.g., diameter, thickness, length, width, etc.), as applicable.
- the carrier substrate can comprise a diameter of approximately 25 millimeters, 51 millimeters, 76 millimeters, 130 millimeters, 150 millimeters, 200 millimeters, 300 millimeters, 450 millimeters, etc.
- the carrier substrate can also comprise a thickness of greater than or equal to approximately 0.3 millimeters and less than or equal to approximately 1.5 millimeters.
- the carrier substrate can comprise a width and length of 370 millimeters by 470 millimeters, 550 millimeters by 650 millimeters, 1500 millimeters by 1800 millimeters, 2160 millimeters by 2400 millimeters, 2880 millimeters by 3130 millimeters, etc.
- the carrier substrate is square, the carrier substrate can comprise a width and length of 150 millimeters by 150 millimeters, 200 millimeters by 200 millimeters, 300 millimeters by 300 millimeters, etc.
- the carrier substrate can comprise a thickness of less than or equal to approximately 0.3 millimeters and less than or equal to approximately 2.0 millimeters.
- FIG. 2 illustrates an exemplary procedure 101 of providing the carrier substrate, according to the embodiment of FIG. 1.
- procedure 101 can comprise process 201 of providing the carrier substrate having a carrier substrate material that is CTE matched to the flexible substrate, described below with respect to procedure 103 (FIG. 1) of method 100 (FIG. 1).
- the carrier substrate material can comprise alumina, silicon, steel, sapphire, barium borosilicate, soda lime silicate, alkali silicate, or any other suitably CTE matched material.
- the carrier substrate could comprise sapphire with a thickness between approximately 0.7 mm and approximately 1.1 mm.
- the carrier substrate could also comprise 96% alumina with a thickness between approximately 0.7 mm and approximately 1.1 mm. In a different embodiment, the thickness of the 96% alumina is approximately 2.0 mm.
- the carrier substrate could be a single crystal silicon wafer with a thickness of at least approximately 0.65 mm.
- the carrier substrate could comprise stainless steel with a thickness of at least approximately 0.5 mm.
- the carrier substrate can comprise any other suitable thickness.
- procedure 101 can also comprise process 202 of treating the carrier substrate.
- process 202 can be performed before performing procedure 106.
- FIG. 3 illustrates an exemplary process 202 of treating the carrier substrate, according to the embodiment of FIG. 1.
- performing procedure 101 can also comprise a process of providing the carrier substrate where the carrier substrate comprises the first adhesive, such as, for example, at the first carrier substrate surface.
- process 202 can be omitted (although the carrier substrate could still have been treated before the adhesive was applied thereto).
- process 202 can comprise activity 301 of cleaning the carrier substrate.
- Performing activity 301 can comprise cleaning the carrier substrate in a sonic bath (e.g., a megasonic bath, an ultrasonic bath, etc.).
- performing activity 301 can also comprise cleaning the carrier substrate with a surfactant solution.
- the surfactant can be a solution comprised of five percent by volume of a surfactant from Alconox of White Plains, New York, sold under the brand "Detergent 8®.”
- the surfactant could also be any other suitable surfactant, such as, for example, a surfactant having properties similar to the Detergent 8® brand.
- the semiconductor device can be rinsed with deionized water and dried.
- the rinsing can be performed in a quick dump rinser.
- the drying can be performed in a spin rinse dryer, such as, for example, where the carrier substrate is round.
- the drying can be performed by isopropyl alcohol vapor drying and/or air drying the carrier substrate.
- process 202 can also comprise activity 302 of etching the carrier substrate, such as, for example, by ashing the carrier substrate with an oxygen (0 2 ) plasma.
- activity 302 can comprise etching the carrier substrate by ashing the carrier substrate in a Tegal 965 asher, manufactured by Tegal Corporation of Petaluma, California, or another suitable device for ashing the carrier substrate.
- the device for ashing the carrier substrate can be operated at a power level of approximately 250 Watts (or approximately 200-300 Watts).
- activity 302 can be performed at a pressure of approximately 0.16 kilopascals (or approximately 0.1-0.2 kilopascals) and/or for a time of approximately 30 minutes (or approximately 15-45 minutes).
- FIG. 4 illustrates a partial cross-sectional view of an exemplary electronic device structure 400 after providing carrier substrate 401, according to the embodiment of FIG. 1.
- carrier substrate 401 can be similar or identical to the carrier substrate described above with respect to procedure 101 of method 100 (FIG. 1).
- Electronic device structure 400 can comprise carrier substrate 400.
- method 100 can comprise procedure 102 of providing an intermediate substrate.
- the intermediate substrate comprises a first intermediate substrate surface and a second intermediate substrate surface opposite the first intermediate substrate surface.
- the first intermediate substrate surface can be configured to be coupled to the carrier substrate by a first adhesive.
- the intermediate substrate can be referred to as a ruggedization film.
- FIG. 5 illustrates an exemplary procedure 102 of providing the intermediate substrate, according to the embodiment of FIG. 1.
- procedure 102 can comprise process 501 of providing the intermediate substrate having an intermediate substrate material.
- the intermediate substrate material can comprise polyethylene naphthalate, polyethylene terephthalate, polyethersulfone, polyimide, polycarbonate, cyclic olefin copolymer, liquid crystal polymer, any other suitable polymeric material, aluminum foil, mylar, etc.
- the intermediate substrate material can comprise tape (e.g., double-sided tape) such as where the intermediate substrate material comprises the first adhesive and/or the second adhesive, as described below.
- Procedure 102 can also comprise process 502 of baking the intermediate substrate, such as, for example, with a Yamato oven, manufactured by Yamato Scientific America, Inc. of Santa Clara, California, or another suitable device for baking the intermediate substrate without damaging the intermediate substrate.
- Process 502 can be performed at a preliminary baking condition.
- the preliminary baking condition can comprise a preliminary baking temperature, a preliminary baking pressure, and/or a preliminary baking time.
- the preliminary baking temperature can be approximately 200°C.
- the preliminary baking pressure can be approximately 0.004 kilopascals (or approximately 0-0.010 kilopascals).
- the preliminary baking time can be approximately 1 hour.
- performing process 502 can comprise an activity of exposing the first intermediate substrate surface and the second intermediate substrate surface to an ionic blower for greater than or equal to approximately 10 seconds prior to baking the intermediate substrate. In some embodiments, process 502 can be omitted.
- Procedure 102 can further comprise process 503 of cutting the intermediate substrate.
- performing process 503 can comprise sizing the intermediate substrate based on the carrier substrate and/or the flexible substrate.
- performing process 503 can comprise cutting (e.g., sizing) the intermediate substrate such that the perimeter of the intermediate substrate is offset (e.g., smaller in at least one lateral dimension) from the perimeter of the carrier substrate by greater than or equal to approximately 1.5 millimeters, or 2 millimeters, etc.
- performing process 503 can also comprise cutting (e.g., sizing) the intermediate substrate such that the perimeter of the intermediate substrate is offset (e.g., larger in at least one lateral dimension) than the perimeter of the flexible substrate.
- Performing process 503 in this manner can aid in performing procedure 112 (FIG. 1) and/or procedure 113 (FIG. 1) later in method 100 (FIG. 1) by distributing stress formed by performing procedure 112 and/or procedure 113.
- process 503 can be omitted, such as where intermediate substrate 503 is pre-sized.
- procedure 102 can also comprise a process of providing the intermediate substrate where the first intermediate substrate surface comprises a first adhesive (e.g., where the intermediate substrate comprises tape).
- process 502 and/or process 503 can be omitted. In further embodiments, this process can be omitted.
- procedure 102 can also comprise a process of providing the intermediate substrate where the second intermediate substrate surface comprises a second adhesive (e.g., where the intermediate substrate comprises tape, such as, for example, double-sided tape).
- process 502 and/or process 503 can also be omitted.
- this process can be omitted like the process of providing the intermediate substrate where the first intermediate substrate surface comprises the first adhesive, as described with respect to procedure 101 (FIG. 1).
- method 100 can comprise procedure 103 of providing a flexible substrate.
- flexible substrate as used herein means a free-standing substrate comprising a flexible material which readily adapts its shape.
- the flexible substrate can comprise a low elastic modulus.
- a low elastic modulus can be considered an elastic modulus of less than approximately five gigapascals.
- the flexible substrate comprises a first flexible substrate surface and a second flexible substrate surface opposite the first flexible substrate surface.
- the first flexible substrate surface can be configured to be coupled to the second intermediate substrate surface by a second adhesive.
- the second flexible substrate surface can be configured such that electronic device(s) are able to be formed over the second flexible substrate surface, such as, for example, when the first intermediate substrate surface is coupled to the carrier substrate and when the first flexible substrate surface is coupled to the second intermediate substrate surface.
- performing procedure 103 can comprise a process of providing the flexible substrate where the flexible substrate comprises a flexible substrate material lacking sufficient mechanical strength to prevent the flexible substrate from being damaged if the flexible substrate were to be coupled to and decoupled from the carrier substrate directly.
- performing procedure 103 can comprise a process of providing the flexible substrate where the first flexible substrate surface comprises the second adhesive. In other embodiments, this process can likewise be omitted.
- procedure 103 can comprise a process of treating the flexible substrate.
- the process can be similar or identical to performing process 202 (FIG. 2) for the carrier substrate.
- this process and process 202 (FIG. 2) can be performed approximately simultaneously with each other, and/or this process can be performed as part of process 202.
- method 100 can comprise procedure 104 of providing the first adhesive.
- performing procedure 104 can comprise applying and/or depositing the first adhesive at the first carrier substrate surface and/or the first intermediate substrate surface.
- procedure 104 can be performed where the first carrier substrate surface and/or the first intermediate substrate surface do not comprise the first adhesive.
- Performing procedure 104 can comprise applying and/or depositing the first adhesive at the first carrier substrate surface and/or the first intermediate substrate surface according to any suitable technique for applying and/or depositing the first adhesive (e.g., spin-coating, spray-coating, extrusion- coating, preform laminating, slot die coating, screen laminating, screen printing, etc.).
- performing process 104 can comprise applying and/or depositing the first adhesive at the first carrier substrate surface and/or the first intermediate substrate surface by spin coating the first adhesive at the first carrier substrate surface and/or the first intermediate substrate surface at a rotational speed of approximately 1000 rotations per minute for approximately 25 seconds and/or at a rotational speed of approximately 3500 rotations per minute for approximately 20 seconds.
- procedure 104 can be omitted, such as where the first carrier substrate surface and/or the first intermediate substrate surface already comprise the first adhesive.
- FIG. 6 illustrates a partial cross-sectional view of electronic device structure 400 (FIG. 4) after applying and/or depositing first adhesive 602 at first carrier substrate surface 603 of carrier substrate 401 (FIG.
- First adhesive 602 can be similar or identical to the first adhesive described above with respect to procedure 104 (FIG. 1) of method 100 (FIG. 1).
- first carrier substrate surface 603 can be similar or identical to the first carrier substrate surface described above with respect to procedure 101 (FIG. 1) of method 100 (FIG. 1).
- Electronic device structure 400 (FIG. 4) can comprise first adhesive 602, and carrier substrate 401 (FIG. 4) can comprise first carrier substrate surface 603.
- method 100 can comprise procedure 105 of providing the second adhesive.
- performing procedure 105 can comprise applying and/or depositing the second adhesive at the second intermediate substrate surface and/or the first flexible substrate surface in a similar manner to that of performing procedure 104 for the first adhesive.
- procedure 104 and/or procedure 105 can be performed as part of procedure 106.
- procedure 104 can be performed prior to performing process 701 and process 702, and procedure 105 can be performed after process 701 but prior to process 702.
- procedure 104 can be performed prior to process 701 and after process 702 while procedure 105 can be performed prior to both process 701 and process 702.
- procedure 104 and procedure 105 can be performed prior to performing procedure 106, such as where process 701 and process 702 are performed approximately simultaneously with each other.
- the first adhesive and the second adhesive can comprise the same adhesive material, and in other embodiments, the first adhesive and the second adhesive can comprise different adhesive materials.
- the first adhesive and/or the second adhesive can comprise any suitable adhesive material (e.g., Henkel NS122 adhesive manufactured by Henkel AG & Company, KGaA of Dusseldorf, Germany; EccoCoat 3613 adhesive manufactured by Henkel AG & Company, KGaA of Dusseldorf, Germany; etc.).
- the adhesive material can comprise a thermally cured adhesive, a pressure sensitive adhesive, an ultraviolet cured adhesive, etc.
- the first adhesive can be selected according to the material properties of the carrier substrate and the intermediate substrate.
- the second adhesive can be selected according to the material properties of the intermediate substrate and the flexible substrate.
- the first adhesive and/or second adhesive can comprise the Henkel NS122 adhesive when the intermediate substrate comprises polyethylene naphthalate or polyethylene terephthalate.
- the first adhesive and/or the second adhesive can comprise the EccoCoat 3613 adhesive.
- method 100 can comprise procedure 106 of interposing an intermediate substrate between the carrier substrate and the flexible substrate in order to couple the flexible substrate to the carrier substrate.
- performing procedure 106 and/or process 702 can comprise coupling the intermediate substrate to the flexible substrate in order to reinforce the flexible substrate.
- FIG. 7 illustrates an exemplary procedure 106 of interposing the intermediate substrate between the carrier substrate and the flexible substrate in order to couple the flexible substrate to the carrier substrate, according to the embodiment of FIG. 1.
- procedure 106 can comprise process 701 of coupling the first intermediate substrate surface to the carrier substrate (e.g., the first carrier substrate surface) with a first adhesive.
- FIG. 8 illustrates an exemplary process 701.
- process 701 can comprise activity 801 of providing a protective layer at one of the first intermediate substrate surface or the second intermediate substrate surface.
- the protective layer can comprise tape (e.g., Blue Low Tack Squares, product number 18133-7.50, manufactured by Semiconductor Equipment Corporation of Moorpark, California).
- performing activity 801 can comprise sizing the protective layer to correspond to the lateral surface area of the first intermediate substrate surface or the second intermediate substrate surface, as applicable.
- Performing activity 801 can prevent damage to and/or contamination of the first intermediate substrate surface or the second intermediate substrate surface, as applicable, when performing activity 802. Accordingly, where process 701 is performed prior to process 702, performing activity 801 can comprise providing the protective layer at the second intermediate substrate surface. Alternatively, when process 701 is performed after process 702, performing activity 801 can comprise providing the protective layer at the first intermediate substrate surface. In some embodiments, activity 801 can be omitted.
- process 701 can continue with activity 802 of bonding the first intermediate substrate surface to the carrier substrate with the first adhesive using any suitable lamination device (e.g., a roll press, a bladder press, etc.).
- bonding the first intermediate substrate surface to the carrier substrate can occur at a first condition.
- the first condition can comprise a first pressure, a first temperature, and/or a first feed rate.
- the first pressure can be greater than or equal to approximately 0 kilopascals (i.e., in a vacuum) and less than or equal to approximately 69 kilopascals (e.g., where the intermediate substrate comprises polyimide) or less than or equal to approximately 150 kilopascals in other embodiments.
- the first feed rate can be greater than or equal to approximately 0.25 meters per minute and less than or equal to approximately 0.5 meters per minute (or approximately 0.10-1.0 meters per minute).
- the first temperature can be greater than or equal to approximately 20°C and less than or equal to approximately 100°C, 160°C, 220°C, 350°C, etc.
- the first temperature can be less than or equal to approximately 220°C (e.g., approximately 100°C) where the intermediate substrate comprises polyethylene naphthalate and can be less than or equal to approximately 160°C (e.g., approximately 100°C) where the intermediate substrate comprises polyethylene terephthalate.
- the first temperature can be less than or equal to approximately 350°C (e.g., approximately 100°C) where the intermediate substrate comprises polyimide.
- the first pressure and/or the first temperature can depend on the material properties and/or limitations of the intermediate substrate.
- process 701 can also comprise activity 803 of removing the protective layer from one of the first intermediate substrate surface or the second intermediate substrate surface.
- activity 803 can be omitted, such as, for example, where activity 801 is omitted.
- FIG. 9 illustrates a partial cross-sectional view of electronic device structure 400 (FIG. 4) after coupling first intermediate substrate surface 904 of intermediate substrate 905 to first carrier substrate surface 603 (FIG. 6) of carrier substrate 401 with first adhesive 602 (FIG. 6), according to the embodiment of FIG. 1.
- First intermediate substrate surface 904 and intermediate substrate 905 can be similar or identical to the first intermediate substrate surface and the intermediate substrate described above, respectively, with respect to procedure 102 (FIG. 1) of method 100 (FIG. 1).
- Electronic device structure 400 (FIG. 4) can comprise intermediate substrate 905, which can comprise first intermediate substrate surface 904.
- procedure 106 can also comprise process 702 of coupling the second intermediate substrate surface to the first flexible substrate surface with a second adhesive.
- FIG. 10 illustrates an exemplary process 702.
- process 702 can comprise activity 1001 of providing a protective layer at the second flexible substrate surface.
- the protective layer can be similar or identical to the protective layer described above with respect to activity 801 (FIG. 8).
- Process 702 can continue with activity 1002 of bonding the second intermediate substrate surface to the first flexible substrate surface with the second adhesive using any suitable lamination device (e.g., a roll press, a bladder press, etc.).
- bonding the second intermediate substrate surface to the first flexible substrate surface occurs at a second condition.
- the second condition can be similar or identical to the first condition described above with respect to activity 802 (FIG. 8). Accordingly, in some embodiments, the first condition and the second condition can be the same while in other embodiments, the first condition and second condition can be different.
- the second condition can comprise a second pressure, which can be greater than or equal to approximately 0 kilopascals (i.e., in a vacuum) and less than or equal to approximately 128 kilopascals (or less than or equal to approximately 150 kilopascals).
- the second pressure can be less than or equal to approximately 69 kilopascals
- the intermediate substrate comprises polyethylene naphthalate or polyethylene terephthalate
- the second pressure can be less than or equal to approximately 128 kilopascals).
- Process 702 can further comprise activity 1003 of etching the carrier substrate, the intermediate substrate, the flexible substrate, the first adhesive, and the second adhesive after coupling the first intermediate substrate surface to the carrier substrate and after coupling the second intermediate substrate surface to the first flexible substrate surface.
- performing activity 1003 can comprise ashing the carrier substrate, the intermediate substrate, the flexible substrate, the first adhesive, and the second adhesive with a Tegal 901 asher, manufactured by Tegal Corporation of Petaluma, California, or another suitable device for ashing the carrier substrate, the intermediate substrate, the flexible substrate, the first adhesive, and the second adhesive.
- Activity 1003 can be performed for greater than or equal to approximately 900 seconds. In many embodiments, performing activity 1003 can remove excess of the first adhesive and/or the second adhesive.
- activity 1003 can be performed as part of process 701 (FIG. 7) instead of process 702 (FIG. 7).
- activity 1003 can be performed as part of process 701 (FIG. 7) where process 701 is performed after process 702 (FIG. 7).
- activity 1003 can be performed after activity 1001 and activity 1002 and can be performed before activity 1004.
- activity 1003 can be performed after procedure 107 (FIG. 1).
- activity 1003 can be omitted, such as where the intermediate substrate comprises polyimide.
- process 702 can also comprise activity 1004 of removing the protective layer at the second flexible substrate. In some embodiments, where process 701 is performed after process 702, activity 1004 can be performed after process 701 is performed.
- FIG. 11 illustrates a partial cross-sectional view of electronic device structure 400 (FIG. 4) after applying and/or depositing second adhesive 1106 at second intermediate substrate surface 1107 of intermediate substrate 905 (FIG. 9) and after coupling first intermediate substrate surface 904 (FIG. 9) of intermediate substrate 905 to first carrier substrate surface 603 (FIG. 6) of carrier substrate 401 with first adhesive 602 (FIG. 6), according to the embodiment of FIG. 1.
- Electronic device structure 400 (FIG. 4) can comprise second adhesive 1106, and intermediate substrate 905 (FIG. 9) can comprise second intermediate substrate surface 1 107.
- FIG. 12 illustrates a cross-sectional view of electronic device structure 400 (FIG. 4) after coupling second intermediate substrate surface 1107 (FIG. 11) to first flexible substrate surface 1208 of flexible substrate 1209 with second adhesive 1106 (FIG. 11), after applying and/or depositing second adhesive 1106 at second intermediate substrate surface 1107 of intermediate substrate 905 (FIG. 9), and after coupling first intermediate substrate surface 904 (FIG. 9) of intermediate substrate 905 to first carrier substrate surface 603 (FIG. 6) of carrier substrate 401 with first adhesive 602 (FIG. 6), according to the embodiment of FIG. 1.
- First flexible substrate surface 1208 and flexible substrate 1209 can be similar or identical to the first flexible substrate surface and the flexible substrate described above, respectively, with respect to procedure 103 (FIG. 1) of method 100 (FIG. 1).
- Electronic device structure 400 (FIG. 4) can comprise flexible substrate 1209, which can comprise first flexible substrate surface 1208.
- FIGs. 6, 9, 11, and 12 illustrate performing method 100 in such a manner that process 701 (FIG. 7) is performed prior to process 702 (FIG. 7), in some embodiments, process 702 (FIG. 7) can be performed after performing process 701 (FIG. 7) instead. Meanwhile, in other embodiments, process 701 (FIG. 7) and process 702 (FIG. 7) can be performed approximately simultaneously.
- method 100 can comprise procedure 107 of curing the first adhesive and the second adhesive after coupling the first intermediate substrate surface to the carrier substrate and after coupling the second intermediate substrate surface to the first flexible substrate surface.
- procedure 107 can comprise curing the first adhesive and the second adhesive according to any technique and/or combination of techniques suitable for curing the first adhesive and/or the second adhesive (e.g., ultraviolet curing, heat curing, pressure curing, etc.) without damaging the carrier substrate, the intermediate substrate, or the flexible substrate.
- performing procedure 107 can comprise ultraviolet curing the first adhesive and/or the second adhesive using an ultraviolet cure system, such as, for example, a Dymax ultraviolet cure system manufactured by Dymax Corporation of Torrington, Connecticut. In these embodiments, procedure 107 can be performed for greater than or equal to approximately 20 seconds (or approximately 10-30 seconds).
- performing procedure 107 can comprise heat curing the first adhesive and/or the second adhesive in an oven, such as, for example, a Yamato Oven manufactured by Yamato Scientific America, Inc. of Santa Clara, California. In these embodiments, procedure 107 can be performed at a temperature of approximately 150°C (or approximately 200°C) for greater than or equal to approximately 30 minutes (or approximately 20-40 minutes).
- Method 100 can comprise procedure 108 of cleaning the carrier substrate, the intermediate substrate, the flexible substrate, the first adhesive, and the second adhesive.
- Procedure 108 can be similar to activity 301 (FIG. 3). In many embodiments, procedure 108 can be performed after procedure 106 and/or procedure 107. In other embodiments, procedure 108 can be omitted, such as where the intermediate substrate comprises polyimide.
- Method 100 can comprise procedure 109 of baking the carrier substrate, the intermediate substrate, the flexible substrate, the first adhesive, and the second adhesive.
- Procedure 109 can be similar to process 502 (FIG. 5). In many embodiments, procedure 109 can be performed after procedure 108.
- Method 100 can also comprise procedure 110 of cleaning the carrier substrate, the intermediate substrate, the flexible substrate, the first adhesive, and the second adhesive.
- Procedure 1 10 can be similar to activity 301 (FIG. 3).
- procedure 110 can be performed after procedure 109.
- Method 100 can additionally comprise procedure 111 of drying the carrier substrate, the intermediate substrate, the flexible substrate, the first adhesive, and the second adhesive.
- procedure 111 can comprise drying the carrier substrate, the intermediate substrate, the flexible substrate, the first adhesive, and the second adhesive in an oven, such as, for example, with a Yamato Oven, manufactured by Yamato Scientific America, Inc. of Santa Clara, California, or another suitable device for baking the intermediate substrate.
- Process 502 can be performed at a dry baking condition.
- the dry baking condition can comprise a dry baking temperature (e.g., approximately 80-120°C, for example, approximately 100°C) and/or a dry baking time (e.g., greater than or equal to approximately 1 hours and less than or equal to approximately 4 hours, for example, approximately 3 hours).
- procedure 111 can be performed after procedure 110.
- Procedure 1 11 can also comprise cooling and/or permitting to cool the carrier substrate, the intermediate substrate, the flexible substrate, the first adhesive, and the second adhesive for greater than or equal to approximately 30 minutes.
- Performing procedure 111 can remove moisture from and/or outgas the carrier substrate, the intermediate substrate, the flexible substrate, the first adhesive, and the second adhesive.
- the length of the dry baking time can depend on the materials used for the carrier substrate, the intermediate substrate, the flexible substrate, the first adhesive, and/or the second adhesive as well as the out-gassing rate and/or out-diffusion rate of the carrier substrate, the intermediate substrate, the flexible substrate, the first adhesive, and the second adhesive.
- Method 100 can further comprise procedure 112 of depositing a nitride barrier layer over the second flexible substrate surface.
- Procedure 112 can comprise depositing the nitride barrier to a nitride barrier thickness of approximately 0.3 micrometers (or approximately 0.2-0.5 micrometers). In many embodiments, procedure 112 can be performed after procedure 111.
- Method 100 can also comprise procedure 113 of inspecting the carrier substrate, the intermediate substrate, the flexible substrate, the first adhesive, and the second adhesive, such as, for example, to determine if any of the carrier substrate, the intermediate substrate, and/or the flexible substrate are damaged.
- procedure 1 13 can be omitted.
- Procedure 113 can be performed after procedure 112.
- Method 100 can comprise procedure 114 of forming one or more electronic devices over the second flexible substrate surface.
- the electronic device(s) can comprise one or more electronic sensors, one or more electronic displays, one or more electronic transistors (e.g., thin film transistors), one or more electronic diodes, one or more micro-electromechanical systems, or any other suitable electronic device(s).
- procedure 114 can be performed after performing procedures 101 through 113.
- FIG. 13 illustrates a cross-sectional view of electronic device structure 400 (FIG. 4) after interposing intermediate substrate 905 (FIG. 9) between carrier substrate 401 (FIG. 4) and flexible substrate 1209 and after forming electronic device(s) 1310 over second flexible substrate surface 1311, according to the embodiment of FIG. 1.
- Electronic device structure 400 can comprise electronic device(s) 1310
- flexible substrate 1209 can comprise second flexible substrate surface 1311.
- method 100 can further comprise procedure 115 of decoupling the first intermediate substrate surface from the carrier substrate (e.g., the first carrier substrate surface).
- the intermediate substrate can be configured to substantially relieve stress formed at the flexible substrate when the flexible substrate is decoupled from the carrier substrate.
- performing procedure 115 can comprise substantially relieving stress formed at the flexible substrate with the intermediate layer while the flexible substrate is being decoupled from the carrier substrate.
- substantially relieving stress formed at the flexible substrate can refer to relieving sufficient stress to prevent damage to the flexible substrate and/or the electronic device(s) when performing procedure 115.
- method 100 can permit one or more electronic devices (e.g., the electronic device(s) described above with respect to procedure 114) to be manufactured on flexible substrates (e.g., the flexible substrate described above with respect to procedure 103) coupled to one or more respective rigid carrier substrates (e.g., the carrier substrate described above with respect to procedure 101) in order to permit using electronic device manufacturing equipment and/or techniques configured for use with rigid substrates while avoiding damage to the flexible substrate(s) by interposing one or more respective intermediate substrates between the rigid carrier substrate(s) and the flexible substrate(s) to absorb stress when decoupling the flexible substrate(s) from the carrier substrate(s).
- electronic devices e.g., the electronic device(s) described above with respect to procedure 11
- flexible substrates e.g., the flexible substrate described above with respect to procedure 103
- respective rigid carrier substrates e.g., the carrier substrate described above with respect to procedure 101
- procedure 115 can comprise mechanically decoupling the first intermediate substrate surface from the carrier substrate.
- procedure 115 can comprise inserting a tool (e.g., a bladed edge) at the first intermediate substrate surface (e.g., between the first adhesive and the first intermediate substrate surface) and pushing the tool along the first intermediate substrate surface at an angle greater than or equal to approximately 0 degrees and less than or equal to approximately 45 degrees with respect to the first intermediate substrate surface in order to release the first intermediate substrate surface from the carrier substrate.
- a tool e.g., a bladed edge
- procedure 115 can comprise decoupling the first intermediate substrate surface from the carrier substrate according to any other suitable technique (e.g., chemical, laser, ultraviolet, thermal, etc.) for decoupling the first intermediate substrate surface from the carrier substrate.
- procedure 115 can be performed in such a manner that the first adhesive remains with the carrier substrate.
- the first intermediate substrate surface can be etched in a manner similar to activity 302 (FIG. 3) to remove any residuals of the first adhesive at the first intermediate substrate surface.
- FIG. 14 illustrates a cross-sectional view of electronic device structure 400 (FIG. 4) after forming electronic device(s) 1310 (FIG. 13) over second flexible substrate surface 1208 (FIG. 12) and after decoupling first intermediate substrate surface 904 (FIG. 9) of intermediate substrate 905 (FIG. 9) from carrier substrate 401 (FIG. 4), according to the embodiment of FIG. 1.
- method 100 can also comprise procedure 116 of decoupling the second intermediate substrate surface from the first flexible substrate surface.
- the intermediate substrate can be configured to be decoupled from the carrier substrate and the flexible substrate without damaging the electronic device(s). Meanwhile, in some embodiments, procedure 116 can be omitted, and the intermediate substrate can remain coupled to the flexible substrate by the second adhesive in order to reinforce the flexible substrate.
- procedure 116 can comprise mechanically decoupling the second intermediate substrate surface from the first flexible substrate surface.
- mechanically decoupling the second intermediate substrate surface from the first flexible substrate surface can comprise manually pulling the intermediate substrate away from the flexible substrate with a continuous force and at a low angle (e.g., approximately 5-45 degrees) with respect to the flexible substrate in order to release the second intermediate substrate surface form the first flexible substrate surface.
- procedure 116 can comprise providing a protective layer over the second flexible substrate surface to protect any electronic device(s) formed thereon while performing procedure 116.
- procedure 116 can also comprise decoupling the second intermediate substrate surface from the first flexible substrate surface according to any other suitable technique (e.g., chemical, laser, ultraviolet, thermal, etc.) for decoupling the first intermediate substrate surface from the carrier substrate. Accordingly, procedure 116 can be similar or identical to procedure 115.
- any other suitable technique e.g., chemical, laser, ultraviolet, thermal, etc.
- FIG. 15 illustrates a cross-sectional view of electronic device structure 400 (FIG. 4) after forming electronic device(s) 1310 (FIG. 13) over second flexible substrate surface 1208 (FIG. 12), after decoupling first intermediate substrate surface 904 (FIG. 9) of intermediate substrate 905 (FIG. 9) from carrier substrate 401 (FIG. 4), and after decoupling second intermediate substrate surface 1107 (FIG. 11) from first flexible substrate surface 1208 (FIG. 12) of flexible substrate 1209 (FIG. 12), according to the embodiment of FIG. 1.
- procedure 116 can further comprise etching the flexible substrate in a manner similar to activity 302 (FIG. 3) to remove any residuals of the second adhesive at the first flexible substrate surface. Accordingly, etching the flexible substrate can be performed after decoupling the second intermediate substrate surface from the first flexible substrate surface.
- procedure 102 through procedure 116 can be performed for both sides of the carrier substrate of procedure 101 of method 100. In these embodiments, one or more of procedure 102 through procedure 116 can be performed approximately simultaneously for both sides of the carrier substrate. Meanwhile, in these or other embodiments, one or more of procedure 102 through procedure 116 can be repeated and performed separately for each side of the carrier substrate.
- FIGs. 1-15 may be modified, and that the foregoing discussion of certain of these embodiments does not necessarily represent a complete description of all possible embodiments.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Electroluminescent Light Sources (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Thin Film Transistor (AREA)
Abstract
Description
Claims
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US201161564535P | 2011-11-29 | 2011-11-29 | |
PCT/US2012/066833 WO2013082138A1 (en) | 2011-11-29 | 2012-11-28 | Method of providing an electronic device structure and related electronic device structures |
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US9991311B2 (en) | 2008-12-02 | 2018-06-05 | Arizona Board Of Regents On Behalf Of Arizona State University | Dual active layer semiconductor device and method of manufacturing the same |
JP5832780B2 (en) | 2011-05-24 | 2015-12-16 | 株式会社半導体エネルギー研究所 | Manufacturing method of semiconductor device |
WO2017034644A2 (en) | 2015-06-09 | 2017-03-02 | ARIZONA BOARD OF REGENTS a body corporate for THE STATE OF ARIZONA for and on behalf of ARIZONA STATE UNIVERSITY | Method of providing an electronic device and electronic device thereof |
WO2015156891A2 (en) | 2014-01-23 | 2015-10-15 | Arizona Board Of Regents, Acting For And On Behalf Of Arizona State University | Method of providing a flexible semiconductor device and flexible semiconductor device thereof |
US10381224B2 (en) | 2014-01-23 | 2019-08-13 | Arizona Board Of Regents On Behalf Of Arizona State University | Method of providing an electronic device and electronic device thereof |
JP2017506204A (en) * | 2014-01-27 | 2017-03-02 | コーニング インコーポレイテッド | Articles and methods for controlled bonding of polymeric surfaces to carriers |
KR102466741B1 (en) | 2014-05-13 | 2022-11-15 | 아리조나 보드 오브 리젠츠 온 비하프 오브 아리조나 스테이트 유니버시티 | Method of providing an electronic device |
US10446582B2 (en) | 2014-12-22 | 2019-10-15 | Arizona Board Of Regents On Behalf Of Arizona State University | Method of providing an imaging system and imaging system thereof |
US9741742B2 (en) | 2014-12-22 | 2017-08-22 | Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University | Deformable electronic device and methods of providing and using deformable electronic device |
CN106527796B (en) * | 2016-10-31 | 2019-06-07 | 京东方科技集团股份有限公司 | A kind of panel making method, touch panel and display equipment |
CN110065267B (en) | 2019-04-26 | 2021-03-26 | 京东方科技集团股份有限公司 | Deformable material, deformation structure, Micro-LED display device and strain sensor |
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US4087300A (en) * | 1974-01-07 | 1978-05-02 | Edward Adler | Process for producing metal-plastic laminate |
JP3081122B2 (en) * | 1994-07-18 | 2000-08-28 | シャープ株式会社 | Jig for transporting substrate and method of manufacturing liquid crystal display element using the same |
US5837380A (en) * | 1995-12-26 | 1998-11-17 | Lucent Technologies, Inc. | Multilayer structures and process for fabricating the same |
US7223672B2 (en) * | 2002-04-24 | 2007-05-29 | E Ink Corporation | Processes for forming backplanes for electro-optic displays |
JP2004311912A (en) * | 2002-12-06 | 2004-11-04 | Sony Corp | Circuit board module and its manufacturing method |
US20090200543A1 (en) * | 2008-02-08 | 2009-08-13 | Roger Stanley Kerr | Method of forming an electronic device on a substrate supported by a carrier and resultant device |
JP4888736B2 (en) * | 2008-08-29 | 2012-02-29 | Tdk株式会社 | Wiring board manufacturing method |
JP5583140B2 (en) * | 2008-12-02 | 2014-09-03 | アリゾナ・ボード・オブ・リージェンツ,フォー・アンド・オン・ビハーフ・オブ・アリゾナ・ステート・ユニバーシティ | Method for preparing flexible substrate assembly and flexible substrate assembly prepared by the method |
US9409383B2 (en) * | 2008-12-22 | 2016-08-09 | Apple Inc. | Layer-specific energy distribution delamination |
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SG11201402622YA (en) | 2014-06-27 |
JP2014533893A (en) | 2014-12-15 |
WO2013082138A1 (en) | 2013-06-06 |
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