TW201345726A - Method of providing an electronic device structure and related electronic device structures - Google Patents

Abstract

Some embodiments include a method of providing an electronic device structure. Other embodiments for related methods and electronic device structures are also disclosed.

Description

Method for providing electronic device structure and related electronic device structure [research or development]

This invention was made with government support W911NF-04-2-0005 awarded by the Army Research Office. The government has certain rights in the invention.

[Cross-reference to related applications]

This application claims the benefit of U.S. Provisional Application No. 61/564,535, filed on Nov. 29, 2011.

In addition, this application is a continuation-in-part of U.S. Provisional Application No. 13/118,225, filed on May 27, 2011. Continuation of PCT Application No. PCT/US2009/066259, filed on December 1, 2009, is hereby incorporated by reference. PCT Application No. PCT/US2009/066259 requires (a) U.S. Provisional Application No. 61/230,051, filed on Jul. 30, 2009, and U.S. Provisional Application No. 61/182,464, filed on May 29, 2009, and (c) US Provisional Application No. 61/119,217, filed on December 2, 2008.

U.S. Provisional Patent Application No. 61/564,535, U.S. Provisional Patent Application No. 13/118,225, PCT Application No. PCT/US2009/066259, U.S. Provisional Patent Application No. 61/230,051, U.S. Provisional Patent Application No. 61/182,464, and U.S. Provisional Patent Application 61/119,217 is hereby incorporated by reference in its entirety.

The present invention generally relates to methods of providing electronic device structures, and more particularly to such methods and related methods and electronic device structures for connecting and disconnecting flexible substrates from rigid substrates.

While flexible electronic devices can be used in a variety of ways and rigid electronic devices cannot, manufacturing flexible electronic devices can be very difficult and/or expensive. However, the difficulty and/or expense of fabricating a flexible electronic device can be reduced by attaching a flexible substrate to a rigid substrate, thereby It is made possible to manufacture electronic devices on the flexible substrate using conventional equipment and/or techniques for rigid electronic device fabrication. Accordingly, there is a need or possibility for a method of detaching the flexible substrate from the rigid substrate after fabrication of the electronic device, and methods and electronic device structures associated therewith.

The invention mainly discloses a method for providing an electronic device structure, comprising: providing a carrier substrate; providing an intermediate substrate, the intermediate substrate comprising a first intermediate substrate surface and a surface opposite to the first intermediate substrate surface a second intermediate substrate surface; providing a flexible substrate, the flexible substrate comprising a first flexible substrate surface and a second flexible substrate surface opposite the first flexible substrate surface; using a first bond Attaching the first intermediate substrate surface to the carrier substrate; and attaching the second intermediate substrate surface to the first flexible substrate surface with a second adhesive.

100‧‧‧ method

101-116‧‧‧ Procedure

201-202‧‧‧ Procedure

301-302‧‧‧Program

400‧‧‧Electronic device structure

401‧‧‧ Carrier substrate

501-503‧‧‧Program

602‧‧‧First adhesive

603‧‧‧First carrier substrate surface

701-702‧‧‧ procedure

801-803‧‧‧ procedure

904‧‧‧First intermediate substrate surface

905‧‧‧Intermediate substrate

1001-1004‧‧‧Program

1106‧‧‧Second adhesive

1107‧‧‧Second intermediate substrate surface

1208‧‧‧First flexible substrate surface

1209‧‧‧Flexible substrate

1310‧‧‧Electronic devices

1311‧‧‧Second flexible substrate surface

To facilitate further description of the embodiments, the following figures are provided, wherein: FIG. 1 illustrates a flow diagram of an embodiment of a method of providing one or more electronic devices; FIG. 2 is provided in accordance with the embodiment of FIG. An exemplary procedure for a carrier substrate; FIG. 3 illustrates an exemplary process for processing the carrier substrate in accordance with the embodiment of FIG. 1; FIG. 4 illustrates an exemplary embodiment of FIG. 1 after providing a carrier substrate A partial cross-sectional view of an electronic device structure; FIG. 5 illustrates an exemplary procedure for providing an intermediate substrate in accordance with the embodiment of FIG. 1; FIG. 6 illustrates a first carrier liner of the carrier substrate of FIG. 4 in accordance with the embodiment of FIG. A partial cross-sectional view of the electronic device structure of FIG. 4 after application and/or deposition of a first adhesive at the bottom; FIG. 7 illustrates the carrier liner of FIG. 2 and a flexible substrate in accordance with the embodiment of FIG. An exemplary procedure for inserting the intermediate substrate of FIG. 5 to connect the flexible substrate to the carrier FIG. 8 illustrates an exemplary process for joining the first intermediate substrate surface of the intermediate substrate of FIG. 5 to the carrier substrate of FIG. 2 with a first adhesive in accordance with the embodiment of FIG. 1; FIG. The embodiment of Figure 1 illustrates the electronics of Figure 4 after attaching the first intermediate substrate surface of the intermediate substrate to the first carrier substrate surface of the carrier substrate of Figure 4 with the first adhesive of Figure 6. A partial cross-sectional view of the device structure; FIG. 10 illustrates an exemplary process for attaching a second intermediate substrate surface of the intermediate substrate of FIG. 5 to the first flexible substrate with a second adhesive in accordance with the embodiment of FIG. Figure 11 illustrates the application of and/or deposition of a second adhesive at the second intermediate substrate surface of the intermediate substrate of Figure 9 and in accordance with the first adhesive of Figure 6 in accordance with the embodiment of Figure 1 Partial cross-sectional view of the electronic device structure of FIG. 4 after the first intermediate substrate surface of the intermediate substrate of 9 is connected to the first carrier substrate surface of the carrier substrate of FIG. 4; FIG. 12 is shown in accordance with the embodiment of FIG. Connecting the second intermediate substrate surface of FIG. 9 to the surface of FIG. 11 with the second adhesive of FIG. After a first flexible substrate surface of the first flexible substrate, after applying and/or depositing a second adhesive at the second intermediate substrate surface, and using the first adhesive of FIG. Partial cross-sectional view of the electronic device structure of FIG. 4 after the first intermediate substrate surface of the intermediate substrate is attached to the first carrier substrate surface of the carrier substrate of FIG. 4; FIG. 13 is shown in accordance with the embodiment of FIG. After the carrier substrate of FIG. 4 is inserted between the intermediate substrate of FIG. 9 and the intermediate substrate of FIG. 9 and one or more electronic devices are formed on a second flexible substrate surface of the flexible substrate, FIG. 4 A partial cross-sectional view of the structure of the electronic device; FIG. 14 illustrates the formation of one or more electronic devices of FIG. 13 on the surface of a second flexible substrate of FIG. 12 and in accordance with the embodiment of FIG. A partial cross-sectional view of the electronic device structure of FIG. 4 after the bottom portion of the intermediate substrate of FIG. 9 is de-bonded; FIG. 15 illustrates a second flexible liner of FIG. 12 in accordance with the embodiment of FIG. After forming one or more electronic devices of FIG. 13 on the bottom surface And after the first intermediate substrate surface of the intermediate substrate of FIG. 9 is detached from the carrier substrate of FIG. 4, and the second intermediate substrate of FIG. 11 is taken from the first flexible surface of the flexible substrate of FIG. After the surface is disconnected, the electronic device of FIG. 4 The cross-sectional view of the structure; the simplification and clarity of the drawings, the overall construction of the drawings, and the description and details of the well-known features and techniques may be omitted to avoid unnecessarily obscuring the present invention. In addition, the elements in the drawings are not necessarily drawn to size. For example, the size of some of the elements in the figures may be exaggerated relative to other elements to help improve the understanding of the embodiments of the invention. The same reference numbers are used in the different drawings in the drawings.

The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims are used to distinguish between similar elements and do not have to be Sequence or chronological description. It is to be understood that the terms so used are interchangeable, where appropriate, such that the embodiments described herein can operate, for example, in a different order than those described or otherwise described herein. In addition, the terms "comprises" and "comprises" and "comprises" or "comprises" or "comprises" or "comprises" This includes programs, methods, systems, projects, devices, or other elements inherent to the device that are not explicitly listed or such.

The terms "left", "right", "front", "back", "top", "bottom", "upper", "lower", etc. (if any) in the specification and claims are used to describe The purpose is not to describe the permanent relative position. It is to be understood that the terms so used are interchangeable, where appropriate, such that the embodiments described herein are capable of operation, for example, other than those described or otherwise described herein.

The terms "connected" and the like are to be understood broadly and refer to electrically, mechanically, and/or otherwise connecting two or more elements or signals. Two or more electrical components may be electrically connected together but may not be mechanically or otherwise connected together; two or more mechanical components may be mechanically coupled together but may not be electrically or otherwise connected Together; two or more electrical components may be mechanically coupled but may not be electrically or otherwise connected together. The connection can be for any length of time, such as permanent or semi-permanent or only a moment.

"Electrical connections" and the like should be broadly understood and include connections involving any electrical signals, regardless of other types or combinations of power signals, data signals, and/or electrical signals. "Mechanical connections" and the like should be widely understood and include all types of mechanical connections.

The absence of the words "removably", "removable" and the like in the vicinity of the words "connected" and the like does not mean that the problematic connection or the like is or is not removable.

The term "CTE matching material" as used herein refers to a material having a coefficient of thermal expansion (CTE) that is different from the CTE of the reference material by about 20 percent (%) less than the CTE of the reference material. In some embodiments, the CTEs are different from the CTE of the reference material by about 10%, 5%, 3%, or 1% less than the CTE of the reference material.

Some embodiments include a method of providing one or more electronic devices. The method may include: providing a carrier substrate; providing an intermediate substrate, the intermediate substrate including a first intermediate substrate surface and a second intermediate substrate surface opposite the first intermediate substrate surface; a flexible substrate comprising a first flexible substrate surface and a second flexible substrate surface opposite the first flexible substrate surface; the first intermediate substrate surface being replaced by a first adhesive Attached to the carrier substrate; and attaching the second intermediate substrate surface to the first flexible substrate surface with a second adhesive.

Different embodiments include a method of providing one or more electronic devices. The method can include: providing a carrier substrate; providing a flexible substrate; and inserting a durable film between the carrier substrate and the flexible substrate to connect the flexible substrate to the carrier substrate. The durable film is configured to substantially alleviate stresses formed at the flexible substrate when the flexible substrate is detached from the carrier substrate.

Further embodiments include an electronic device structure. The electronic device structure includes an intermediate substrate. The substrate includes a first intermediate substrate surface and a second intermediate substrate surface opposite the first intermediate substrate surface. At the same time, the first intermediate substrate surface can be configured for attachment to a carrier substrate by a first adhesive. The electronic device structure further includes a flexible substrate. The flexible substrate includes a first flexible substrate surface and a second flexible substrate surface opposite the first flexible substrate surface. The first flexible substrate surface can be configured to be coupled to the second intermediate substrate surface by a second adhesive, and the second flexible substrate surface can be configured such that the first intermediate liner A bottom surface is coupled to the carrier substrate and when the first flexible substrate surface is coupled to the second intermediate substrate surface, one or more electronic devices can be formed over the second flexible substrate surface.

FIG. 1 illustrates a flow diagram of an embodiment of a method 100 of providing one or more electronic devices. Method 100 is merely exemplary and is not limited to the embodiments presented herein. Method 100 can be applied to many different embodiments or examples not specifically depicted or described herein. in. In some implementations, the procedures, processes, and/or activities of method 100 can be performed sequentially as shown. In other embodiments, the procedures, processes, and/or activities of method 100 can be performed in any suitable order. In other embodiments, one or more of the programs, processes, and/or activities in method 100 may be combined or skipped.

Referring to Figure 1, method 100 includes a program 101 for providing a carrier substrate. The carrier substrate can be a wafer or a panel. Accordingly, the carrier substrate includes a first carrier substrate surface and a second carrier substrate surface opposite the first carrier substrate surface. The carrier substrate can comprise any suitable geometry (eg, circular, rectangular, square, any other suitable polygon). Also, the carrier substrate can comprise any suitable gauge (e.g., diameter, thickness, length, width, etc.), if applicable. For example, when the carrier substrate is circular, the carrier substrate may include diameters of about 25 mm, 51 mm, 76 mm, 130 mm, 150 mm, 200 mm, 300 mm, 450 mm, and the like. In such examples, the carrier substrate can comprise a thickness greater than or equal to about 0.3 mm and less than or equal to about 1.5 mm. Meanwhile, in other examples, when the carrier substrate is rectangular, the carrier substrate may include 370 mm × 470 mm, 550 mm × 650 mm, 1500 mm × 1800 mm, 2160 mm × 2400 mm, 2880 mm × The width and length of 3130 mm, etc., and when the carrier substrate is square, the carrier substrate may include widths and lengths of 150 mm x 150 mm, 200 mm x 200 mm, 300 mm x 300 mm, and the like. In such examples, the carrier substrate can comprise a thickness of less than or equal to about 0.3 mm and less than or equal to about 2.0 mm. 2 illustrates an exemplary process 101 for providing a carrier substrate in accordance with the embodiment of FIG.

Referring to FIG. 2, the process 101 can include a process 201 for providing a carrier substrate having a carrier substrate material that is matched to the flexible substrate system CTE, relative to the process 103 of the method 100 (FIG. 1). 1) Described below. For example, the carrier substrate material can comprise alumina, tantalum, steel, sapphire, barium borate, sodium calcium silicate, or alkali silicate, or any other suitable CTE matching material. In various more specific examples, the carrier substrate can comprise sapphire having a thickness between about 0.7 mm and about 1.1 mm. The carrier substrate may also comprise 96% alumina having a thickness between about 0.7 mm and about 1.1 mm. In a different embodiment, the 96% alumina has a thickness of about 2.0 mm. In another example, the carrier substrate can be a single crystal wafer having a thickness of at least about 0.65 mm. In yet another embodiment, the carrier substrate comprises stainless steel having a thickness of at least about 0.5 mm. In these or other embodiments The carrier substrate can comprise any other suitable thickness.

In many embodiments, the program 101 can also include a process 202 of processing the carrier substrate. In many implementations, process 202 can be performed prior to executing program 106. FIG. 3 illustrates an exemplary process 202 for processing the carrier substrate in accordance with the embodiment of FIG. 1.

In some embodiments, the execution of the program 101 can also include the process of providing a carrier substrate where the carrier substrate includes the first adhesive, such as, for example, at the surface of the first carrier substrate. In such embodiments, process 202 may be omitted (although the carrier substrate may still have been treated prior to application of the adhesive thereto).

Referring to Figure 3, process 202 can include activity 301 of cleaning the carrier substrate. Performing activity 301 can include cleaning the carrier substrate (eg, supersonic, ultrasonic bath, etc.) in a sonic bath. In the same or other embodiments, performing activity 301 can also include cleaning the carrier substrate with a surfactant solution. For example, the surfactant may comprise a solution of 5% by volume surfactant, sold under the "Detergent 8®" brand from Alconox, White Plains, New York. However, the surfactant may also be any other suitable surfactant, such as a surfactant having a property similar to the Detergent 8® brand. After cleaning the carrier substrate with the surfactant solution, the semiconductor device can be rinsed with deionized water and allowed to dry. In some examples, the flushing can be performed in a high efficiency flusher. In these or other examples, drying can be performed in a cleaning spin dryer, such as when the carrier substrate is circular. In still other examples, the carrier substrate and/or air may be dried by isopropyl alcohol vapor to effect the drying.

At the same time, process 202 can also include etching the activity 302 of the carrier substrate, such as, for example, by dusting the carrier substrate with oxygen (O ₂ ) plasma. Thus, in some examples, activity 302 may include the carrier substrate by a Tegal 965 duster manufactured by the Tegal Group of Baicheng, California, or another suitable device for dusting the carrier substrate. Dust is removed to etch the carrier substrate. The means for dusting the carrier substrate can be operated at a power level of about 250 watts (or about 200-300 watts). At the same time, activity 302 (or about 15-45 minutes) can be performed at a pressure of about 0.16 kPa (or about 0.1-0.2 kPa) and/or for about 30 minutes.

Referring to the drawings, FIG. 4 illustrates a partial cross-sectional view of an exemplary electronic device structure 400 after providing a carrier substrate 401 in accordance with the embodiment of FIG. Therefore, the carrier substrate 401 can be similar to or identical to the carrier substrate described by program 101 of Control Method 100 (FIG. 1) above. The electronic device structure 400 can include a carrier substrate 400.

Returning to Figure 1, method 100 can include a program 102 that provides an intermediate substrate. The intermediate substrate includes a first intermediate substrate surface and a second intermediate substrate surface opposite the first intermediate substrate surface. The first intermediate substrate surface can be configured for attachment to the carrier substrate by a first adhesive. In some embodiments, the intermediate substrate can be referred to as a durable film. FIG. 5 illustrates an exemplary process 102 for providing an intermediate substrate in accordance with the embodiment of FIG. 1.

Referring to Figure 5, the process 102 can include a process 501 of providing an intermediate substrate having an intermediate substrate material. In many embodiments, the intermediate substrate material may comprise polyethylene naphthalate, polyethylene terephthalate, polyether oxime, polyimine, polycarbonate, cyclic olefin copolymer, or liquid crystal. Polymer, any other suitable polymeric material, aluminum foil, polyester film, and the like. In other embodiments, the intermediate substrate material can include an adhesive tape (eg, a double-sided tape) such as when the intermediate substrate material includes a first adhesive and/or a second adhesive, as described below.

The program 102 may include, for example, a Yamato thermostat manufactured by Daiwa Scientific Co., Ltd. of Santa Clara, Calif., or another device suitable for baking the intermediate substrate without damaging the intermediate substrate to bake the intermediate substrate. Process 502. Process 502 can be performed under a preliminary baking condition. The preliminary baking conditions can include a preliminary baking temperature, a preliminary baking pressure, and/or a preliminary baking time. For example, the preliminary baking temperature can be about 200 °C. At the same time, the preliminary baking pressure can be about 0.004 kPa (or about 0-0.010 kPa). In addition, the preliminary baking time can be about one hour. In various embodiments, the process 502 can include exposing the first intermediate substrate surface and the second intermediate substrate surface to an ion blower for greater than or equal to about 10 seconds prior to baking the intermediate substrate. In some embodiments, process 502 can be omitted.

The program 102 can further include a process 503 of cutting the intermediate substrate. In many embodiments, performing process 503 can include determining a size of the intermediate substrate based on a size of at least one of the carrier substrate and/or the flexible substrate. For example, performing process 503 can include cutting (eg, sizing) the intermediate substrate such that the perimeter of the intermediate substrate deviates from the perimeter of the carrier substrate (eg, is smaller in at least one lateral dimension) greater than or equal to about 1.5 millimeters , or 2 mm and so on. (or about 1-5 mm). Likewise, performing process 503 can include cutting (eg, sizing) the intermediate substrate such that the perimeter of the intermediate substrate deviates (eg, is greater in at least one lateral dimension) the perimeter of the flexible substrate. Executing process 503 in this manner can be later The stresses formed by the distribution execution program 112 and/or the program 113 in the method 100 (FIG. 1) illustrate the execution of the program 112 (FIG. 1) and/or the execution of the program 113 (FIG. 1). In some embodiments, process 503 can be omitted, such as when the size of intermediate substrate 503 is predetermined.

In some embodiments, the program 102 can also include the process of providing the intermediate substrate where the first intermediate substrate surface includes the first adhesive (eg, where the intermediate substrate includes tape). In such embodiments, process 502 and/or process 503 may be omitted. In a further embodiment, this process can be omitted.

Meanwhile, in the same or other embodiments, the program 102 may further include a process of providing an intermediate substrate where the second intermediate substrate surface includes the second adhesive (eg, the intermediate substrate includes an adhesive tape (eg, like a double Face tape))). In such embodiments, process 502 and/or process 503 may also be omitted. Also, in many embodiments, the process of providing an intermediate substrate, such as where the first intermediate substrate surface includes the first adhesive, may omit this process, as described with respect to program 101 (FIG. 1).

Referring back to FIG. 1, method 100 can include a program 103 that provides a flexible substrate. The term "flexible substrate" as used herein means a freestanding substrate comprising a flexible material that is easily adapted to its shape. In some embodiments, the flexible substrate can include a low modulus of elasticity. For example, a low modulus of elasticity can be considered to be less than about 5 gigapascals of modulus of elasticity.

The flexible substrate includes a first flexible substrate surface and a second flexible substrate surface opposite the first flexible substrate surface. The first flexible substrate surface can be configured for attachment to the second intermediate substrate surface by a second adhesive. Meanwhile, the second flexible substrate surface may be configured such that one or more electronic devices can be formed on the second flexible substrate surface, such as, for example, on the first intermediate substrate surface connected to the carrier substrate and at the first When the flexible substrate surface is attached to the surface of the second intermediate substrate.

In some embodiments, if the flexible substrate is directly attached to or directly detached from the carrier substrate, the executing program 103 can include a process of providing a flexible substrate where the flexible substrate includes a flexible substrate material, The flexible substrate material lacks sufficient mechanical strength to prevent damage to the flexible substrate.

Also, similar to that described above with respect to program 101 and/or program 102, in some embodiments, executing program 103 can include providing the flexible liner where the first flexible substrate surface includes the second adhesive The bottom process. In other embodiments, it is also possible to save Slightly this process.

In many embodiments, the program 103 can include a process of processing the flexible substrate. The process can be similar or identical to the execution process 202 (Fig. 2) for the carrier substrate. In many instances, this process and process 202 (FIG. 2) can be performed on each other approximately simultaneously, and/or the process can be performed as part of process 202.

At the same time, method 100 can include a program 104 that provides the first adhesive. In various embodiments, executing the program 104 can include applying and/or depositing a first adhesive at a surface of the first carrier substrate and/or at a surface of the first intermediate substrate. In general, the program 104 can be performed where the first carrier substrate surface and/or the first intermediate substrate surface does not include the first adhesive. Executing the program 104 may include any suitable according to the application and/or deposition of the first adhesive (eg, spin coating, spray coating, extrusion coating, preformed lamination, slot extrusion coating, or screen printing, etc.) The technique applies and/or deposits a first adhesive at a surface of the first carrier substrate and/or at a surface of the first intermediate substrate. For example, performing process 104 can include spin coating the first adhesive at a rotational speed of about 1000 rotations per minute at the surface of the first carrier substrate and/or the first intermediate substrate surface for about 25 seconds and/or per The first adhesive is applied and/or deposited at the first carrier substrate surface and/or the first intermediate substrate surface by spin coating the first adhesive at a rotational speed of about 3500 rotations in about 20 seconds. In some embodiments, the program 104 can be omitted, such as where the first carrier substrate surface and/or the first intermediate substrate surface already includes the first adhesive.

Skipping the previous figures, FIG. 6 illustrates the electronic device after application and/or deposition of the first adhesive 602 at the first carrier substrate surface 603 of the carrier substrate 401 (FIG. 4) in accordance with the embodiment of FIG. A partial cross-sectional view of structure 400 (Fig. 4). The first adhesive 602 can be similar or identical to the first adhesive described above with respect to the procedure 104 (FIG. 1) of the method 100 (FIG. 1). At the same time, the first carrier substrate surface 603 can be similar or identical to the first carrier substrate surface described above with respect to the procedure 101 (FIG. 1) of the method 100 (FIG. 1). The electronic device structure 400 (Fig. 4) can include a first adhesive 602, and the carrier substrate 401 (Fig. 4) can include a first carrier substrate surface 603.

Returning again to FIG. 1, method 100 can include a program 105 for providing a second adhesive. In various embodiments, the execution of the program 105 can include application and/or deposition in a manner similar to the execution of the program 104 for the first adhesive at the second intermediate substrate surface and/or the first flexible substrate surface. Two binders.

In various implementations, the program 104 and/or the program 105 can be executed as part of the program 106. For example, program 104 can be executed prior to execution of process 701 and process 702, and program 105 can be executed after process 701 but prior to process 702. In a different example, program 104 may be executed prior to execution of process 701 and after process 702, while program 105 may be executed prior to both process 701 and process 702. In still other examples, program 104 and program 105 can be executed prior to execution of program 106, such as when process 701 and process 702 are executed at approximately the same time.

In certain embodiments, the first adhesive and the second adhesive may comprise the same adhesive material, while in other embodiments, the first adhesive and the second adhesive may comprise different adhesives. Mixture material. The first adhesive and/or the second adhesive may comprise any suitable adhesive material (for example, Henkel NS122 adhesive manufactured by KGA (Company), Henkel AG & Company, Dusseldorf, Germany) Agent; Henkel AG & Company of Dusseldorf, Germany, EccoCoat 3613 adhesive manufactured by KGaA (company); etc.). In these or other embodiments, the binder material can include a heat curing adhesive, a pressure sensitive adhesive, a UV curable adhesive, and the like. In many embodiments, the first adhesive can be selected based on the material properties of the carrier substrate and the intermediate substrate. Also, the second adhesive can be selected according to the material properties of the intermediate substrate and the flexible substrate. For example, the first adhesive and/or the second adhesive may comprise a Henkel NS122 adhesive when the intermediate substrate comprises polyethylene naphthalate or polyethylene terephthalate. Meanwhile, when the intermediate substrate includes polyphenolimide, the first adhesive and/or the second adhesive may include an EccoCoat 3613 adhesive.

At the same time, method 100 can include a process 106 of inserting an intermediate substrate between a carrier substrate and a flexible substrate to connect the flexible substrate to a carrier substrate. In some implementations, executing program 106 and/or process 702 can include attaching an intermediate substrate to a flexible substrate to reinforce the flexible substrate. Figure 7 illustrates an exemplary procedure 106 for inserting an intermediate substrate between a carrier liner and a flexible substrate to attach the flexible substrate to the carrier liner in accordance with the embodiment of Figure 1.

Referring to Figure 7, the process 106 can include a process 701 of joining the first intermediate substrate surface to the carrier substrate (e.g., the first carrier substrate surface) with a first adhesive. FIG. 8 illustrates an exemplary process 701.

Referring to Figure 8, process 701 can include activity 801 providing a protective layer at one of the first intermediate substrate surface or one of the second intermediate substrate surfaces. In many embodiments, the insurance The cover may include tape (eg, Blue Low Tack Squares, manufactured by Semiconductor Equipment Group, Inc., of Merck, California, product number 18133-7.50). In many embodiments, executing the program 801 can include determining the size of the protective layer to correspond to a side area of the first intermediate substrate surface or the second intermediate substrate surface, if applicable.

When activity 802 is performed, performing activity 801 can prevent damage and/or contamination of the first intermediate substrate surface or the second intermediate substrate surface, if applicable. Accordingly, when process 701 is performed prior to process 702, performing activity 801 can include providing the protective layer at the second intermediate substrate surface. Alternatively, when process 701 is performed after process 702, performing activity 801 can include providing the protective layer at the first intermediate substrate surface. In some embodiments, activity 801 can be omitted.

At the same time, process 701 can continue to bond the first intermediate substrate surface to activity 802 of the carrier substrate with the first adhesive using any suitable lamination device (eg, roll press, bladder press, etc.). In many embodiments, bonding the first intermediate substrate surface to the carrier substrate can occur under the first condition. The first condition can include a first pressure, a first temperature, and/or a first feed rate. For example, in other embodiments, the first pressure can be greater than or equal to about zero kilopascals (ie, in a vacuum) and less than or equal to about 69 kilopascals (eg, where the intermediate substrate comprises polybenzamine) ) or less than or equal to about 150 kPa. Additionally, the first feed rate can be greater than or equal to about 0.25 meters per minute and less than or equal to about 0.5 meters per minute (or about 0.10-1.0 meters per minute). Also, the first temperature may be greater than or equal to about 20 ° C and less than or equal to about 100 ° C, 160 ° C, 220 ° C, 350 ° C, and the like. For example, where the intermediate substrate comprises polyethylene naphthalate, the first temperature may be less than or equal to about 220 ° C (eg, about 100 ° C), and the intermediate substrate comprises polyethylene terephthalate. Where the alcohol ester is present, the first temperature can be less than or equal to about 160 ° C (eg, about 100 ° C). Also, the intermediate substrate includes polyimine, and the first temperature may be less than or equal to about 350 ° C (eg, about 100 ° C). In general, the first pressure and/or the first temperature may depend on the material properties and/or limitations of the intermediate substrate.

In some embodiments, the process 701 can also include an activity 803 of removing the protective layer from one of the first intermediate substrate surface or the second intermediate substrate surface. In some embodiments, activity 803 can be omitted, such as when the activity 801 is omitted.

Returning to the drawings, Figure 9 illustrates the use of a first adhesive in accordance with the embodiment of Figure 1. 602 (FIG. 6) A partial cross-sectional view of the electronic device structure 400 (FIG. 4) after the first intermediate substrate surface 904 of the intermediate substrate 905 is attached to the first carrier substrate surface 603 (FIG. 6) of the carrier substrate 401. . The first intermediate carrier substrate surface 904 and the intermediate substrate 905 can be correspondingly similar or identical to the first intermediate substrate surface and intermediate substrate described above with respect to the program 102 (FIG. 1) of the method 100 (FIG. 1). The electronic device structure 400 (Fig. 4) can include an intermediate substrate 905, which can include a first intermediate substrate surface 904.

Returning to Figure 7, the program 106 can also include a process 702 of joining the second intermediate substrate surface to the first flexible substrate surface with a second adhesive. FIG. 10 illustrates an exemplary process 702.

Referring to Figure 10, process 702 can include activity 1001 of providing a protective layer at the surface of the second flexible substrate. The protective layer can be similar or identical to the protective layer described above with respect to activity 801 (Fig. 8).

Process 702 can continue to use the second adhesive to bond the second intermediate substrate surface to the activity 1002 of the first flexible substrate surface using any suitable lamination device (eg, roll press, bladder press, etc.) . In many embodiments, bonding the second intermediate substrate surface to the first flexible substrate surface can occur under a second condition. This second condition can be similar or identical to the first condition described above with respect to activity 802 (Fig. 8). Thus, in some embodiments, the first condition and the second condition may be the same, while in other embodiments, the first condition and the second condition may be different. For example, the second condition can include a second pressure that can be greater than or equal to about zero kilopascals (ie, in a vacuum) and less than or equal to about 128 kilopascals (or less than or equal to about 150 kilopascals). In a more specific example, where the intermediate substrate comprises polyimide, the second pressure may be less than or equal to about 69 kPa, and the intermediate substrate comprises polyethylene naphthalate or polyparaphenyl. Where ethylene formate is present, the second pressure may be less than or equal to about 128 kPa.

After attaching the first intermediate substrate surface to the carrier substrate and after attaching the second intermediate substrate surface to the first flexible substrate surface, the process 702 can further include etching the carrier substrate, The intermediate substrate, the flexible substrate, the first adhesive, and the activity of the second adhesive 1003. In certain embodiments, performing activity 1003 can include a Tegal 01 duster manufactured by the Tegal Group of Baicheng, California, or another suitable for the carrier substrate, the intermediate substrate, the flexibility Substrate, the first adhesive, And the second adhesive dust removing device to dust the carrier substrate, the intermediate substrate, the flexible substrate, the first adhesive, and the second adhesive. Activity 1003 can be performed greater than or equal to approximately 900 seconds. In many embodiments, performing activity 1003 can remove excess of the first adhesive and/or the second adhesive.

In some embodiments, activity 1003 can be performed as part of process 701 (FIG. 7) instead of process 702 (FIG. 7). For example, activity 1003 can be performed as part of process 701 (FIG. 7) in place of process 702 (FIG. 7) when process 701 is performed after process 702 (FIG. 7). In still other embodiments, activity 1003 can be performed after activity 1001 and activity 1002 and can be performed prior to activity 1004. Also, in still further embodiments, activity 1003 can be performed after program 107 (FIG. 1). In still other embodiments, activity 1003 can be omitted, such as where the intermediate substrate comprises polyimide.

In some embodiments, the process 702 can also include removing the activity 1004 of the protective layer at the second flexible substrate. In some implementations, activity 1004 can be performed after process 701 when process 701 is performed after process 702.

Returning to the drawings again, FIG. 11 illustrates the application and/or deposition of a second adhesive 1106 at the second intermediate substrate surface 1107 of the intermediate substrate 905 (FIG. 9) and in the first embodiment in accordance with the embodiment of FIG. Adhesive 602 (Fig. 6) connects first intermediate substrate surface 904 (Fig. 9) of intermediate substrate 905 to electronic device structure 400 after first carrier substrate surface 603 (Fig. 6) of carrier substrate 401 ( Figure 4) is a partial cross-sectional view. The electronic device structure 400 (Fig. 4) can include a second adhesive 1106, and the intermediate substrate 905 (Fig. 9) can include a second intermediate substrate surface 1107.

Meanwhile, FIG. 12 illustrates the first flexible substrate surface 1208 connecting the second intermediate substrate surface 1107 (FIG. 11) to the flexible substrate 1209 with the second adhesive 1106 (FIG. 11) according to the embodiment of FIG. Thereafter, after applying and/or depositing a second adhesive 1106 at the second intermediate substrate surface 1107 of the intermediate substrate 905 (FIG. 9), and intermediate the lining with the first adhesive 602 (FIG. 6) The first intermediate substrate surface 904 (FIG. 9) of the bottom 905 is connected to a cross-sectional view of the electronic device structure 400 (FIG. 4) subsequent to the first carrier substrate surface 603 (FIG. 6) of the carrier substrate 401. The first flexible substrate surface 1208 and the flexible substrate 1209 can be correspondingly similar or identical to the first flexible substrate surface and flexible substrate described above with respect to the procedure 103 (FIG. 1) of the method 100 (FIG. 1). The electronic device structure 400 (Fig. 4) can include a flexible substrate 1209, The flexible substrate can include a first flexible substrate surface 1208.

Although Figures 6, 9, 11, and 12 illustrate performing the method 100 in a manner such as that performed prior to the process 702 in process 701 (Fig. 7), in some embodiments, the process 702 (Fig. 7) may be reversed. Executed after performing process 701 (Fig. 7). Also, in other embodiments, process 701 (FIG. 7) and process 702 (FIG. 7) can be performed at approximately the same time.

Returning now to Figure 1, after attaching the first intermediate substrate surface to the carrier substrate and after attaching the second intermediate substrate surface to the first flexible substrate surface, the method 100 can include curing the The first adhesive and the procedure 107 of the second adhesive. Executing the program 107 can include curing the first adhesive according to any technique and/or combination of techniques suitable for curing the first adhesive and/or the second adhesive (eg, UV curing, heat curing, pressure curing, etc.) And the second adhesive without damaging the carrier substrate, the intermediate substrate or the flexible substrate. For example, when the first adhesive and/or the second adhesive comprises a Henkel NS122 adhesive, the execution of the program 107 can include the use of an ultraviolet curing system (eg, such as Dymax Corporation of Torrington, Connecticut, USA). The manufactured Dymax UV curing system) is used to UV cure the first adhesive and/or the second adhesive. In such embodiments, the program 107 can continue to perform for greater than or equal to about 20 seconds (or about 10 to 30 seconds). Meanwhile, when the first adhesive and/or the second adhesive includes the EccoCoat 3613 adhesive, the execution program 107 may be included in an incubator (for example, manufactured by Daiwa Scientific Co., Ltd., Santa Clara, California, USA). The first adhesive and/or the second adhesive are thermally cured in a Yamato incubator. In such embodiments, the program 107 can be continuously performed at a temperature of about 150 ° C (or about 200 ° C) for greater than or equal to about 30 minutes (or about 20 to 40 minutes).

The method 100 can include a process 108 of cleaning a carrier substrate, an intermediate substrate, a flexible substrate, a first adhesive, and a second adhesive. Program 108 can be similar to activity 301 (Fig. 3). In many implementations, the program 108 can be executed after the program 106 and/or the program 107. In other embodiments, the program 108 can be omitted, such as when the intermediate substrate comprises polyimide.

The method 100 can include a process 109 of baking a carrier substrate, an intermediate substrate, a flexible substrate, a first adhesive, and a second adhesive. Program 109 can be similar to process 502 (Fig. 5). In many implementations, program 109 can be executed after program 108 is executed.

The method 100 can also include a process 110 of cleaning the carrier substrate, the intermediate substrate, the flexible substrate, the first adhesive, and the second adhesive. Program 110 can be similar to activity 301 (figure 3). In many implementations, program 110 can be executed after program 109 is executed.

The method 100 can additionally include a procedure 111 of drying the carrier substrate, the intermediate substrate, the flexible substrate, the first adhesive, and the second adhesive. In some embodiments, the program 111 can include a dry carrier in an incubator (eg, a Yamato incubator manufactured by Daiwa Scientific Co., Ltd., Santa Clara, Calif.) or other suitable device for baking an intermediate substrate. A substrate, an intermediate substrate, a flexible substrate, a first adhesive, and a second adhesive. Process 502 can be performed under a dry baking condition. Dry baking conditions can include a dry bake temperature (eg, about 80-120 ° C, for example, about 100 ° C) and/or a dry bake time (eg, greater than or equal to about 1 hour and less than or equal to about 4 hours, such as , about 3 hours). In many implementations, process 111 can be performed after execution of program 110. Process 111 may also include cooling and/or allowing the cooled carrier substrate, intermediate substrate, flexible substrate, first adhesive, and second adhesive to last for greater than or equal to about 30 minutes. The execution program 111 can remove moisture from the carrier substrate, the intermediate substrate, the flexible substrate, the first adhesive, and the second adhesive and/or degas it. Therefore, the length of the dry baking time may depend on the material for the carrier substrate, the intermediate substrate, the flexible substrate, the first adhesive, and the second adhesive, and the carrier substrate, the intermediate substrate, the flexible substrate. The outgassing rate and/or the outdiffusion rate of the first binder and the second binder.

The method 100 can further include the process 112 of depositing a nitride barrier layer on the surface of the second flexible substrate. The process 112 can include depositing a nitride barrier layer to a nitride barrier layer thickness of about 0.3 microns (or about 0.2-0.5 microns). In many implementations, program 112 can be executed after program 111 is executed.

The method 100 can also include inspecting the carrier substrate, the intermediate substrate, the flexible substrate, the first adhesive, and the second adhesive to, for example, determine any of the carrier substrate, the intermediate substrate, and/or the flexible substrate. Whether the program is damaged or not. In some embodiments, the program 113 can be omitted. Program 113 can be executed after program 112.

The method 100 can include a program 114 of forming one or more electronic devices on a surface of a second flexible substrate. The or the electronic device may include one or more electronic sensors, one or more electronic displays, one or more electronic transistors (eg, thin film transistors), one or more electronic diodes, or A plurality of microelectromechanical systems, or any other suitable one or more electronic devices. In many implementations, program 114 can be executed after execution of programs 101-113.

Figure 13 shows the carrier liner 401 (Figure 4) in accordance with the embodiment of Figure 1 A partial cross-sectional view of the electronic device structure 400 (FIG. 4) after insertion of the intermediate substrate 905 (FIG. 9) between the flexible substrates 1209 and after forming one or more electronic devices 1310 on the second flexible substrate surface 1311. The electronic device structure 400 (Fig. 4) may include one or more electronic devices 1310, and the flexible substrate 1209 (Fig. 12) includes a second flexible substrate surface 1311.

Returning to FIG. 1, method 100 can further include a process 115 of detaching the first intermediate substrate surface from the carrier substrate (eg, the first carrier substrate surface). The intermediate substrate can be configured to substantially alleviate stresses formed at the flexible substrate when the flexible substrate is detached from the carrier substrate. Thus, executing program 115 can include substantially alleviating stresses formed at the flexible substrate with the intermediate layer when the flexible substrate is detached from the carrier substrate. Substantially alleviating the stress formed at the flexible substrate may mean alleviating sufficient stress to prevent damage to the flexible substrate and/or the electronic device or devices when the program 115 is performed. Thus, method 100 can allow for a flexible substrate (e.g., the flexible substrate described above for program 103) that is coupled to one or more corresponding rigid carrier substrates (e.g., the carrier substrate described above for program 101). Manufacturing one or more electronic devices (eg, the one or the electronic devices described above for program 114) to allow for the use of electronic device manufacturing equipment and/or technology configured for use with a rigid substrate without Or inserting one or more corresponding intermediate substrates between the rigid carrier substrate and the or the flexible substrate to absorb stress when the or the flexible substrate is detached from the carrier substrate or the carrier substrate Damage to this or the flexible substrate is caused.

In many embodiments, the program 115 can include mechanically detaching the first intermediate substrate surface from the carrier substrate. For example, in such embodiments, the program 115 can include inserting a tool (eg, a blade edge) at a first intermediate substrate surface (eg, between the first adhesive and the first intermediate substrate surface) and The tool is urged relative to the first intermediate substrate surface at an angle greater than or equal to about 0 degrees and less than or equal to about 45 degrees along the first intermediate substrate surface to release the first intermediate substrate surface from the carrier substrate.

In other embodiments, the program 115 can include any other suitable technique for detaching the first intermediate substrate surface from the carrier substrate (eg, chemical, laser, ultraviolet, thermal, etc.) according to any other suitable technique. An intermediate substrate surface is detached from the carrier substrate. Therefore, any of those described in U.S. Patent Publication No. 20100297829, U.S. Patent Publication No. 20110023672, U.S. Patent Publication No. 20110064953, U.S. Patent Publication No. 20110228492 Suitable stripping technology, SMO'Rourke et al., pages 1 to 4 of the 26th Army Science Conference, ADM002187, December 2008, directly fabricate amorphous tantalum film on plastic and metal tin foil for flexible displays. Technical papers of Direct Fabrication of a-Si (H Thin Film Transistor Arrays on Plastic and Metal Foils for Flexible Displays), and 1353 of the IEEE Transactions on Electronic Devices, August 8, Vol. 1360 pages of Satoshi Inoue et al. Laser-based surface separation technology and its application to polycrystalline TFT LCDs on plastic films with integrated drivers (Surfac-Free Technology by Laser Annealing (SUFTLA) and Its Application to Poly-Si TFT- Technical papers of LCDs on Plastic Film With Integrated Drivers, each of which is incorporated herein by reference, and can be used to execute program 115.

In many embodiments, the program 115 can be performed in a manner that a first adhesive remains with the carrier substrate. However, in some embodiments, the first intermediate substrate surface can be etched in a manner similar to activity 302 (FIG. 3) to remove any residue of the first adhesive at the first intermediate substrate surface. .

Figure 14 illustrates the formation of one or more electronic devices 1310 (Figure 13) on a second flexible substrate surface 1208 (Figure 12) and in the middle from the carrier substrate 401 (Figure 4), in accordance with the embodiment of Figure 1 A partial cross-sectional view of the electronic device structure 400 (FIG. 4) after the first intermediate substrate surface 904 (FIG. 9) of the substrate 905 (FIG. 9) is de-bonded.

Returning again to FIG. 1, after execution of the program 115, the method 100 can also disconnect the program 116 of the second intermediate layer substrate surface from the first flexible substrate surface. The intermediate substrate can be configured to be disconnected from the carrier substrate and the flexible substrate without damaging the or the electronic device. Also, in some embodiments, the program 116 can be omitted and the intermediate substrate can still be coupled to the flexible substrate by a second adhesive to reinforce the flexible substrate.

Regardless of the embodiments in which it is desired to maintain the intermediate substrate attached to the flexible substrate, the process 116 can include mechanically detaching the second intermediate substrate surface from the first flexible substrate surface. For example, mechanically detaching the second intermediate substrate surface from the first flexible substrate surface can include manually lining the intermediate lining with a continuous force and at a low angle (eg, about 5 to 45 degrees) relative to the flexible substrate. The bottom pulls away from the flexible substrate to detach the second intermediate substrate surface from the first flexible substrate surface. In such examples, the program 116 can include providing a protective layer on the surface of the second flexible substrate to protect any one or more of the formations thereon when the program 116 is executed Electronic device.

At the same time, the program 116 can also include the second intermediate substrate surface from the other technique (eg, chemical, laser, ultraviolet, thermal, etc.) suitable for detaching the first intermediate substrate surface from the carrier substrate. A flexible substrate surface is detached. Thus, program 116 can be similar or identical to program 115.

Figure 15 illustrates the formation of one or more electronic devices 1310 (Figure 13) on a second flexible substrate surface 1208 (Figure 12) and in the middle from the carrier substrate 401 (Figure 4), in accordance with the embodiment of Figure 1 After the first intermediate substrate surface 904 (FIG. 9) of the substrate 905 (FIG. 9) is detached and the second intermediate substrate surface is removed from the first flexible surface 1208 (FIG. 12) of the flexible substrate 1209 (FIG. 12) 1107 (FIG. 11) A partial cross-sectional view of the electronic device structure 400 (FIG. 4) after disconnection.

In some embodiments, the program 116 can further include etching the flexible substrate in a manner similar to the activity 302 (FIG. 3) to remove any residue of the second adhesive on the first flexible substrate surface. Therefore, the flexible substrate can be etched after the second intermediate substrate surface is detached from the surface of the first flexible substrate.

In many embodiments, the programs 102 through 116 can be executed on both sides of the carrier substrate of the program 101 of the method 100. In such embodiments, one or more of the programs 102 through 116 may be performed on both sides of the carrier substrate at approximately the same time. Also, in these or other embodiments, one or more of the programs 102 through 116 may be repeated for each side of the carrier substrate and performed separately.

Although the present invention has been described with reference to the specific embodiments thereof, it should be understood that those skilled in the art can make various changes without departing from the spirit and scope of the invention. Therefore, the disclosure of the embodiments of the present invention is intended to describe the scope of the invention It should be noted that the scope of the invention should be limited only by the scope of the appended claims. For example, for those skilled in the art, it will be apparent that the procedures 101 to 116 of FIG. 1, the processes 201 and 202 of FIG. 2, the activities 301 and 302 of FIG. 3, and the processes 501 to 503 of FIG. 5, FIG. Processes 701 and 702, activities 801 through 803 of FIG. 8, and activities 1001 through 1004 of FIG. 10 may be comprised of many different programs, processes, and activities, and may be performed by many different modules in many different sequential steps, and will be apparent It is possible to modify any of the elements of Figures 1 through 15, and it will be apparent that the foregoing discussion of some of the embodiments does not necessarily represent all possible A complete description of the approach.

All of the elements mentioned in the scope of any specific patent application are necessary for the embodiments mentioned in the scope of the specific application. Thus, an alternative form of one or more of the mentioned elements forms a reconstruction and does not have to be repaired. Additionally, benefits, other advantages, and solutions to problems have been described in terms of specific embodiments. However, benefits, advantages, problem solutions, and any elements or elements that may result in any benefit, advantage, or solution becoming apparent or not, are not considered to be critical, required, or essential to any or all of the scope of the patent application. Features or elements, unless such benefits, advantages, solutions or elements are clearly stated in the scope of such claims.

In addition, by way of example and/or limitation, the embodiments and limitations disclosed herein are not used by the public under the principle of contribution: (1) not explicitly mentioned in the scope of the patent application; and (2) It is a potential equivalent of the elements and/or limitations expressed in the patent application scope or equivalents.

100‧‧‧ method

101-116‧‧‧ Procedure

Claims (34)

A method comprising: providing a carrier substrate; providing an intermediate substrate, the intermediate substrate comprising a first intermediate substrate surface and a second intermediate substrate surface opposite the first intermediate substrate surface; a flexible substrate comprising a first flexible substrate surface and a second flexible substrate surface opposite the first flexible substrate surface; the first intermediate substrate surface being replaced by a first adhesive Attached to the carrier substrate; and attaching the second intermediate substrate surface to the first flexible substrate surface with a second adhesive. The method of claim 1, wherein: attaching the first intermediate substrate surface to the carrier substrate with the first adhesive comprises using the first intermediate substrate with a binder material a surface coupled to the carrier substrate, the first adhesive comprising the adhesive material; and attaching the second intermediate substrate surface to the first flexible substrate with the second adhesive An adhesive material connects the second intermediate substrate surface to the first flexible substrate, the second adhesive comprising the adhesive material. The method of claim 1, further comprising at least one of: providing the first adhesive; or providing the second adhesive. The method of claim 3, wherein at least one of the following: providing the first adhesive comprises applying the first adhesive, wherein: applying the first adhesive is included Spin coating, spray coating, extrusion coating, preform lamination, slit extrusion coating, screen coating, or screen printing of the carrier substrate and one or both of the first intermediate substrate surfaces At least one of the adhesives; or providing the second adhesive includes applying the second adhesive, wherein: applying the second adhesive includes the second intermediate substrate surface and the first flexible substrate table At least one of the second adhesive is applied by spin coating, spray coating, extrusion coating, preformed lamination, slit extrusion coating, screen coating, or screen printing. The method of claim 1, wherein at least one of the following: providing the carrier substrate comprises providing the carrier substrate having a carrier substrate material, the carrier substrate material comprising aluminum oxide, At least one of bismuth, steel, sapphire, barium borate, sodium calcium strontate, or alkali strontium; providing the flexible substrate comprises providing the flexible substrate having a flexible glass material; or providing the The intermediate substrate includes the intermediate substrate provided with an intermediate substrate material comprising polyethylene naphthalate, polyethylene terephthalate, polyether oxime, polyimine, At least one of a polycarbonate, a cyclic olefin copolymer, or a liquid crystal polymer. The method of claim 1, wherein at least one of the following: attaching the first intermediate substrate surface to the carrier substrate with the first adhesive comprises using a roll press or Bonding at least one of the first intermediate substrate surface to the carrier substrate with the first adhesive; or connecting the second intermediate substrate surface to the first surface with the second adhesive The surface of a flexible substrate includes bonding the second intermediate substrate surface to the first flexible substrate surface with the second adhesive using at least one of a roll press or a bag press. The method of claim 6, wherein at least one of the following: bonding the first intermediate substrate surface to the carrier substrate under a first condition, the first condition comprising the following At least one of: a first pressure greater than or equal to about zero kPa and less than or equal to about 69 kPa; a first temperature greater than or equal to about 20 ° C and less than or equal to about 100 ° C; or a first Giving a rate greater than or equal to about 0.25 meters per minute and less than or equal to about 0.5 meters per minute; or Bonding the second intermediate substrate surface to the first flexible substrate surface under a second condition, the second condition comprising at least one of: a second pressure greater than or equal to about zero kilopascals and Less than or equal to about 138 kPa; a second temperature greater than or equal to about 20 ° C and less than or equal to about 100 ° C; or a first feed rate greater than or equal to about 0.25 meters per minute and less than or equal to about 0.5 meters per minute . The method of claim 1, wherein: providing the carrier substrate comprises processing the carrier substrate prior to attaching the first intermediate substrate surface to the carrier substrate, wherein processing the carrier substrate comprises the following At least one of: cleaning the carrier substrate; or removing the carrier substrate. The method of claim 1, wherein the providing the intermediate substrate comprises at least one of: baking the intermediate substrate under preliminary baking conditions, comprising at least one of the following: : a preliminary baking temperature of about 200 ° C; a preliminary baking pressure of about 0.004 kPa; or a preliminary baking time of about 1 hour; or cutting the intermediate substrate, wherein cutting the intermediate substrate comprises based on the carrier substrate or The size of at least one item of the flexible substrate determines the size of the intermediate substrate. The method of claim 1, further comprising: after attaching the first intermediate substrate surface to the carrier substrate and connecting the second intermediate substrate surface to the first flexible substrate After the surface, the carrier substrate, the intermediate substrate, the flexible substrate, the first adhesive, and the second adhesive are baked. The method of any one of claims 1 to 10, further comprising: after attaching the first intermediate substrate surface to the carrier substrate and in the second intermediate After the substrate surface is attached to the first flexible substrate surface, one or more electronic devices are formed on the second flexible substrate surface. The method of claim 11, further comprising: after attaching the first intermediate substrate surface to the carrier substrate and connecting the second intermediate substrate surface to the first flexible substrate After the surface, the first intermediate substrate surface is detached from the carrier substrate. The method of claim 12, further comprising: after attaching the first intermediate substrate surface to the carrier substrate and connecting the second intermediate substrate surface to the first flexible substrate After the surface, the second intermediate substrate surface is detached from the carrier substrate after the first intermediate substrate surface is detached from the carrier substrate. The method of any one of claims 1 to 10, further comprising: after attaching the first intermediate substrate surface to the carrier substrate and connecting the second intermediate substrate surface to After the first flexible substrate surface, the first intermediate substrate surface is detached from the carrier substrate. The method of claim 14, further comprising: after attaching the first intermediate substrate surface to the carrier substrate and connecting the second intermediate substrate surface to the first flexible substrate After the surface, the second intermediate substrate surface is detached from the carrier substrate after the first intermediate substrate surface is detached from the carrier substrate. A method of providing one or more electronic devices, the method comprising: providing a carrier substrate; providing a flexible substrate; and inserting a durable film between the carrier substrate and the flexible substrate to thereby bond the flexible liner A bottom is coupled to the carrier substrate, the durable film being configured to substantially relieve stress formed at the flexible substrate when the flexible substrate is detached from the carrier substrate. The method of claim 16, wherein: inserting the durable film between the carrier substrate and the flexible substrate comprises: applying a first adhesive to a first durable film surface of the durable film Connecting to the carrier substrate, further one of: (a) at least one of the carrier substrate or the durable film comprises the first adhesive, or (b) the first durable film Attaching the surface to the carrier substrate includes providing the first adhesive at the carrier substrate or providing at least one of the first adhesive at the first durable film surface; and at the first After the durable film surface is attached to the carrier substrate, the second durable film surface of the durable film is attached to the first flexible substrate surface of the flexible substrate with a second adhesive, the second durable film surface Opposite the first durable film surface, further one of: (a) at least one of the second durable film surface or the first flexible substrate surface comprises the second adhesive, or (b) Connecting the second durable film surface to the first Including providing the second substrate surface of the second adhesive surface of the film or to provide a durable least one of the second adhesive surface of the first flexible substrate. The method of claim 16, wherein: inserting the durable film between the carrier substrate and the flexible substrate comprises: joining a second durable film surface of the durable film with a second adhesive To a first flexible substrate surface of the flexible substrate, further one of: (a) at least one of the second durable film surface or the first flexible substrate surface comprises the second paste Mixing, or (b) attaching the second durable film surface to the first flexible substrate surface includes providing the second adhesive at or at the surface of the first flexible film At least one of the second adhesive; and after attaching the second durable film surface to the surface of the first flexible substrate, the first durable film surface of the durable film is coated with a second adhesive Attached to the carrier substrate, the first durable film surface is opposite the second durable film surface, further one of: (a) at least one of the first durable film surface or the carrier substrate Including the second adhesive, or (b) Attaching the first durable film surface to the carrier substrate includes providing at least one of the first adhesive at the first durable film surface or the first adhesive at the carrier substrate . The method of claim 16, wherein: inserting the durable film between the carrier substrate and the flexible substrate comprises: forming a first durable film of the durable film with a first adhesive a surface coupled to the carrier substrate, further wherein one of: (a) at least one of the carrier substrate or the first durable film comprises the first adhesive, or (b) the first Attaching a durable film surface to the carrier substrate includes providing the first adhesive at the carrier substrate or providing at least one of the first adhesive at the first durable film surface; a second adhesive bonding the second durable film surface of the durable film to a first flexible substrate surface of the flexible substrate, the second durable film surface being opposite the first durable film surface, further wherein each of the following One of: (a) at least one of the second durable film surface or the first flexible substrate surface comprises the second adhesive, or (b) the second durable film surface is attached to the first Providing on the surface of the flexible substrate at the surface of the second durable film The second adhesive or at least one of the second adhesive is provided at the surface of the first flexible substrate; and the first durable film surface is attached to the carrier substrate and the second durable The surface of the film attached to the surface of the first flexible substrate occurs substantially simultaneously with each other. The method of any one of claims 17 to 19, further comprising: forming the one or more electronic devices on a second flexible substrate surface of the flexible substrate, the second flexible substrate The surface is opposite the surface of the first flexible substrate. The method of any one of claims 16 to 19, wherein inserting the durable film between the carrier substrate and the flexible substrate comprises attaching the durable film to the flexible substrate, The flexible substrate is reinforced. The method of any one of claims 16 to 19, further comprising: after inserting the durable film between the carrier substrate and the flexible substrate, the first durable film from the carrier substrate Go to connect; and When the flexible substrate is detached from the carrier substrate, the stress formed at the flexible substrate is substantially alleviated by the durable film. An electronic device structure comprising: an intermediate substrate including a first intermediate substrate surface and a second intermediate substrate surface opposite the first intermediate substrate surface, the first The intermediate substrate surface is configured to be coupled to a carrier substrate by a first adhesive; and a flexible substrate comprising a first flexible substrate surface and a first flexible a second flexible substrate surface opposite the substrate surface, the first flexible substrate surface being coupled to the carrier substrate and the first flexible substrate surface being coupled to the second intermediate substrate surface, the first flexibility A substrate surface is configured for attachment to the second intermediate substrate surface by a second adhesive and the first flexible substrate surface is configured to enable one or more electronic devices to be in the second flexibility Formed on the surface of the substrate. The electronic device structure of claim 23, further comprising: the carrier substrate. The electronic device structure of claim 23, further comprising: the first adhesive and the second adhesive, wherein the first adhesive connects the first intermediate substrate surface to the carrier A substrate and a second adhesive connect the second intermediate substrate surface to the first flexible substrate surface. The electronic device structure of claim 23, wherein: the first adhesive comprises an adhesive material; and the second adhesive comprises the adhesive material. The electronic device structure of claim 23, wherein: the first adhesive comprises one of a Henkel NS122 adhesive, an EccoCoat 3613 adhesive, or a pressure sensitive adhesive; and the second adhesive The mixture includes the Henkel NS122 adhesive, the EccoCoat 3613 adhesive, Or one of the pressure sensitive adhesives. The electronic device structure of claim 23, further comprising: a nitride barrier layer between the surface of the second flexible substrate and the one or more electronic devices. The electronic device structure of claim 23, wherein at least one of the following: the carrier substrate comprises alumina, bismuth, iron, sapphire, barium borate, sodium calcium citrate, Or at least one of an alkali silicate; the flexible substrate comprises a flexible glass material; or the intermediate substrate comprises polyethylene naphthalate, polyethylene terephthalate, polyether oxime, poly At least one of a quinone imine, a polycarbonate, a cyclic olefin copolymer, or a liquid crystal polymer. The electronic device structure of any one of claims 23 to 29, further comprising: the one or more electronic devices above the surface of the second flexible substrate. The electronic device structure of claim 30, wherein at least one of the following: the carrier substrate comprises alumina, bismuth, iron, sapphire, barium borate, sodium calcium citrate, Or at least one of an alkali silicate; the flexible substrate comprises a flexible glass material; or the intermediate substrate comprises polyethylene naphthalate, polyethylene terephthalate, polyether oxime, poly At least one of a quinone imine, a polycarbonate, a cyclic olefin copolymer, or a liquid crystal polymer. The electronic device structure of claim 30, wherein the one or more electronic devices comprise at least one of an electronic sensor, an electronic display, an electronic transistor, an electronic diode, or a microelectromechanical system. item. The electronic device structure as described in claim 30, wherein: The intermediate substrate is configured to be disconnected from the carrier substrate and the flexible substrate without damaging the one or more electronic devices or the flexible substrate. The electronic device structure of any one of claims 23 to 29, wherein the intermediate substrate is configured to be disconnected from the carrier substrate and the flexible substrate without damaging the one or A plurality of electronic devices or the flexible substrate.