EP2786645A4 - Method of providing an electronic device structure and related electronic device structures - Google Patents

Method of providing an electronic device structure and related electronic device structures

Info

Publication number
EP2786645A4
EP2786645A4 EP12854351.9A EP12854351A EP2786645A4 EP 2786645 A4 EP2786645 A4 EP 2786645A4 EP 12854351 A EP12854351 A EP 12854351A EP 2786645 A4 EP2786645 A4 EP 2786645A4
Authority
EP
European Patent Office
Prior art keywords
electronic device
providing
device structure
structures
device structures
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP12854351.9A
Other languages
German (de)
French (fr)
Other versions
EP2786645A1 (en
Inventor
Emmett Howard
Douglas E Loy
Nicholas Munizza
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Arizona Board of Regents of ASU
University of Arizona
Original Assignee
Arizona Board of Regents of ASU
University of Arizona
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arizona Board of Regents of ASU, University of Arizona filed Critical Arizona Board of Regents of ASU
Publication of EP2786645A1 publication Critical patent/EP2786645A1/en
Publication of EP2786645A4 publication Critical patent/EP2786645A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/08—Dimensions, e.g. volume
    • B32B2309/10—Dimensions, e.g. volume linear, e.g. length, distance, width
    • B32B2309/105—Thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
EP12854351.9A 2011-11-29 2012-11-28 Method of providing an electronic device structure and related electronic device structures Withdrawn EP2786645A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161564535P 2011-11-29 2011-11-29
PCT/US2012/066833 WO2013082138A1 (en) 2011-11-29 2012-11-28 Method of providing an electronic device structure and related electronic device structures

Publications (2)

Publication Number Publication Date
EP2786645A1 EP2786645A1 (en) 2014-10-08
EP2786645A4 true EP2786645A4 (en) 2016-11-09

Family

ID=48536005

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12854351.9A Withdrawn EP2786645A4 (en) 2011-11-29 2012-11-28 Method of providing an electronic device structure and related electronic device structures

Country Status (7)

Country Link
EP (1) EP2786645A4 (en)
JP (1) JP2014533893A (en)
KR (1) KR20140123480A (en)
CN (1) CN104041199A (en)
SG (1) SG11201402622YA (en)
TW (1) TW201345726A (en)
WO (1) WO2013082138A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9991311B2 (en) 2008-12-02 2018-06-05 Arizona Board Of Regents On Behalf Of Arizona State University Dual active layer semiconductor device and method of manufacturing the same
JP5832780B2 (en) 2011-05-24 2015-12-16 株式会社半導体エネルギー研究所 Manufacturing method of semiconductor device
US10381224B2 (en) 2014-01-23 2019-08-13 Arizona Board Of Regents On Behalf Of Arizona State University Method of providing an electronic device and electronic device thereof
WO2015156891A2 (en) 2014-01-23 2015-10-15 Arizona Board Of Regents, Acting For And On Behalf Of Arizona State University Method of providing a flexible semiconductor device and flexible semiconductor device thereof
WO2017034644A2 (en) 2015-06-09 2017-03-02 ARIZONA BOARD OF REGENTS a body corporate for THE STATE OF ARIZONA for and on behalf of ARIZONA STATE UNIVERSITY Method of providing an electronic device and electronic device thereof
CN106104778A (en) * 2014-01-27 2016-11-09 康宁股份有限公司 Goods and method for polymer surfaces and the controlled bonding of carrier
CN106663640B (en) 2014-05-13 2020-01-07 代表亚利桑那大学的亚利桑那校董会 Method of providing an electronic device and electronic device thereof
US10446582B2 (en) 2014-12-22 2019-10-15 Arizona Board Of Regents On Behalf Of Arizona State University Method of providing an imaging system and imaging system thereof
US9741742B2 (en) 2014-12-22 2017-08-22 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Deformable electronic device and methods of providing and using deformable electronic device
CN106527796B (en) * 2016-10-31 2019-06-07 京东方科技集团股份有限公司 A kind of panel making method, touch panel and display equipment
CN110065267B (en) 2019-04-26 2021-03-26 京东方科技集团股份有限公司 Deformable material, deformation structure, Micro-LED display device and strain sensor

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4087300A (en) * 1974-01-07 1978-05-02 Edward Adler Process for producing metal-plastic laminate
US5837380A (en) * 1995-12-26 1998-11-17 Lucent Technologies, Inc. Multilayer structures and process for fabricating the same
US5869150A (en) * 1994-07-18 1999-02-09 Sharp Kabushiki Kaisha Substrate carrier jig and method of producing liquid crystal display element by using the substrate carrier jig
US20100051189A1 (en) * 2008-08-29 2010-03-04 Tdk Corporation Method of manufacturing wiring board
WO2010065542A1 (en) * 2008-12-02 2010-06-10 Arizona Board Of Regents, For And On Behalf Of Arizona State University Method of preparing a flexible substrate assembly and flexible substrate assembly therefrom
US20100154992A1 (en) * 2008-12-22 2010-06-24 Feinstein Casey J Layer-Specific Energy Distribution Delamination

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7223672B2 (en) * 2002-04-24 2007-05-29 E Ink Corporation Processes for forming backplanes for electro-optic displays
JP2004311912A (en) * 2002-12-06 2004-11-04 Sony Corp Circuit board module and its manufacturing method
US20090200543A1 (en) * 2008-02-08 2009-08-13 Roger Stanley Kerr Method of forming an electronic device on a substrate supported by a carrier and resultant device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4087300A (en) * 1974-01-07 1978-05-02 Edward Adler Process for producing metal-plastic laminate
US5869150A (en) * 1994-07-18 1999-02-09 Sharp Kabushiki Kaisha Substrate carrier jig and method of producing liquid crystal display element by using the substrate carrier jig
US5837380A (en) * 1995-12-26 1998-11-17 Lucent Technologies, Inc. Multilayer structures and process for fabricating the same
US20100051189A1 (en) * 2008-08-29 2010-03-04 Tdk Corporation Method of manufacturing wiring board
WO2010065542A1 (en) * 2008-12-02 2010-06-10 Arizona Board Of Regents, For And On Behalf Of Arizona State University Method of preparing a flexible substrate assembly and flexible substrate assembly therefrom
US20100154992A1 (en) * 2008-12-22 2010-06-24 Feinstein Casey J Layer-Specific Energy Distribution Delamination

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2013082138A1 *

Also Published As

Publication number Publication date
EP2786645A1 (en) 2014-10-08
JP2014533893A (en) 2014-12-15
SG11201402622YA (en) 2014-06-27
KR20140123480A (en) 2014-10-22
CN104041199A (en) 2014-09-10
WO2013082138A1 (en) 2013-06-06
TW201345726A (en) 2013-11-16

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Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20140609

AK Designated contracting states

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Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

RIN1 Information on inventor provided before grant (corrected)

Inventor name: MUNIZZA, NICHOLAS

Inventor name: LOY, DOUGLAS E

Inventor name: HOWARD, EMMETT

DAX Request for extension of the european patent (deleted)
RIC1 Information provided on ipc code assigned before grant

Ipc: H05K 3/00 20060101AFI20160628BHEP

Ipc: B32B 37/12 20060101ALI20160628BHEP

Ipc: B32B 37/02 20060101ALI20160628BHEP

Ipc: H05K 1/03 20060101ALN20160628BHEP

RA4 Supplementary search report drawn up and despatched (corrected)

Effective date: 20161007

RIC1 Information provided on ipc code assigned before grant

Ipc: H05K 3/00 20060101AFI20160930BHEP

Ipc: B32B 37/02 20060101ALI20160930BHEP

Ipc: H05K 1/03 20060101ALN20160930BHEP

Ipc: B32B 37/12 20060101ALI20160930BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20170505