EP2775790B1 - Kocheinrichtung - Google Patents

Kocheinrichtung Download PDF

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Publication number
EP2775790B1
EP2775790B1 EP14401014.7A EP14401014A EP2775790B1 EP 2775790 B1 EP2775790 B1 EP 2775790B1 EP 14401014 A EP14401014 A EP 14401014A EP 2775790 B1 EP2775790 B1 EP 2775790B1
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EP
European Patent Office
Prior art keywords
sensor
cooking
sensor device
radiation
designed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP14401014.7A
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German (de)
English (en)
French (fr)
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EP2775790A1 (de
Inventor
Volker Backherms
Dominic Beier
Holger Ernst
Meike Garben
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Miele und Cie KG
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Miele und Cie KG
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Publication of EP2775790A1 publication Critical patent/EP2775790A1/de
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
    • H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24C—DOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
    • F24C7/00—Stoves or ranges heated by electric energy
    • F24C7/08—Arrangement or mounting of control or safety devices
    • F24C7/082—Arrangement or mounting of control or safety devices on ranges, e.g. control panels, illumination
    • F24C7/083—Arrangement or mounting of control or safety devices on ranges, e.g. control panels, illumination on tops, hot plates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/02—Induction heating
    • H05B6/10—Induction heating apparatus, other than furnaces, for specific applications
    • H05B6/12—Cooking devices
    • H05B6/1209—Cooking devices induction cooking plates or the like and devices to be used in combination with them
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2213/00—Aspects relating both to resistive heating and to induction heating, covered by H05B3/00 and H05B6/00
    • H05B2213/07—Heating plates with temperature control means

Definitions

  • the present invention relates to a cooking device with at least one hob, wherein the hob comprises at least one cooking point.
  • the hob comprises at least one cooking point.
  • at least one heating device is provided for heating at least one cooking area.
  • a prerequisite for an automatic operation of a cooking device is sometimes an accurate detection of various parameters that are characteristic of the cooking process, such. B. the temperature of the food.
  • the heating source is automatically controlled in an automatic function of a cooking device, for. B. to avoid overheating of the food.
  • the reproducibility and the accuracy of the recorded parameters is therefore important for the functionality of the automatic function and thus an important quality feature of a modern cooking appliance with automatic functions.
  • One way of determining temperature during cooking and cooking processes is, for example, a temperature sensor integrated in the food container.
  • a temperature sensor integrated in the food container.
  • the user must use special food containers and could not use his previous cookware.
  • a temperature sensor which is placed with the food in the cookware, since the sensor must be "fished out" of the food later and should not be eaten by mistake.
  • the heat sensor should have a certain distance from the hob plate to avoid damage, for example, in case of unforeseen shocks or shocks in the region of the heat sensor on the hob plate. Such shocks can occur, for example, during the abrupt placement or fall of pots or other objects on the hob.
  • a cooking device comprises at least one hob with at least one cooking point. At least one heating device is provided for heating at least one cooking area. At least one sensor device is used to detect at least one physical quantity.
  • the hob has at least one carrier device which is suitable and designed for positioning at least one Gargut materialsers. At least one damping device is provided, by means of which damping device the sensor device in the installation position of the hob below the carrier device is arranged at least partially elastically and in particular at least substantially elastically.
  • the invention has many advantages. Since the sensor device preferably close below the z. B. designed as a glass ceramic or such a comprehensive carrier device is arranged to a particularly reliable detection of the physical size In particular to ensure the cooking area, even small unexpected shock or mechanical stress can lead to contact of the sensor device with the carrier device. A rigid arrangement of the sensor device can then lead to locally very high loads on the carrier device, as a result of which damage to the carrier device or even breakage of a carrier device designed as a glass ceramic can occur. By a z. B. directly adjacent arrangement of the sensor device can then optionally be increased, the measurement accuracy in the detection of physical size, but this can already lead to a break in shocks. The inventive elastic recording of the sensor device relative to the support means such damage can be reliably avoided. The sensor device can be arranged very close below the carrier device.
  • the sensor device is preferably kept spring-loaded relative to the carrier device.
  • the damping device may be attached to the carrier device. But it is possible z. As well as an attachment of the damping device to a housing or a frame of the cooking device.
  • the damping device is arranged at least partially and / or in sections on the hob. It is also possible to arrange the damping device on the housing of the cooking device and / or the induction coil device or the like.
  • the damping device is attached or arranged on the covering device.
  • the damping device particularly preferably comprises at least one spring device and in particular at least one coil spring and / or leaf spring and / or disc spring and / or gas spring. It is also possible to use compression springs and / or tension springs.
  • the sensor device comprises in particular at least one support device and at least one housing.
  • the damping device or at least part of the damping device may be at least partially disposed between the support means and the housing.
  • the support means may comprise or be formed as a circuit board or printed circuit board.
  • the damping device comprises a resilient seal, such. B. from a silicone material or at least partially.
  • the sealing device may be at least partially or partially be arranged between the support means and at least a part of the sensor device.
  • the sealing device can also shield the region of the sensor device from dust and other environmental influences.
  • the sealing device can be designed as a resilient seal.
  • At least part of the sensor device is preferably acted on by the damping device with at least one spring force.
  • at least one part and in particular the sensor device as a whole is resiliently biased against at least a part of the sealing device. If the sensor device rests elastically resiliently on the carrier device, the sensor device can occur when strong loads of the carrier device, the z. B. lead to a deflection of the support means, the sensor device elastically dodge to the rear, so that even with strong shocks to the support means, load peaks are avoided by a beating of the support means on the sensor device.
  • a possible stroke of the sensor device is preferably greater than half the thickness of the carrier device and in particular greater than the thickness of the carrier device and may preferably be more than twice the thickness of the carrier device.
  • the damping device is designed and suitable for damping a force acting on the carrier device substantially opposite to the spring force.
  • the sensor device can deflect against the spring force of the spring device in order to avoid load peaks on the carrier device and / or the sensor device.
  • the sensor device can be arranged at least partially surrounded by the heating device.
  • the sensor device is practically completely surrounded by parts of the heating device in a plane parallel to the plane of the carrier device.
  • the heating device comprises in particular at least one induction device.
  • the induction device can have one, two or a multiplicity of induction coils.
  • the sensor device preferably has at least one magnetic shielding device, wherein the magnetic shielding device is designed and suitable in particular for shielding electromagnetic interactions and preferably for shielding from the electromagnetic field of the induction device.
  • the sensor device can be effectively protected from the electromagnetic field of the induction device, so that thermal heating of the sensor device and other disturbing influences can be considerably reduced. This can increase the accuracy and reliability of the measurement.
  • At least one sealing device is preferably arranged at least partially between the carrier device and the magnetic shielding device.
  • the sealing device preferably consists at least partially of a softer material than the carrier device or comprises elastic components or parts.
  • the sensor device comprises at least one sensor unit, which is suitable in particular for non-contact detection of at least one characteristic parameter for temperatures.
  • the sensor device is used to detect a temperature of the pot bottom of a pot or cooking product container located in the cooking region.
  • the invention enables integration of a sensor device on a hob, wherein the sensor device can be designed as an optical module.
  • the sensor device as an optical module can, for. B. by means of springs easily pressed against the glass ceramic plate as part of the support means.
  • the sensor device can be accommodated protected on a housing. The sensor device and the glass ceramic plate are thus much better protected under shock loads.
  • the sensor device which is designed in particular as an optical module, is preferably used for non-contact temperature measurement. After a measurement of the heat radiation from the bottom of the cookware or the Gargefäßêts and the glass ceramic plate, the signals can be charged to close the cooking vessel temperature.
  • An essential feature is the spring-mounted mounting of the optical module as a sensor device. This allows an optimal contact pressure on the seal between the glass ceramic and the ferrite ring as a magnetic shielding device and in particular the absorption of energy in case of impacts on the surface of the glass ceramic plate.
  • the housing of the sensor device is fastened in particular with screws or the like on the cover plate.
  • the sensor device or the optical module should preferably be fastened to the cover plate with at least two screws or the like.
  • B. two or more pins and two or more springs are provided for the resilient mounting of the optics module z.
  • a fan may be provided which sufficiently cools the optical module as a sensor device.
  • This fan can be located both inside and outside the optical module enclosure.
  • the FIG. 1 shows a cooking device 1 according to the invention, which is designed here as part of a cooking appliance 100.
  • the cooking appliance 1 or the cooking appliance 100 can be designed both as a built-in appliance and as a self-sufficient cooking appliance 1 or stand-alone cooking appliance 100.
  • the cooking device 1 here comprises a hob 11 with four cooking zones 21.
  • Each of the cooking zones 21 here has at least one heatable cooking area 31 for cooking food.
  • a heating device 2 not shown here, is provided in total for each hotplate 21.
  • the heating devices 2 are designed as induction heating sources and each have an induction device 12 for this purpose. But it is also possible that a cooking area 31 is not associated with any particular cooking area 21, but represents any location on the hob 11. In this case, the cooking area 31 may have a plurality of induction devices 12 and in particular a plurality of induction coils and be formed as part of a so-called full-surface induction unit.
  • a pot can be placed anywhere on the hob 11, wherein during cooking only the corresponding induction coils are driven in the pot or are active.
  • other types of heaters 2 are also possible, such as e.g. Gas, infrared or resistance heating sources.
  • the cooking device 1 can be operated here via the operating devices 105 of the cooking appliance 100.
  • the cooking device 1 can also be designed as a self-sufficient cooking device 1 with its own operating and control device. Also possible is an operation via a touch-sensitive surface or a touch screen or remotely via a computer, a smartphone or the like.
  • the cooking appliance 100 is here designed as a stove with a cooking chamber 103, which can be closed by a cooking chamber door 104.
  • the cooking chamber 104 can be heated by various heating sources, such as a Um Kunststoffsagenmaschine.
  • Other heating sources such as a top heat radiator and a bottom heat radiator and a microwave heat source or a vapor source and the like may be provided.
  • the sensor device 3 can detect a variable, via which the temperature of a pot can be determined, which is turned off in the cooking area 31.
  • each cooking area 31 and / or each cooking place 21 can be assigned a sensor device 3.
  • the sensor device 3 is operatively connected to a control device 106 here.
  • the control device 106 is designed to control the heating devices 2 as a function of the parameters detected by the sensor device 3.
  • the cooking device 1 is preferably designed for an automatic cooking operation and has various automatic functions.
  • a soup can be boiled briefly and then kept warm without a user having to supervise the cooking process or set a heating level. For this he sets the pot with the soup on a hob 21 and selects the corresponding automatic function via the operating device 105, here z. As a boil with subsequent keeping warm at 60 ° C or 70 ° C or the like.
  • the temperature of the pot bottom is determined during the cooking process.
  • the control device 106 sets the heating power of the heating device 2 accordingly.
  • the temperature of the bottom of the pot is monitored continuously, so that when the desired temperature or when boiling the soup, the heating power is regulated down.
  • the automatic function it is also possible by the automatic function to perform a longer cooking process at one or more different desired temperatures, for. B. to slowly let rice pudding draw.
  • a cooking device 1 is shown in a sectional side view very schematic.
  • the cooking device 1 here has a carrier device 5 designed as a glass ceramic plate 15.
  • the glass ceramic plate 15 may in particular be designed as a ceramic hob or the like or at least comprise such. Also possible are other types of support means 5.
  • On the glass ceramic plate 15 is here a cookware or food containers 200, such as a pot or a pan, in which food or food can be cooked.
  • a sensor device 3 is provided which detects heat radiation in a detection region 83 here.
  • the detection area 83 is provided in the installed position of the cooking device 1 above the sensor device 3 and extends upward through the glass ceramic plate 15 to the food container 200 and beyond, if there is no food container 200 is placed there.
  • an induction device 12 for heating the cooking area 31 is attached below the glass ceramic plate 15, an induction device 12 for heating the cooking area 31 is attached.
  • the induction device 12 is here annular and has in the middle a recess in which the sensor device 3 is mounted.
  • Such an arrangement of the sensor device 3 has the advantage that it is still in the detection range 83 of the sensor device even if the food container 200 is not centered on the cooking point 21.
  • the sensor device 3 may also not be arranged centrally in the induction device. If an induction device has, for example, a dual-circuit induction coil, then at least one sensor device 3 can be arranged in a space provided between the two induction coils of the induction device.
  • the FIG. 3 shows a schematic cooking device 1 in a sectional side view.
  • the cooking device 1 has a glass ceramic plate 15, below which the induction device 12 and the sensor device 3 are mounted.
  • the sensor device 3 has a first sensor unit 13 and another sensor unit 23. Both sensor units 13, 23 are suitable for non-contact detection of thermal radiation and designed as a thermopile or thermopile.
  • the sensor units 13, 23 are each equipped with a filter device 43, 53 and provided for detecting heat radiation emanating from the cooking area 31.
  • the thermal radiation emanates, for example, from the bottom of a food container 200, penetrates the glass ceramic plate 15 and reaches the sensor units 13, 23.
  • the sensor device 3 is advantageously mounted directly underneath the glass ceramic plate 15 in order to maximize the proportion of heat radiation emanating from the cooking region 31 without great losses to be able to capture.
  • the sensor units 13, 23 are provided close to the glass ceramic plate 15.
  • a magnetic shielding device 4 which consists of a ferrite body 14 here.
  • the ferrite body 14 is essentially designed here as a hollow cylinder and surrounds the sensor units 13, 23 in an annular manner.
  • the magnetic shielding device 4 shields the sensor device 3 against electromagnetic interactions and in particular against the electromagnetic field of the induction device 12. Without such shielding, the magnetic field generated by induction device 12 during operation could undesirably heat parts of sensor device 3 as well, resulting in unreliable temperature sensing and inferior measurement accuracy.
  • the magnetic shielding device 4 thus considerably improves the accuracy and reproducibility of the temperature detection.
  • the magnetic shielding device 4 may also consist at least in part of at least one at least partially magnetic material and an at least partially electrically non-conductive material.
  • the magnetic material and the electrically non-conductive material may be arranged alternately and in layers. Also possible are other materials or materials which have at least partially magnetic properties and also have electrically insulating properties or at least low electrical conductivity.
  • the sensor device 3 has at least one optical screen device 7, which is provided to shield radiation influences and in particular heat radiation, which act on the sensor units 13, 23 from outside the detection zone 83.
  • the optical shield device 7 is designed here as a tube or a cylinder 17, wherein the cylinder 17 is hollow and the sensor units 13, 23 surrounds approximately annular.
  • the cylinder 17 is made of stainless steel here. This has the advantage that the cylinder 17 a has reflective surface, which reflects a large proportion of the much heat radiation and absorbs as little heat radiation as possible.
  • the high reflectivity of the surface on the outside of the cylinder 17 is particularly advantageous for the shielding against thermal radiation.
  • the high reflectivity of the surface on the inside of the cylinder 17 is also advantageous in order to direct thermal radiation from (and in particular only out) the detection area 83 to the sensor units 13, 23.
  • the optical screen device 7 can also be configured as a wall, which surrounds the sensor device 13, 23 at least partially and preferably annularly.
  • the cross section may be round, polygonal, oval or rounded. Also possible is a configuration as a cone.
  • an insulation device 8 for thermal insulation is provided, which is arranged between the optical shield device 7 and the magnetic shielding device 4.
  • the insulation device 8 consists here of an air layer 18, which is between the ferrite 14 and the cylinder 17.
  • the insulation device 8 in particular a heat conduction from the ferrite 14 to the cylinder 17 is counteracted.
  • the insulation device 8 has, in particular, a thickness of between approximately 0.5 mm and 5 mm and preferably a thickness of 0.8 mm to 2 mm and particularly preferably a thickness of approximately 1 mm.
  • the isolation device 8 may also be at least one medium with a correspondingly low heat conduction, such. B. include a foam material and / or a polystyrene plastic or other suitable insulating material.
  • the sensor units 13, 23 are arranged here in a thermally conductive manner on a thermal compensation device 9 and in particular are coupled in a thermally conductive manner to the thermal compensation device 9.
  • the thermal compensation device 9 has for this purpose two coupling devices 29, which are formed here as depressions, in which the sensor units 13, 23 are embedded accurately. This ensures that the sensor units 13, 23 are at a common and relatively constant temperature level.
  • the thermal compensation device 9 ensures a homogeneous temperature of the sensor unit 13, 23, when they are in operation of the cooking device. 1 heated. An unequal own temperature can lead to artefacts during the detection, in particular in the case of sensor units 13, 23 designed as thermopiles.
  • a spacing between cylinder 17 and thermal compensation device 9 is provided.
  • the copper plate 19 may also be provided as the bottom 27 of the cylinder 17.
  • the thermal compensation device 9 is designed here as a solid copper plate 19.
  • the thermal compensation device 9 is also possible at least in part another material with a correspondingly high heat capacity and / or a high thermal conductivity.
  • the sensor device 3 here has a radiation source 63, which can be used to determine the reflection properties of the measuring system or the emissivity of a food container 200.
  • the radiation source 63 is embodied here as a lamp 111, which emits a signal in the wavelength range of the infrared light and the visible light.
  • the radiation source 63 may also be formed as a diode or the like.
  • the lamp 111 is used here in addition to the reflection determination for signaling the operating state of the cooking device 1.
  • a region of the thermal compensation device 9 or the copper plate 19 is formed as a reflector 39.
  • the copper plate 19 has a concave-shaped depression, in which the lamp 111 is arranged.
  • the copper plate 19 is also coated with a gold-containing coating to increase the reflectivity.
  • the gold-containing layer has the advantage that it also protects the thermal compensation device 9 from corrosion.
  • the thermal compensation device 9 is attached to a holding device 10 designed as a plastic holder.
  • the holding device 10 has a connecting device 20, not shown here, by means of which the holding device 10 can be latched to a support means 30.
  • the support device 30 is formed here as a printed circuit board 50. On the support means 30 and the circuit board 50 also other components may be provided, such. B electronic components, control and computing devices and / or mounting or mounting elements.
  • a sealing device 6 is provided between the glass ceramic plate 15 and the induction device 12, which is designed here as a micanite layer 16.
  • the micanite layer 16 is used for thermal insulation, so that the induction device 12 is not heated by the heat of the cooking area 31.
  • a micanite layer 16 for thermal insulation between the ferrite body 14 and the glass-ceramic plate 15 is provided here. This has the advantage that the heat transfer from the hot during operation Glass ceramic plate 15 to the ferrite 14 is severely limited. As a result, hardly any heat emanates from the ferrite body 14, which could be transmitted to the insulation device 8 or the optical screen device. The micanite layer 16 thus counteracts an undesirable heat transfer to the sensor device 3, which increases the reliability of the measurements.
  • the microlayer 16 seals the sensor device 3 dust-tight against the remaining regions of the cooking device 1.
  • the micanite layer 16 has a thickness between about 0.2 mm and 4 mm, preferably from 0.2 mm to 1.5 mm and particularly preferably a thickness of 0.3 mm to 0.8 mm.
  • the cooking device 1 has on the underside a cover 41, which is designed here as an aluminum plate and covers the Indu Vietnameseseicardi 12.
  • the covering device 41 is connected to a housing 60 of the sensor device 3 via a screw connection 122.
  • the sensor device 3 is arranged elastically relative to the glass ceramic plate 15.
  • a damping device 102 is provided which has a spring device 112 here.
  • the spring device 112 is connected at a lower end to the inside of the housing 60 and at an upper end to the printed circuit board 50.
  • the spring device 112 presses the printed circuit board 50 with the ferrite body 14 and the micanite layer 16 mounted thereon upwards against the glass ceramic plate 15.
  • Such an elastic arrangement is particularly advantageous since the sensor device 3 should be arranged as close as possible to the glass ceramic plate 15 for metrological reasons , This directly adjacent arrangement of the sensor device 3 on the glass ceramic plate 15 could cause damage to the glass ceramic plate 15 in the event of impacts or impacts. Due to the elastic reception of the sensor device 3 relative to the carrier device 5, shocks or impacts are damped on the glass ceramic plate 15 and thus reliably prevent such damage.
  • the first sensor unit 13 detects heat radiation emanating from the bottom of the pot as mixed radiation together with the heat radiation which is emitted by the glass-ceramic plate 15.
  • the portion of the radiation output emanating from the glass ceramic plate 15 is calculated out of the mixed radiation power.
  • the other sensor unit 23 is provided to detect only the heat radiation of the glass-ceramic plate 15.
  • the other sensor unit 23 has a filter device 53, which transmits essentially only radiation having a wavelength greater than 5 ⁇ m to the sensor unit 23. The reason is that radiation with one wavelength greater than 5 microns or hardly by the glass ceramic plate 15 is transmitted.
  • the other sensor unit 23 thus essentially detects the heat radiation emitted by the glass ceramic plate 15. With the knowledge of the portion of the heat radiation, which is emitted from the glass ceramic plate 15, can be determined in per se known, the proportion of heat radiation, which emanates from the bottom of the pot.
  • the first sensor unit 13 is equipped with a filter device 43 which is very permeable to radiation in this wavelength range, while the filter device 43 substantially reflects radiation from other wavelength ranges.
  • the filter devices 43, 53 are here each formed as an interference filter 433 and in particular designed as a bandpass filter or as a long-pass filter.
  • a detection of the radiation in the wavelength range between 3 .mu.m and 5 .mu.m and in particular in the range of 3.1 .mu.m to 4.2 .mu.m be provided, wherein the respective sensor unit and filter device is then respectively formed or adapted accordingly.
  • the determination of a temperature from a specific radiant power is a known method.
  • the decisive factor is that the emissivity of the body is known, from which the temperature is to be determined. In the present case, therefore, the emissivity of the pot bottom must be known or determined for a reliable temperature determination.
  • the sensor device 3 here has the advantage that it is designed to determine the emissivity of a Gargut variousers 200. This is particularly advantageous, since thus any cookware can be used and not just a specific food container whose emissivity must be known in advance.
  • the lamp 111 emits a signal, in particular a light signal, which has a proportion of heat radiation in the wavelength range of the infrared light.
  • the radiant power or thermal radiation of the lamp 111 passes through the glass ceramic plate 15 on the bottom of the pot and is partially reflected there and partially absorbed.
  • the radiation reflected from the bottom of the pot passes through the glass-ceramic plate 15 back to the sensor device 3, where it is detected by the first sensor unit 13.
  • Simultaneously with the signal reflected from the bottom of the pot and transmitted by the glass ceramic plate 15 signal radiation and the own heat radiation of the pot bottom and the thermal radiation of the glass ceramic plate 15 reaches the first sensor unit 13.
  • the lamp 111 is turned off and only the heat radiation of the pot bottom and the glass ceramic plate 15 detected.
  • At least one reference value with regard to reflected radiation and the associated emissivity is deposited in a memory unit which cooperates with the sensor device and is not shown in the figures, wherein the memory unit can be arranged, for example, on the printed circuit board 50.
  • the respective actual emissivity of the pot bottom can then be determined based on a comparison of the reflected signal radiation with the at least one reference value.
  • the proportion of the signal radiation absorbed by the bottom of the pot is determined. This results according to methods known per se from the radiation power emitted by the lamp 111 less the signal radiation reflected from the bottom of the pot.
  • the radiation power of the lamp 111 is either fixed and thus known or is determined for example by a measurement with the other sensor unit 23.
  • the other sensor unit 23 detects a wavelength range of the signal radiation, which is almost completely reflected by the glass ceramic plate 15.
  • the emitted radiation power can be determined in a very suitable approximation, whereby inter alia a wavelength dependence of the radiation line or the spectrum of the lamp 111 must be taken into account.
  • the degree of absorption of the pot bottom can be determined in a known manner. Since the absorption capacity of a body corresponds in principle to the emissivity of a body, the desired emissivity can be derived from the degree of absorption of the pot bottom. With the knowledge of the emissivity and the amount of thermal radiation, which emanates from the bottom of the pot, the temperature of the pot bottom can be determined very reliably.
  • the emissivity is preferably continuously redefined in the shortest possible intervals. This has the advantage that a subsequent change in the emissivity does not lead to a falsified measurement result.
  • a change in the emissivity may occur, for example, when the cookware bottom has different emissivities and is displaced on the cooking surface 21. Different emissivities are very common in cookware trays observed because z. B. already light soiling, corrosion or even different coatings or coatings can have a major impact on the emissivity.
  • the lamp 111 is also used here for signaling the operating state of the cooking device 1 in addition to the determination of the emissivity or the determination of the reflection behavior of the measuring system.
  • the signal of the lamp 111 also includes visible light, which is perceptible by the glass-ceramic plate 15.
  • the lamp 111 indicates to a user that an automatic function is in operation.
  • Such an automatic function can, for. B. be a cooking operation, in which the heater 2 is controlled automatically in dependence of the determined pot temperature. This is particularly advantageous because the lighting up of the lamp 111 does not confuse the user. The user knows from experience that the lighting is an operation indicator and belongs to the normal appearance of the cooking device 1.
  • a flash of the lamp 111 is not a malfunction and the cooking device 1 may not work properly.
  • the lamp 111 may also light up in a certain duration and at certain intervals. It is possible z. B. also that different operating states can be output via different flashing frequencies. Different signals are also possible via different on / off sequences.
  • a sensor device 3 with a radiation source 63 which is suitable for displaying at least one operating state, is provided for each cooking point 21 or each (possible) cooking region 31.
  • At least one arithmetic unit may be provided for the necessary calculations for determining the temperature and for the evaluation of the detected variables.
  • the arithmetic unit can be at least partially provided on the circuit board 50.
  • the control device 106 it is also possible, for example, for the control device 106 to be designed accordingly, or at least one separate arithmetic unit is provided.
  • the FIG. 4 shows a development in which below the glass ceramic plate 15, a security sensor 73 is attached.
  • the safety sensor 73 is designed here as a temperature-sensitive resistor, such as a thermistor, in particular an NTC sensor, and thermally conductively connected to the glass ceramic plate 15.
  • the safety sensor 73 is provided here to be able to detect a temperature of the cooking area 31 and in particular of the glass ceramic plate 15. If the temperature exceeds a certain value, there is a risk of overheating and the heaters 2 are switched off.
  • the safety sensor 73 is operatively connected to a safety device, not shown here, which can trigger a safety state depending on the detected temperature.
  • a security condition has z. B. the shutdown of the heaters 2 and the cooking device 1 result.
  • the safety sensor 73 is assigned here as a further sensor unit 33 of the sensor device 3.
  • the values detected by the safety sensor 73 are also taken into account for the determination of the temperature by the sensor device 3.
  • the determination of the temperature of the glass ceramic plate 15 find the values of the safety sensor 73 use. So z. B. the temperature, which was determined by means of the other sensor unit 23 on the detected thermal radiation, are compared with the temperature detected by the safety sensor 73. This adjustment can on the one hand serve to control the function of the sensor device 3, but on the other hand can also be used for a tuning or adjustment of the sensor device 3.
  • a sensor device 3 is likewise shown, in which a safety sensor 73 is assigned as a further sensor unit 33 to the sensor device 3. Unlike the one in the FIG. 4 described embodiment, but no other sensor unit 23 is provided here. The task of the other sensor unit 23 is taken over here by the safety sensor 73.
  • the safety sensor 73 is used to determine the temperature of the glass ceramic plate 15. For example, with knowledge of this temperature from the thermal radiation, which detects the first sensor unit 13, the proportion of a pot bottom can be determined.
  • the other sensor unit 23 may be referred to as a second sensor unit.
  • the further sensor unit 33 may be referred to as a third sensor unit. In the embodiment according to Fig. 5 only the first sensor unit and the third sensor unit are provided.
  • FIG. 6 Another embodiment of a cooking device 1 is in the FIG. 6 shown.
  • a common sealing device 6 for the induction device 12 and the ferrite body 14 of the sensor device 3 is provided.
  • the sealing device 6 is designed as a micanite layer 16 which has a recess in the detection area 83 of the sensor device 3.
  • the FIG. 7 shows a schematic, magnetic shielding 4, which is formed as a hollow, cylindrical ferrite body 14.
  • a schematic, magnetic shielding 4 which is formed as a hollow, cylindrical ferrite body 14.
  • the wall of the ferrite body 14 has a thickness of about 1 mm to 10 mm and in particular from 2 mm to 5 mm, and particularly preferably from 2.5 mm to 4 mm and in particular of 3 mm or more.
  • FIG. 8 is an optical shield device 7 shown schematically, which is designed here as a cylinder 17.
  • the cylinder has here three locking devices 80, which are suitable for connection to a holding device 10.
  • a thermal compensation device 9 is in the FIG. 9 shown.
  • the thermal compensation device 9 is designed as a copper plate 19.
  • the copper plate has a thickness of 0.5 mm to 4 mm or even 10 mm or more, and more preferably from 0.8 mm to 2 mm, and more preferably 1 mm or more.
  • the copper plate 19 here has two coupling devices 29.
  • the coupling device 29 is suitable and provided to receive a sensor unit 13, 23 thermally conductive.
  • the copper plate 19 has a reflector device 39, which can reflect the radiation of a radiation source 63 and, in particular, can focus.
  • FIG. 10 shows a holding device 10, which is designed as a plastic holder.
  • the holding device 10 preferably has a thickness between 0.3 mm and 3 mm or even 6 mm, and particularly preferably a thickness of 1 mm or more.
  • the holding device 10 includes, for example, three connecting devices, of which only two connecting devices 20 are visible in the figure, by means of which the holding device 10 z. B. is connectable to a support device 30.
  • the holding device 10 on three receiving devices 40, which are formed here as webs.
  • the recording devices 40 are suitable for receiving the optical screen device 7 and arranging it at a defined distance from the magnetic shielding device 4. To carry out contacts receiving openings 70 are provided.
  • the holding device 10 may also have further, not shown receptacles 40 which z. B.
  • Such receiving devices 40 are provided in particular for the defined arrangement of a magnetic shielding device 4, an optical shield device 7, a thermal compensation device 9, an insulation device 8 and / or a support device 30.
  • a sensor unit 13 for non-contact detection of heat radiation is listed.
  • the sensor unit 13 is designed as a thermopile or thermopile.
  • the sensor unit 13 has contacts in order to connect them, for example, to a printed circuit board 50 or board.
  • a filter device 43 is arranged here.
  • FIG. 12a shows a formed as a thermopile sensor unit 13 with a filter device 43 in a sectioned, schematic side view.
  • the filter device 43 is arranged here on the region in which the thermal radiation impinges on the sensor unit 13 and is detected.
  • the filter device 43 is here attached to the sensor unit 13 with an adhesive connection means 430 in a thermally conductive manner.
  • the connecting means 430 here is an adhesive with a thermal conductivity of at least 1 W m -1 K -1 (W / (mK)) and preferably of 0.5 W m -1 K -1 (W / (mK)). Also possible and preferred is a thermal conductivity of more than 4 W m -1 K -1 (W / (mK)).
  • heat can be dissipated from the filter device 43 to the sensor unit 43.
  • the dissipation of the heat prevents the sensor unit 13 from detecting the self-heat of the filter device 43, which would lead to a falsified measurement result.
  • the heat from the filter device 43 via the sensor unit 13 also to the thermal compensation device 9 and the copper plate 19th to get redirected.
  • Such indirect dissipation of the heat from the filter device 43 via the sensor unit 13 to the copper plate 19 is also particularly favorable since the copper plate 19 has a high heat capacity.
  • the adhesive may be, for example, a thermosetting, one-component, solvent-free silver-filled epoxy conductive adhesive. Due to the proportion of silver or silver-containing compounds a very favorable thermal conductivity is achieved. Also possible is a proportion of other metals or metal compounds with a corresponding thermal conductivity. Such an adhesive ensures a thermally conductive connection, which is durable and stable even at the temperatures to be expected in a cooking device 1.
  • the filter device 43 is designed as an interference filter 433 and here has four filter layers 432 with a different refractive index and with dielectric properties. In this case, filter layers 432 with higher and lower refractive indices are alternately stacked and connected.
  • the filter layers 432 are, in particular, very thin, preferably a few nanometers to 25 nm.
  • the carrier layer for the filter layers 432 here is a filter base 431 made of a silicon-containing material with a thickness of more than 0.2 mm.
  • the filter device 43 is designed and suitable for transmitting a wavelength range in the infrared spectrum and for substantially reflecting radiation outside this range.
  • FIG. 12b shows a further embodiment of a sensor unit 13 with a filter device 43, wherein the filter device 43 is glued here only partially on the sensor device 13.
  • the region in which the heat radiation strikes and is detected on the sensor unit 13 is surrounded here by a raised edge region.
  • the connecting means 430 was applied only in an edge region. This has the advantage that the heat radiation to be detected does not have to pass through the connection means 430 before it strikes the sensor unit 13.
  • a sensor device 3 is shown in a plan view. For clarity and distinctiveness, some parts or areas are shaded. It can be clearly seen that the sensor device 3 has a concentric structure according to the onion shell principle. Inside there is a thermal compensation device 9 or a copper plate 19, on which two sensor units 13, 23 and designed as a lamp 111 radiation source 63 are arranged. So that no unwanted heat radiation from the side of the sensor units 13, 23 is incident, the sensor units 13, 23 are surrounded by an optical screen device 7 and a cylinder 17. The cylinder 17 is spaced from the copper plate 19, so that as possible no heat transfer between the cylinder 17 and copper plate 19 can take place. The cylinder 17 is of a magnetic shielding device 4 and a ferrite 14th surrounded. The ferrite body 14 represents the outermost layer of the sensor device 3 and shields it against electromagnetic interactions.
  • the sensor device 3 is preferably provided as close as possible below a carrier device 5, a sealing device 6 or a micanite layer 16 lies on the ferrite body 14, which considerably reduces a heat transfer from the carrier device 5 to the ferrite body 14.
  • an insulation device 8 is formed between the ferrite body 14 and the cylinder 17, an insulation device 8 is formed.
  • the insulation device 8 is here an air layer 18.
  • the air layer 18 counteracts a heat transfer from the ferrite body 14 to the cylinder 17.
  • the sensor units 13, 23 in the interior of the sensor device 3 are thus very effective against interference, such.
  • B. a magnetic field of an induction device 12, heat radiation from outside the detection range 83 and heating by heat conduction, protected.
  • Such a configured, shell-like arrangement of the listed components significantly increases the reliability of the measurements performed with the sensor device 3.
  • FIG. 14 shows a sensor device 3 in an exploded view.
  • the items are here shown spatially separated from each other, whereby the arrangement of the items within the sensor device 3 is clearly visible.
  • the concentric or onion-like structure is also clearly visible here. In addition to an improved measurement accuracy, such a structure also allows a particularly production-friendly and cost-effective installation of the sensor device 3.
  • a sensor unit 13, 23 may already be adhesively bonded to a filter device 43, 53 in a thermally conductive manner.
  • the circuit board 50 may already be partially equipped with electronic components prior to assembly. Preferably z. B. the radiation source 63 already contacted with the circuit board 50.
  • the holding device 10 designed as a plastic holder is first mounted on the supporting device 30 designed as a printed circuit board 50.
  • the holding device 10 at least one connecting device 20, not shown here, which is connected to the circuit board 50 and z. B. can be locked.
  • a holding device 10 with three connecting devices 20 is in the FIG. 10 shown.
  • the provided here as a copper plate 19 thermal compensation device 9 is inserted into the holding device 10.
  • the sensor units 13, 23 designed as thermopiles or thermopiles are then passed through receiving openings 70 in the copper plate 19, the holding device 10 and the printed circuit board 50.
  • the mounting of the holding device 10, the copper plate 19 and the sensor units 13, 23 can also be performed in any other order. So z. B. first inserted the copper plate 19 in the holding device 10, then the sensor units 13, 23 inserted and subsequently the holding device 10 is locked to the circuit board 50. The contacting of the sensor units 13, 23 with the printed circuit board 50 can be done at any time during assembly.
  • the contacting of the radiation source 63 designed as a lamp 111 with the printed circuit board 50 can likewise take place at any desired time of assembly. It is preferred to contact the lamp 111 first with the printed circuit board 50 and then to start with the mounting option described above.
  • the optical screen device 7 designed as a cylinder 17.
  • the cylinder 17 has three latching devices 80, which are latched to the three receiving devices 40 of the holding device 10.
  • the ferrite body 14 formed magnetic shield 4 is mounted on the holding device 10.
  • the holding device 10 preferably has a further, not shown here receiving device 40, which may be formed as a recess, survey, web and / or annular groove or the like.
  • the sealing device 6 designed as micanite layer 16 is fastened to the magnetic shielding device 4.
  • Other suitable mounting sequences for the cylinder 17, the ferrite body 14 and the sealing device 6 may be provided.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Induction Heating Cooking Devices (AREA)
  • Electric Stoves And Ranges (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
EP14401014.7A 2013-03-04 2014-02-03 Kocheinrichtung Active EP2775790B1 (de)

Applications Claiming Priority (1)

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DE201310102116 DE102013102116A1 (de) 2013-03-04 2013-03-04 Kocheinrichtung

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Cited By (1)

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RU2803916C2 (ru) * 2019-01-11 2023-09-21 Фабита С.Р.Л. Усовершенствованная индукционная варочная система

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WO2017020964A1 (en) * 2015-08-06 2017-02-09 Arcelik Anonim Sirketi Improved mounting assembly for use in a cooking appliance
DE102018215434A1 (de) * 2018-09-11 2020-03-12 Convotherm-Elektrogeräte Gmbh Gargerät

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EP2775790A1 (de) 2014-09-10
ES2683327T3 (es) 2018-09-26

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