EP2770806A4 - METHOD FOR FORMING DECLOUCHANT HOLES IN AN INSULATING SUBSTRATE, AND METHOD FOR PRODUCING AN INSULATING SUBSTRATE FOR AN INTERCALAR - Google Patents

METHOD FOR FORMING DECLOUCHANT HOLES IN AN INSULATING SUBSTRATE, AND METHOD FOR PRODUCING AN INSULATING SUBSTRATE FOR AN INTERCALAR

Info

Publication number
EP2770806A4
EP2770806A4 EP12841704.5A EP12841704A EP2770806A4 EP 2770806 A4 EP2770806 A4 EP 2770806A4 EP 12841704 A EP12841704 A EP 12841704A EP 2770806 A4 EP2770806 A4 EP 2770806A4
Authority
EP
European Patent Office
Prior art keywords
insulating substrate
interposer
holes
forming
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP12841704.5A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP2770806A1 (en
Inventor
Shintaro Takahashi
Satoshi Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of EP2770806A1 publication Critical patent/EP2770806A1/en
Publication of EP2770806A4 publication Critical patent/EP2770806A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/22—Removing surface-material, e.g. by engraving, by etching
    • B44C1/228—Removing surface-material, e.g. by engraving, by etching by laser radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/26—Perforating by non-mechanical means, e.g. by fluid jet
    • B26F1/28—Perforating by non-mechanical means, e.g. by fluid jet by electrical discharges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/18—Means for removing cut-out material or waste
    • B26D7/1845—Means for removing cut-out material or waste by non mechanical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0029—Etching of the substrate by chemical or physical means by laser ablation of inorganic insulating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Plasma & Fusion (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Laser Beam Processing (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
EP12841704.5A 2011-10-20 2012-10-11 METHOD FOR FORMING DECLOUCHANT HOLES IN AN INSULATING SUBSTRATE, AND METHOD FOR PRODUCING AN INSULATING SUBSTRATE FOR AN INTERCALAR Withdrawn EP2770806A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011231101 2011-10-20
PCT/JP2012/076360 WO2013058169A1 (ja) 2011-10-20 2012-10-11 絶縁基板に貫通孔を形成する方法およびインターポーザ用の絶縁基板を製造する方法

Publications (2)

Publication Number Publication Date
EP2770806A1 EP2770806A1 (en) 2014-08-27
EP2770806A4 true EP2770806A4 (en) 2015-10-21

Family

ID=48140817

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12841704.5A Withdrawn EP2770806A4 (en) 2011-10-20 2012-10-11 METHOD FOR FORMING DECLOUCHANT HOLES IN AN INSULATING SUBSTRATE, AND METHOD FOR PRODUCING AN INSULATING SUBSTRATE FOR AN INTERCALAR

Country Status (5)

Country Link
US (1) US20140217075A1 (ja)
EP (1) EP2770806A4 (ja)
JP (1) JPWO2013058169A1 (ja)
TW (1) TW201328843A (ja)
WO (1) WO2013058169A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016135491A (ja) * 2013-05-17 2016-07-28 旭硝子株式会社 放電補助式レーザ孔加工方法
JP2016147266A (ja) * 2013-06-14 2016-08-18 旭硝子株式会社 放電補助式レーザ孔加工装置および放電補助式レーザ孔加工方法
JP2015211162A (ja) * 2014-04-28 2015-11-24 旭硝子株式会社 ガラス部材の製造方法、ガラス部材、およびガラスインターポーザ

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3706124A1 (de) * 1987-02-25 1988-09-08 Agie Ag Ind Elektronik Verfahren zum elektroerosiven bearbeiten von elektrisch schwach oder nicht leitenden werkstuecken sowie elektroerosionsmaschine zur durchfuehrung des verfahrens
JPH05208323A (ja) * 1991-01-25 1993-08-20 Nippon Steel Corp 絶縁性セラミックスの導電性付与方法及び加工方法
US6407363B2 (en) * 2000-03-30 2002-06-18 Electro Scientific Industries, Inc. Laser system and method for single press micromachining of multilayer workpieces
JP4439092B2 (ja) * 2000-07-31 2010-03-24 京セラ株式会社 穿孔方法
JP4683736B2 (ja) * 2001-01-30 2011-05-18 京セラ株式会社 穿孔方法
JP4780881B2 (ja) * 2001-09-28 2011-09-28 京セラ株式会社 プリプレグシートのレーザによる穿孔方法
JP3875867B2 (ja) * 2001-10-15 2007-01-31 新光電気工業株式会社 シリコン基板の穴形成方法
JPWO2005052666A1 (ja) * 2003-11-27 2008-03-06 イビデン株式会社 Ｉｃチップ実装用基板、マザーボード用基板、光通信用デバイス、ｉｃチップ実装用基板の製造方法、および、マザーボード用基板の製造方法
JP2007115951A (ja) * 2005-10-21 2007-05-10 Matsushita Electric Ind Co Ltd インターポーザ基板及びその製造方法
JP5662664B2 (ja) * 2008-12-19 2015-02-04 東京応化工業株式会社 加工基板及びその製造方法
CN102300820B (zh) 2009-02-02 2014-02-26 旭硝子株式会社 半导体器件构件用玻璃基板及半导体器件构件用玻璃基板的制造方法
US8736026B2 (en) 2009-02-27 2014-05-27 Picodrill Sa Method of generating a hole or recess or well in a substrate

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
No further relevant documents disclosed *

Also Published As

Publication number Publication date
EP2770806A1 (en) 2014-08-27
US20140217075A1 (en) 2014-08-07
WO2013058169A1 (ja) 2013-04-25
JPWO2013058169A1 (ja) 2015-04-02
TW201328843A (zh) 2013-07-16

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