EP2752498A4 - Copper alloy material and manufacturing method thereof - Google Patents
Copper alloy material and manufacturing method thereofInfo
- Publication number
- EP2752498A4 EP2752498A4 EP12828596.2A EP12828596A EP2752498A4 EP 2752498 A4 EP2752498 A4 EP 2752498A4 EP 12828596 A EP12828596 A EP 12828596A EP 2752498 A4 EP2752498 A4 EP 2752498A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- manufacturing
- copper alloy
- alloy material
- copper
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/10—Alloys containing non-metals
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/10—Alloys based on copper with silicon as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011186253 | 2011-08-29 | ||
PCT/JP2012/071857 WO2013031841A1 (en) | 2011-08-29 | 2012-08-29 | Copper alloy material and manufacturing method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2752498A1 EP2752498A1 (en) | 2014-07-09 |
EP2752498A4 true EP2752498A4 (en) | 2015-04-08 |
Family
ID=47756321
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP12828596.2A Withdrawn EP2752498A4 (en) | 2011-08-29 | 2012-08-29 | Copper alloy material and manufacturing method thereof |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP2752498A4 (en) |
JP (1) | JP5307305B1 (en) |
KR (1) | KR101914322B1 (en) |
CN (1) | CN103534370B (en) |
TW (1) | TWI571518B (en) |
WO (1) | WO2013031841A1 (en) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5802150B2 (en) | 2012-02-24 | 2015-10-28 | 株式会社神戸製鋼所 | Copper alloy |
JP5795030B2 (en) * | 2013-07-16 | 2015-10-14 | 株式会社古河テクノマテリアル | Expanded material made of Cu-Al-Mn alloy material with excellent stress corrosion resistance |
JP5668814B1 (en) * | 2013-08-12 | 2015-02-12 | 三菱マテリアル株式会社 | Copper alloy for electronic and electrical equipment, copper alloy sheet for electronic and electrical equipment, parts for electronic and electrical equipment, terminals and bus bars |
JP6133178B2 (en) * | 2013-09-06 | 2017-05-24 | 古河電気工業株式会社 | Copper alloy sheet and manufacturing method thereof |
CN105518165B (en) * | 2013-09-06 | 2017-08-18 | 古河电气工业株式会社 | Copper alloy wire and its manufacture method |
JP6266354B2 (en) * | 2014-01-15 | 2018-01-24 | 株式会社神戸製鋼所 | Copper alloy for electrical and electronic parts |
JP6201815B2 (en) * | 2014-02-28 | 2017-09-27 | 株式会社オートネットワーク技術研究所 | Method for producing copper alloy stranded wire |
CN106029929B (en) | 2014-03-31 | 2019-03-22 | 古河电气工业株式会社 | Rolled copper foil, the manufacturing method of rolled copper foil, the manufacturing method of flexible ribbon cables, flexible ribbon cables |
CN106164306B (en) * | 2014-03-31 | 2020-03-17 | 古河电气工业株式会社 | Copper alloy wire and method for producing same |
KR102441663B1 (en) * | 2014-05-29 | 2022-09-13 | 후루카와 덴키 고교 가부시키가이샤 | Copper alloy sheet material, production method therefor, and electrical/electronic component comprising said copper alloy sheet material |
EP3231880B1 (en) * | 2014-12-12 | 2020-10-21 | Nippon Steel Corporation | Oriented copper plate, copper- clad laminate, flexible circuit board, and electronic device |
JP6056876B2 (en) | 2015-01-07 | 2017-01-11 | 三菱マテリアル株式会社 | Superconducting stabilizer |
JP6056877B2 (en) | 2015-01-07 | 2017-01-11 | 三菱マテリアル株式会社 | Superconducting wire and superconducting coil |
DE102015001293B4 (en) * | 2015-02-02 | 2022-11-17 | Isabellenhütte Heusler Gmbh & Co. Kg | power rail arrangement |
JP6299803B2 (en) | 2016-04-06 | 2018-03-28 | 三菱マテリアル株式会社 | Superconducting wire and superconducting coil |
JP6299802B2 (en) * | 2016-04-06 | 2018-03-28 | 三菱マテリアル株式会社 | Superconducting stabilizer, superconducting wire and superconducting coil |
ITUA20163211A1 (en) * | 2016-05-06 | 2017-11-06 | De Angeli Prod S R L | ELECTRIC CONDUCTOR FOR ELECTRIC WINDINGS, ESPECIALLY FOR CONTINUOUS TRAVEL CABLE |
CN108913932B (en) * | 2018-07-19 | 2020-05-01 | 江西理工大学 | MAX phase reinforced copper-based composite material and preparation method thereof |
CN108754218B (en) * | 2018-09-10 | 2019-09-10 | 江西理工大学 | A kind of high-strength highly-conductive Cu-Cr-Fe-Mg-P alloy wire and preparation method thereof |
CN112030032B (en) * | 2020-09-09 | 2022-07-29 | 中铝洛阳铜加工有限公司 | Cu-Cr-Ti-Zr alloy and copper strip preparation method |
CN114672688A (en) * | 2022-03-23 | 2022-06-28 | 中南大学 | Copper alloy and preparation method and application thereof |
WO2024014091A1 (en) * | 2022-07-13 | 2024-01-18 | 古河電気工業株式会社 | Copper alloy sheet and drawn component |
US20240116110A1 (en) * | 2022-10-04 | 2024-04-11 | Iowa State University Research Foundation, Inc. | Oxidation resistant high conductivity copper alloys |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1179606A2 (en) * | 2000-08-09 | 2002-02-13 | Olin Corporation | Silver containing copper alloy |
JP2005029857A (en) * | 2003-07-09 | 2005-02-03 | Nikko Metal Manufacturing Co Ltd | High tensile and high conductivity copper alloy having excellent ductility |
EP2343388A1 (en) * | 2009-12-23 | 2011-07-13 | Mitsubishi Shindoh Co., Ltd. | Cu-Mg-P based copper alloy material and method of producing the same |
EP2610359A1 (en) * | 2010-08-27 | 2013-07-03 | Furukawa Electric Co., Ltd. | Copper alloy sheet and method for producing same |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03162553A (en) * | 1989-11-22 | 1991-07-12 | Nippon Mining Co Ltd | Manufacture of high strength and high conductivity copper alloy having good bendability |
JP3353324B2 (en) | 1992-02-10 | 2002-12-03 | 三菱伸銅株式会社 | Copper alloy cold-rolled strip with low abrasion of stamping die and method of manufacturing the same |
US5486244A (en) | 1992-11-04 | 1996-01-23 | Olin Corporation | Process for improving the bend formability of copper alloys |
JPH11323463A (en) | 1998-05-14 | 1999-11-26 | Kobe Steel Ltd | Copper alloy for electrical and electronic parts |
JP4756197B2 (en) | 2005-08-23 | 2011-08-24 | Dowaメタルテック株式会社 | Cu-Mg-P-based copper alloy and method for producing the same |
JP5075447B2 (en) * | 2006-03-30 | 2012-11-21 | Dowaメタルテック株式会社 | Cu-Fe-P-Mg based copper alloy, manufacturing method, and current-carrying component |
JP4968533B2 (en) | 2007-11-30 | 2012-07-04 | 日立電線株式会社 | Copper alloy material for electrical and electronic parts |
KR101249107B1 (en) * | 2008-03-31 | 2013-03-29 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | Cu-ni-si alloy to be used in electrically conductive spring material |
CN102105610B (en) * | 2008-06-03 | 2013-05-29 | 古河电气工业株式会社 | Copper alloy sheet material and manufacturing method thereof |
JP5045783B2 (en) | 2010-05-14 | 2012-10-10 | 三菱マテリアル株式会社 | Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, and rolled copper alloy material for electronic equipment |
-
2012
- 2012-08-29 TW TW101131290A patent/TWI571518B/en active
- 2012-08-29 EP EP12828596.2A patent/EP2752498A4/en not_active Withdrawn
- 2012-08-29 JP JP2013500698A patent/JP5307305B1/en active Active
- 2012-08-29 KR KR1020137030001A patent/KR101914322B1/en active IP Right Grant
- 2012-08-29 WO PCT/JP2012/071857 patent/WO2013031841A1/en active Application Filing
- 2012-08-29 CN CN201280023476.6A patent/CN103534370B/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1179606A2 (en) * | 2000-08-09 | 2002-02-13 | Olin Corporation | Silver containing copper alloy |
JP2005029857A (en) * | 2003-07-09 | 2005-02-03 | Nikko Metal Manufacturing Co Ltd | High tensile and high conductivity copper alloy having excellent ductility |
EP2343388A1 (en) * | 2009-12-23 | 2011-07-13 | Mitsubishi Shindoh Co., Ltd. | Cu-Mg-P based copper alloy material and method of producing the same |
EP2610359A1 (en) * | 2010-08-27 | 2013-07-03 | Furukawa Electric Co., Ltd. | Copper alloy sheet and method for producing same |
Non-Patent Citations (1)
Title |
---|
See also references of WO2013031841A1 * |
Also Published As
Publication number | Publication date |
---|---|
KR101914322B1 (en) | 2018-11-01 |
TW201311913A (en) | 2013-03-16 |
CN103534370B (en) | 2015-11-25 |
EP2752498A1 (en) | 2014-07-09 |
WO2013031841A1 (en) | 2013-03-07 |
JPWO2013031841A1 (en) | 2015-03-23 |
KR20140052997A (en) | 2014-05-07 |
TWI571518B (en) | 2017-02-21 |
JP5307305B1 (en) | 2013-10-02 |
CN103534370A (en) | 2014-01-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2752498A4 (en) | Copper alloy material and manufacturing method thereof | |
SG11201401464UA (en) | Copper alloy and copper alloy forming material | |
HK1177716A1 (en) | Aluminum copper clad material and manufacturing method thereof | |
EP2740754A4 (en) | Metal nanoparticle-pcp complex and manufacturing method therefor | |
EP2711111A4 (en) | Metallic powder production method and metallic powder production device | |
EP2891554A4 (en) | Metal structure and method for manufacturing same | |
SG11201400688YA (en) | Metal material for electronic components and method for producing same | |
EP2778240A4 (en) | Copper alloy for electronic devices, method of manufacturing copper alloy for electronic devices, copper alloy plastic working material for electronic devices, and component for electronic devices | |
EP2728024A4 (en) | Silver-white copper alloy and method for manufacturing silver-white copper alloy | |
EP2683040A4 (en) | Bus-bar set and manufacturing method therefor | |
HK1182218A1 (en) | Electronic component and manufacturing method thereof | |
EP2725591A4 (en) | Inductor and manufacturing method therefor | |
PL2529856T3 (en) | Metal Part Assembly And Method For Making Same | |
EP2915890A4 (en) | Copper alloy and process for manufacturing same | |
EP2554693A4 (en) | Cu-ni-si-co copper alloy for electronic material and process for producing same | |
EP2653574A4 (en) | Copper alloy and method for producing copper alloy | |
SG11201404017YA (en) | Silver-coated copper alloy powder and method for manufacturing same | |
EP2641983A4 (en) | Cu-Ni-Si-Co COPPER ALLOY FOR ELECTRON MATERIAL AND METHOD FOR PRODUCING SAME | |
EP2670875A4 (en) | Copper alloy material for seawater and method for preparing same | |
EP2690203A4 (en) | Metal member and method for manufacturing same | |
EP2677050A4 (en) | Cu-Zr-BASED COPPER ALLOY PLATE AND PROCESS FOR MANUFACTURING SAME | |
EP2792759A4 (en) | Heat-resistant alloy and manufacturing method therefor | |
EP2761042A4 (en) | Leadless free-cutting copper alloy and method for producing the same | |
EP2759612A4 (en) | Copper alloy sheet and method for producing copper alloy sheet | |
EP2692879A4 (en) | Cu-co-si-based copper alloy strip for electron material, and method for manufacturing same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20140331 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
DAX | Request for extension of the european patent (deleted) | ||
RA4 | Supplementary search report drawn up and despatched (corrected) |
Effective date: 20150306 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: C22C 9/04 20060101ALI20150302BHEP Ipc: C22C 1/10 20060101ALI20150302BHEP Ipc: C22F 1/08 20060101ALI20150302BHEP Ipc: H01B 1/02 20060101ALI20150302BHEP Ipc: C22C 9/00 20060101AFI20150302BHEP Ipc: C22C 9/10 20060101ALI20150302BHEP Ipc: H01B 13/00 20060101ALI20150302BHEP Ipc: C22F 1/00 20060101ALI20150302BHEP Ipc: C22C 9/02 20060101ALI20150302BHEP Ipc: C22C 9/06 20060101ALI20150302BHEP Ipc: H01B 5/02 20060101ALI20150302BHEP |
|
17Q | First examination report despatched |
Effective date: 20160613 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN |
|
18W | Application withdrawn |
Effective date: 20011231 |
|
R18W | Application withdrawn (corrected) |
Effective date: 20161103 |