EP2752498A4 - Copper alloy material and manufacturing method thereof - Google Patents

Copper alloy material and manufacturing method thereof

Info

Publication number
EP2752498A4
EP2752498A4 EP12828596.2A EP12828596A EP2752498A4 EP 2752498 A4 EP2752498 A4 EP 2752498A4 EP 12828596 A EP12828596 A EP 12828596A EP 2752498 A4 EP2752498 A4 EP 2752498A4
Authority
EP
European Patent Office
Prior art keywords
manufacturing
copper alloy
alloy material
copper
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP12828596.2A
Other languages
German (de)
French (fr)
Other versions
EP2752498A1 (en
Inventor
Ryosuke Matsuo
Hiroshi Kaneko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of EP2752498A1 publication Critical patent/EP2752498A1/en
Publication of EP2752498A4 publication Critical patent/EP2752498A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C1/00Making non-ferrous alloys
    • C22C1/10Alloys containing non-metals
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/02Alloys based on copper with tin as the next major constituent
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/04Alloys based on copper with zinc as the next major constituent
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/10Alloys based on copper with silicon as the next major constituent
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026Alloys based on copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
EP12828596.2A 2011-08-29 2012-08-29 Copper alloy material and manufacturing method thereof Withdrawn EP2752498A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011186253 2011-08-29
PCT/JP2012/071857 WO2013031841A1 (en) 2011-08-29 2012-08-29 Copper alloy material and manufacturing method thereof

Publications (2)

Publication Number Publication Date
EP2752498A1 EP2752498A1 (en) 2014-07-09
EP2752498A4 true EP2752498A4 (en) 2015-04-08

Family

ID=47756321

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12828596.2A Withdrawn EP2752498A4 (en) 2011-08-29 2012-08-29 Copper alloy material and manufacturing method thereof

Country Status (6)

Country Link
EP (1) EP2752498A4 (en)
JP (1) JP5307305B1 (en)
KR (1) KR101914322B1 (en)
CN (1) CN103534370B (en)
TW (1) TWI571518B (en)
WO (1) WO2013031841A1 (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5802150B2 (en) 2012-02-24 2015-10-28 株式会社神戸製鋼所 Copper alloy
JP5795030B2 (en) * 2013-07-16 2015-10-14 株式会社古河テクノマテリアル Expanded material made of Cu-Al-Mn alloy material with excellent stress corrosion resistance
JP5668814B1 (en) * 2013-08-12 2015-02-12 三菱マテリアル株式会社 Copper alloy for electronic and electrical equipment, copper alloy sheet for electronic and electrical equipment, parts for electronic and electrical equipment, terminals and bus bars
JP6133178B2 (en) * 2013-09-06 2017-05-24 古河電気工業株式会社 Copper alloy sheet and manufacturing method thereof
CN105518165B (en) * 2013-09-06 2017-08-18 古河电气工业株式会社 Copper alloy wire and its manufacture method
JP6266354B2 (en) * 2014-01-15 2018-01-24 株式会社神戸製鋼所 Copper alloy for electrical and electronic parts
JP6201815B2 (en) * 2014-02-28 2017-09-27 株式会社オートネットワーク技術研究所 Method for producing copper alloy stranded wire
CN106029929B (en) 2014-03-31 2019-03-22 古河电气工业株式会社 Rolled copper foil, the manufacturing method of rolled copper foil, the manufacturing method of flexible ribbon cables, flexible ribbon cables
CN106164306B (en) * 2014-03-31 2020-03-17 古河电气工业株式会社 Copper alloy wire and method for producing same
KR102441663B1 (en) * 2014-05-29 2022-09-13 후루카와 덴키 고교 가부시키가이샤 Copper alloy sheet material, production method therefor, and electrical/electronic component comprising said copper alloy sheet material
EP3231880B1 (en) * 2014-12-12 2020-10-21 Nippon Steel Corporation Oriented copper plate, copper- clad laminate, flexible circuit board, and electronic device
JP6056876B2 (en) 2015-01-07 2017-01-11 三菱マテリアル株式会社 Superconducting stabilizer
JP6056877B2 (en) 2015-01-07 2017-01-11 三菱マテリアル株式会社 Superconducting wire and superconducting coil
DE102015001293B4 (en) * 2015-02-02 2022-11-17 Isabellenhütte Heusler Gmbh & Co. Kg power rail arrangement
JP6299803B2 (en) 2016-04-06 2018-03-28 三菱マテリアル株式会社 Superconducting wire and superconducting coil
JP6299802B2 (en) * 2016-04-06 2018-03-28 三菱マテリアル株式会社 Superconducting stabilizer, superconducting wire and superconducting coil
ITUA20163211A1 (en) * 2016-05-06 2017-11-06 De Angeli Prod S R L ELECTRIC CONDUCTOR FOR ELECTRIC WINDINGS, ESPECIALLY FOR CONTINUOUS TRAVEL CABLE
CN108913932B (en) * 2018-07-19 2020-05-01 江西理工大学 MAX phase reinforced copper-based composite material and preparation method thereof
CN108754218B (en) * 2018-09-10 2019-09-10 江西理工大学 A kind of high-strength highly-conductive Cu-Cr-Fe-Mg-P alloy wire and preparation method thereof
CN112030032B (en) * 2020-09-09 2022-07-29 中铝洛阳铜加工有限公司 Cu-Cr-Ti-Zr alloy and copper strip preparation method
CN114672688A (en) * 2022-03-23 2022-06-28 中南大学 Copper alloy and preparation method and application thereof
WO2024014091A1 (en) * 2022-07-13 2024-01-18 古河電気工業株式会社 Copper alloy sheet and drawn component
US20240116110A1 (en) * 2022-10-04 2024-04-11 Iowa State University Research Foundation, Inc. Oxidation resistant high conductivity copper alloys

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1179606A2 (en) * 2000-08-09 2002-02-13 Olin Corporation Silver containing copper alloy
JP2005029857A (en) * 2003-07-09 2005-02-03 Nikko Metal Manufacturing Co Ltd High tensile and high conductivity copper alloy having excellent ductility
EP2343388A1 (en) * 2009-12-23 2011-07-13 Mitsubishi Shindoh Co., Ltd. Cu-Mg-P based copper alloy material and method of producing the same
EP2610359A1 (en) * 2010-08-27 2013-07-03 Furukawa Electric Co., Ltd. Copper alloy sheet and method for producing same

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03162553A (en) * 1989-11-22 1991-07-12 Nippon Mining Co Ltd Manufacture of high strength and high conductivity copper alloy having good bendability
JP3353324B2 (en) 1992-02-10 2002-12-03 三菱伸銅株式会社 Copper alloy cold-rolled strip with low abrasion of stamping die and method of manufacturing the same
US5486244A (en) 1992-11-04 1996-01-23 Olin Corporation Process for improving the bend formability of copper alloys
JPH11323463A (en) 1998-05-14 1999-11-26 Kobe Steel Ltd Copper alloy for electrical and electronic parts
JP4756197B2 (en) 2005-08-23 2011-08-24 Dowaメタルテック株式会社 Cu-Mg-P-based copper alloy and method for producing the same
JP5075447B2 (en) * 2006-03-30 2012-11-21 Dowaメタルテック株式会社 Cu-Fe-P-Mg based copper alloy, manufacturing method, and current-carrying component
JP4968533B2 (en) 2007-11-30 2012-07-04 日立電線株式会社 Copper alloy material for electrical and electronic parts
KR101249107B1 (en) * 2008-03-31 2013-03-29 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 Cu-ni-si alloy to be used in electrically conductive spring material
CN102105610B (en) * 2008-06-03 2013-05-29 古河电气工业株式会社 Copper alloy sheet material and manufacturing method thereof
JP5045783B2 (en) 2010-05-14 2012-10-10 三菱マテリアル株式会社 Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, and rolled copper alloy material for electronic equipment

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1179606A2 (en) * 2000-08-09 2002-02-13 Olin Corporation Silver containing copper alloy
JP2005029857A (en) * 2003-07-09 2005-02-03 Nikko Metal Manufacturing Co Ltd High tensile and high conductivity copper alloy having excellent ductility
EP2343388A1 (en) * 2009-12-23 2011-07-13 Mitsubishi Shindoh Co., Ltd. Cu-Mg-P based copper alloy material and method of producing the same
EP2610359A1 (en) * 2010-08-27 2013-07-03 Furukawa Electric Co., Ltd. Copper alloy sheet and method for producing same

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2013031841A1 *

Also Published As

Publication number Publication date
KR101914322B1 (en) 2018-11-01
TW201311913A (en) 2013-03-16
CN103534370B (en) 2015-11-25
EP2752498A1 (en) 2014-07-09
WO2013031841A1 (en) 2013-03-07
JPWO2013031841A1 (en) 2015-03-23
KR20140052997A (en) 2014-05-07
TWI571518B (en) 2017-02-21
JP5307305B1 (en) 2013-10-02
CN103534370A (en) 2014-01-22

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